Semiconductor chip sorting machine

Abstract

The utility model provides a semiconductor chip sorting machine, which relates to the technical field of sorting machines, and comprises a sorting arm, one end of the sorting arm is sleeved with a suction nozzle, one end of the sorting arm is provided with a clamping groove, the inner wall of the clamping groove is sleeved with a sealing ring, the outer surface of the sorting arm is provided with a positioning groove, the inner wall of the sorting arm is provided with a groove, and the groove is provided with a sealing ring. A groove is formed in the outer surface of the sorting arm, a first spring is fixedly connected to the inner wall of the groove, one end of the first spring is fixedly connected with a top block, a pull plate is arranged on the outer surface of the sorting arm, a sliding rod is fixedly connected to one side of the pull plate, one end of the sliding rod is fixedly connected with an intercepting block, and the outer surface of the sliding rod is sleeved with a second spring. According to the utility model, the sealing ring is arranged to ensure that no gas enters the interior of the vacuum pipeline, the normal operation of sorting work is ensured, the positioning groove and the positioning block are clamped and connected, so that a worker can conveniently and quickly disassemble and assemble the suction nozzle, the working efficiency of the worker is improved, the shutdown time is shortened, and the sorting working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a sorting machine technical field especially relates to a semiconductor chip sorting machine. BACKGROUND

[0002] Now when detecting chip, generally need turret type test sorting machine to send multiple chips to each detection station and carry out detection, the existing turret type test sorting machine generally is equipped with 16-20 vacuum nozzles, since the tip of vacuum nozzle is subjected to the size of chip surface, under normal circumstances, the vacuum pipeline of nozzle only 0.3-0.5mm. The continuous operation of equipment for a long time will make nozzle appear aging condition, thereby needing staff to disassemble and replace nozzle, guarantee sorting work, when replacing new nozzle, it will lead to the long downtime of entire machine. UTILITARY MODEL CONTENT

[0003] The utility model discloses a semiconductor chip sorting machine, which can solve the problem of long downtime of the entire machine caused by the continuous operation of the equipment for a long time, and can ensure the normal operation of the sorting machine.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor chip sorting machine, comprising a sorting arm, a nozzle is connected to one end of the sorting arm, a clamping groove is formed in one end of the sorting arm, a sealing ring is connected to the inner wall of the clamping groove, a positioning groove is formed on the outer surface of the sorting arm, a recess is formed in the inner wall of the sorting arm, a first spring is fixedly connected to the inner wall of the recess, a top block is fixedly connected to one end of the first spring, a pull plate is arranged on the outer surface of the sorting arm, a slide rod is fixedly connected to one side of the pull plate, an intercepting block is fixedly connected to one end of the slide rod, and a second spring is connected to the outer surface of the slide rod.

[0005] As a preferred embodiment, the outer surface of the nozzle is fixedly connected with a positioning block, a screw hole is formed in the outer surface of the positioning block, and a bolt is connected to the inner wall of the screw hole.

[0006] As a preferred embodiment, the outer surface of the bolt is threadedly connected with the inner wall of the screw hole, and the screw hole extends into the interior of the positioning groove.

[0007] As a preferred embodiment, the positioning groove is connected with the positioning block in a clamping manner.

[0008] As a preferred embodiment, one end of the second spring is fixedly connected with the inner wall of the sorting arm, and the other end of the second spring is fixedly connected with one side of the intercepting block.

[0009] As a preferred implementation, the outer surface of the top block is in sliding connection with the inner wall of the groove.

[0010] As a preferred implementation, the outer surface of the sealing ring is in clamping connection with the inner wall of the clamping groove.

[0011] Compared with the prior art, the advantages and positive effects of the semiconductor chip sorting machine are as follows:

[0012] The sorting arm is arranged to ensure normal sorting work of the semiconductor chip, the suction nozzle is arranged to adsorb and fix the semiconductor chip, so that the sorting purpose is achieved, the sealing ring is arranged to ensure that gas cannot enter the inside of the vacuum pipeline, so that the normal sorting work is ensured, the positioning groove and the positioning block are arranged in clamping connection, the suction nozzle is conveniently disassembled and installed by the worker, the working efficiency of the worker is improved, the downtime is reduced, and the sorting work efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 A perspective view of the semiconductor chip sorting machine is provided.

[0014] Figure 2 A sectional view of the semiconductor chip sorting machine is provided.

[0015] Figure 3 A sectional view of the suction nozzle of the semiconductor chip sorting machine is provided.

[0016] Figure 4 A perspective view of the suction nozzle of the semiconductor chip sorting machine is provided.

[0017] LEGEND:

[0018] 1, sorting arm; 2, suction nozzle; 21, positioning block; 22, screw hole; 3, clamping groove; 4, sealing ring; 5, positioning groove; 6, groove; 7, first spring; 8, top block; 9, pull plate; 10, sliding rod; 11, second spring; 12, intercepting block; 13, bolt. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] Embodiment 1

[0021] As Figures 1-3As shown, this utility model provides a technical solution: a semiconductor chip sorting machine, including a sorting arm 1, a suction nozzle 2 sleeved on one end of the sorting arm 1, a slot 3 opened on one end of the sorting arm 1, a sealing ring 4 sleeved on the inner wall of the slot 3, a positioning groove 5 opened on the outer surface of the sorting arm 1, a groove 6 opened on the inner wall of the sorting arm 1, a first spring 7 fixedly connected to the inner wall of the groove 6, a top block 8 fixedly connected to one end of the first spring 7, a pull plate 9 provided on the outer surface of the sorting arm 1, a slide rod 10 fixedly connected to one side of the pull plate 9, an intercepting block 12 fixedly connected to one end of the slide rod 10, and a second spring 11 sleeved on the outer surface of the slide rod 10.

[0022] In this embodiment, a sorting arm 1 is provided to ensure the normal operation of the sorting process. A suction nozzle 2 is provided to fix the semiconductor chip, thereby achieving the sorting purpose. A slot 3 is provided to provide an installation environment for the suction nozzle 2. A sealing ring 4 is provided to prevent gas from entering the vacuum pipe, ensuring the normal operation of the sorting process. A positioning groove 5 is provided to engage with a positioning block 21, enabling the quick installation of the suction nozzle 2. A groove 6 is provided to provide an installation environment for other components. A first spring 7 is provided to drive a top block 8 to slide inside the groove 6, thereby pushing out the positioning block 21 and completing the quick disassembly of the suction nozzle 2, improving the work efficiency of the staff. A pull plate 9 is provided to drive a sliding rod 10 to move, which in turn drives an intercepting block 12 to move. The movement of the intercepting block 12 compresses the second spring 11, thereby releasing the restriction on the positioning block 21 and facilitating disassembly by the staff.

[0023] Example 2

[0024] like Figures 1-4 As shown, a positioning block 21 is fixedly connected to the outer surface of the suction nozzle 2, and the positioning groove 5 is engaged with the positioning block 21. A screw hole 22 is opened on the outer surface of the positioning block 21, and a bolt 13 is sleeved on the inner wall of the screw hole 22. The outer surface of the bolt 13 is threadedly connected to the inner wall of the screw hole 22, and the screw hole 22 extends into the interior of the positioning groove 5.

[0025] In this embodiment, the positioning block 21 is set to facilitate the quick installation of the suction nozzle 2 by the staff. The screw hole 22 is set to be threadedly connected to the bolt 13 to fix the suction nozzle 2, so as to ensure that the suction nozzle 2 will not fall off during the sorting work and to ensure the normal operation of the sorting work.

[0026] Working principle:

[0027] like Figures 1-4As shown, when the worker needs to disassemble and replace the suction nozzle 2 during the sorting work of the semiconductor chip using the sorting arm 1, first, the worker clamps the new suction nozzle 2 with the clamping groove 3 and extrudes the sealing ring 4, clamps and connects the suction nozzle 2, the positioning blocks 21 on both sides of the suction nozzle 2 are clamped with the positioning groove 5, then one of the positioning blocks 21 extrudes the intercepting block 12, so that the intercepting block 12 moves backward, the movement of the intercepting block 12 drives the sliding rod 10 to move, and the second spring 11 is compressed, when the positioning block 21 passes the intercepting block 12, the second spring 11 is rebounded to drive the intercepting block 12 to reset, so as to intercept the positioning block 21, then the worker screws the bolt 13 with the screw hole 22, completes the fixation of the suction nozzle 2, when the suction nozzle 2 needs to be disassembled, the screw thread connection between the bolt 13 and the screw hole 22 is released, then the sliding rod 10 is moved by pulling the pull plate 9, so that the intercepting block 12 is released from the limiting of the positioning block 21, then the first spring 7 is rebounded to drive the top block 8 to slide in the recess 6, so as to eject the positioning block 21, and the disassembly work of the suction nozzle 2 is completed.

[0028] The above is only a preferred embodiment of the present application, and is not intended to limit the present application in other forms. Any skilled person in the art can modify or change the above disclosed technical content to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present application still belong to the protection scope of the present application.

Claims

1. A semiconductor chip handler comprising a sorting arm (1), characterized in that: The one end of the sorting arm (1) is sleeved with a suction nozzle (2), the one end of the sorting arm (1) is provided with a clamping groove (3), the inner wall of the clamping groove (3) is sleeved with a sealing ring (4), the outer surface of the sorting arm (1) is provided with a positioning groove (5), the inner wall of the sorting arm (1) is provided with a recess (6), the inner wall of the recess (6) is fixedly connected with a first spring (7), one end of the first spring (7) is fixedly connected with a top block (8), the outer surface of the sorting arm (1) is provided with a pull plate (9), one side of the pull plate (9) is fixedly connected with a sliding rod (10), one end of the sliding rod (10) is fixedly connected with an intercepting block (12), the outer surface of the sliding rod (10) is sleeved with a second spring (11).

2. A semiconductor chip handler according to claim 1, characterized in that: The outer surface of the suction nozzle (2) is fixedly connected with a positioning block (21), the outer surface of the positioning block (21) is provided with a threaded hole (22), the inner wall of the threaded hole (22) is sleeved with a bolt (13).

3. A semiconductor chip handler according to claim 2, wherein: The outer surface of the bolt (13) is threadedly connected with the inner wall of the threaded hole (22), the threaded hole (22) extends to the inside of the positioning groove (5).

4. The semiconductor chip handler of claim 1 wherein: The positioning groove (5) is clampedly connected with the positioning block (21).

5. The semiconductor chip handler of claim 1 wherein: One end of the second spring (11) is fixedly connected with the inner wall of the sorting arm (1), the other end of the second spring (11) is fixedly connected with one side of the intercepting block (12).

6. The semiconductor chip handler of claim 1, wherein: The outer surface of the top block (8) is slidably connected with the inner wall of the recess (6).

7. The semiconductor chip handler of claim 1 wherein: The outer surface of the sealing ring (4) is clampedly connected with the inner wall of the clamping groove (3).

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