Heat treatment equipment heating module capable of rapidly raising temperature

Abstract

The utility model discloses a heat treatment equipment heating module capable of heating quickly, which comprises a lamp holder shell, heat dissipation holes are arranged on two sides of the lamp holder shell, heat dissipation components are fixedly mounted on the outer sides of the heat dissipation holes, a heating block shell is fixedly mounted at the bottom of the lamp holder shell, and a lamp body component is fixedly mounted in the heating block shell. The heat treatment equipment heating module comprises a heating block shell, lifting assemblies are fixedly installed on the front face and the rear face of the heating block shell, a detection assembly is installed on one side of the heating block shell, and an output assembly is installed in the detection assembly in a sliding mode. According to the utility model, the process deviation caused by non-uniform temperature is reduced, flexible height adjustment is realized through the lifting assembly, the consistency and stability of the heating effect are ensured, accurate temperature data is provided through the detection assembly, and the service life of the detection assembly can be prolonged by preventing the detection assembly from being exposed in a severe working environment for a long time through the output assembly.

Description

Technical Field

[0001] This utility model relates to the field of fully automatic heat treatment technology, specifically a heating module for a heat treatment device that can rapidly raise the temperature. Background Technology

[0002] Early wafer thermal processor heating modules mainly used resistance wire heating. Heat was generated by passing an electric current through the resistance wire and then transferred to the wafer through thermal conduction and radiation. This heating method was simple in structure and low in cost.

[0003] However, existing heating modules suffer from uneven heating and low temperature control accuracy, making it difficult to meet the requirements of modern semiconductor manufacturing for process consistency and high precision. Moreover, during temperature detection, the detection components cannot be moved, and prolonged exposure to high-temperature areas will affect their service life.

[0004] Therefore, there is a need to provide a heating module for heat treatment equipment that can rapidly raise the temperature. Utility Model Content

[0005] The purpose of this invention is to provide a heating module for a heat treatment device that can rapidly heat up, in order to solve the problems mentioned in the background art, such as uneven heating and low temperature control accuracy, which make it difficult to meet the requirements of modern semiconductor manufacturing for process consistency and high precision. Moreover, during temperature detection, the detection component cannot be moved, and prolonged exposure to high-temperature areas will affect its service life.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a heating module for a heat treatment device capable of rapid heating, comprising a lamp holder housing, an installation body fixedly installed inside the lamp holder housing, a plurality of lamp holders fixedly installed at the bottom of the installation body, heat dissipation holes on both sides of the lamp holder housing, heat dissipation components for dissipating heat from the module fixedly installed outside the heat dissipation holes, a heating block housing fixedly installed at the bottom of the lamp holder housing, a lamp assembly for heating fixedly installed inside the heating block housing, lifting components fixedly installed on both the front and rear sides of the heating block housing, a detection component for temperature detection installed on one side of the heating block housing, and an output component slidably installed inside the detection component.

[0007] Preferably, the heat dissipation assembly includes two heat dissipation flanges, which are fixedly connected to both sides of the lamp holder housing. A connecting pipe connects the two heat dissipation flanges, and a cooling pipe is connected to the middle of the connecting pipe. The heat dissipation flanges are tightly connected to the module, which can provide a good heat conduction path, so that the heat generated by the module can be quickly transferred to the heat dissipation flanges, and then the heat can be dissipated through the heat dissipation system, reducing the accumulation of heat inside the module.

[0008] Preferably, the lamp assembly includes a circuit board, which is fixedly installed inside the heating block housing. Several TT-type LEDs are installed inside the circuit board, with the bottom of each TT-type LED fixedly installed inside a corresponding lamp holder. Multiple PIN blocks are installed on one side of the heating block housing, and a power port is installed on the side where the heating block housing connects to the PIN blocks. The power port is connected to the circuit board. The light energy emitted by the TT LEDs can be highly concentrated in a specific area of ​​the wafer, achieving precise local heating. For processes requiring high-precision temperature control at specific locations on the wafer, such as photolithography and annealing, this can meet the stringent requirements for temperature accuracy and reduce process deviations caused by uneven temperature.

[0009] Preferably, the lifting assembly includes two fixing plates, which are respectively fixedly installed on the front and rear sides of the heating block housing. A fixing shaft is fixedly installed on one side of each fixing plate, and a telescopic cylinder is rotatably installed on the outer side of the fixing shaft. A mounting block is rotatably installed on one end of the telescopic cylinder. During the processing, the height of the heating module can be dynamically adjusted in real time according to different process requirements or the real-time status of the wafer, so as to achieve flexible height adjustment and ensure the consistency and stability of the heating effect.

[0010] Preferably, the detection component includes a rotating housing, which is fixedly installed on the side of the heating block housing. A connecting block is rotatably installed inside the rotating housing. Multiple meshing teeth are equidistantly installed on the periphery of the connecting block. An installation plate is fixedly installed at one end of the connecting block. A temperature detector is fixedly installed at the bottom of the installation plate. Different process steps have different requirements for heating temperature. With the accurate temperature data provided by the temperature detection component, the operator can adjust the process parameters in a timely manner according to the actual temperature conditions.

[0011] Preferably, the output component includes a rack slidably mounted inside a rotating housing. The rotating housing is engaged with multiple meshing teeth. An electric actuator is fixedly mounted at one end of the rack, and a connecting plate is fixedly mounted at one end of the electric actuator. The connecting plate is fixedly mounted on the side of the heating block housing. When detection is not required, the detection component can be rotated back, which can prevent it from being exposed to harsh working environments for a long time, reduce the erosion and damage of environmental factors to the detection component, and thus extend its service life.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: the lamp body assembly can meet the strict requirements for temperature accuracy, reduce process deviations caused by uneven temperature, the lifting assembly can achieve flexible height adjustment, ensure the consistency and stability of heating effect, the accurate temperature data provided by the detection assembly allows operators to adjust process parameters in a timely manner according to the actual temperature conditions, and the output assembly can prevent the detection assembly from being exposed to harsh working environments for a long time, reduce the corrosion and damage of environmental factors to the detection assembly, thereby extending its service life. Attached Figure Description

[0013] Figure 1 This is a three-dimensional view of the bottom structure of this utility model;

[0014] Figure 2 This is a top perspective view of the present invention;

[0015] Figure 3 This is a diagram of the internal structure of the present invention;

[0016] Figure 4 This is a diagram of the detection component of this utility model.

[0017] In the diagram: 1. Lamp holder housing; 2. Mounting body; 3. Lamp holder; 4. Heat dissipation flange; 5. Connecting pipe; 6. Cooling pipe; 7. Heating block housing; 8. PIN block; 9. Power port; 10. Circuit board; 11. TT type lamp bead; 12. Fixing plate; 13. Fixing shaft; 14. Telescopic cylinder; 15. Mounting block; 16. Rotating housing; 17. Connecting block; 18. Mounting plate; 19. Temperature detector; 20. Rack; 21. Electric actuator; 22. Connecting plate; 23. Meshing teeth. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0019] Please see Figure 1-4 This utility model provides a heating module for a heat treatment device that can rapidly heat up, including a lamp holder housing 1, an installation body 2 fixedly installed inside the lamp holder housing 1, a plurality of lamp holders 3 fixedly installed at the bottom of the installation body 2, heat dissipation holes on both sides of the lamp holder housing 1, heat dissipation components for dissipating heat from the module fixedly installed outside the heat dissipation holes, a heating block housing 7 fixedly installed at the bottom of the lamp holder housing 1, a lamp assembly for heating fixedly installed inside the heating block housing 7, lifting components fixedly installed on both the front and rear sides of the heating block housing 7, a detection component for temperature detection installed on one side of the heating block housing 7, and an output component slidably installed inside the detection component.

[0020] Furthermore, the heat dissipation assembly includes two heat dissipation flanges 4, which are fixedly connected to both sides of the lamp holder housing 1. A connecting pipe 5 connects the two heat dissipation flanges 4, and a cooling pipe 6 is connected to the middle of the connecting pipe 5. Through the heat dissipation flanges 4 on both sides of the lamp holder housing 1, the heat generated inside the lamp holder housing 1 is absorbed by the high thermal conductivity of the flanges 4. The cooling medium is introduced through the cooling pipe 6 and flows to the two heat dissipation flanges 4 through the connecting pipe 5. The flow of the medium carries away the heat of the heat dissipation flanges 4, thus dissipating heat.

[0021] Furthermore, the lamp assembly includes a circuit board 10, which is fixedly installed inside the heating block housing 7. Several TT-type LED beads 11 are installed inside the circuit board 10. The bottom of the TT-type LED beads 11 is fixedly installed inside the corresponding lamp holder 3. Several PIN blocks 8 are installed on one side of the heating block housing 7. A power port 9 is installed on the side where the heating block housing 7 connects to the PIN blocks 8. The inside of the power port 9 is connected to the circuit board 10. By supplying power to the power port 9, the circuit board 10 activates the multiple TT-type LED beads 11 to irradiate and heat the wafer.

[0022] Furthermore, the lifting assembly includes two fixing plates 12, which are respectively fixedly installed on the front and rear sides of the heating block housing 7. A fixing shaft 13 is fixedly installed on one side of the fixing plate 12, and a telescopic cylinder 14 is rotatably installed on the outside of the fixing shaft 13. An installation block 15 is rotatably installed on one end of the telescopic cylinder 14. The installation block 15 is fixedly installed inside the heat processor. The telescopic cylinder 14 is activated by a switch on the heat processor body. The telescopic cylinder 14 drives the heating module to lift and lower, thereby adjusting the height of the TT-type lamp bead 11 inside and adjusting the irradiation of the wafer.

[0023] Furthermore, the detection component includes a rotating housing 16, which is fixedly installed on the side of the heating block housing 7. A connecting block 17 is rotatably installed inside the rotating housing 16. Multiple meshing teeth 23 are equidistantly installed on the periphery of the connecting block 17. An mounting plate 18 is fixedly installed at one end of the connecting block 17. A temperature detector 19 is fixedly installed at the bottom of the mounting plate 18. When the rack 20 slides and rises inside the rotating housing 16, it engages with multiple meshing teeth 23. The multiple meshing teeth 23 are fixedly installed on the outside of the connecting block 17. When they engage with the rack 20, they can only make the connecting block 17 rotate 90 degrees. When the connecting block 17 rotates, it drives the mounting plate 18 to rotate. The mounting plate 18 drives the temperature detector 19 to detect the temperature of the heat source of the heating module.

[0024] Furthermore, the output component includes a rack 20, which is slidably mounted inside the rotating housing 16. The rotating housing 16 is engaged with multiple meshing teeth 23. An electric push rod 21 is fixedly mounted on one end of the rack 20, and a connecting plate 22 is fixedly mounted on one end of the electric push rod 21. The connecting plate 22 is fixedly mounted on the side of the heating block housing 7. The electric push rod 21 is activated by a switch on the heat processor body, and the electric push rod 21 pushes the rack 20 to slide and rise and fall inside the rotating housing 16.

[0025] In this embodiment, during use: Power is supplied to the power port 9, and multiple TT-type LED beads 11 are activated via the circuit board 10 to irradiate and heat the wafer. The heat generated inside the lamp holder housing 1 is absorbed by the heat dissipation flanges 4 on both sides of the housing due to their high thermal conductivity. A cooling medium is then introduced through the cooling pipe 6 and flows through the connecting pipe 5 to the two heat dissipation flanges 4. The flow of the medium carries away the heat from the heat dissipation flanges 4, thus achieving heat dissipation. The mounting block 15 is fixedly installed inside the heat processor. A switch on the heat processor body controls the activation of the telescopic cylinder 14, which moves the heating module up and down, adjusting the height of the internal TT-type LED beads 11. The irradiation of the wafer is adjusted by controlling the electric push rod 21 via a switch on the heat processor body. The electric push rod 21 pushes the rack 20 to slide and rise inside the rotating housing 16. When the rack 20 slides and rises inside the rotating housing 16, it engages multiple meshing teeth 23. The multiple meshing teeth 23 are fixedly installed on the outside of the connecting block 17. When they engage with the rack 20, they can only make the connecting block 17 rotate 90 degrees. When the connecting block 17 rotates, it drives the mounting plate 18 to rotate. The mounting plate 18 drives the temperature detector 19 to detect the temperature of the heat source of the heating module. When temperature detection is not required, the electric push rod 21 is controlled by a switch on the heat processor body to retract the temperature detector 19.

[0026] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heatable module for a heat treatment apparatus that can be rapidly heated, comprising a lamp holder housing (1), characterized in that: The inside of the lamp holder shell (1) is fixedly installed with a mounting body (2), the bottom of the mounting body (2) is fixedly installed with a plurality of lamp body seats (3), both sides of the lamp holder shell (1) are provided with heat dissipation holes, the outside of the heat dissipation holes is fixedly installed with a heat dissipation assembly for heat dissipation of the module, the bottom of the lamp holder shell (1) is fixedly installed with a heating block shell (7), the inside of the heating block shell (7) is fixedly installed with a lamp body assembly for heating, the front and back of the heating block shell (7) are fixedly installed with lifting assemblies, one side of the heating block shell (7) is installed with a detection assembly for temperature detection, the inside of the detection assembly is slidably installed with an output assembly.

2. The rapid heat up heat processing equipment heating module of claim 1, wherein: The heat dissipation assembly comprises two heat dissipation flanges (4), the two heat dissipation flanges (4) are fixedly connected on both sides of the lamp holder shell (1), and a communication pipe (5) is communicated between the two heat dissipation flanges (4).

3. The rapid heat up heat processing equipment heating module of claim 1, wherein: The lamp body assembly comprises a circuit board (10), the circuit board (10) is fixedly installed in the inside of the heating block shell (7), a plurality of T-T type lamp beads (11) are installed in the inside of the circuit board (10), the bottom of the T-T type lamp bead (11) is fixedly installed in the inside of the corresponding lamp body seat (3), a plurality of PIN blocks (8) are installed on one side of the heating block shell (7), a power supply port (9) is installed on one side of the connection between the heating block shell (7) and the PIN block (8), and the inside of the power supply port (9) is communicated with the circuit board (10).

4. The rapid heat up heat processing equipment heating module of claim 1, wherein: The lifting assembly comprises two fixed sheets (12), the two fixed sheets (12) are fixedly installed on the front and back of the heating block shell (7), respectively, a fixed shaft (13) is fixedly installed on one side of the fixed sheet (12), a telescopic cylinder (14) is rotatably installed on the outside of the fixed shaft (13), and an installation block (15) is rotatably installed on one end of the telescopic cylinder (14).

5. The rapid heat up heat processing apparatus heating module of claim 1, wherein: The detection assembly comprises a rotating shell (16), the rotating shell (16) is fixedly installed on the side of the heating block shell (7), a connecting block (17) is rotatably installed in the inside of the rotating shell (16), a plurality of meshing teeth (23) are equidistantly installed on the periphery of the connecting block (17), an installation plate (18) is fixedly installed on one end of the connecting block (17), and a temperature probe (19) is fixedly installed on the bottom of the installation plate (18).

6. A heatable module for a heat treatment apparatus according to claim 5, wherein: The output assembly comprises a rack (20), the rack (20) is slidably installed in the inside of the rotating shell (16), the rotating shell (16) is meshingly connected with the plurality of meshing teeth (23), an electric push rod (21) is fixedly installed on one end of the rack (20), a connecting plate (22) is fixedly installed on one end of the electric push rod (21), and the connecting plate (22) is fixedly installed on the side of the heating block shell (7).

Images