Electrostatic protection suction nozzle for chip processing
By using a nozzle body made of 304 stainless steel and a protective nozzle cap made of ESD antistatic Peek material, the problem of scratching WLCSP glass chips by traditional nozzles has been solved, thus achieving reliability in chip processing and stability in equipment.
Patent Information
- Application Number
- CN202423166545.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-23
AI Technical Summary
Traditional metal nozzles cannot meet the processing requirements of WLCSP glass chips, and are prone to scratching the chip surface during pick-up and drop-off.
The nozzle body is made of 304 stainless steel and combined with the ESD anti-static PEek material protective nozzle cap. The nozzle rod, reflector and nozzle opening are designed to be connected to avoid scratching the glass chip.
It effectively avoids scratches on the surface of WLCSP glass-grade chips, improves the reliability and safety of chip processing, and ensures the stable operation of automated equipment.
Smart Images
Figure CN223743630U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to chip processing technical field, specifically point to a kind of electrostatic protection suction nozzle for chip processing. BACKGROUND
[0002] With the rise of wearable devices, wearable devices are small in size, low in power consumption and require long-term stable operation, which requires semiconductor chips to have small size and low power consumption. The biggest feature of WLCSP wafer glass packaging method is to effectively reduce the packaging size. The high integration of WLCSP glass chip volume determines that WLCSP chip packaging adopts wafer-level glass packaging. Wafer glass level packaging requires higher process for programming and testing links, and traditional metal suction nozzle cannot meet the processing needs of WLCSP glass chip. It is easy to scratch the surface of WLCSP glass chip during pickup and discharge. SUMMARY
[0003] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a kind of electrostatic protection suction nozzle for chip processing, to solve the problem that traditional metal suction nozzle cannot meet the processing needs of WLCSP glass chip, solve the scratch problem of chip surface caused by suction nozzle in programming and testing link.
[0004] The technical scheme adopted in the present application is as follows:
[0005] The present application provides a kind of electrostatic protection suction nozzle for chip processing, including suction nozzle main part, the suction nozzle main part adopts 304 stainless steel material;
[0006] One end surface of the suction nozzle main part is provided with suction nozzle rod, suction nozzle reflector is arranged between the suction nozzle main part and the suction nozzle rod, the side of the suction nozzle rod away from the suction nozzle reflector is provided with suction nozzle mouth, the suction nozzle mouth is provided with protective suction nozzle cap, protective suction nozzle cap adopts ESD anti-static Peek material, can not scratch glass chip when picking up, suction nozzle main part, suction nozzle reflector, suction nozzle rod, suction nozzle mouth and protective suction nozzle cap are sequentially provided with adsorption channel.
[0007] As a preferred scheme, the suction nozzle main part is provided with suction nozzle slot, and the suction nozzle slot is arranged on the side of the suction nozzle main part away from the suction nozzle reflector. The suction nozzle slot is opened along the circumference of the suction nozzle main part.
[0008] As a preferred scheme, the suction nozzle rod is 1.4-1.5mm, and one end of the protective suction nozzle cap is embedded in the inside of the suction nozzle mouth.
[0009] The utility model with the above structure has the following beneficial effects:
[0010] By embedding the suction cap at the suction rod, the suction cap with scratch and static electricity prevention can solve the pickup and discharge problem of WLCSP glass level, and effectively avoid the scratch problem of the glass material on the chip surface. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 A front view of an electrostatic protection suction nozzle for chip processing is provided in the present scheme;
[0012] Figure 2 A perspective view of an electrostatic protection suction nozzle for chip processing is provided in the present scheme Figure One ;
[0013] Figure 3 A perspective view of an electrostatic protection suction nozzle for chip processing is provided in the present scheme Figure Two .
[0014] The meanings of the reference signs in the drawings are shown as follows:
[0015] 1, suction body, 2, suction rod, 3, suction reflector, 4, protective suction cap, 5, suction slot. DETAILED DESCRIPTION
[0016] The technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application.
[0017] Example 1
[0018] Please refer to Figures 1-3 , the present embodiment provides an electrostatic protection suction nozzle for chip processing, comprising:
[0019] The suction body 1 is provided with a suction rod 2 on one end face, and the suction body 1 and the suction rod 2 are provided with a suction reflector 3, the side of the suction rod 2 away from the suction reflector 3 is provided with a suction port, the suction port is provided with a protective suction cap 4, the protective suction cap 4 will not scratch the glass chip when sucking, and the suction body 1, the suction reflector 3, the suction rod 2, the suction port and the protective suction cap 4 are sequentially provided with a suction channel.
[0020] In the present embodiment, the protective suction cap 4 is made of ESD anti-static Peek material, which is an engineering plastic with excellent anti-static function, and can not scratch the glass chip when picking up, which can not only improve the reliability and safety performance of use, has good chemical resistance, temperature resistance and good electrical insulation performance, by embedding the anti-static Peek suction cap at the suction head, the scratch on the surface of WLCSP chip and the sticking problem existing in the suction and discharge can be effectively solved, so that the automatic programming equipment runs more stably.
[0021] As a preferred solution, the nozzle body 1 is provided with a nozzle clamping groove 5, which is arranged on the side of the nozzle body 1 away from the nozzle reflective plate 3. Further, the nozzle clamping groove 5 is arranged along the circumference of the nozzle body 1.
[0022] As a preferred embodiment, the diameter of the nozzle rod 2 is 1.4-1.5mm. The nozzle body 1 is made of 304 stainless steel.
[0023] In use of the utility model, the WLCSP chip is adsorbed by the adsorption channel, and the nozzle cap of ESD anti-static Peek material is embedded in the nozzle head, so that the chip scratch and adhesive tape can be effectively solved, and the automatic burning equipment runs more stably. The nozzle structure provided by the scheme is suitable for 8mm carrier tape width coding packaging machine with chip size less than 2mmx2mm.
[0024] It should be noted that although the embodiments of the utility model have been shown and described, for those skilled in the art, similar structural modes and embodiments can be designed without departing from the creative purpose of the utility model, which should belong to the protection scope of the utility model.
Claims
1. An electrostatic protection nozzle for chip processing comprising a nozzle body (1), characterized in that: One end face of the nozzle main body (1) is provided with a nozzle rod (2), the nozzle main body (1) and the nozzle rod (2) are provided with a nozzle reflection plate (3), the side of the nozzle rod (2) away from the nozzle reflection plate (3) is provided with a nozzle port, the nozzle port is provided with a protective nozzle cap (4), the nozzle main body (1), the nozzle reflection plate (3), the nozzle rod (2), the nozzle port and the protective nozzle cap (4) are sequentially and throughly provided with an adsorption channel.
2. The electrostatic protection suction nozzle for chip processing according to claim 1, wherein: The protective nozzle cap (4) is made of ESD anti-static Peek material.
3. An electrostatically shielded nozzle for chip processing according to claim 2, wherein: One end of the protective nozzle cap (4) is embedded in the inside of the nozzle port.
4. The electrostatic protection suction nozzle for chip processing according to claim 1, wherein: The nozzle main body (1) is provided with a nozzle clamping groove (5), the nozzle clamping groove (5) is arranged on the side of the nozzle main body (1) away from the nozzle reflection plate (3), and the nozzle clamping groove (5) is arranged along the circumference of the nozzle main body (1).
5. The electrostatically shielded nozzle for chip processing of claim 1, wherein: The nozzle main body (1) is made of 304 stainless steel.