Shell assembly for computing device and computing device

Abstract

The embodiment of the utility model provides a shell assembly for computing equipment and the computing equipment, and the computing equipment comprises a computing module, a power module and a fan; the shell assembly comprises an inner shell, and a calculation module, a power module and a fan are integrally arranged in the inner shell. A cavity is defined in the outer shell, a first mounting opening is formed in one side, in the first direction, of the outer shell, and the inner shell is slidably mounted in the cavity through the first mounting opening. According to the technology of the application, the computing module, the power supply module, the fan and the like of the computing equipment can be integrally arranged in the protective shell, so that the integration level and the maintenance convenience of the computing equipment are improved, and meanwhile, a good heat dissipation effect is achieved in a limited space of the computing equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computing devices, and particularly relates to a shell assembly for a computing device and the computing device. BACKGROUND

[0002] A high-performance computing device is usually composed of multiple modules such as a computing module, a power module, and a heat dissipation module. These modules need to be arranged integrally in the computing device to ensure efficient heat dissipation and stable operation of the computing device. In the related art, the shell of the computing device is usually a single-layer integrated structure, and components are usually fixed to the inner side wall of the shell. Therefore, the disassembly and maintenance of the components of the computing device are usually complicated, which increases the cost and time of operation and maintenance. In addition, the heat dissipation module and the computing module of the computing device in the related art are usually arranged separately, and the layout design needs to be optimized. CONTENT OF THE UTILITY MODEL

[0003] Embodiments of the present application provide a shell assembly for a computing device and the computing device to solve or alleviate one or more technical problems in the prior art.

[0004] As an aspect of the embodiments of the present application, a shell assembly for a computing device is provided, the computing device comprising a computing module, a power module, and a fan; the shell assembly comprising: an inner shell, the computing module, the power module, and the fan being integrally arranged in the inner shell; an outer shell, an inner portion of the outer shell defining a cavity, the outer shell being provided with a first mounting opening on one side in a first direction, and the inner shell being slidably mounted in the cavity through the first mounting opening.

[0005] In an embodiment, an inner portion of the inner shell defines a receiving cavity, and the computing module and the power module are arranged side by side in the receiving cavity along the first direction; a top portion of the inner shell defines a mounting groove, and the fan is arranged in the mounting groove.

[0006] In an embodiment, the top portion of the inner shell is provided with a first side baffle and a second side baffle, the first side baffle and the second side baffle being oppositely arranged in a second direction, and the mounting groove is defined between the first side baffle and the second side baffle.

[0007] In an embodiment, the first side baffle and the second side baffle respectively abut against an outer wall surface of the fan.

[0008] In an embodiment, the inner shell has two side walls oppositely arranged in the second direction, inner wall surfaces of the two side walls are respectively provided with support ribs, and the two support ribs are arranged adjacent to the top portion of the inner shell; and the mounting groove is defined by the first side baffle, the second side baffle, and the two support ribs.

[0009] In an embodiment, the support ribs are formed by the inner wall surfaces of the side walls being inwardly protruded, and the length direction of the support ribs is parallel to the first direction.

[0010] In an embodiment, the two side walls of the inner shell are respectively provided with a limiting flange, the limiting flange is inclinedly extended downward by the side wall in a direction towards the inner wall surface of the outer shell

[0011] In an embodiment, the two opposite inner wall surfaces of the outer shell are respectively provided with a stopper, the stopper is inclinedly extended upward by the inner wall surface of the outer shell in a direction towards the outer wall surface of the inner shell, and the stopper is located at a lower side of the limiting flange.

[0012] In an embodiment, the side wall of the outer shell is provided with an air outlet communicated with the cavity, and the bottom wall of the outer shell is provided with an air inlet communicated with the cavity.

[0013] In an embodiment, the bottom of the inner shell has a bottom open area communicated with the accommodating cavity, and the side of the inner shell has a side open area communicated with the accommodating cavity, the bottom open area is correspondingly communicated with the air inlet, and the side open area is correspondingly communicated with the air outlet.

[0014] In an embodiment, a air outlet baffle is detachably installed at the air outlet of the outer shell, and the air outlet baffle is provided with an air outlet filtering assembly; and / or, an air inlet baffle is detachably installed at the air inlet of the outer shell, and the air inlet baffle is provided with an air inlet filtering assembly.

[0015] In an embodiment, the air inlet filtering assembly is detachably connected to the bottom of the outer shell to cover the air inlet.

[0016] In an embodiment, the air inlet filtering assembly comprises a first clamping plate, a filtering element and a second clamping plate which are stacked in a direction away from the air inlet, the first clamping plate and the second clamping plate form a pressing space therebetween, and the filtering element is arranged in the pressing space.

[0017] In an embodiment, the first clamping plate and the second clamping plate are respectively provided with a plurality of ventilation areas which are hollowed out, and the ventilation areas are arranged through the thickness direction of the first clamping plate and the second clamping plate.

[0018] In an embodiment, a first side surface of the first clamping plate adjacent to the second clamping plate is provided as a non-planar surface with unevenness, a second side surface of the second clamping plate adjacent to the first clamping plate is provided as a non-planar surface with unevenness, and the shape of the first side surface of the first clamping plate is matched with the shape of the second side surface of the second clamping plate, so that the filtering element arranged between the first clamping plate and the second clamping plate is in a non-planar shape with unevenness.

[0019] In an embodiment, the shell assembly for the computing device further comprises a mounting side plate which is detachably mounted to the first mounting opening to form a closure for the first mounting opening.

[0020] In an embodiment, the end of the fan adjacent to the first mounting opening is provided with a clamping protrusion, and the mounting side plate is provided with a first clamping hole penetrating therethrough, the first clamping hole being clamped with the clamping protrusion of the fan.

[0021] In an embodiment, the mounting side plate is provided with a wire passing hole penetrating therethrough, the wire passing hole being used for passing a cable connecting the control module and the power module, and the control module is arranged outside the accommodating cavity of the inner shell.

[0022] In an embodiment, the outer shell has an extension part extending along the first direction, the extension part defining a mounting space, and the mounting space is adjacent to the inner shell in the first direction, and the mounting space is used for mounting the control module.

[0023] In an embodiment, the top of the mounting space is open.

[0024] In an embodiment, the control module comprises a control box, the side of the control box adjacent to the mounting side plate is provided with a clamping protrusion, the mounting side plate is provided with a second clamping hole penetrating therethrough, and the clamping protrusion is clamped with the second clamping hole.

[0025] In an embodiment, the other side of the outer shell in the first direction is provided with a second mounting opening; the shell assembly further comprises a cover side plate detachably mounted to the second mounting opening, and used for forming a closure to the second mounting opening.

[0026] In an embodiment, the cover side plate and the control module are respectively arranged on opposite sides of the outer shell in the first direction, the cover side plate is provided with a clamping part, and the control module is provided with a clamping matching part; in the two computing devices arranged adjacent to each other in the first direction, the clamping part of one of the computing devices is clamped with the clamping matching part of the other computing device.

[0027] In an embodiment, the side wall of the inner shell is provided with a wire passing area corresponding to the position of the power module, and the wire passing area penetrates the side wall of the inner shell.

[0028] In an embodiment, the bottom wall of the inner shell is provided with a positioning member, and the positioning member is slidably matched with the bottom of the computing module.

[0029] In an embodiment, the inner shell is a sheet metal part, and the outer shell is a profiled part; or, the inner shell and the outer shell are both profiled parts.

[0030] In an embodiment, the shell assembly for the computing device further comprises a plurality of supports arranged at the bottom of the outer shell.

[0031] As another aspect of the embodiments of the present application, the embodiments of the present application further provide a computing device, comprising: the shell assembly for computing device of any of the above-mentioned embodiments; and the computing module, the power module and the fan which are integrally arranged in the inner shell of the shell assembly.

[0032] According to the shell assembly for computing device of the embodiments of the present application, the computing module, the power module, the fan and the like of the computing device are integrally arranged in the double-layer protective shell, so that the integration and the structural stability of the computing device are improved, the inner shell can be conveniently installed and dismounted through the sliding installation, so that the maintenance convenience of the device is improved, the heat dissipation efficiency of the computing module and the power module is improved through the shell inlet and outlet, and good heat dissipation effect is achieved in the limited space of the computing device.

[0033] The above summary is intended to illustrate the present application and is not intended to be limiting thereof. Further aspects, embodiments and features of the present application will be apparent from the drawings and the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0034] In the drawings, like reference numerals will be used to represent like parts throughout the several views. These drawings are not necessarily to scale, the emphasis instead being placed upon illustrating the principles of the application. It should be understood that these drawings are only illustrative of some embodiments of the present application and are not intended to be limiting thereof.

[0035] Figure 1 An exploded structural schematic view of the computing device of the embodiments of the present application is exemplarily provided.

[0036] Figure 2 An exploded structural schematic view of the computing device of the embodiments of the present application after removing the outer shell is exemplarily provided.

[0037] Figure 3 A side view of the power module and the fan of the computing device of the embodiments of the present application which are integrally installed in the inner shell is exemplarily provided.

[0038] Figure 4 A transverse cross-sectional view of the inner shell of the computing device of the embodiments of the present application is exemplarily provided.

[0039] Figure 5 A transverse cross-sectional view of the computing device of the embodiments of the present application is exemplarily provided.

[0040] Figure 6A A bottom view of the computing device of the embodiments of the present application is exemplarily provided.

[0041] Figure 6B A bottom view of the computing device of another embodiment of the present application is exemplarily provided.

[0042] Figure 7 An exploded structural schematic view of a control module of a computing device according to an embodiment of the present application is provided.

[0043] Figure 8 A perspective structural schematic view of a computing device according to an embodiment of the present application is provided.

[0044] Figure 9 A partial structural schematic view of a computing device according to an embodiment of the present application is provided.

[0045] Figure 10A A structural schematic view of an air intake filter assembly of a computing device according to an embodiment of the present application is provided.

[0046] Figure 10B A side view of an air intake filter assembly of a computing device according to an embodiment of the present application is provided.

[0047] Figure 10C An exploded structural schematic view of an air intake filter assembly of a computing device according to an embodiment of the present application is provided.

[0048] Figure 11A A perspective structural schematic view of a computing device according to an embodiment of the present application is provided.

[0049] Figure 11B A perspective structural schematic view of a computing device according to an embodiment of the present application is provided.

[0050] Figure 12 An assembly schematic view of a control module and a housing assembly of a computing device according to an embodiment of the present application is provided.

[0051] BRIEF DESCRIPTION OF THE DRAWINGS

[0052] 1 - computing device;

[0053] 100 - housing assembly;

[0054] 10 - inner shell; 10a - accommodating cavity; 10b - mounting groove; 111 - first side baffle; 112 - second side baffle; 12 - side wall; 121 - support rib; 122 - limiting folded edge; 123 - first limiting column; 13 - power supply decorative cover plate; 14 - wire passing area; 15 - positioning member;

[0055] 20 - housing; 20a - first mounting opening; 20b - air outlet; 20c - air inlet; 20c1 - first air inlet; 20c2 - second air inlet; 211 - stopper; 212 - second limiting column; 22 - air outlet partition; 23 - air inlet partition; 24 - air inlet filtering assembly; 241 - first clamping plate; 242 - filter; 243 - second clamping plate; 244 - magnetic element; 245 - ventilation area; 25 - mounting space;

[0056] 30 - mounting side plate; 30a - first clamping hole; 30b - second clamping hole; 30c - wire hole;

[0057] 40 - cover side plate; 41 - clamping portion; 42 - first clamping hook;

[0058] 50 - support; 51 - second clamping hook; 52 - elastic support pad; 53 - fastening screw;

[0059] 60 - wireless communication unit;

[0060] 70 - ambient temperature detection unit;

[0061] 200 - fan; 210 - clamping protrusion;

[0062] 300 - power module; 301 - power input unit; 302 - switch unit;

[0063] 400 - computing module; computing board 410;

[0064] 500 - control module; 510 - control box; 5121 - clamping protrusion; 513 - clamping matching portion;

[0065] L1 - first direction; L2 - second direction. DETAILED DESCRIPTION

[0066] Hereinafter, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0067] In the related art, the housing of the computing device is mostly a single-layer integrated structure, and the components are mostly fixed to the inner side wall of the housing, so that the disassembly and maintenance of each module of the computing device are more complicated, which increases the time and cost of operation and maintenance, and the heat dissipation module and the computing module of the computing device in the related art are mostly separately arranged, and the layout design needs to be optimized.

[0068] Based on the above defects existing in the related art, the embodiment of the present application provides a shell assembly for a computing device. The computing module, power module, fan and other modules of the computing device are arranged in an inner and outer double-layer protective shell, which improves the integration and structural stability of the computing device. The inner shell can be conveniently installed and disassembled through sliding installation, improving the maintenance convenience of the device. The shell inlet and outlet are provided, improving the heat dissipation efficiency of the computing module and the power module, and achieving good heat dissipation effect in the limited space of the computing device.

[0069] A high-performance computing device is usually composed of multiple modules such as a computing module, a power module and a heat dissipation module. These modules need to be arranged in the computing device to ensure efficient heat dissipation and stable operation of the computing device. In the embodiment of the present application, the computing device 1 can include a computing module 400, a power module 300, a control module 500, a fan 200 and other functional modules.

[0070] Figure 1 An exploded structural schematic diagram of the computing device of the embodiment of the present application is exemplarily provided, Figure 3 A side view of the power module and the fan of the computing device according to the embodiment of the present application being integrated and installed in the inner shell is exemplarily provided, Figure 4 A transverse cross-sectional view of the inner shell of the computing device according to the embodiment of the present application is exemplarily provided. As Figure 1 、 Figure 3 and Figure 4 shown, the computing device 1 can include a power module 300, a computing module 400 and a fan 200. The shell assembly 100 for the computing device 1 provided by the embodiment of the present application can include an inner shell 10 and an outer shell 20. Specifically, the computing module 400, the power module 300 and the fan 200 can be arranged in the inner shell 10. The inner part of the outer shell 20 can define a cavity. The outer shell 20 is provided with a first installation opening 20a on one side in the first direction L1. The inner shell 10 is slidably installed in the cavity through the first installation opening 20a.

[0071] Exemplarily, the inner shell 10 can adopt a frame structure to provide an installation basis for the components of the computing device 1 and provide stable support for the overall structure of the computing device 1. The frame structure of the inner shell 10 can be provided with installation supports or installation holes for fixing various modules of the computing device 1.

[0072] In some examples, the computing module 400, the power module 300 and the fan 200 of the computing device 1 can be arranged in the frame structure of the inner shell 10 through screw connection. In the screw connection mode, the modules of the computing device 1 are more stable, which can ensure that the computing device 1 is not affected by vibration or impact during transportation.

[0073] In some examples, the computing module 400, the power module 300 and the fan 200 of the computing device 1 can be arranged in the frame structure of the inner shell 10 through a snap connection. In the snap connection, the modules of the computing device 1 are more convenient to install and disassemble, which is beneficial to the maintenance and replacement of the modules of the computing device 1.

[0074] It should be noted that the above is only an example, and the embodiments of the present application do not specifically limit the connection mode of the functional modules of the computing device 1 and the inner shell 10. Those skilled in the art can flexibly select other connection modes according to actual needs.

[0075] In the embodiments of the present application, referring to Figure 1 , one side of the shell 20 in the first direction L1 can be provided with a first mounting opening 20a, and the first mounting opening 20a is in communication with the cavity inside. The opening area of the first mounting opening 20a is greater than the cross-sectional area of the inner shell 10 after the power module 300, the computing module 400 and the fan 200 are integrated and installed, so as to ensure that the inner shell 10 integrated with the power module 300, the computing module 400 and the fan 200 can slide into the inside of the shell 20 through the first mounting opening 20a.

[0076] For example, the cavity of the shell 20 can extend along the first direction L1, and the outer shape of the inner shell 10 also extends along the first direction L1. The size and shape of the inner shell 10 are adapted to the size and shape of the cavity of the shell 20, so as to ensure that the inner shell 10 after assembling the computing device 1 can be smoothly slid into and completely accommodated in the cavity, forming an overall shell assembly 100.

[0077] For example, the cavity shape of the shell 20 can be designed as a cuboid, a cube or a cylinder, etc. The outer shape of the inner shell 10 can be designed as a cuboid frame, a cube frame or a cylinder, etc. The outer shape of the inner shell 10 is adapted to the cavity shape of the shell 20, so that the inner shell 10 can be accommodated in the cavity of the shell 20 and be slidable in the cavity along the first direction L1.

[0078] It should be noted that the above examples of the cavity shape of the shell 20 and the outer shape of the inner shell 10 are only for example and cannot be understood as a limitation of the present application. The cavity shape of the shell 20 and the outer shape of the inner shell 10 can be flexibly set according to actual conditions, and other installation modes of the inner shell 10 and the shell 20 are allowed to be selected according to actual needs. The shell 20 provides external protection for the computing device 1, which can prevent external environmental factors such as dust, moisture, impact, etc. from damaging the functional modules of the computing device 1.

[0079] In the embodiments of the present application, the shell 20 and the inner shell 10 can be connected through a sliding structure to ensure that the inner shell 10 can smoothly slide in the shell 20.

[0080] In some examples, the inner shell 10 can slide into or out of the cavity of the outer shell 20 along a specific track or guide, wherein the outer wall surface of the inner shell 10 and the inner wall surface of the outer shell 20 can be provided with mutually matched sliding structures, which can include sliding rails, pulleys or other devices to guide the sliding of the inner shell 10 into or out of the cavity, to ensure smooth sliding and to achieve the installation and fixation of the inner shell 10 in the cavity of the outer shell 20.

[0081] In other examples, the outer wall surface of the inner shell 10 and the inner wall surface of the outer shell 20 can be provided with mutually matched limiting structures, which can include limiting flanges, screw limiting columns or other structures, and the outer wall surface of the inner shell 10 and the inner wall surface of the outer shell 20 can be matched and abutted by the limiting structures, so that the inner shell 10 can be firmly installed in the cavity of the outer shell 20 and the computing device 1 can be prevented from falling off or moving during operation or transportation.

[0082] It should be noted that the sliding matching structure and the limiting structure of the inner shell 10 and the outer shell 20 are not specifically limited in the embodiments of the present application, and a person skilled in the art can flexibly set the specific form of the sliding structure according to actual needs.

[0083] In some embodiments, the outer surface of the side wall of the inner shell 10 and / or the inner surface of the side wall of the outer shell 20 is provided with at least one limiting column. The limiting column on the side wall of the inner shell 10 can be in abutting cooperation with the inner surface of the side wall of the outer shell 20 or can leave a certain gap, and the limiting column on the side wall of the outer shell 20 can be in abutting cooperation with the outer surface of the side wall of the inner shell 10 or can leave a certain gap.

[0084] Figure 2 An example of the exploded structure of the computing device of the embodiments of the present application is provided, Figure 5 An example of the transverse cross-sectional view of the computing device of the embodiments of the present application is provided. As shown in Figure 2 、 Figure 4 and Figure 5 shown, the side wall 12 of the inner shell 10 can be provided with a first limiting column 123 extending along the first direction L1 and protruding in the direction of the inner wall surface of the outer shell 20 (shown in Figure 2 The opposite two side walls of the outer shell 20 in the second direction L2 can be provided with a second limiting column 212 extending along the first direction L1 and protruding in the direction of the outer wall surface of the inner shell. The number of the first limiting column 123 on the inner shell 10 can be two and arranged in pairs in the second direction L2 of the inner shell 10, and the number of the second limiting column 212 on the outer shell 20 can be two and arranged in pairs in the second direction L2 of the outer shell 20. The number and position of the first limiting column 123 and the second limiting column 212 are not specifically limited in the embodiments of the present application.

[0085] Exemplarily, the first limiting column 123 can protrude from the sidewall 12 of the inner shell 10 and abut against or leave a proper gap with the inner wall surface of the outer shell 20 in the second direction L2. Similarly, the second limiting column 212 can protrude from the inner sidewall of the outer shell 20 and abut against or leave a proper gap with the sidewall 12 of the inner shell 10. After the inner shell 10 is installed in the cavity of the outer shell 20, the first limiting column 123 and the second limiting column 212 can simultaneously limit the installation position of the inner shell 10 in the cavity of the outer shell 20 as a limiting structure, so that the inner shell 10 can be firmly installed in the cavity of the outer shell 20 and prevent the computing device 1 from falling off or moving during operation or transportation.

[0086] Exemplarily, the first limiting column 123 and the second limiting column 212 can be provided with screw holes penetrating in the first direction L1. The side plate installed at the first mounting opening 20a can be provided with through holes corresponding to the positions of the screw holes, and the through holes are used for the screws to pass through to form threaded connection with the screw holes, so as to fix and install the side plate at the first mounting opening 20a to close the first mounting opening 20a.

[0087] In addition, referring to Figure 1 , the other side of the outer shell 20 opposite to the first mounting opening 20a is also provided with a second mounting opening (not shown in the figure) in communication with the cavity of the outer shell 20. Correspondingly, the second mounting opening is also provided with a side plate for closing the second mounting opening, and the side plate can also be provided with through holes corresponding to the positions of the screw holes, and the through holes are used for the screws to pass through to form threaded connection with the screw holes, so as to fix and install the side plate at the second mounting opening.

[0088] Exemplarily, the frame of the inner shell 10 can be made of metal material, such as aluminum alloy or steel. The metal material of the frame of the inner shell 10 has good mechanical strength and heat conduction performance, which can provide stable support for the computing device 1 and cooperate with the fan 200 of the computing device 1 to complete heat dissipation, thereby improving the heat dissipation efficiency of the computing device 1 during operation.

[0089] Exemplarily, the outer shell 20 can be made of metal material (such as aluminum alloy or steel) or high polymer material. In the case of selecting metal material for the outer shell 20, the outer shell 20 can have good structural rigidity and certain heat conduction performance, thereby effectively protecting the internal components and assisting heat dissipation. In the case of selecting high polymer material for the outer shell 20, the computing device 1 can have lighter weight and good durability, which is suitable for application scenarios with high requirements for weight and durability.

[0090] It should be noted that the above examples of materials of the inner shell 10 and the outer shell 20 are only illustrative and do not limit the present application.

[0091] Through the above implementation method, the computing module 400, power supply module 300, fan 200, and other modules of computing device 1 are integrated and arranged in an inner and outer double-layer protective shell, improving the integration and scalability of computing device 1. The frame structure of the inner shell 10 and the cavity design of the outer shell 20 together provide good physical protection, ensuring the reliability of computing device 1 in various working environments. The sliding installation method allows for easy installation and disassembly of the inner shell 10, improving the ease of maintenance. The frame structure design of the inner shell 10 and the effective layout of the fan 200 enhance airflow and improve the heat dissipation efficiency of the computing module 400 and power supply module 300, achieving good heat dissipation within the limited space of computing device 1.

[0092] In one implementation, such as Figure 3 and Figure 4 As shown, the inner shell 10 may have a receiving cavity 10a inside, and the computing module 400 and the power module 300 may be arranged side by side in the receiving cavity 10a along the first direction L1; the top of the inner shell 10 is defined by a mounting groove 10b, and the fan 200 is disposed in the mounting groove 10b.

[0093] Exemplarily, the top of the inner shell 10 may define a mounting groove 10b, and the fan 200 may pass through the mounting groove 10b along the first direction L1. The interior of the inner shell 10 may define a receiving cavity 10a, and the power module 300 and the computing module 400 may be electrically connected to each other. The electrically connected power module 300 and computing module 400 may pass through the receiving cavity 10a of the inner shell 10 along the first direction L1. The power module 300 and computing module 400 may be electrically connected via gold fingers. This embodiment of the application does not specifically limit the connection method between the power module 300 and the computing module 400.

[0094] For example, the fan 200 can be installed on top of the computing module 400 and the power module 300, with its air inlet facing the top of the computing module 400 and the power module 300, and its air outlet perpendicular to the orientation of the air inlet. During the operation of the fan 200, the airflow generated by the fan 200 can rise from the bottom of the inner shell 10, flow through the computing module 400 and the power module 300 into the air inlet of the fan 200, and then be blown out of the inner shell 10 through the air outlet to remove the heat generated by the computing module 400 and the power module 300.

[0095] For example, such as Figure 1 , Figure 2 and Figure 3As shown, the outer wall 12 of the inner shell 10 accommodating cavity 10a may also be provided with a power supply decorative cover 13. Exemplarily, the power supply decorative cover 13 may be disposed on the outer wall 12 of the inner shell 10 at a location corresponding to the mounting position of the power module 300 or computing module 400. The power supply decorative cover 13 may be a flexible structure used to cover and protect the cables passing beneath it. Specifically, the power supply decorative cover may be made of silicone, rubber, or other flexible polymer materials, capable of effectively absorbing external impacts and vibrations, effectively protecting the circuit board and other easily damaged components, and preventing them from being interfered with by the external environment.

[0096] It should be noted that, please continue to refer to Figure 1 The fan 200 may have a snap-fit ​​protrusion 210 at one end along the first direction L1, and the snap-fit ​​protrusion 210 may protrude from the frame of the inner shell 10 at one end along the first direction L1. The power module 300, the computing module 400 and the fan 200 may be fixed to the frame of the inner shell 10 by bolts to prevent the computing device 1 from falling off or shifting during operation or transportation.

[0097] Through the above-described embodiments, by defining a receiving cavity 10a inside the inner shell 10, the computing module 400 and the power module 300 can be effectively integrated into the compact space at the bottom of the fan 200, thereby allowing the heat dissipation airflow formed by the fan 200 to cover the heat source area of ​​the computing device 1. The mounting slot 10b at the top of the inner shell 10 provides a fixed position for the fan 200, enabling the fan 200 to operate stably and generate airflow that penetrates the internal space of the computing device 1, effectively removing heat.

[0098] Figure 9 A partial structural schematic diagram of a computing device according to an embodiment of this application is provided. Referring below... Figure 3 , Figure 4 , Figure 5 and Figure 9 The assembly process of the computing device 1 according to an embodiment of this application is described using a specific example. Figure 3 and Figure 4 As shown, after the power module 300 and computing module 400 are electrically connected, they can be installed inside the receiving cavity 10a of the inner shell 10; the fan 200 can be installed inside the mounting slot 10b of the inner shell 10, and then the fan 200 is electrically connected to the power module 300. This achieves integrated installation of the fan 200, power module 300, and computing module 400 on the inner shell 10. Then, as... Figure 5 As shown, the integrated setup includes a fan 200, a power supply module 300, and a computing module 400 (see [reference]). Figure 9 The computing module 400 and the power supply module 300 are arranged side by side in the L2 direction. Figure 5The computing module 400 (not shown) and the inner shell 10 are inserted through the first mounting opening 10 of the outer shell 20 into the interior of the outer shell 20, thus completing the integrated installation of the various functional modules of the computing device 1 on the housing assembly 100.

[0099] In one implementation, such as Figure 3 and Figure 4 As shown, the top of the inner shell 10 may be provided with a first side baffle 111 and a second side baffle 112. The first side baffle 111 and the second side baffle 112 may be arranged opposite to each other in the second direction L2. An installation groove 10b may be defined between the first side baffle 111 and the second side baffle 112.

[0100] For example, the inner shell 10 can be a cuboid frame structure, and the second direction L2 can be perpendicular to the first direction L1 or parallel to the width direction of the inner shell 10. The width direction of the inner shell 10 can be perpendicular to its length direction and lie in the same plane. It should be noted that the application examples provided in this embodiment are for ease of understanding, and this embodiment does not specifically limit the specific direction of the second direction L2 or its positional relationship with the first direction L1.

[0101] The first side baffle 111 and the second side baffle 112 can be integrally formed with the frame of the inner shell 10 or fixed to the top of the inner shell 10 by fasteners. This application does not specifically limit the specific connection relationship between the first side baffle 111, the second side baffle 112 and the inner shell 10. A mounting groove 10b for mounting the fan 200 can be defined between the first side baffle 111 and the second side baffle 112 to ensure that the fan 200 can be stably installed in the groove.

[0102] In some examples, the first side baffle 111 and the second side baffle 112 may be made of metal and have elastic deformation capability, and the size of the mounting groove 10b formed between them may match the size of the fan 200 in the second direction L2. A damping pad may be provided between the fan 200 and the mounting groove 10b to reduce vibration and noise generated during operation of the fan 200.

[0103] In other examples, the first side baffle 111 and the second side baffle 112 can be designed in a streamlined or zigzag shape to match the air outlet direction of the fan 200, so as to guide the high-temperature airflow that needs to be discharged from the housing assembly 100, optimize the discharge path of the high-temperature airflow, and further optimize the heat dissipation effect of the computing device 1.

[0104] With this structural design, the fan 200 can be stably installed in the mounting slot 10b on the top of the inner shell 10, and can more effectively dissipate heat from the computing module 400 and the power module 300 during operation, ensuring that the device can maintain a stable temperature even when running under high load, thereby improving the overall performance and reliability of the computing device 1.

[0105] For example, such as Figure 2 As shown, the side wall of the inner shell 10 may have a wiring area 14 corresponding to the position of the power module 300. The wiring area 14 is provided through the side wall of the inner shell 10 to connect the mounting cavity 10a of the inner shell 10 and the external space. With this configuration, the wires of the power module 300 can extend through the wiring area 14, thereby facilitating the electrical connection of the power module 300 with other modules via wires.

[0106] For example, such as Figure 4 As shown, the bottom wall of the inner shell 10 may be provided with a positioning member 15, which forms a sliding fit with the bottom of the computing module 400. The positioning member 15 may adopt a groove-shaped structure, and the top of the groove-shaped structure has a sliding groove extending along the first direction L1. The bottom of the computing module 400 forms a sliding fit with the sliding groove, so as to position the computing module 400 during the process of sliding the computing module 400 into the receiving cavity 10a, thereby improving the assembly accuracy of the computing module 400 in the inner shell 10. In one embodiment, as... Figure 3 As shown, the first side baffle 111 and the second side baffle 112 can respectively abut against the outer wall surface of the fan 200.

[0107] For example, the first side baffle 111 and the second side baffle 112 may have elastic deformation capability to adapt to the assembly of fans 200 of different sizes. When the fan 200 is installed in the mounting groove 10b, one side of the outer wall surface of the fan 200 can be abutted against one of the side baffles, and then the fan 200 can be slid into the mounting groove 10b along the first direction L1, so that the other side of the fan 200 abuts against the other side baffle. To enhance the fixing effect, additional snap-fit ​​holes or screw holes can be provided on the first side baffle 111 and the second side baffle 112, and the fan 200 can be further secured by the snap-fit ​​or the bolt tightening.

[0108] In some examples, the first side baffle 111 and the second side baffle 112 can be made of metal. By closely abutting against the outer wall of the fan 200, the fan 200 can be fixed, preventing displacement and detachment that may occur during transportation. The side baffles can also conduct some of the heat from the fan 200, further improving the heat dissipation effect.

[0109] In other examples, the first side baffle 111 and the second side baffle 112 may be made of polymer materials, which enables the computing device 1 to have a lighter weight and good durability, making it suitable for application scenarios with high requirements for weight and durability.

[0110] It should be noted that the above examples of materials for the first side baffle 111 and the second side baffle 112 are merely illustrative and do not constitute a limitation on this application. For example, the first side baffle 111 and the second side baffle 112 can also be made of plastic material with good elastic deformation capability. Those skilled in the art can flexibly set them according to the actual situation.

[0111] In one implementation, such as Figure 3 and Figure 4 As shown, the inner shell 10 has two side walls 12 arranged opposite each other in the second direction L2. The inner wall surfaces of the two side walls 12 may be provided with supporting ribs 121, and the two supporting ribs 121 are respectively arranged adjacent to the top of the inner shell 10. The mounting groove 10b may be defined by the first side baffle 111, the second side baffle 112 and the two supporting ribs 121.

[0112] For example, the material of the supporting rib 121 can be a high-strength, high-temperature resistant material, such as aluminum alloy, stainless steel, or heat-resistant polymer material, which can have sufficient mechanical strength to support and fix the fan 200 and maintain stable performance in high-temperature environments. The cross-sectional shape of the supporting rib 121 can be designed as rectangular, circular, or other specific shapes to optimize its mechanical properties and structural stability. The supporting rib 121 can be fixed or connected to the side wall 12 of the inner shell 10 by welding, screw connection, or integral molding to ensure the strength and stability of the connection and prevent the fan 200 from loosening or falling off due to external forces.

[0113] In this embodiment, the inner wall surfaces of the two sidewalls 12 of the inner shell 10 in the second direction L2 can be respectively provided with supporting ribs 121. The receiving cavity 10a of the inner shell 10 can be defined by the two sidewalls 12 and the two supporting ribs 121 provided in opposite directions L2, and the computing module 400 and the power module 300 can be arranged in the receiving cavity 10a of the inner shell 10. Exemplarily, the two supporting ribs 121 can be respectively provided near the top of the inner shell 10, and a certain gap can be left between the supporting ribs 121 and the top of the computing module 400 to avoid the adverse effects caused by the top of the high-temperature computing module 400 contacting the housing assembly 100, while ensuring that the airflow generated by the fan 200 can fully flow through the computing module 400 and the power module 300, thereby improving the heat dissipation efficiency. In a specific example, the mounting groove 10b can be defined by the first side baffle 111, the second side baffle 112 and two supporting ribs 121. The outer wall surface of the fan 200 can abut against the first side baffle 111 and the second side baffle 112 respectively. At the same time, the bottom of the fan 200 can be supported by the two supporting ribs 121, so that the fan 200 can obtain a stable support point in the mounting groove 10b, and realize the assembly and fixation of the fan 200 in the mounting groove 10b.

[0114] For example, the support rib 121 can be formed by protruding inward from the inner wall of the side wall 12, and the length direction of the support rib 121 can be parallel to the first direction L1. For example, the fan 200 can be disposed in the mounting groove 10b along the first direction L1, and the side wall 12 of the mounting groove 10b can protrude inward to form the support rib 121, providing stable support for the bottom of the fan 200. At the same time, the length direction of the support rib 121 can be parallel to the first direction L1, ensuring that the support rib 121 provides continuous support for the fan 200, avoiding local stress concentration, and ensuring the stability of the fan 200 assembly.

[0115] In one implementation, such as Figure 3 and Figure 4 As shown, the two side walls 12 of the inner shell 10 can be respectively provided with limiting flanges 122, and the limiting flanges 122 can extend downward from the side walls 12 in the direction toward the inner wall surface of the outer shell 20.

[0116] like Figure 5 As shown, the outer shell 20 may be provided with two opposing inner wall surfaces in the second direction L2. The stop 211 extends upward from the inner wall surface of the outer shell 20 in the direction toward the outer wall surface of the inner shell 10, and the stop 211 may be located on the lower side of the limiting fold 122.

[0117] For example, the outer wall surfaces of the two side walls 12 of the inner shell 10 may be provided with limiting flanges 122 respectively. Specifically, the limiting flanges 122 may be provided at the top, middle or bottom of the side wall 12. This application does not limit the specific location of the limiting flanges 122 on the side wall 12 of the inner shell 10.

[0118] For example, see Figure 1 The limiting flange 122 may be provided on the side wall 12 and extend downwardly at an angle from the side wall 12 toward the inner wall surface of the outer casing 20. See also Figure 5 Stoppers 211 can be provided on the two inner wall surfaces of the outer shell 20 in the second direction L2 at the positions corresponding to the limiting flanges 122. The stoppers 211 can extend upward from the inner wall surface of the outer shell 20 in the direction toward the outer wall surface of the inner shell 10. The inclination angle of the stoppers 211 can match the inclination angle of the limiting flanges 122 to limit the installation position of the inner shell 10 in the outer shell 20.

[0119] For example, the shape and structure of the stop 211 can be configured according to the actual space within the cavity of the housing 20. See, for example, [link to relevant documentation]. Figure 5The stop 211 can be bent once at its end near the inner wall of the outer shell 20, and the other end can continue to extend upward in the direction toward the outer wall of the inner shell 10. This bending structure can provide a clear locking point to ensure that when the inner shell 10 is slidably installed on the outer shell 20, the stop 211 can cooperate with the installation of the corresponding extension of the limiting fold 122.

[0120] For example, see [link to previous article] Figure 5 The limiting flange 122 of the inner shell 10 can abut against the stop member 211 of the outer shell 20 to improve the stability of the inner shell 10 installation. The limiting flange 122 of the inner shell 10 can also be kept separate from the stop member 211 of the outer shell 20 to avoid the adverse effects of the high-temperature inner shell 10 contacting the outer shell 20, while ensuring that the airflow generated by the fan 200 can flow fully through the gap between the inner shell 10 and the outer shell 20, thereby improving heat dissipation efficiency.

[0121] Understandably, during the sliding installation of the inner shell 10 into the outer shell 20, the limiting flange 122 of the inner shell 10 aligns with the stop 211 of the outer shell 20, providing a guiding function so that the inner shell 10 can smoothly slide into the outer shell 20. During the transport of the housing assembly 100, when the inner shell 10 moves vertically or horizontally due to bumps, the limiting flange 122 gradually approaches and eventually contacts the stop 211 because the inclined directions of the limiting flange 122 and the stop 211 are opposite. This allows the limiting flange 122 to accurately engage above the stop 211, preventing the inner shell 10 from shifting due to vibration or external forces during use. This design simplifies the installation process of the inner shell 10 and improves the overall structural stability and reliability of the device, thereby ensuring the normal operation and service life of the device.

[0122] In one implementation, such as Figure 5 As shown, the side wall of the outer casing 20 may have an air outlet 20b communicating with the cavity, and the bottom wall of the outer casing 20 may have an air inlet 20c communicating with the cavity. Exemplarily, the side wall 12 of the outer casing 20 along the second direction L2 may have an air outlet 20b communicating with the cavity, and one or more air outlets 20b communicating with the cavity may be opened on one or both sides of the outer casing 20 along the second direction L2. This embodiment does not impose specific limitations on this. When the fan 200 performs a heat dissipation task, airflow can enter the housing assembly 100 from the air inlet 20c on the bottom wall of the outer casing 20, and warm air generated by the computing module 400 can be blown out from the side wall of the outer casing 20.

[0123] For example, see [link to previous article] Figure 5The bottom of the inner shell 10 may have a bottom opening area communicating with the receiving cavity 10a, and the side of the inner shell 10 may have a side opening area communicating with the receiving cavity 10a. The bottom opening area is correspondingly connected to the air inlet 20c, and the side opening area is correspondingly connected to the air outlet 20b.

[0124] In this embodiment, the cross-flow fan 200 can be arranged in the frame structure of the inner shell 10. Its specific location can be optimized based on the heat source distribution of the computing module 400 and the power module 300 to ensure optimal heat dissipation. The internal cavities of the housing assembly 100 can be interconnected. The inner shell 10 and the outer shell 20 can define a connected heat dissipation duct based on the heat source modules of the computing device 1. The airflow generated by the fan 200 can effectively pass through the duct, carrying away the heat generated by the computing module 400 and the power module 300 during operation. The bottom of the inner shell 10 can have a bottom opening area communicating with the receiving cavity 10a, and the sides of the inner shell 10 can have side opening areas communicating with the receiving cavity 10a. The bottom opening area can be correspondingly connected to the air inlet 20c of the outer shell 20, and the side opening area can be correspondingly connected to the air outlet 20b.

[0125] For example, see [link to previous article] Figure 5 The bottom and side opening areas of the inner shell 10 can be correspondingly set to the air inlet 20c and air outlet 20b of the fan 200. The size of the bottom and side opening areas of the inner shell 10 can be larger than the size of the air inlet 20c and air outlet 20b of the fan 200. The size of the air inlet 20c and air outlet 20b of the outer shell 20 can be correspondingly set to the size of the bottom and side opening areas of the inner shell 10. Specifically, the area of ​​the air inlet 20c and air outlet 20b of the outer shell 20 can be larger than the area of ​​the bottom and side opening areas of the inner shell 10.

[0126] It should be noted that the above examples do not constitute a limitation of this application. The outer shell 20 and the inner shell 10 are connected by open areas at the bottom and sides, allowing airflow. During the cooling process of the fan 200, the airflow can enter from the air inlet 20c of the outer shell 20, enter the receiving cavity 10a of the inner shell 10 through the bottom open area, carry away the heat generated by the operation of the computing module 400, and then be discharged through the side open areas of the inner shell 10 and finally from the air outlet 20b of the outer shell 20.

[0127] In this embodiment, multiple temperature sensors can be installed at key locations of the computing module 400 and power module 300 on the inner shell 10 and outer shell 20 to monitor the temperature of the computing module 400 and power module 300 in real time and provide feedback to the control module 500. The fan 200 can be connected to the control module of the computing device 1. The control module 500 can automatically adjust the speed of the fan 200 based on real-time temperature monitoring data to ensure that the computing device 1 maintains the optimal temperature under different workloads.

[0128] Figure 6A A bottom view of a computing device according to one embodiment of this application is provided as an example. Figure 6B A bottom view of a computing device according to another embodiment of this application is provided as an example. Exemplarily, as shown... Figure 6B As shown, an ambient temperature detection unit 70 can be installed at the bottom of the outer casing 20 to detect the ambient temperature of the environment in which the computing device 1 is located. The ambient temperature detection unit 70 is electrically connected to the control module 500 to transmit the ambient temperature detection result to the control module 500. The control module 500 can control the operating parameters of the fan 200 according to the ambient temperature detection result. For example, if the ambient temperature detection result is lower than the temperature threshold, the control module 500 can control the fan 200 to increase its speed to improve the heat exchange efficiency between the airflow and the computing module 400, or the control module 500 can control the computing module 400 to increase its computing power to increase the heat generation of the computing module 400, thereby increasing the outlet air temperature of the computing device 1 and thus improving the heating effect in low-temperature environments.

[0129] In one implementation, such as Figure 1 As shown, an air outlet baffle 22 is detachably installed at the air outlet 20b of the housing 20, and an air outlet filter assembly (not shown in the figure) may be provided on the air outlet baffle 22; and / or, an air inlet baffle 23 is detachably installed at the air inlet 20c of the housing 20, and an air inlet filter assembly 24 may be provided on the air inlet baffle 23.

[0130] In the embodiments of this application, see Figure 1 To protect the internal components of the computing device 1 and ensure efficient airflow and air cleanliness, the outer shell 20 of the housing assembly 100 is detachably equipped with an air inlet baffle 23 or an air outlet baffle 22 at the air inlet 20c or air outlet 20b. An air inlet filter assembly 24 and an air outlet filter assembly (not shown in the figure) can be respectively installed on the air inlet baffle 23 and the air outlet baffle 22. Exemplarily, in terms of connection sequence, the air outlet baffle 22 and the air inlet baffle 23 can be installed first, and then the air inlet filter assembly 24 and the air outlet filter assembly can be fixed to the corresponding baffles.

[0131] For example, the inlet baffle 23 and the outlet baffle 22 can be designed as a window structure with grilles or a louvered structure. The arrangement or tilt angle of the grilles and louvers can be fixed or flexibly adjusted to guide the airflow and thus flexibly change the direction of the airflow. The materials of the inlet baffle 23, the outlet baffle 22, and the filter assembly can be selected from high-temperature resistant and corrosion-resistant metals or polymer materials to ensure stability and durability during long-term use.

[0132] For example, multiple temperature sensors can be installed at key locations such as the air inlet 20c and the air outlet 20b to detect the inlet air temperature at the air inlet 20c and the outlet air temperature at the air outlet 20b of the housing assembly 100 in real time, and feed this information back to the control module 500. In an application scenario where the computing device 1 is used as a heating device, the fan 200 and the computing module 400 can be connected to the control module 500 of the computing device 1. The control module 500 can automatically adjust the operating power of the computing module 400 and the speed of the fan 200 based on real-time temperature monitoring data to meet the corresponding heating requirements within the normal operating range of the computing device 1.

[0133] For example, an electric heating device can be installed at the air outlet 20b of the housing assembly 100 to supplement the heating with the exhaust warm air. A heat collection device such as a hot air guide pipe can be installed at the air outlet baffle 22 to concentrate the heat of the exhaust warm air for heating. An auxiliary fan can also be installed at the air outlet 20b to enhance the flow of hot air and ensure that the heat can be effectively transferred to the location that needs to be heated.

[0134] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can install any form of airflow guiding structure or heating device at the air outlet 20b to optimize the airflow effect of the computing device 1 or increase the airflow temperature of the computing device 1.

[0135] In one implementation, such as Figure 6B As shown, an air inlet filter assembly 24 is provided at the air inlet 20c at the bottom of the housing assembly 100. The air inlet filter assembly 24 is detachably connected to the bottom of the housing assembly 100 and covers the air inlet 20c. The air inlet filter assembly 24 is used to filter the air entering the air inlet 20c.

[0136] Figure 10A An exemplary schematic diagram of the air inlet filter assembly of a computing device according to an embodiment of this application is provided. Figure 10B An exemplary side view of the air inlet filter assembly of a computing device according to an embodiment of this application is provided. Figure 10C An exploded structural diagram of the air inlet filter assembly of a computing device according to an embodiment of this application is provided. Exemplarily, as shown... Figure 10A to Figure 10CAs shown, the air inlet filter assembly 24 includes a first locking plate 241, a filter element 242, and a second locking plate 243 stacked in a direction away from the air inlet 20c. A compression space is formed between the first locking plate 241 and the second locking plate 243, and the filter element 242 is disposed in the compression space between the first locking plate 241 and the second locking plate 243.

[0137] In some examples, the air inlet filter assembly 24 can be detachably connected to the bottom of the housing assembly 100 via a snap-fit ​​structure. For example, the surface of the first snap-fit ​​plate 241 adjacent to the housing assembly 100 may be provided with multiple snap-fit ​​protrusions, and the surface of the bottom of the housing assembly 100 may be provided with multiple snap-fit ​​holes. The multiple snap-fit ​​protrusions are engaged in the multiple snap-fit ​​holes one by one to realize the installation of the air inlet filter assembly 24 on the bottom of the housing assembly 100.

[0138] In other examples, the air intake filter assembly 24 can be detachably connected to the bottom of the housing assembly 100 via magnetic attraction. For example, such as Figure 10C As shown, the air inlet filter assembly 24 may also include multiple magnetic elements 244, which are evenly distributed on the first locking plate 241 and / or the second locking plate 243. The housing assembly 100 may be made of metal, and the air inlet filter assembly 24 is magnetically attracted to the housing assembly 100 by the multiple magnetic elements 244, thereby achieving a detachable connection between the two.

[0139] It should be noted that the above is merely an exemplary description and should not be construed as a limitation on the embodiments of this application. In other examples of this application, the air inlet filter assembly 24 may also be detachably connected to the bottom of the housing assembly 100 by fasteners such as screws.

[0140] For example, the connection between the first locking plate 241 and the second locking plate 243 can be a detachable connection.

[0141] In some examples, the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 can be detachably connected by a snap-fit ​​structure.

[0142] In other examples, the first locking plate 241 and the second locking plate 243 can be detachably connected by fasteners such as screws.

[0143] With this configuration, after the computing device 1 has been used for a period of time, the first locking plate 241 and the second locking plate 243 can be disassembled, and the filter element 242 sandwiched between them can be taken out for cleaning or replacement to ensure the filtration capacity of the air intake filter assembly 24.

[0144] It should be noted that the above description is merely exemplary and should not be construed as a limitation on the embodiments of this application. Regarding the connection method of the first locking plate 241 and the second locking plate 243, those skilled in the art can also employ other forms of detachable connection. Furthermore, the first locking plate 241 and the second locking plate 243 can also be connected using a non-detachable connection method, such as by ultrasonic welding.

[0145] For example, the filter element 242 may be made of filter cotton with a certain thickness, and the filter cotton has multiple tiny cavity structures inside, which are used to contain the trapped dust and other fine impurities during the air passage.

[0146] For example, see Figure 10A The first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 each have multiple ventilation areas 245 that are hollowed out. The ventilation areas 245 are arranged through the thickness of the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243 to connect the upper and lower surfaces of the first snap-fit ​​plate 241 and the second snap-fit ​​plate 243. The multiple ventilation areas 245 on the first snap-fit ​​plate 241 correspond one-to-one with the multiple ventilation areas 245 on the second snap-fit ​​plate 243. With this arrangement, air can sequentially pass through the multiple ventilation areas on the second snap-fit ​​plate 243, the filter element 242, and the multiple ventilation areas on the first snap-fit ​​plate 241 before entering the air inlet 20c.

[0147] In some examples, the cross-sectional shape of the ventilation area 245 on the first locking plate 241 and the second locking plate 243 can be a regular hexagon or a part of a regular hexagon.

[0148] In other examples, the cross-sectional shape of the ventilation area 245 on the first locking plate 241 and the second locking plate 243 may be a regular pentagon or a part of a regular pentagon.

[0149] In other examples, the cross-sectional shape of the ventilation area 245 on the first locking plate 241 and the second locking plate 243 may be triangular or a part of a triangle.

[0150] In other examples, the cross-sectional shape of the ventilation area 245 on the first locking plate 241 and the second locking plate 243 can be circular or elliptical.

[0151] It should be noted that the above is only an exemplary description. Regarding the cross-sectional shape of the ventilation area 245 on the first snap plate 241 and the second snap plate 243, the art can flexibly set it according to the actual situation. For example, any geometric shape such as a heptagon or an octagon can also be used.

[0152] For example, the first side surface of the first locking plate 241 adjacent to the second locking plate 243 can be configured as an uneven, non-planar surface, and the second side surface of the second locking plate 243 adjacent to the first locking plate 241 can also be configured as an uneven, non-planar surface. The shape of the first side surface of the first locking plate 241 matches the shape of the second side surface of the second locking plate 243, so that the filter element 242 pressed between the first locking plate 241 and the second locking plate 243 is uneven and non-flat. The filter element 242 has a similar thickness in different regions.

[0153] In some examples, the first side surface of the first locking plate 241 adjacent to the second locking plate 243 and the second side surface of the second locking plate 243 adjacent to the first locking plate 241 can be set to be wavy, so that the overall shape of the filter element 242 is wavy.

[0154] In other examples, the first side surface of the first locking plate 241 adjacent to the second locking plate 243 and the second side surface of the second locking plate 243 adjacent to the first locking plate 241 can be set as serrated so that the overall shape of the filter element 242 is serrated.

[0155] This configuration increases the surface area of ​​the filter element 242, thereby increasing the filtration area of ​​the filter element 242 for air and improving the filtration effect of the air intake filter assembly 24.

[0156] In one implementation, such as Figure 2 As shown, the housing assembly 100 may further include a mounting side plate 30, which is detachably mounted to the first mounting opening 20a to close the first mounting opening 20a. The mounting side plate 30 may be made of a high-strength, corrosion-resistant material, such as aluminum alloy or stainless steel, to ensure its stability and durability during long-term use. The mounting side plate 30 is used to close the housing 20 of the housing assembly 100 after the inner housing 10 is slidably mounted to the cavity of the outer housing 20.

[0157] For example, the mounting side plate 30 may be provided with through holes corresponding to the positions of the first limiting post 123 and the second limiting post 212. When assembling the mounting side plate 30, screws can be passed through the through holes and tightened into the screw holes on the first limiting post 123 and the second limiting post 212 to achieve a firm connection between the inner shell 10 or the outer shell 20 and the mounting side plate 30. This bolt fixing method can further enhance the connection strength between the inner shell 10, the outer shell 20 and the mounting side plate 30.

[0158] In one implementation, such as Figure 2As shown, the end of the fan 200 adjacent to the first mounting opening 20a may be provided with a snap-fit ​​protrusion 210, and the mounting side plate 30 may be provided with a through first snap-fit ​​hole 30a, which can be snap-fitted into the fan 200 with the snap-fit ​​protrusion 210.

[0159] For example, the fan 200 may have a snap-fit ​​protrusion 210 at its end adjacent to the first mounting opening 20a. After the fan 200 is disposed in the mounting groove 10b of the inner shell 10 along the first direction L1, one end of the snap-fit ​​protrusion 210 may protrude from the frame of the inner shell 10 along the first direction L1. After the inner shell 10 is slidably mounted in the cavity of the outer shell 20, the snap-fit ​​protrusion 210 may also correspondingly protrude from the end of the outer shell 20 adjacent to the first mounting opening 20a.

[0160] For example, the housing assembly 100 can be sealed by a mounting side plate 30 with a through-hole. Specifically, the snap-fit ​​protrusion 210 of the fan 200 can be aligned with the first snap-fit ​​hole 30a on the mounting side plate 30, and a certain pressure can be applied to insert the snap-fit ​​protrusion 210 into the first snap-fit ​​hole 30a to form a stable snap-fit ​​fit, ensuring that the fan 200 is securely fixed on the mounting side plate 30, while facilitating disassembly and maintenance.

[0161] In one implementation, such as Figure 2 As shown, the mounting side plate 30 may have a through-hole 30c, which can be used for cables connecting the control module 500 and the power module 300 to pass through. The control module 500 is located outside the receiving cavity 10a of the inner shell 10.

[0162] In this embodiment, the computing device 1 may further include a control module 500. Exemplarily, the control module 500 of the computing device 1 is a module that implements functions such as power control, temperature monitoring and management, and data communication. Components such as the power module 300, computing module 400, and heat dissipation module can be electrically connected to the control module 500 via cables, and the control module 500 performs system monitoring and task management.

[0163] In some examples, the control module 500 is used to automatically adjust the operating power of the computing module 400 and the speed of the fan 200 based on real-time temperature monitoring data, ensuring that the computing device 1 maintains the optimal temperature under different workloads. The mounting side plate 30 may have a cable pass-through hole 30c for the cables connecting the control module 500 and the power module 300 to pass through. The periphery of the cable pass-through hole 30c may be made of a soft material and insulated to prevent cable wear and short circuits.

[0164] See Figure 6BIn some examples, the wireless communication unit 60 of the control module 500 may be arranged on the bottom wall of the housing 20. Specifically, the communication module of the control module 500 may be a Bluetooth device or a wireless WIFI connection device, etc. In addition, the bottom wall of the housing 20 may also integrate a power input unit 301, a switch unit 302, an ambient temperature detection unit 70, etc., but this application embodiment does not specifically limit this.

[0165] Figure 7 An exploded view of the control module of a computing device according to an embodiment of this application is provided, such as... Figure 2 and Figure 7 As shown, the control module 500 may also include a control box 510. The control box 510 may have a snap-fit ​​protrusion 5121 on the side adjacent to the mounting side plate 30, and the mounting side plate 30 may have a through second snap-fit ​​hole 30b, and the snap-fit ​​protrusion 5121 and the second snap-fit ​​hole 30b form a snap-fit ​​engagement.

[0166] For example, see Figure 2 and Figure 7 The control box 510 may have a snap-fit ​​protrusion 5121 on the side adjacent to the mounting side plate 30, and a corresponding through second snap-fit ​​hole 30b may be provided on the top of the mounting side plate 30. In this embodiment, the number, shape and position of the snap-fit ​​protrusion 5121 and the second snap-fit ​​hole 30b are not specifically limited. After the mounting side plate 30 is installed in the first mounting opening 20a of the housing 20, the snap-fit ​​protrusion 5121 of the control box 510 can be aligned with the second snap-fit ​​hole 30b on the mounting side plate 30. By applying a certain pressure, the snap-fit ​​protrusion 5121 is embedded into the second snap-fit ​​hole 30b to form a stable snap-fit ​​fit, ensuring that the control box 510 is securely fixed on the mounting side plate 30 and located in the mounting space extending from the housing 20 along the first direction L1, thereby completing the installation of the control module 500 of the computing device 1, while facilitating disassembly and maintenance.

[0167] Through the above-described implementation, the snap-fit ​​design between the mounting side plate 30 and the fan 200 and control module 500 ensures both stable installation of the fan 200 and control module 500 and facilitates disassembly and maintenance of the fan 200 and control module 500. The independent installation space design for the control module 500 provides sufficient installation space and also maintains physical isolation between the control module 500 and the receiving cavity 10a of the inner shell 10, facilitating maintenance and heat dissipation. The design of the cable routing hole 30c ensures neat cable routing, further improving the overall performance of the computing device 1.

[0168] In one implementation, such as Figure 1 and Figure 2As shown, the outer casing 20 has a second mounting opening (not shown) on the other side in the first direction L1. The casing assembly 100 also includes a cover side plate 40, which is detachably mounted to the second mounting opening to close the second mounting opening. Exemplarily, the cover side plate 40 can be used to close the outer casing 20 of the casing assembly 100 after the inner casing 10 is slidably mounted to the cavity of the outer casing 20.

[0169] For example, see Figure 1 The cover side plate 40 can be provided with through holes corresponding to the positions of the second limiting post 212. When assembling the cover side plate 40, bolts can be passed through the through holes and tightened into the screw holes on the second limiting post 212 to achieve a firm connection between the outer shell 20 and the cover side plate 40. This bolt fixing method can further enhance the connection strength between the outer shell 20 and the cover side plate 40.

[0170] In this way, the computing device 1 provided in this application embodiment integrates the computing module 400, power supply module 300, fan 200, etc., within an inner and outer double-layer protective shell, thereby improving the integration of the computing device 1. Through a sliding installation method, the inner shell 10 can be easily installed and disassembled, improving the ease of maintenance of the device, while achieving good heat dissipation within the limited space of the computing device 1.

[0171] Figure 11A An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided from one perspective. Figure 11B An exemplary three-dimensional structural diagram of a computing device according to an embodiment of this application is provided from one perspective, such as... Figure 11A and Figure 11B As shown, in one embodiment, the cover side plate 40 and the control module 500 are located on opposite sides of the housing 20 in the first direction L1. The cover side plate 40 is provided with a snap-fit ​​portion 41, and the control module 500 is provided with a snap-fit ​​mating portion 513. In two computing devices 1 arranged adjacent to each other along the first direction L1, the snap-fit ​​portion 41 of one computing device 1 and the snap-fit ​​mating portion 513 of the other computing device 1 form a snap-fit ​​mating.

[0172] In this embodiment, multiple computing devices 1 can be integrated to form a computing device cluster. Exemplarily, the multiple computing devices 1 can be arranged adjacently along a first direction L1, each computing device 1 having a first end and a second end in the first direction. The control module 500 of the computing device 1 is located at the first end, and the cover side plate 40 of the computing device 1 is located at the second end. In two adjacent computing devices 1, the second end of the first computing device is adjacent to the first end of the second computing device, and the snap-fit ​​portion 41 on the cover side plate 40 of the first computing device forms a snap-fit ​​engagement with the snap-fit ​​mating portion 513 on the control module 500 of the second computing device.

[0173] In some examples, the snap-fit ​​portion 41 may be formed by protruding outward from the outer side wall of the cover side plate 40, and the snap-fit ​​mating portion 513 may be formed by recessing inward from the outer side wall of the control module 500. Thus, the snap-fit ​​portion 41 can be inserted into the snap-fit ​​mating portion 513 to form a snap-fit.

[0174] In other examples, the snap-fit ​​portion 41 may be formed by an inward recess from the outer side wall of the cover side plate 40, and the snap-fit ​​mating portion 513 may be formed by an outward protrusion from the outer side wall of the control module 500. Thus, the snap-fit ​​mating portion 513 can be inserted into the snap-fit ​​portion 41 to form a snap-fit.

[0175] It should be noted that the above is merely an illustrative example and should not be construed as a limitation of this application. In other examples of this application, the latching portion 41 and the latching mating portion 513 can also adopt other arbitrary structures, which can be flexibly set by those skilled in the art according to actual conditions. For example, one of the latching portion 41 and the latching mating portion 513 can be a protruding structure, and the other can be a matching card hole structure. As another example, the latching portion 41 and the latching mating portion 513 can also be magnetic components with mutual magnetic attraction, and the two can be attracted to each other by magnetic force so that two adjacent computing devices 1 can be fixed relative to each other.

[0176] Furthermore, the number of snap-fit ​​parts 41 and snap-fit ​​mating parts 513 can be one or more sets correspondingly arranged, which can be flexibly configured according to the actual situation by those skilled in the art. For example, the number of snap-fit ​​parts 41 and snap-fit ​​mating parts 513 can each be one, with the snap-fit ​​part 41 disposed in the central area of ​​the cover side plate 40 and the snap-fit ​​mating part 513 disposed in the central area of ​​the control module 500. As another example, the number of snap-fit ​​parts 41 can be multiple, with multiple snap-fit ​​parts 41 arranged circumferentially adjacent to the outer periphery of the cover side plate 40, and the number of snap-fit ​​mating parts 513 can be multiple, with multiple snap-fit ​​mating parts 513 arranged circumferentially adjacent to the outer periphery of the control module 500.

[0177] Figure 12 An exemplary assembly diagram of the control module and housing assembly of a computing device according to an embodiment of this application is provided, such as... Figure 12As shown, exemplarily, the cover side plate 40 is further provided with a plurality of first hooks 42, which are disposed on the inner sidewall of the cover side plate 40 and arranged circumferentially adjacent to the outer periphery of the cover side plate 40. The first hooks 42 are used to engage with the inner sidewall of the housing assembly 100 adjacent to the second mounting opening to ensure the connection and fastening of the cover side plate 40 at the second mounting opening.

[0178] In one implementation, such as Figure 1 and Figure 12 As shown, the housing assembly 100 also includes a plurality of supports 50 disposed at the bottom of the housing 20.

[0179] For example, the support 50 is detachably connected to the bottom of the housing 20 to ensure that the airflow flows smoothly through the air inlet 20c on the housing 20 into the housing assembly 100 of the computing device 1, thereby reducing the vibration and noise caused by the operation of the computing device 1.

[0180] In some examples, such as Figure 12 As shown, the top of the support 50 is provided with multiple second hooks 51, and the bottom of the housing 20 is provided with multiple slots (not shown in the figure). The multiple second hooks 51 and the multiple slots are engaged in a one-to-one manner to realize the detachable connection of the support 50 to the bottom of the housing 20.

[0181] In other examples, such as Figure 6B As shown, the support 50 has a through hole for the fastening screw 53 to pass through, so that the fastening screw 53 and the screw hole (not shown in the figure) at the bottom of the housing 20 form a threaded connection, so as to realize the detachable connection of the support 50 at the bottom of the housing 20.

[0182] It should be noted that the above description is merely illustrative and should not be construed as limiting this application. Regarding the connection method between the support 50 and the bottom of the housing 20, those skilled in the art can flexibly configure it according to actual circumstances; for example, a detachable connection method combining a hook structure and fasteners can also be used.

[0183] For example, such as Figure 6B As shown, the bottom of the support 50 can also be provided with an elastic support pad 52, and the number of elastic support pads 52 can be multiple. With this configuration, the support 50 can contact the ground or other supporting surfaces through the elastic support pads 52, thereby providing a certain shock absorption effect for the computing device 1. As for the material of the elastic support pad 52, it can be any material with elastic properties such as rubber, and this embodiment does not make specific limitations on this.

[0184] In one implementation, such as Figure 12As shown, the outer casing 20 may have an extension portion extending along a first direction L1, the extension portion defining an installation space 25, the installation space 25 being adjacent to the inner casing 10 in the first direction L1, and the installation space 25 being used to install the control module 500.

[0185] For example, see Figure 2 and Figure 12 The two side walls 12 of the outer casing 20 along the second direction L2 and the bottom wall of the outer casing 20 can extend outward along the first direction L1, and the extended portions can define an installation space 25 for installing the control module 500 of the computing device 1. The top of the installation space 25 can be opened. With this configuration, the control module 500 can be installed into the installation space 25 from above. When it is necessary to inspect or replace the control module 500, the module can be removed from the top for processing without disassembling other parts, simplifying the installation and maintenance process.

[0186] In one embodiment, the inner shell 10 may be a sheet metal part, and the outer shell 20 may be a profile part; or, the inner shell 10 and the outer shell 20 may be profile parts.

[0187] In one example, the inner shell 10 can be a sheet metal structure to achieve a complex structural design for the inner shell 10 frame. The outer shell 20 can be a profile component to ensure the consistency of the outer shell 20 structure.

[0188] In another example, the inner shell 10 and the outer shell 20 can be profiles to simplify the manufacturing process, improve production efficiency, and ensure the consistency of the overall structure.

[0189] Figure 8 A three-dimensional structural schematic diagram of a computing device according to an embodiment of this application is provided. As another aspect of this application, such as Figure 1 , Figure 2 and Figure 8 As shown, this application embodiment also provides a computing device 1, including: a housing assembly 100 for computing device 1 as described in any of the above embodiments of this application; and a computing module 400, a power module 300, and a fan 200 integrated into the inner shell 10 of the housing assembly 100.

[0190] The computing module 400, power module 300, fan 200 and other modules of computing device 1 can be integrated into the inner and outer double-layer shell assembly 100, which improves the integration and structural stability of computing device 1. The inner shell 10 can be easily installed and disassembled by sliding installation, which improves the ease of maintenance of the equipment. The air inlet 20c and air outlet 20b on the outer shell 20 improve the heat dissipation efficiency of computing module 400 and power module 300, and achieve good heat dissipation effect in the limited space of computing device 1.

[0191] Other configurations of the computing device 1 in the above embodiments can be adopted from various technical solutions now and in the future known to those skilled in the art, and will not be described in detail here.

[0192] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0193] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0194] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0195] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0196] It should be noted that although the steps of the method in this application are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps. The above drawings are merely illustrative of the processes included in the method according to exemplary embodiments of this application and are not intended to be limiting. It is readily understood that the processes shown in the above drawings do not indicate or limit the temporal order of these processes. Furthermore, it is readily understood that these processes may be performed synchronously or asynchronously in multiple modules, for example.

[0197] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0198] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A housing assembly for a computing device, comprising: The computing device comprises a computing module, a power module and a fan; the shell assembly comprises: an inner shell, the computing module, the power module and the fan are integrally arranged in the inner shell; an outer shell, an inner part of the outer shell is defined as a cavity, a first installation opening is formed on one side of the outer shell in a first direction, and the inner shell is slidably installed in the cavity through the first installation opening.

2. The housing assembly for a computing device of claim 1, wherein, An inner part of the inner shell is defined as a containing cavity, the computing module and the power module are arranged side by side in the containing cavity along the first direction; a top of the inner shell is defined as an installation slot, and the fan is arranged in the installation slot.

3. The housing assembly for a computing device of claim 2, wherein, A first side baffle and a second side baffle are arranged on the top of the inner shell, the first side baffle and the second side baffle are oppositely arranged in a second direction, and the installation slot is defined between the first side baffle and the second side baffle.

4. The housing assembly for a computing device of claim 3, wherein, The first side baffle and the second side baffle respectively abut against an outer wall surface of the fan.

5. The housing assembly for a computing device of claim 3, wherein, The inner shell has two side walls oppositely arranged in the second direction, inner wall surfaces of the two side walls are respectively provided with support ribs, and the two support ribs are respectively arranged adjacent to the top of the inner shell; wherein the installation slot is jointly defined by the first side baffle, the second side baffle and the two support ribs.

6. The housing assembly for a computing device of claim 5, wherein, The support rib is formed by protruding inward from the inner wall surface of the side wall, and a length direction of the support rib is parallel to the first direction.

7. The housing assembly for a computing device of claim 5, wherein, The two side walls of the inner shell are respectively provided with limiting folded edges, and the limiting folded edges are extended downward from the side walls in a direction towards the inner wall surface of the outer shell.

8. The housing assembly for a computing device of claim 7, wherein, Opposite inner wall surfaces of the outer shell in the second direction are respectively provided with stoppers, the stoppers are extended upward from the inner wall surface of the outer shell in a direction towards the outer wall surface of the inner shell, and the stoppers are located below the limiting folded edges.

9. The housing assembly for a computing device of claim 2, wherein, A side wall of the outer shell is provided with an air outlet communicated with the cavity, and a bottom wall of the outer shell is provided with an air inlet communicated with the cavity.

10. The housing assembly for a computing device of claim 9, wherein, A bottom part of the inner shell has a bottom open area communicated with the containing cavity, and a side part of the inner shell has a side open area communicated with the containing cavity, the bottom open area is correspondingly communicated with the air inlet, and the side open area is correspondingly communicated with the air outlet.

11. The housing assembly for a computing device of claim 9, wherein, A wind-out baffle is detachably installed at the air outlet of the outer shell, and the wind-out baffle is provided with a wind-out filtering assembly; and / or, an air-in baffle is detachably installed at the air inlet of the outer shell, and the air-in baffle is provided with an air-in filtering assembly.

12. The housing assembly for a computing device of claim 11, wherein, The air-in filtering assembly is detachably connected to the bottom of the outer shell, and covers the air inlet.

13. The housing assembly for a computing device of claim 12, wherein, The air-in filtering assembly comprises a first clamping plate, a filtering piece and a second clamping plate which are stacked in a direction away from the air inlet, an extrusion space is formed between the first clamping plate and the second clamping plate, and the filtering piece is arranged in the extrusion space.

14. The housing assembly for a computing device of claim 13, wherein, The first clamping plate and the second clamping plate are respectively provided with a plurality of hollowed-out ventilation areas, and the ventilation areas are arranged through in a thickness direction of the first clamping plate and the second clamping plate.

15. The housing assembly for a computing device of claim 13, wherein, The first clamping plate is provided with a non-flat surface adjacent to the first side surface of the second clamping plate, the second clamping plate is provided with a non-flat surface adjacent to the second side surface of the first clamping plate, and the first side surface of the first clamping plate is shaped to match the second side surface of the second clamping plate, so that the filter arranged between the first clamping plate and the second clamping plate is in the form of a non-flat plate.

16. The housing assembly for a computing device of any of claims 1-15, wherein, Further comprising: A mounting side plate detachably mounted on the first mounting opening for forming a closure on the first mounting opening.

17. The housing assembly for a computing device of claim 16, wherein, An end portion of the fan adjacent to the first mounting opening is provided with a clamping protrusion, and the mounting side plate is provided with a first clamping hole penetrating therethrough, which forms a clamping fit with the clamping protrusion of the fan.

18. The housing assembly for a computing device of claim 16, wherein, The mounting side plate is provided with a wire passing hole penetrating therethrough, which is used for passing a wire cable connecting the control module and the power module, and the control module is arranged outside the accommodating cavity of the inner shell.

19. The housing assembly for a computing device of claim 18, wherein, The outer shell has an extension portion extending in the first direction, and the extension portion defines a mounting space adjacent to the inner shell in the first direction, and the mounting space is used for mounting the control module.

20. The housing assembly for a computing device of claim 19, wherein, A top portion of the mounting space is open.

21. The housing assembly for a computing device of claim 18, wherein, The control module comprises a control box, and a clamping protrusion is arranged on a side of the control box adjacent to the mounting side plate, and the mounting side plate is provided with a second clamping hole penetrating therethrough, which forms a clamping fit with the clamping protrusion.

22. The housing assembly for a computing device of any of claims 1-15, wherein, The outer shell is provided with a second mounting opening on the other side in the first direction; the shell assembly further comprises: A cover side plate detachably mounted on the second mounting opening for forming a closure on the second mounting opening.

23. The housing assembly for a computing device of claim 22, wherein, The cover side plate and the control module are respectively arranged on opposite sides of the outer shell in the first direction, the cover side plate is provided with a clamping portion, and the control module is provided with a clamping fit portion; in two adjacent computing devices in the first direction, the clamping portion of one of the computing devices forms a clamping fit with the clamping fit portion of the other computing device.

24. The housing assembly for a computing device of any of claims 1-15, wherein, The side wall of the inner shell is provided with a wire passing area corresponding to the position of the power module, and the wire passing area is provided penetratingly on the side wall of the inner shell.

25. The case assembly for a computing device of any one of claims 1 to 15, wherein, The bottom wall of the inner shell is provided with a positioning member, which forms a sliding fit with the bottom of the computing module.

26. The case assembly for a computing device of any one of claims 1 to 15, wherein, The inner shell is a sheet metal part, and the outer shell is a profiled part; or the inner shell and the outer shell are respectively profiled parts.

27. The housing assembly for a computing device of any of claims 1 to 15, wherein, Further comprising: A plurality of supports arranged on the bottom of the outer shell.

28. A computing device, comprising: Including The shell assembly for the computing device according to any one of claims 1 to 27; and The computing module, the power module and the fan are integrally arranged in the inner shell of the shell assembly.

Images