Transfer robot

By designing a double-layer shock absorption structure in the handling robot and using springs and rubber components to absorb vibrations, the problem of poor adaptability of the handling robot to bumps and vibrations is solved, and safe handling and efficient transportation of wafer boxes are achieved.

CN223743612UActive Publication Date: 2025-12-30SHENZHEN YOUIBOT ROBOTICS CO LTD
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Patent Information

Application Number
CN202423203799.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-12-30
Estimated Expiration
2034-12-23

AI Technical Summary

Technical Problem

Existing handling robots have poor adaptability to bumps and vibrations, which makes the wafers inside the wafer cassette easily damaged.

Method used

A dual-layer shock absorption structure was designed, including a first shock absorption module and a second shock absorption module. It uses spring components and rubber components to absorb the impact force generated by bumps or vibrations, and combines them with a fixed bracket to prevent damage to the wafer cassette.

Benefits of technology

It effectively reduces the vibration and impact on the fixed bracket, prevents the wafer box from being damaged during handling, and improves handling efficiency and stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of robots, and discloses a transfer robot which comprises a robot body, a first damping module, a second damping module and a fixing support, and the robot body is provided with a bearing platform; the first damping module comprises a first supporting plate and a plurality of spring assemblies, the spring assemblies are arranged on the bearing platform in an array mode in the first direction and the second direction, and the first supporting plate is connected to the spring assemblies; the second damping module comprises a second supporting plate and a plurality of rubber assemblies, the multiple rubber assemblies are arranged on the first supporting plate in an array mode in the first direction and the second direction, and the second supporting plate is connected to the multiple rubber assemblies; and the fixed bracket is arranged on the second supporting plate and is used for placing the wafer box. The utility model aims to solve the technical problems that the adaptive capacity of a transfer robot to vibration is poor, and wafers in a wafer box are easy to damage.
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Description

TECHNICAL FIELD

[0001] The utility model relates to robot technical field, in particular to a carrying robot. BACKGROUND

[0002] The wafer box is mainly used for loading wafers in the electronic irradiation process, and the wafers can be irradiated by high-energy rays to improve their performance and reliability.

[0003] In the related art, a carrying robot is used to carry the wafer box, but the carrying robot has poor adaptability to bumps and vibrations due to the influence of the on-site environment and the vehicle body itself, which can easily damage the wafers in the wafer box. SUMMARY

[0004] The utility model discloses a carrying robot to solve the technical problem that the carrying robot has poor adaptability to bumps and vibrations at present, which can easily damage the wafers in the wafer box.

[0005] To achieve the above object, the utility model provides a carrying robot, which comprises:

[0006] A robot body is provided with a bearing platform.

[0007] A first damping module comprises a first support plate and a plurality of spring assemblies, and the plurality of spring assemblies are arranged in a first direction and a second direction on the bearing platform respectively, and the first support plate is connected to the plurality of spring assemblies.

[0008] A second damping module comprises a second support plate and a plurality of rubber assemblies, and the plurality of rubber assemblies are arranged in the first direction and the second direction on the first support plate, and the second support plate is connected to the plurality of rubber assemblies.

[0009] A fixing support is arranged on the second support plate, and the fixing support is used to place the wafer box.

[0010] Optionally, the first damping module comprises a first baffle, and the first baffle is arranged on the bearing platform along the outer edge of the first support plate to shield the spring assemblies.

[0011] The second damping module comprises a second baffle, and the first baffle is arranged along the outer edge of the second support plate and connected to the first baffle to shield the rubber assemblies.

[0012] Optionally, the first damping module comprises four spring assemblies, and the four spring assemblies are arranged in the first direction and the second direction.

[0013] The second damping module comprises four rubber assemblies arranged in the first direction and the second direction.

[0014] Optionally, the fixing support comprises a first support, a second support and a plurality of storage boards, the first support and the second support are arranged on two sides of the storage boards in the first direction, the plurality of storage boards are arranged in the height direction of the transfer robot from top to bottom, and the first support and the second support are used for fixing the plurality of storage boards.

[0015] Optionally, the first support and the second support are provided with clamping parts, and the edges of the storage boards are provided with clamping grooves, the clamping parts are embedded in the clamping grooves, so that the storage boards are connected to the first support and the second support.

[0016] Optionally, the edges of the storage boards are also provided with empty slots, and the empty slots are arranged adjacent to the clamping grooves.

[0017] Optionally, the transfer robot comprises a mechanical arm, one end of the mechanical arm is connected to the robot body, and the other end of the mechanical arm is provided with a gripper mechanism, and the gripper mechanism is used for clamping the wafer box.

[0018] Optionally, the storage board is provided with a two-dimensional code label.

[0019] The gripper mechanism or the mechanical arm is provided with a camera device, and the camera device is used for reading the information of the two-dimensional code label.

[0020] Optionally, the inside of the robot body is arranged with a first lifting mechanism and a second lifting mechanism, and in the first direction, the first lifting mechanism supports a first end of the bearing platform, and the second lifting mechanism supports a second end of the bearing platform.

[0021] The first lifting mechanism and the second lifting mechanism are used for adjusting the height of the bearing platform.

[0022] Optionally, the gripper mechanism comprises a first gripper and a second gripper, the first gripper and the second gripper are provided with limiting parts, the edges of the two sides of the storage board in the first direction are provided with limiting holes, and each limiting part is inserted into each limiting hole one by one, so that the first gripper and the second gripper are respectively fixedly connected to the two sides of the storage board.

[0023] The utility model provides a kind of transfer robot, its beneficial effect lies in:

[0024] The present invention relates to a handling robot comprising a robot body, a first shock-absorbing module, a second shock-absorbing module, and a fixed support. During the handling of wafer cassettes, if the handling robot encounters bumps or vibrations, the spring assembly of the first shock-absorbing module and the rubber assembly of the second shock-absorbing module work together to absorb the impact force generated by the bumps or vibrations. The first and second shock-absorbing modules form a double-layer shock-absorbing structure, which can reduce the vibration impact on the fixed support and prevent damage to the wafer cassettes on the fixed support. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of the handling robot provided in an embodiment of the present utility model;

[0027] Figure 2 An exploded view of the handling robot provided in this embodiment of the utility model;

[0028] Figure 3 Another exploded view of the handling robot provided in this embodiment of the utility model;

[0029] Figure 4 Another exploded view of the handling robot provided in this embodiment of the utility model;

[0030] Figure 5 This is a schematic diagram of the structure of the fixing bracket provided in an embodiment of the present utility model;

[0031] Figure 6 for Figure 5 A magnified view of a section at point A in the middle;

[0032] Figure 7 A cross-sectional schematic diagram of the handling robot provided in an embodiment of this utility model.

[0033] The markings in the image are as follows:

[0034] 1, robot body; 10, bearing platform; 11, first jacking mechanism; 12, second jacking mechanism; 2, first damping module; 21, first support plate; 22, spring assembly; 23, first baffle; 3, second damping module; 31, second support plate; 32, rubber assembly; 33, second baffle; 4, fixed support; 41, first support; 42, second support; 43, storage plate; 44, clamping part; 45, clamping groove; 46, clearance groove; 47, two-dimensional code label; 48, limiting hole; 5, wafer box; 6, mechanical arm; 7, clamping jaw mechanism; 71, first clamping jaw; 72, second clamping jaw; 8, camera device; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0035] The specific embodiments of the present application will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0036] In the description of the present application, it should be explained that the positions or position relationships indicated by the terms "upper", "lower", "front", "rear", "inner", "outer" and the like in the present application are based on the position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as limiting the devices and elements indicated or implied to have a specific position, a specific position and operation, and therefore cannot be understood as limiting the present application.

[0037] In the description of the present application, it should be understood that the terms "first", "second" and the like are used to describe various information in the present application, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the "first" information can also be referred to as "second" information, and similarly, the "second" information can also be referred to as "first" information.

[0038] As shown in Figures 1 to 7 The embodiment of the present application provides a carrying robot, which comprises a robot body 1, a first damping module 2, a second damping module 3 and a fixed support 4, the robot body 1 is provided with a bearing platform 10; the first damping module 2 comprises a first support plate 21 and a plurality of spring assemblies 22, the plurality of spring assemblies 22 are respectively arranged on the bearing platform 10 along the first direction X and the second direction Y, and the first support plate 21 is connected to the plurality of spring assemblies 22; the second damping module 3 comprises a second support plate 31 and a plurality of rubber assemblies 32, the plurality of rubber assemblies 32 are arranged on the first support plate 21 along the first direction X and the second direction Y, and the second support plate 31 is connected to the plurality of rubber assemblies 32; the fixed support 4 is arranged on the second support plate 31, and the fixed support 4 is used for placing a wafer box 5.

[0039] In this embodiment, the handling robot has a first direction X, a second direction Y, and a third direction Z. The first direction X is the length direction of the robot body 1, the second direction Y is the width direction of the robot body 1, and the third direction Z is the height direction of the robot body 1.

[0040] The robot body 1 is the main structure of the transport robot, and it is equipped with a support platform 10.

[0041] In the first damping module 2, the spring assembly 22 has resilience and damping functions. Multiple spring assemblies 22 are arrayed on the support platform 10, and a first support plate 21 is connected to the top of the multiple spring assemblies 22 by bolts, welding, or other means to form a first-layer damping structure. In the second damping module 3, the rubber assembly 32 has vibration absorption and noise reduction functions. The rubber assembly 32 can be made of high-damping rubber material. Multiple rubber assemblies 32 are arrayed on the first support plate 21, and a second support plate 31 is connected to the top of the multiple rubber assemblies 32 to form a second-layer damping structure, further enhancing the damping effect of the support platform 10 based on the first-layer damping structure.

[0042] The fixed bracket 4 is set on the second support plate 31 and is used to place the wafer box 5, which can prevent the wafer box 5 from falling and being damaged during robot handling.

[0043] Based on the above technical solution, if the handling robot encounters bumps or vibrations during the handling of the wafer cassette, the spring assembly 22 of the first shock absorption module 2 and the rubber assembly 32 of the second shock absorption module 3 will jointly absorb the impact force generated by the bumps or vibrations. The double-layer shock absorption structure formed by the first shock absorption module 2 and the second shock absorption module 3 can reduce the vibration impact on the fixed bracket 4 and prevent the wafer cassette 5 on the fixed bracket 4 from being damaged.

[0044] In one embodiment, such as Figure 3 As shown, the first shock absorption module 2 includes a first baffle 23, which is disposed on the bearing platform 10 along the outer edge of the first support plate 21 to shield the spring assembly 22; the second shock absorption module 3 includes a second baffle 33, which is disposed along the outer edge of the second support plate 31 and connected to the first baffle 23 to shield the rubber assembly 32.

[0045] Specifically, the first baffle plate 23 is fixedly arranged on the bearing platform 10 along the outer edge of the first support plate 21, and the second baffle plate 33 is fixedly connected to the first baffle plate 23 along the outer edge of the second support plate 31. The first baffle plate 23 and the second baffle plate 33 can shield the spring assembly 22 and the rubber assembly 32, preventing the spring assembly 22 and the rubber assembly 32 from being affected by the accumulation of dust, dirt and other impurities after long-term use, thereby affecting the shock absorption performance. The materials of the first baffle plate 23 and the second baffle plate 33 are stainless steel, aluminum alloy, etc., which are not limited in the embodiment.

[0046] When the wafer box 5 is transported, the transport robot encounters bumps or vibrations, and the spring assembly 22 and the rubber assembly 32 can absorb the impact force generated by the bumps or vibrations. The first baffle plate 23 and the second baffle plate 33 can prevent the spring assembly 22 and the rubber assembly 32 from being damaged by external objects.

[0047] In an embodiment, as shown in Figure 3 and Figure 4 , the first shock absorption module 2 includes four spring assemblies 22 arranged in the first direction X and the second direction Y, and the second shock absorption module 3 includes four rubber assemblies 32 arranged in the first direction X and the second direction Y.

[0048] Specifically, the bearing platform 10, the first support plate 21 and the second support plate 31 are square plates. The four spring assemblies 22 are arranged at the four corner positions of the bearing platform 10, and the four rubber assemblies 32 are arranged at the four corner positions of the first support plate 21. The positions of the four rubber assemblies 32 and the four spring assemblies 22 form a corresponding relationship, and the double shock absorption structure formed by the four corner positions of the first shock absorption module 2 and the second shock absorption module 3 effectively absorbs vibration energy.

[0049] In an embodiment, as shown in Figure 5 , the fixed support 4 includes a first support 41, a second support 42 and a plurality of storage plates 43. The first support 41 and the second support 42 are arranged on both sides of the storage plate 43 along the first direction X, and the plurality of storage plates 43 are arranged from top to bottom along the height direction of the transport robot. The first support 41 and the second support 42 are used to fix the plurality of storage plates 43, and each storage plate 43 is used to place a plurality of wafer boxes 5.

[0050] Specifically, the fixed support 4 is used to carry and fix the wafer box 5. The first support 41 and the second support 42 of the fixed support 4 are arranged on both sides of the storage plate 43 along the first direction X. The first support 41 and the second support 42 are used to fix and support the storage plate 43. The plurality of storage plates 43 are arranged from top to bottom along the height direction (i.e. the third direction Z) of the transport robot. A plurality of wafer boxes 5 are placed between adjacent two storage plates 43, thereby increasing the storage capacity of the transport robot.

[0051] In the first direction X, a plurality of first supports 41 and second supports 42 can be arranged at intervals on both sides of the storage plate 43. The storage plate 43 is fixed at different positions in the length direction of the storage plate 43, so that the supports can stably support the storage plate 43 and prevent the storage plate 43 from tilting.

[0052] Exemplarily, as shown in Figure 5 The fixed support 4 includes five layers of storage plates 43, and each layer of storage plate 43 places four wafer boxes 5. The handling robot can transport twenty wafer boxes 5 at a time, improving the handling efficiency.

[0053] In an embodiment, as shown in Figure 6 The first support 41 and the second support 42 are provided with a clamping portion 44, and the edge of the storage plate 43 is provided with a clamping groove 45. The clamping portion 44 is embedded in the clamping groove 45, so that the storage plate 43 is connected to the first support 41 and the second support 42.

[0054] Specifically, the clamping portion 44 is located on the side edge of the first support 41 facing the second support 42, and the clamping portion 44 is a protruding structure. The clamping groove 45 is located on the edge of the storage plate 43, and the shape of the clamping groove 45 matches the shape of the clamping portion 44. The inner circumference of the clamping groove 45 is equal to or slightly larger than the outer circumference of the clamping portion 44, so that the clamping portion 44 can be clamped into the clamping groove 45 and stably connected.

[0055] In an embodiment, as shown in Figure 6 The edge of the storage plate 43 is also provided with a clearance groove 46, and the clearance groove 46 is arranged adjacent to the clamping groove 45.

[0056] Specifically, the clearance groove 46 is a groove structure, and the slot of the clearance groove 46 is larger than the slot of the clamping groove 45. When fixing the storage plate 43, the clearance groove 46 of the storage plate 43 is aligned with the top of the first support 41 and the second support 42, so as to place the storage plate 43 between the first support 41 and the second support 42, and then move along the first direction X until the clamping portion 44 is clamped into the clamping groove 45, so that the storage plate 43 is fixed between the first support 41 and the second support 42, forming a stable support structure.

[0057] In an embodiment, as shown in Figure 1 The handling robot includes a mechanical arm 6, one end of the mechanical arm 6 is connected to the robot body 1, and the other end of the mechanical arm 6 is provided with a gripper mechanism 7 for clamping the wafer box 5.

[0058] Specifically, the robotic arm 6 of the handling robot drives the gripper mechanism 7 to grip the wafer cassette 5. The gripper mechanism 7 consists of multiple grippers, and the opening and closing of the grippers is achieved by an internal drive device (such as a motor or cylinder). When gripping the wafer cassette 5, the grippers of the gripper mechanism 7 are tightly attached to the outer surface of the wafer cassette 5, and the drive device generates a sufficiently large clamping force to keep the wafer cassette 5 stable during handling.

[0059] In one embodiment, such as Figure 1 He Ru Figure 5 As shown, the storage plate 43 is equipped with a QR code label 47; the gripper mechanism 7 or the robotic arm 6 is equipped with a camera device 8, which is used to read the information of the QR code label 47.

[0060] Specifically, in this embodiment, multiple QR code labels 47 are provided on each storage plate 43. When the robotic arm 6 drives the gripper mechanism 7 to pick up materials from the machine or from the storage plate 43, the camera device 8 can read the QR code labels 47 to obtain the position of the wafer box 5 on the storage plate 43, thereby achieving precise gripping and automatic feeding and unloading.

[0061] In another embodiment, the QR code label 47 can be replaced with other codes, such as RFID (Radio Frequency Identification) tags or barcode labels. Compared to QR codes, RFID tags are read faster, and if the handling robot supports RFID technology, the camera device 8 can be replaced with an RFID reader.

[0062] In one embodiment, such as Figure 7 As shown, the robot body 1 is internally spaced with a first lifting mechanism 11 and a second lifting mechanism 12. In the first direction X, the first lifting mechanism 11 supports the first end of the bearing platform 10, and the second lifting mechanism 12 supports the second end of the bearing platform 10. The first lifting mechanism 11 and the second lifting mechanism 12 are used to adjust the height of the bearing platform 10.

[0063] Specifically, when a wafer box 5 is placed on the storage plate 43, the storage plate 43 is not fixed in a stable position at a height because the first shock-absorbing module 2 and the second shock-absorbing module 3 are provided below the fixed bracket 4.

[0064] In this embodiment, a first lifting mechanism 11 and a second lifting mechanism 12 are respectively provided at both ends of the bottom of the support platform 10. Whenever the robotic arm 6 passes the gripper mechanism 7 to pick up or place the wafer box 5 from the storage plate 43, the first lifting mechanism 11 and the second lifting mechanism 12 can adjust the height of the support platform 10, thereby lifting the entire fixed bracket 4 to a certain height, so that the gripper mechanism 7 can pick up or place the wafer box 5 from the fixed position.

[0065] In one embodiment, such asFigure 2 He Ru Figure 6 As shown, the gripper mechanism 7 includes a first gripper 71 and a second gripper 72. The first gripper 71 and the second gripper 72 are provided with limiting parts (not shown in the figure). The storage plate 43 is provided with limiting holes 48 on both sides along the first direction X. Each limiting part is inserted into the limiting hole 48 in a corresponding manner so that the first gripper 71 and the second gripper 72 are respectively fixedly connected to both sides of the storage plate 43.

[0066] Specifically, in this embodiment, by inserting the limiting part into the limiting hole 48, the storage plate 43 can be clamped by the first gripper 71 and the second gripper 72 and kept stably clamped, so as to prevent the storage plate 43 from falling off during the clamping and moving process and causing the wafer cassette 5 to fall.

[0067] During clamping, the first gripper 71 and the second gripper 72 move to the sides of the storage plate 43 respectively until each limiting part is inserted into the limiting hole 48 on the storage plate 43, so that the gripper mechanism 7 is firmly connected to the storage plate 43. Through the cooperation of the limiting part and the limiting hole 48, the movement of the storage plate 43 in the first direction X is restricted, thereby improving the stability of material handling.

[0068] In one embodiment, the transport robot also includes a mobile chassis (not shown in the figures), which is located at the bottom of the robot body 1 and is equipped with a positioning radar.

[0069] Specifically, the transport robot scans its surroundings using a positioning radar to determine its real-time location, autonomously plans its transport path, avoids collisions with obstacles, and achieves efficient and accurate transport tasks. The positioning radar is unaffected by environmental factors such as light and smoke, and can operate stably in various complex environments, enabling the transport robot to perform transport operations in any environment and greatly enhancing its environmental adaptability. The mobile chassis provides a stable mobile platform for the transport robot, ensuring its operation in various terrains and environments. Furthermore, the mobile chassis has load-bearing capacity and mobility, enabling the robot to carry itself and complete the transport task.

[0070] In this embodiment, the handling robot also includes a communication module, a positioning vision camera, sensors, and other components. The handling robot can adapt to various working environments, which will not be described in detail.

[0071] It should be understood that the term "and / or" as used in this specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations. It should be noted that, herein, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0072] The sequence numbers of the above-described embodiments of this utility model are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above descriptions are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A transport robot, characterized in that, The robot comprises: a robot body provided with a carrying platform; a first damping module comprising a first support plate and a plurality of spring assemblies, the plurality of spring assemblies are arranged on the carrying platform along a first direction and a second direction respectively, and the first support plate is connected to the plurality of spring assemblies; a second damping module comprising a second support plate and a plurality of rubber assemblies, the plurality of rubber assemblies are arranged on the first support plate along the first direction and the second direction, and the second support plate is connected to the plurality of rubber assemblies; a fixing support provided on the second support plate, and used for placing a wafer box.

2. The transport robot of claim 1, wherein, The first damping module comprises a first baffle plate arranged on the carrying platform along the outer edge of the first support plate to shield the spring assemblies. The second damping module comprises a second baffle plate arranged along the outer edge of the second support plate and connected to the first baffle plate to shield the rubber assemblies.

3. The transport robot of claim 1, wherein, The first damping module comprises four spring assemblies arranged along the first direction and the second direction. The second damping module comprises four rubber assemblies arranged along the first direction and the second direction.

4. The transport robot of claim 2, wherein, The fixing support comprises a first support, a second support, and a plurality of storage plates, the first support and the second support are arranged on both sides of the storage plates along the first direction, the plurality of storage plates are arranged from top to bottom along the height direction of the transfer robot, the first support and the second support are used for fixing the plurality of storage plates, and each of the storage plates is used for placing a plurality of wafer boxes.

5. The transport robot of claim 4, wherein, The first support and the second support are provided with clamping portions, the edges of the storage plates are provided with clamping grooves, and the clamping portions are embedded in the clamping grooves to connect the first support and the second support to the storage plates.

6. The transport robot of claim 5, wherein, The edges of the storage plates are also provided with emptying grooves arranged adjacent to the clamping grooves.

7. The transport robot of claim 4, wherein, The transfer robot comprises a mechanical arm, one end of the mechanical arm is connected to the robot body, and the other end of the mechanical arm is provided with a gripper mechanism used for clamping the wafer box.

8. The transport robot of claim 7, wherein, The storage plates are provided with two-dimensional code labels. The gripper mechanism or the mechanical arm is provided with a camera device used for reading the information of the two-dimensional code labels.

9. The transport robot of claim 8, wherein, The inside of the robot body is provided with a first jacking mechanism and a second jacking mechanism, in the first direction, the first jacking mechanism supports a first end of the carrying platform, and the second jacking mechanism supports a second end of the carrying platform. The first jacking mechanism and the second jacking mechanism are used for adjusting the height of the carrying platform.

10. The transport robot of claim 7, wherein, The clamping jaw mechanism comprises a first clamping jaw and a second clamping jaw, the first clamping jaw and the second clamping jaw are provided with limiting portions, limiting holes are arranged on both sides of the storage plate along the first direction, and each limiting portion is inserted into each limiting hole one by one, so that the first clamping jaw and the second clamping jaw are fixedly connected to both sides of the storage plate, respectively.