Clamp for flattening semiconductor chip

Abstract

The utility model discloses a semiconductor chip flattening clamp, which belongs to the technical field of chip processing, and comprises a workbench, a clamping assembly is arranged in the workbench, the clamping assembly comprises an inclined block I, inclined surfaces on two sides of the inclined block I movably abut against inclined blocks II, slide blocks are fixedly arranged at the tops of the two groups of inclined blocks II, and the slide blocks are arranged on the inclined blocks I; sliding rods are installed in the two sets of sliding blocks in a sliding mode, a chip can be fixed from the front direction, the rear direction, the left direction and the right direction, the freedom degree of the chip is effectively limited, the chip can be kept in a stable posture when subjected to flattening pressure, it is guaranteed that the pressure is evenly distributed on the surface of the chip, and therefore the flatness and consistency of the flattened chip are improved; according to the chip clamping device, the yield of chips is improved, the quality standard of high-precision manufacturing of semiconductor chips is met, the chip clamping device can adapt to chips of different sizes, shapes and thicknesses, and stable clamping of various chips can be achieved without replacing the whole clamp or conducting complex modification through the adjustable design of the buffer pads and the clamping plates.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a fixture for flattening semiconductor chips. Background Technology

[0002] With the rapid advancement of information technology, semiconductor chips are increasingly widely used in various fields, from consumer electronics such as smartphones, computers, and servers to high-end fields such as automobiles, industrial automation, aerospace, and artificial intelligence. Semiconductor chips have become the cornerstone of modern technological development. This has spurred rapid growth in the semiconductor industry, with market demand for chips continuously rising. Simultaneously, it has placed increasingly higher demands on chip performance, quality, and manufacturing processes. Chip flattening is a crucial step in semiconductor chip manufacturing. Many traditional chip flattening fixtures employ simple single-sided or double-sided fixing methods, failing to effectively restrict the chip's degrees of freedom from multiple directions. Therefore, during flattening, the chip is easily affected by pressure, leading to displacement, shaking, or rotation, resulting in uneven stress on the chip surface and affecting its flatness. With the continuous development of semiconductor technology, chip sizes, shapes, and thicknesses are becoming increasingly diverse. Traditional chip flattening fixtures are typically designed for chips of specific sizes and shapes, lacking flexibility and versatility. They cannot guarantee the overall stability of the chip during flattening, affecting chip performance and reliability, and increasing the difficulty and cost of chip manufacturing. Therefore, we propose a semiconductor chip flattening fixture to solve this problem. Utility Model Content

[0003] The purpose of this invention is to provide a clamp for flattening semiconductor chips to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A fixture for flattening semiconductor chips includes: a worktable, the worktable having a clamping assembly inside, the clamping assembly including: a first inclined block, the two inclined surfaces of the first inclined block being movably abutting against a second inclined block, a slider being fixedly mounted on the top of each of the two sets of second inclined blocks, a sliding rod being slidably mounted inside each of the two sets of sliders, two sets of springs being sleeved on the outer side of each sliding rod, a fixing rod being fixedly mounted on the top of each of the two sets of sliders, a clamping frame being fixedly mounted on one end of each of the two sets of fixing rods, and an auxiliary assembly inside each of the two sets of clamping frames, the auxiliary assembly including: a bidirectional lead screw, the outer side of the bidirectional lead screw being threadedly connected to two sets of threaded plates, two sets of connecting rods being fixedly mounted on one side of each of the two sets of threaded plates, and a clamping plate being fixedly mounted on one side of each of the two sets of connecting rods located on the same side.

[0006] Preferably, an electric push rod is fixedly installed at the bottom of the workbench, and the output end of the electric push rod is fixedly connected to the inclined block.

[0007] Preferably, the two sets of bidirectional lead screws are rotatably installed on the inner walls of the corresponding clamping frames on both sides, and a motor is fixedly installed on one side of each set of clamping frames. The output shafts of the two sets of motors are fixedly connected to the corresponding bidirectional lead screws.

[0008] Preferably, the two ends of the slide rod are fixedly connected to the inner walls of both sides of the worktable, and the two ends of the two sets of springs are fixedly connected to the corresponding slider and the inner wall of one side of the worktable, respectively.

[0009] Preferably, limit plates are slidably installed inside both sets of inclined blocks 2, and the two sets of limit plates are fixedly connected to the inner walls of both sides of the workbench respectively. Two sets of telescopic cylinders are fixedly installed at the bottom of the workbench, and the top ends of the two sets of telescopic cylinders are fixedly connected to inclined block 1.

[0010] Preferably, two sets of limiting grooves are provided on one side of both sets of clamping frames and buffer pads, and the two sets of connecting rods located on the same side are slidably installed inside the corresponding limiting grooves. Two sets of sliding grooves are provided on the top of the workbench, and the two sets of fixing rods are slidably installed inside the corresponding sliding grooves.

[0011] In this invention, a semiconductor chip flattening fixture is provided with a clamping assembly. By driving an electric push rod, the electric push rod causes the inclined block one to move up and down. Under the action of two sets of springs, the inclined surfaces of the two sets of inclined blocks two are always in contact with the inclined surfaces on both sides of the inclined block one. When the inclined block one moves downward, the two sets of inclined blocks two move closer to each other, causing the sliders at the top of the two sets of inclined blocks two to move closer to each other. This causes the two sets of fixed rods to move the corresponding clamping frames and buffer pads closer to each other, which facilitates the clamping and fixing of the left and right sides of the chip. This ensures that the chip remains in the predetermined position during the flattening process and does not shift or rotate. It ensures that the chip is firmly clamped throughout the flattening process, ensuring the smooth operation of the flattening operation. It is also suitable for chips of different sizes.

[0012] In this utility model, a semiconductor chip flattening fixture is provided with auxiliary components. By driving two sets of motors, the two sets of motors drive corresponding bidirectional lead screws to rotate. The two sets of bidirectional lead screws drive two sets of threaded plates on the outer side to move relative to each other. The two sets of threaded plates drive the connecting rod and clamping plate to clamp and fix the front and rear sides of the chip. It can apply pressure evenly from the front and rear direction, keep the chip stable in the horizontal direction, and avoid shaking, displacement or rotation during the flattening process.

[0013] This utility model features a reasonable structural design. By incorporating clamping components and auxiliary components, it can fix the chip from four directions (front, back, left, and right), effectively limiting the chip's degrees of freedom. This allows the chip to maintain a stable posture when subjected to flattening pressure, ensuring that the pressure is evenly distributed on the chip surface. This improves the flatness and consistency of the flattened chip, increases the yield rate, and meets the quality standards for high-precision semiconductor chip manufacturing. It can adapt to chips of different sizes, shapes, and thicknesses. Through the flexible adjustment of structures such as electric push rods, lead screws, and wedge blocks, as well as the adjustable design of buffer pads and clamping plates, stable clamping of various chips can be achieved without replacing the entire fixture or making complex modifications. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a clamp for flattening semiconductor chips according to the present invention.

[0015] Figure 2 This is a cross-sectional view of a clamp for flattening semiconductor chips according to the present invention.

[0016] Figure 3 This is a schematic diagram of the auxiliary component structure proposed in this utility model.

[0017] In the diagram: 1. Workbench; 2. Clamping assembly; 201. Electric push rod; 202. Inclined block one; 203. Inclined block two; 204. Slider; 205. Fixing rod; 206. Clamping frame; 207. Buffer pad; 208. Slide rod; 209. Spring; 210. Limiting plate; 211. Telescopic cylinder; 3. Auxiliary assembly; 301. Motor; 302. Two-way lead screw; 303. Threaded plate; 304. Connecting rod; 305. Clamping plate. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figure 1-3A fixture for flattening semiconductor chips includes: a worktable 1, with a clamping assembly 2 inside the worktable 1. The clamping assembly 2 includes: a first inclined block 202, with two inclined blocks 203 movably abutting each other on both sides of the first inclined block 202; sliders 204 are fixedly installed on the top of each of the two sets of second inclined blocks 203; slide rods 208 are slidably installed inside the two sets of slide rods 204; two sets of springs 209 are sleeved on the outside of the slide rods 208; fixing rods 205 are fixedly installed on the top of each of the two sets of sliders 204; clamping frames 206 are fixedly installed at one end of each of the two sets of fixing rods 205; and auxiliary assembly 3 is provided inside the two sets of clamping frames 206. The auxiliary assembly 3 includes: a bidirectional lead screw 302, with two sets of threaded plates 303 threadedly connected to the outside of the bidirectional lead screw 302; two sets of connecting rods 304 are fixedly installed on one side of each of the two sets of threaded plates 303; and clamping plates 305 are fixedly installed on one side of each of the two sets of connecting rods 304 located on the same side.

[0020] In this embodiment, an electric push rod 201 is fixedly installed at the bottom of the workbench 1. The output end of the electric push rod 201 is fixedly connected to the inclined block 202, which facilitates the movement of the inclined block 202 and the clamping frame 206 to fix the chip in the left and right directions. Two sets of bidirectional lead screws 302 are respectively rotatably installed on the inner walls of the corresponding clamping frames 206 on both sides. A motor 301 is fixedly installed on one side of each of the two sets of clamping frames 206. The output shafts of the two sets of motors 301 are respectively fixedly connected to the corresponding bidirectional lead screws 302, which facilitates the rotation of the bidirectional lead screws 302 and the clamping and fixing of the chip on both sides.

[0021] In this embodiment, the two ends of the slide rod 208 are fixedly connected to the inner walls of both sides of the workbench 1, and the two ends of the two sets of springs 209 are fixedly connected to the corresponding sliders 204 and the inner wall of one side of the workbench 1, respectively, so that the inclined surfaces of the two sets of inclined blocks 203 are always in constant contact with the inclined surfaces of the two sides of the inclined block 202. Limiting plates 210 are slidably installed inside the two sets of inclined blocks 203, and the two sets of limiting plates 210 are fixedly connected to the inner walls of both sides of the workbench 1. Two sets of telescopic cylinders 211 are fixedly installed at the bottom of the workbench 1. The tops of both sets of telescopic components are fixedly connected to inclined block 1 202, which facilitates the stable sliding of inclined block 2 203 and inclined block 1 202. Two sets of limiting grooves are provided on one side of both sets of clamping frames 206 and buffer pads 207. Two sets of connecting rods 304 located on the same side are slidably installed in the corresponding limiting grooves. Two sets of sliding grooves are provided on the top of the workbench 1. Two sets of fixing rods 205 are slidably installed in the corresponding sliding grooves, which facilitates the stable movement of the two sets of clamping plates 305 and the two sets of clamping frames 206.

[0022] In this embodiment, during use, the chip is placed on the top of the workbench 1. The electric push rod 201 is then driven to move the first inclined block 202 up and down. Under the action of the two sets of springs 209, the inclined surfaces of the two sets of second inclined blocks 203 are always in contact with the inclined surfaces on both sides of the first inclined block 202. When the first inclined block 202 moves downwards, the two sets of second inclined blocks 203 move closer together, causing the sliders 204 at the top of the two sets of second inclined blocks 203 to move their top fixing rods 205 closer together. This, in turn, causes the two sets of fixing rods 205 to move the corresponding clamping frames 206 and buffer pads 207 closer together, facilitating chip alignment. The chip is clamped and fixed on both sides. Conversely, when the first inclined block 202 moves upward, the two sets of second inclined blocks 203 move away from each other, so that the two sets of clamping frames 206 can drive the corresponding buffer pads 207 to release the chip. By driving the two sets of motors 301, the two sets of motors 301 drive the corresponding bidirectional lead screws 302 to rotate, so that the two sets of bidirectional lead screws 302 drive the two sets of threaded plates 303 on the outside to move relative to each other, so that the two sets of threaded plates 303 drive the connecting rods 304 and the clamping plates 305 to clamp and fix the chip on both sides. Through the clamping components 2 and auxiliary components 3, the chip can be stably clamped and fixed on the front, back, left and right sides.

[0023] The above provides a detailed description of a semiconductor chip flattening fixture provided by this utility model. Specific embodiments have been used to illustrate the principle and implementation of this utility model. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core idea of ​​this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model.

Claims

1. A clamp for flattening a semiconductor chip, characterized by, Include: Workbench (1), the inside of the workbench (1) is provided with clamping assembly (2), the clamping assembly (2) includes: inclined block one (202), both sides of the inclined block one (202) are movably connected with inclined block two (203), the top of the two groups of inclined block two (203) is fixedly installed with sliding block (204), the inside of the two groups of sliding block (204) is slidably installed with slide rod (208), the outer side of the slide rod (208) is provided with two groups of springs (209), the top of the two groups of sliding block (204) is fixedly installed with fixed rod (205), one end of the two groups of fixed rod (205) is fixedly installed with clamping frame (206), the inside of the two groups of clamping frame (206) is provided with auxiliary assembly (3), the auxiliary assembly (3) includes: bidirectional screw rod (302), the outer side of the bidirectional screw rod (302) is threadedly connected with two groups of threaded plates (303), one side of the two groups of threaded plates (303) is fixedly installed with two groups of connecting rods (304), one side of the two groups of connecting rods (304) on the same side is fixedly installed with clamping plate (305).

2. The clamp for flattening a semiconductor chip according to claim 1, wherein The bottom of the workbench (1) is fixedly installed with electric push rod (201), and the output end of the electric push rod (201) is fixedly connected with inclined block one (202).

3. The clamp for flattening a semiconductor chip according to claim 1, wherein Two groups of bidirectional screw rods (302) are rotatably installed on the inner walls of the two sides of the corresponding clamping frame (206), and two groups of clamping frames (206) are fixedly installed with motors (301) on one side.

4. The clamp for flattening a semiconductor chip according to claim 1, wherein Both ends of the slide rod (208) are fixedly connected with the inner walls of the two sides of the workbench (1), and both ends of the two groups of springs (209) are fixedly connected with the corresponding sliding block (204) and the inner wall of one side of the workbench (1).

5. The clamp for flattening a semiconductor chip according to claim 1, wherein The inside of the two groups of inclined block two (203) is slidably installed with limiting plate (210), and the two groups of limiting plates (210) are fixedly connected with the inner walls of the two sides of the workbench (1), and the bottom of the workbench (1) is fixedly installed with two groups of telescopic cylinders (211), and the top ends of the two groups of telescopic cylinders (211) are fixedly connected with inclined block one (202).

6. The clamp for flattening a semiconductor chip according to claim 1, wherein One side of the two groups of clamping frames (206) and buffer pads (207) is provided with two groups of limiting grooves, and the two groups of connecting rods (304) on the same side are slidably installed in the corresponding limiting grooves, and the top of the workbench (1) is provided with two groups of sliding grooves, and the two groups of fixed rods (205) are slidably installed in the corresponding sliding grooves.

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