Planar capacitor material with uniform thickness
By designing a first dielectric film and a second dielectric film with complementary thicknesses, the problem of uneven dielectric layer thickness in planar capacitor materials was solved, achieving uniform capacitance density and stability of electronic circuits.
Patent Information
- Application Number
- CN202520289730.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-02-21
AI Technical Summary
During the production of planar capacitor materials, uneven dielectric layer thickness leads to capacitance density deviation, affecting the stability and characteristics of electronic circuits.
By designing the first and second dielectric films to have complementary thicknesses, the thickness of the dielectric layer is ensured to be uniform throughout. The first and second dielectric films with complementary thicknesses are then laminated to form a planar capacitor material with uniform thickness.
This achieves uniformity in dielectric layer thickness, reduces capacitance density deviation, and improves the stability and consistency of electronic circuits.
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Figure CN223743473U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of capacitors, in particular to a planar capacitor material with uniform thickness. BACKGROUND
[0002] Due to slight solvent volatilization, solid content change and tension system abnormality in a polymer dielectric material slurry, the thickness of the dielectric layer of the planar capacitor material is slightly deviated in the production process, thereby affecting the capacitance density (i.e. the capacitance value per unit area; after a kind of dielectric material is selected, the capacitance density is inversely proportional to the thickness of the dielectric layer) of the planar capacitor material, and finally leading to the deviation of the electronic circuit characteristics of the customer and low stability. CONTENT OF THE UTILITY MODEL
[0003] The application aims to provide a planar capacitor material with uniform thickness, the thickness of the first dielectric film and the second dielectric film is complementary, and the thickness of the dielectric layer is uniform.
[0004] To solve the above technical problem, the application provides a planar capacitor material with uniform thickness, which comprises a first electrode plate and a second electrode plate arranged oppositely and at least one dielectric layer connected between the first electrode plate and the second electrode plate, the dielectric layer comprises a first dielectric film and a second dielectric film, the first dielectric film comprises a first thick area and a first thin area, the second dielectric film comprises a second thick area and a second thin area, the first thick area and the second thin area are overlapped together, the second thick area and the first thin area are overlapped together, and the sum of the thicknesses of the first thick area and the second thin area is equal to the sum of the thicknesses of the second thick area and the first thin area.
[0005] Optionally, the first dielectric film comprises a first head edge and a first tail edge arranged oppositely, the first thin area is arranged close to the first head edge, and the first thick area is arranged close to the first tail edge.
[0006] The second dielectric film comprises a second head edge and a second tail edge arranged oppositely, the second thin area is arranged close to the second head edge, and the second thick area is arranged close to the second tail edge.
[0007] When the first dielectric film and the second dielectric film are overlapped together, the first head edge is aligned with the second tail edge, and the second head edge is aligned with the first tail edge.
[0008] Optionally, the thickness of the first dielectric film gradually increases from the first head edge to the direction close to the first tail edge.
[0009] The thickness of the second medium film gradually increases from the second roll head edge to the direction close to the second roll tail edge.
[0010] Optionally, the first medium film further comprises oppositely arranged first and second side edges, and the first medium film comprises a third thick region and a third thin region, the third thick region is arranged close to the first side edge, and the third thin region is arranged close to the second side edge.
[0011] The second medium film further comprises oppositely arranged third and fourth side edges, and the second medium film comprises a fourth thick region and a fourth thin region, the fourth thick region is arranged close to the third side edge, and the fourth thin region is arranged close to the fourth side edge.
[0012] When the first medium film and the second medium film are laminated together, the third thick region and the fourth thin region are laminated together, the fourth thick region and the third thin region are laminated together, the sum of the thicknesses of the third thick region and the fourth thin region is equal to the sum of the thicknesses of the fourth thick region and the third thin region, the first side edge is aligned with the third side edge, and the second side edge is aligned with the fourth side edge.
[0013] Optionally, the thickness of the first medium film gradually decreases from the first side edge to the direction close to the second side edge.
[0014] The thickness of the second medium film gradually decreases from the third side edge to the direction close to the fourth side edge.
[0015] Optionally, when the first medium film and the second medium film are laminated together, the thickness of each of the medium layers is equal.
[0016] Optionally, the planar capacitive material with uniform thickness comprises at least two medium layers, and the plurality of medium layers are laminated together.
[0017] Optionally, the thickness of each of the medium layers is equal; and / or,
[0018] The thickness of each of the medium layers is different.
[0019] Optionally, the thickness of the medium layer is 1-50 um.
[0020] Optionally, the dielectric constant of the medium layer 12 is 10-40.
[0021] The thickness of the first dielectric film and the second dielectric film of the thickness-uniform planar capacitor material of the present application is complementary, which ensures the uniform thickness of the dielectric layer, and thus the thickness-uniform planar capacitor material has a small deviation of the capacitance density from the thickness of the dielectric layer, and can reduce the deviation of the electronic circuit characteristics and has good stability.
[0022] The above description is only a summary of the technical solutions of the present application. In order to make the technical means of the present application more clearly understood and implemented according to the content of the description, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS
[0023] The accompanying drawings are incorporated into the description and form a part of the description, which show embodiments consistent with the present application, and together with the description serve to explain the principles of the present application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, those skilled in the art can obtain other drawings according to these drawings without any creative labor.
[0024] Figure 1 is a cross-sectional structure schematic diagram of the thickness-uniform planar capacitor material of an embodiment of the present application;
[0025] Figure 2 is a plan view schematic diagram of the first dielectric film or the second dielectric film of the present application;
[0026] Figure 3 is a cross-sectional structure schematic diagram of the first dielectric film or the second dielectric film shown in Figure 2 along the A direction;
[0027] Figure 4 is a cross-sectional structure schematic diagram of the first dielectric film or the second dielectric film shown in Figure 2 along the B direction;
[0028] Figure 5 is a cross-sectional structure schematic diagram of the thickness-uniform planar capacitor material of another embodiment of the present application.
[0029] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. Through the above drawings, the specific embodiments of the present application have been shown, and more detailed descriptions will be given in the following. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0030] The following detailed description together with the accompanying drawings makes apparent the advantages and features of the application.
[0031] In the following description, reference is made to the accompanying drawings which form a part hereof, and which show, by way of illustration, several embodiments of the present application. It is understood that other embodiments can be utilized and mechanical, structural, electrical, and operational changes can be made without departing from the spirit and scope of the present application. The following detailed description is, therefore, not to be taken in a limiting sense, as the scope of the present application is defined by the appended claims.
[0032] While the terms first, second, etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
[0033] Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including" when used herein, specify the presence of stated features, steps, operations, elements, components, items, and / or groups but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, and / or groups thereof. As used herein the term "and / or" and "and / or" is construed to be inclusive, or meaning either or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". The exception to this definition will occur when two of A, B, and C are mutually exclusive from one another.
[0034] Figure 1 is a schematic diagram of a cross-section of a planar capacitive material with uniform thickness according to an embodiment of the present application, as shown in Figure 1 The planar capacitive material with uniform thickness includes a first electrode plate 11 and a second electrode plate 13 arranged oppositely, and at least one dielectric layer 12 connected between the first electrode plate 11 and the second electrode plate 13, the dielectric layer 12 includes a first dielectric film 121 and a second dielectric film 122, the first dielectric film 121 includes a first thick region 1211 and a first thin region 1212, the second dielectric film 122 includes a second thick region 1221 and a second thin region 1222, the first thick region 1211 and the second thin region 1222 are laminated together, the second thick region 1221 and the first thin region 1212 are laminated together, and the sum of the thicknesses of the first thick region 1211 and the second thin region 1222 is equal to the sum of the thicknesses of the second thick region 1221 and the first thin region 1212.
[0035] The thickness of the first dielectric film 121 and the second dielectric film 122 of the planar capacitor material with uniform thickness of the present application is complementary, which ensures the uniform thickness of the dielectric layer 12 everywhere, and thus the capacitance density of the planar capacitor material with uniform thickness has a small deviation from the thickness of the dielectric layer 12, which can reduce the deviation of the characteristics of the electronic circuit and has good stability.
[0036] Optionally, Figure 2 is a plan view of the first dielectric film or the second dielectric film of the present application, Figure 3 is Figure 2 is a sectional view of the first dielectric film or the second dielectric film along the A direction, as shown in Figure 1 , Figure 2 and Figure 3 , the first dielectric film 121 includes oppositely arranged first head edge 101 and first tail edge 102, the first thin area 1212 is arranged near the first head edge 101, and the first thick area 1211 is arranged near the first tail edge 102.
[0037] The second dielectric film 122 includes oppositely arranged second head edge 201 and second tail edge 202, the second thin area 1222 is arranged near the second head edge 201, and the second thick area 1221 is arranged near the second tail edge 202.
[0038] When the first dielectric film 121 and the second dielectric film 122 are overlaid together, the first head edge 101 is aligned with the second tail edge 202, and the second head edge 201 is aligned with the first tail edge 102.
[0039] Optionally, as shown in Figure 3 , the thickness of the first dielectric film 121 gradually increases from the first head edge 101 to the direction close to the first tail edge 102.
[0040] The thickness of the second dielectric film 122 gradually increases from the second head edge 201 to the direction close to the second tail edge 202.
[0041] Optionally, Figure 4 is Figure 2 is a sectional view of the first dielectric film or the second dielectric film along the B direction, as shown in Figure 1 , Figure 2 and Figure 4 , the first dielectric film 121 further includes oppositely arranged first side edge 103 and second side edge 104, the first dielectric film 121 includes third thick area 1213 and third thin area 1214, the third thick area 1213 is arranged near the first side edge 103, and the third thin area 1214 is arranged near the second side edge 104.
[0042] The second dielectric film 122 further comprises a third side edge 203 and a fourth side edge 204 opposite to each other, and the second dielectric film 122 comprises a fourth thick region 1223 and a fourth thin region 1224, the fourth thick region 1223 is arranged close to the third side edge 203, and the fourth thin region 1224 is arranged close to the fourth side edge 204.
[0043] When the first dielectric film 121 and the second dielectric film 122 are laminated together, the third thick region 1213 and the fourth thin region 1224 are laminated together, the fourth thick region 1223 and the third thin region 1214 are laminated together, the sum of the thicknesses of the third thick region 1213 and the fourth thin region 1224 is equal to the sum of the thicknesses of the fourth thick region 1223 and the third thin region 1214, the first side edge 103 is aligned with the third side edge 203, and the second side edge 104 is aligned with the fourth side edge 204.
[0044] Optionally, the thickness of the first dielectric film 121 gradually decreases from the first side edge 103 towards the direction close to the second side edge 104.
[0045] The thickness of the second dielectric film 122 gradually decreases from the third side edge 203 towards the direction close to the fourth side edge 204.
[0046] Optionally, when the first dielectric film 121 and the second dielectric film 122 are laminated together, the thickness of the dielectric layer 12 is uniform.
[0047] When the thickness of the planar capacitive material is uniform and there is only one dielectric layer 12, the first dielectric film 121 is arranged on the first electrode plate 11, and the second dielectric film 122 is arranged on the second electrode plate 13, and the first electrode plate 11 and the second electrode plate 13 are laminated together, the first dielectric film 121 and the second dielectric film 122 are laminated together, the first thick region 1211 and the second thin region 1222 are laminated together, the second thick region 1221 and the first thin region 1212 are laminated together, the third thick region 1213 and the fourth thin region 1224 are laminated together, and the fourth thick region 1223 and the third thin region 1214 are laminated together, so that the thickness of the dielectric layer 12 is uniform, i.e., the thickness of the dielectric layer 12 is uniform.
[0048] Optionally, Figure 5 is a sectional view of the planar capacitive material with uniform thickness according to another embodiment of the present application, as shown in Figure 5 The planar capacitive material with uniform thickness comprises at least two dielectric layers 12, and the multiple dielectric layers 12 are laminated together.
[0049] Optionally, the thickness of each dielectric layer 12 is uniform.
[0050] The thickness of each dielectric layer 12 is different.
[0051] Optionally, the first electrode plate 11 and the second electrode plate 13 are both copper foils; the first dielectric film 121 and the second dielectric film 122 are both formed by curing a dielectric layer slurry; the dielectric layer slurry comprises at least one of an epoxy resin, an inorganic filler, an additive, and a solvent;
[0052] The epoxy resin is at least one of a glycidyl ether type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, an alicyclic epoxy resin, an epoxidized olefin compound, a sugarcane polyol epoxy resin, and a mixed structure epoxy resin;
[0053] The additive is at least one of a curing agent, a dispersant, a coupling agent, a leveling agent, a defoaming agent, and an accelerator;
[0054] The inorganic filler is at least one of barium sodium titanate, barium titanate, copper calcium titanate, strontium titanate, barium strontium titanate, calcium titanate, barium calcium titanate, lead zirconium titanate, lead sodium titanate, and lead titanate;
[0055] The solvent comprises at least one of acetone, pentanone, alcohol, and butanone.
[0056] Optionally, the method for preparing the dielectric layer slurry comprises:
[0057] The epoxy resin is added to a first solvent, and stirred at a temperature of 20-40°C for 15-35 min to obtain a mixed solution of the dielectric layer slurry;
[0058] The inorganic filler is dispersed in a second solvent to obtain a suspension of the dielectric layer slurry, and the suspension is dispersed in the mixed solution; an additive is then added and stirred to obtain a mixture of the dielectric layer slurry, and the mixture is poured into a ball mill tank and ball milled at a speed of 100-200 rpm for 5-40 h to obtain the dielectric layer slurry.
[0059] Further, the method for preparing a planar capacitor material with uniform thickness comprises:
[0060] A first copper foil substrate is uniformly coated with a layer of the above-mentioned polymer dielectric material slurry mixture, and after passing through a drying box, a semi-cured polymer dielectric material dielectric layer 12 is formed; then the first copper foil substrate with the dielectric layer slurry is laminated with a second copper foil substrate to prepare a planar capacitor material product with uniform thickness, at this time the dielectric layer slurry is in a semi-cured state; and then the laminated semi-finished planar capacitor material product with uniform thickness is cured at 80-170°C for 6-40 h; wherein the dielectric layer 12 of the planar capacitor material product with uniform thickness has a thickness of 1-50 um, a dielectric constant of 10-40, a loss of ≤0.05, and no obvious particles or other abnormalities on the surface of the dielectric layer 12.
[0061] The dielectric material slurry is placed in a negative pressure device, and then the slurry is subjected to negative pressure treatment for 1-60 min at a vacuum negative pressure of-0.08 Mpa to-0.10 Mpa, so that the dielectric material slurry is completely free of bubbles due to stirring, dispersion, etc., and thus the dielectric layer 12 is completely free of bubbles, and the thickness uniformity of the planar capacitor material is improved, and the yield of the product is improved.
[0062] The above embodiments are only illustrative of the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed in the present application should be covered by the claims of the present application.
Claims
1. A planar capacitive material of uniform thickness, characterized in that, The capacitor includes a first electrode plate and a second electrode plate arranged oppositely, and at least one dielectric layer connected between the first electrode plate and the second electrode plate, the dielectric layer includes a first dielectric film and a second dielectric film, the first dielectric film includes a first thick area and a first thin area, the second dielectric film includes a second thick area and a second thin area, the first thick area and the second thin area are laminated together, the second thick area and the first thin area are laminated together, and the sum of the thicknesses of the first thick area and the second thin area is equal to the sum of the thicknesses of the second thick area and the first thin area.
2. The planar capacitive material of uniform thickness of claim 1, wherein, The first dielectric film includes a first leading edge and a first trailing edge arranged oppositely, the first thin area is arranged close to the first leading edge, and the first thick area is arranged close to the first trailing edge. The second dielectric film includes a second leading edge and a second trailing edge arranged oppositely, the second thin area is arranged close to the second leading edge, and the second thick area is arranged close to the second trailing edge. When the first dielectric film and the second dielectric film are laminated together, the first leading edge is aligned with the second trailing edge, and the second leading edge is aligned with the first trailing edge.
3. The planar capacitive material of uniform thickness of claim 2, wherein, The thickness of the first dielectric film gradually increases from the first leading edge towards the first trailing edge. The thickness of the second dielectric film gradually increases from the second leading edge towards the second trailing edge.
4. The planar capacitive material of uniform thickness of claim 2, wherein, The first dielectric film further includes a first side edge and a second side edge arranged oppositely, the first dielectric film includes a third thick area and a third thin area, the third thick area is arranged close to the first side edge, and the third thin area is arranged close to the second side edge. The second dielectric film further includes a third side edge and a fourth side edge arranged oppositely, the second dielectric film includes a fourth thick area and a fourth thin area, the fourth thick area is arranged close to the third side edge, and the fourth thin area is arranged close to the fourth side edge. When the first dielectric film and the second dielectric film are laminated together, the third thick area and the fourth thin area are laminated together, the fourth thick area and the third thin area are laminated together, the sum of the thicknesses of the third thick area and the fourth thin area is equal to the sum of the thicknesses of the fourth thick area and the third thin area, the first side edge is aligned with the third side edge, and the second side edge is aligned with the fourth side edge.
5. The planar capacitive material of uniform thickness of claim 4, wherein, The thickness of the first dielectric film gradually decreases from the first side edge towards the second side edge. The thickness of the second dielectric film gradually decreases from the third side edge towards the fourth side edge.
6. The planar capacitive material of uniform thickness according to any one of claims 1 to 5, wherein The thickness of the dielectric layer is uniform when the first dielectric film and the second dielectric film are laminated together.
7. The planar capacitive material of uniform thickness according to any one of claims 1 to 5, wherein The uniform-thickness planar capacitor material includes at least two dielectric layers, and the multiple dielectric layers are laminated together.
8. The planar capacitive material of uniform thickness of claim 7, wherein, The thickness of each dielectric layer is equal; and / or The thickness of each dielectric layer is different.
9. The planar capacitive material of uniform thickness according to any one of claims 1 to 5, wherein, The thickness of the dielectric layer is 1-50 um.
10. The planar capacitive material of uniform thickness according to any one of claims 1 to 5, wherein, The dielectric constant of the dielectric layer is 10-40.