Vacuum heating exhaust table for plasma cleaning

By designing a vacuum heating exhaust platform for plasma cleaning, which combines mechanical pumps, molecular pumps, thermal shielding components, and plasma, the problem of high outgassing rate of parts in ultra-high vacuum environment is solved, enabling multiple methods of exhaust and surface cleaning of parts, and improving vacuum level and surface finish.

CN223743592UActive Publication Date: 2025-12-30北京金竟科技有限责任公司
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Patent Information

Application Number
CN202423174224.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-22
Publication Date
2025-12-30
Estimated Expiration
2034-12-22

AI Technical Summary

Technical Problem

Existing technologies lack vacuum chamber designs for plasma cleaning of parts, and the surface treatment methods for parts are limited, resulting in a high outgassing rate in ultra-high vacuum environments.

Method used

Design a vacuum heating exhaust platform for plasma cleaning, comprising a mechanical pump, a molecular pump, a heat shield, a heating coil, and plasma. By heating and baking in a vacuum chamber while performing plasma cleaning, the combination of molecular pump, heat shield, heating coil, and plasma enables multiple exhaust methods for parts, reducing the outgassing rate.

Benefits of technology

This technology enables plasma cleaning of parts while they are being heated, reducing the outgassing rate of parts in an ultra-high vacuum environment and improving surface finish and vacuum level.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of vacuum exhaust, in particular to a vacuum heating exhaust table for plasma cleaning. The device comprises a chamber, a heat shielding part, a support frame, plasmas, a heating coil, a molecular pump and a mechanical pump, wherein the mechanical pump is arranged at the bottom of the inner side of the support frame; the molecular pump is arranged at the top of the inner side of the supporting frame; the heat shielding part is arranged at the top of the outer side of the supporting frame; the cavity is an internal space of the heat shielding part, and a sample to be heated is arranged in the cavity; the heating coil is arranged in the cavity; and the plasma is fixed on the top of the heat shielding part. Parts can be subjected to plasma cleaning while being heated and baked, the parts can be exhausted in various modes, and the deflation rate of the parts in an ultrahigh vacuum environment is reduced. Plasma is used for cleaning, the smoothness of the surface is improved, the deflation rate of a cleaned object is reduced, and the vacuum degree of a part under ultrahigh vacuum is effectively improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a vacuum exhaust technology field especially, it relates to a vacuum heating exhaust platform for plasma cleaning. BACKGROUND

[0002] The development of the special exhaust process high vacuum system of space traveling wave tube in prior art involves the design and processing of vacuum chamber and vacuum system, but lacks plasma cleaning of parts.

[0003] Some prior art involves the cavity design of plasma cleaning machine, but the cavity is not heated and baked, and the part surface treatment method is single. UTILITY MODEL CONTENT

[0004] In view of the above-mentioned shortcomings of prior art, the utility model aims at providing a vacuum heating exhaust platform for plasma cleaning, which can perform plasma cleaning while heating and baking the parts, and can exhaust the parts in multiple ways, thereby reducing the outgassing rate of the parts in the ultra-high vacuum environment.

[0005] To achieve the above-mentioned purpose and other related purposes, the utility model provides a vacuum heating exhaust platform for plasma cleaning, which comprises:

[0006] A mechanical pump is arranged at the inner bottom of the support frame.

[0007] A molecular pump is arranged at the inner top of the support frame.

[0008] A heat shielding component is arranged at the outer top of the support frame.

[0009] A cavity is the internal space of the heat shielding component, and a sample to be heated is arranged in the cavity.

[0010] A heating coil is arranged in the cavity.

[0011] A plasma is fixed at the top of the heat shielding component.

[0012] In an embodiment of the utility model, it further comprises:

[0013] A hydraulic bellows is sleeved on the outer side of the mechanical pump, and the top of the hydraulic bellows is fixedly connected with the molecular pump.

[0014] A support base is arranged at one end of the opening of the hydraulic bellows and in contact with the bottom of the mechanical pump, and the other end of the support base is used for supporting the vacuum heating exhaust platform.

[0015] In one embodiment of this utility model, it further includes:

[0016] A first support component, one end of which is fixed to the molecular pump, and the other end of which is fixed to the right and / or left side of the support frame;

[0017] The second support component has one end fixed to the molecular pump and the other end fixed to the upper side of the support frame, and is in contact with the bottom of the heat shield component.

[0018] In one embodiment of this utility model, two first support components are provided.

[0019] In one embodiment of this utility model, multiple heating coils are provided, and the multiple heating coils are evenly arranged in the cavity and closely attached to the heat shielding component. The sample to be heated is disposed inside the heating coil.

[0020] In one embodiment of this utility model, it further includes:

[0021] The third support component has one end fixed to the top of the heat shield component, and the other end of the third support component is used to fix the plasma.

[0022] In one embodiment of this utility model, it further includes:

[0023] Rollers, which are mounted on the bottom of the support frame, move the vacuum heating exhaust platform.

[0024] In one embodiment of this utility model, it further includes:

[0025] A first temperature display is disposed on the outer surface of the support frame, and the first temperature display is used to display temperature information within the plasma.

[0026] A second temperature display is disposed on the outer surface of the support frame, and the second temperature display is used to display the temperature information of the sample to be heated within the heat shield component.

[0027] In one embodiment of this utility model, it further includes:

[0028] A first controller, disposed on the outer surface of the support frame, is used to control the plasma;

[0029] The second controller, which is located on the outer surface of the support frame, is used to control the heating coil.

[0030] As described above, the vacuum heating exhaust station for plasma cleaning according to this invention has the following beneficial effects:

[0031] (1) A vacuum heating exhaust platform for plasma cleaning according to the present invention includes a chamber, a heat shield component, a support frame, plasma, a heating coil, a molecular pump, and a mechanical pump. The parts of the present invention can be heated and baked while being cleaned by plasma. The parts can be vented in multiple ways, which reduces the outgassing rate of the parts in the ultra-high vacuum environment.

[0032] (2) The present invention provides a vacuum heating exhaust platform for plasma cleaning, which uses plasma cleaning to improve the surface smoothness, reduce the outgassing rate of the cleaned object, and effectively improve the vacuum degree of the parts under ultra-high vacuum. Attached Figure Description

[0033] Figure 1 This is a cross-sectional view of a vacuum heating exhaust station for plasma cleaning provided in an embodiment of this application.

[0034] Figure 2 This is a structural diagram of a vacuum heating exhaust station for plasma cleaning provided in an embodiment of this application.

[0035] Component designation explanation

[0036] 1 chamber

[0037] 2. Heat shielding components

[0038] 3 Support frame

[0039] 4. Plasma

[0040] 5. Heating coil

[0041] 6 molecular pumps

[0042] 7 Mechanical pumps

[0043] 8 First temperature display

[0044] 9. Second temperature display

[0045] 10 First Controller

[0046] 11 Second Controller

[0047] 41 Third support component

[0048] 61 First Support Component

[0049] 62 Second support component

[0050] 71 Hydraulic bellows piping

[0051] 72 Support base Detailed Implementation

[0052] The embodiments of the present application will be described in detail by the following specific examples, and those skilled in the art can easily understand other advantages and functions of the present application from the contents disclosed in the specification. The present application can also be implemented or applied by other different specific embodiments, and each detail in the specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following examples and features in the examples can be combined with each other without conflict.

[0053] It should be noted that the diagrams provided in the following examples only illustrate the basic concept of the present application in a schematic manner, and only the components related to the present application are shown in the diagrams, not the number, shape and size of the components when actually implemented. The shapes, numbers and proportions of each component in actual implementation can be arbitrarily changed, and the component layout pattern can also be more complex.

[0054] Terms such as first or second can be used to describe various components, but these components are not limited by the above terms. The above terms are used to distinguish one component from another component, for example, the first component can be referred to as the second component, and likewise, the second component can be referred to as the first component without departing from the scope of the concept according to the present disclosure.

[0055] In addition, "connected / coupled" means that one component is directly electrically coupled to another component or indirectly electrically coupled through another component. The singular form can include the plural form as long as it is not explicitly stated in the sentence. In addition, "comprising / including" or "comprising / including" used in the specification means that one or more components, steps, operations and elements are present or have been added. The specific structure or function description of the example of the embodiment disclosed in the specification is only exemplified to describe the example of the embodiment according to the concept, and the example of the embodiment according to the concept can be implemented in various forms, but these descriptions are not limited to the example of the embodiment described in the specification.

[0056] According to the concept, various modifications and changes can be applied to the example of the embodiment, so that the example of the embodiment will be illustrated in the drawings and described in the specification. However, the example of the embodiment according to the concept is not limited to the specific embodiment, but includes all changes, equivalents or alternatives included in the spirit and technical scope of the present disclosure.

[0057] It will be understood that when an element is referred to as being "coupled" or "connected" to another element, it can be directly coupled or connected to the other element or coupled or connected to the other element through a third element. In contrast, it will be understood that when an element is referred to as being "directly coupled" or "directly connected" to another element, it is not coupled or connected to the other element through a third element. Other expressions should be construed similarly.

[0058] The terms used in the present specification are merely used to describe particular embodiments and are not intended to limit the present disclosure. Singular forms are intended to include plural forms unless explicitly indicated in the context. In the present specification, it should be understood that the terms "include" or "have" indicate that there are features, numbers, steps, operations, components, parts or combinations thereof described in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0059] All terms used herein, including technical or scientific terms, have the same meanings as commonly understood by those skilled in the art unless explicitly defined otherwise. If the terms defined in a generally used dictionary have meanings different from those used in the present specification, the terms used in the present specification should be interpreted to have the meanings consistent with the context in which they are used, not the meanings in the dictionary.

[0060] Descriptions of well-known components and processing techniques can be omitted so as not to unnecessarily obscure the embodiments of the present disclosure.

[0061] Throughout the specification, the same drawing reference numerals will be used for the same elements throughout the specification. Accordingly, even if a drawing reference numeral is not mentioned or described with reference to one drawing, it can be mentioned or described with reference to another drawing. In addition, even if a drawing reference numeral is not shown in one drawing, it can be mentioned or described with reference to another drawing.

[0062] In addition, the logic level of a signal can be different from or opposite to the described logic level. For example, a signal described as having a logic "high" level can alternatively have a logic "low" level, and a signal described as having a logic "low" level can alternatively have a logic "high" level.

[0063] The embodiments of the present disclosure will be described in detail below with reference to the drawings. However, those skilled in the art can understand that, in the embodiments of the present disclosure, many technical details are presented in order to enable the reader to better understand the present disclosure. However, the technical solutions claimed by the present disclosure can be implemented even without these technical details and various changes and modifications based on the following embodiments.

[0064] Please refer to Figure 1 , Figure 1 The utility model provides a kind of sectional view structure for plasma cleaning of vacuum heating exhaust station provided by the embodiment of the application.The utility model provides a kind of vacuum heating exhaust station for plasma cleaning, including chamber 1, heat shield component 2, support frame 3, plasma 4, heating coil 5, molecular pump 6, mechanical pump 7, mechanical pump 7 is arranged in the inner side bottom of support frame 3;Molecular pump 6 is arranged in the inner side top of support frame 3;Heat shield component 2 is arranged in the outer side top of support frame 3;Chamber 1 is the internal space of heat shield component 2, the chamber 1 is provided with sample to be heated;Heating coil 5 is arranged in the chamber 1;Plasma 4 is fixed in the top of heat shield component 2.

[0065] The plasma 4 of the vacuum heating exhaust station for plasma cleaning of the utility model is that high-frequency voltage is applied between electrode and grounding device in vacuum chamber, gas is broken down, and ionization and plasma are generated by glow discharge.Let the plasma generated in vacuum chamber completely cover the workpiece to be processed, and start cleaning operation.The operation range is wide, and the pollutants on the surface of workpiece can be effectively removed.

[0066] The utility model discloses a kind of vacuum heating exhaust stations for plasma cleaning, and the cleaned piece is in ultrahigh vacuum environment, suitable for needing ultraclean environment to clean, especially electron microscope component cleaning etc.

[0067] The vacuum heating exhaust station for plasma cleaning of the utility model adopts the combination of molecular pump 6+mechanical pump 7, and uses ionization gauge as ultrahigh vacuum measurement means.

[0068] The vacuum heating exhaust station for plasma cleaning of the utility model increases surface exhaust means, uses plasma cleaning simultaneously, improves the surface finish, reduces the outgassing rate of cleaned object, effectively improves the vacuum degree of part under ultrahigh vacuum.

[0069] The vacuum heating exhaust station for plasma cleaning of the utility model includes heating system, temperature control system, plasma cleaning system, vacuum system etc.

[0070] In an embodiment of the utility model, heating system adopts vacuum heating coil 5 heating, protects vacuum from being polluted, and relies on bottom heat conduction and peripheral heat radiation heat conduction.

[0071] In one embodiment of the present application, the heat shielding component 2 can be but not limited to molybdenum plate heat insulation, three layers of heat insulation shield, effectively protecting the outermost shell temperature from being scalded by touch.

[0072] Specifically, the vacuum heating and exhaust platform for plasma cleaning further comprises:

[0073] A hydraulic bellows pipe 71 is sleeved outside the mechanical pump 7, the top of the hydraulic bellows pipe 71 is fixedly connected with the molecular pump 6, and the bottom of the hydraulic bellows pipe 71 is provided with an opening;

[0074] A support base 72 is arranged at one end of the opening of the hydraulic bellows pipe 71 and in contact with the bottom of the mechanical pump 7, and the other end of the support base 72 is used for supporting the vacuum heating and exhaust platform.

[0075] Specifically, the vacuum heating and exhaust platform for plasma cleaning further comprises:

[0076] A first support component 61 is fixed at one end on the molecular pump 6, and the other end of the first support component 61 is fixed on the right side and / or the left side of the support frame 3.

[0077] A second support component 62 is fixed at one end on the molecular pump 6, and the other end of the second support component 62 is fixed on the upper side of the support frame 3 and in contact with the bottom of the heat shielding component 2.

[0078] Specifically, the first support component 61 is provided with two.

[0079] Specifically, the heating coil 5 is provided in plurality, and the plurality of heating coils 5 are arranged uniformly in the chamber 1 and closely attached to the heat shielding component 2, and the heating coil 5 is provided with the sample to be heated.

[0080] Specifically, the vacuum heating and exhaust platform for plasma cleaning further comprises:

[0081] A third support component 41 is fixed at one end on the top of the heat shielding component 2, and the other end of the third support component 41 is used for fixing the plasma 4.

[0082] Specifically, the vacuum heating and exhaust platform for plasma cleaning further comprises:

[0083] A roller 73 is installed at the bottom of the support frame 3, and the roller 73 moves the vacuum heating and exhaust platform.

[0084] Specifically, the vacuum heating and exhaust platform for plasma cleaning further comprises:

[0085] A first temperature display 8 is arranged on the outer surface of the support frame 3, and the first temperature display 8 is used for displaying temperature information in the plasma 4.

[0086] A second temperature display 9 is arranged on the outer surface of the support frame 3, and the second temperature display 9 is used for displaying temperature information of the sample to be heated in the heat shielding component 2.

[0087] Specifically, the vacuum heating and exhaust platform for plasma cleaning further comprises:

[0088] A first controller 10 is arranged on the outer surface of the support frame 3, and the first controller 10 is used for controlling the plasma 4.

[0089] A second controller 11 is arranged on the outer surface of the support frame 3, and the second controller 11 is used for controlling the heating coil 5.

[0090] In one embodiment of the utility model, the vacuum heating and exhaust platform for plasma cleaning has large heating power and high heating temperature, and can be heated to above 500 DEG C.

[0091] The working principle of the vacuum heating and exhaust platform for plasma cleaning is as follows:

[0092] After the vacuum heating and exhaust platform for plasma cleaning is powered on, the mechanical pump 7 is first started, and the molecular pump 6 is started when the rough vacuum degree is displayed below 2 Pa. -4 Pa order of magnitude, and then the heating system, i.e. the vacuum heating coil 5, is started, and the temperature in the vacuum can reach 300 DEG C.

[0093] The vacuum heating coil 5 is in close contact with the heat shielding component 2, and when the temperature in the vacuum cavity is 300 DEG C, the heat is shielded by the two layers of heat shielding components 2, and the temperature of the outer cavity of the heat shielding component 2 is below 50 DEG C.

[0094] The plasma 4 can be independently controlled to be started and stopped.

[0095] In summary, the utility model discloses a kind of vacuum heating exhaust platform for plasma cleaning including chamber, heat shield component, support frame, plasma, heating coil pipe, molecular pump, mechanical pump, the part of the utility model can be added plasma cleaning while being heated and roasted, parts can be exhausted in multiple ways, reduce the outgassing rate of parts in ultra-high vacuum environment.The utility model uses plasma cleaning, improve the surface finish, reduce the outgassing rate of the object to be cleaned, effectively improve the vacuum degree of parts in ultra-high vacuum.

[0096] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed by the present application should be covered by the claims of the present application.

Claims

1. A vacuum heating and exhaust station for plasma cleaning, characterized in that, It comprises: a mechanical pump (7) arranged at the inner bottom of the support frame (3); a molecular pump (6) arranged at the inner top of the support frame (3); a heat shielding component (2) arranged at the outer top of the support frame (3); a chamber (1) which is the internal space of the heat shielding component (2), and in which the sample to be heated is arranged; a heating coil (5) arranged in the chamber (1); a plasma (4) fixed at the top of the heat shielding component (2).

2. A vacuum heating and exhaust station for plasma cleaning according to claim 1, wherein, It further comprises: a hydraulic bellows (71) sleeved outside the mechanical pump (7), and the top of the hydraulic bellows (71) is fixedly connected with the molecular pump (6); and the bottom of the hydraulic bellows (71) is provided with an opening; a support base (72) which is inserted into the opening of the hydraulic bellows (71) and is in contact with the bottom of the mechanical pump (7), and the other end of the support base (72) is used for supporting the vacuum heating and exhaust platform.

3. A vacuum heating and exhaust station for plasma cleaning according to claim 2, wherein, It further comprises: a first support component (61) which is fixed at one end to the molecular pump (6) and at the other end to the right side and / or left side of the support frame (3); a second support component (62) which is fixed at one end to the molecular pump (6) and at the other end to the upper side of the support frame (3) and is in contact with the bottom of the heat shielding component (2).

4. A vacuum heating and exhaust station for plasma cleaning according to claim 3, wherein: The first support component (61) is provided with two.

5. The vacuum heating and exhausting stage for plasma cleaning according to claim 1, characterized in that: The heating coil (5) is provided in multiple, and multiple heating coils (5) are arranged uniformly in the chamber (1) and closely attached to the heat shielding component (2), and the sample to be heated is arranged in the heating coil (5).

6. The vacuum heating and exhausting stage for plasma cleaning according to claim 1, wherein, It further comprises: a third support component (41) which is fixed at one end to the top of the heat shielding component (2) and at the other end to the plasma (4).

7. A vacuum heating and exhaust station for plasma cleaning according to any one of claims 1 to 6, characterized in that It further comprises: a roller (73) installed at the bottom of the support frame (3), which moves the vacuum heating and exhaust platform.

8. A vacuum heating and exhaust station for plasma cleaning according to claim 7, wherein, It further comprises: a first temperature display (8) arranged on the outer surface of the support frame (3), which is used to display the temperature information in the plasma (4); a second temperature display (9) arranged on the outer surface of the support frame (3), which is used to display the temperature information of the sample to be heated in the heat shielding component (2).

9. A vacuum hot bench for plasma cleaning according to claim 8, characterized in that, It further comprises: a first controller (10) arranged on the outer surface of the support frame (3) and used to control the plasma (4); a second controller (11) arranged on the outer surface of the support frame (3) and used to control the heating coil (5).