Wafer supporting PIN convenient for height adjustment and lifting tray

Abstract

The utility model discloses a wafer supporting PIN and lifting tray convenient for height adjustment, which relates to the technical field of semiconductor manufacturing, and comprises a fixed end and a movable end, the lower part of the movable end is inserted into the fixed end and is in threaded connection with the fixed end, the upper end of the movable end is spherical, and the lower part of the movable end is in threaded connection with the fixed end. The lower part of the movable end and the outer surface of the fixed end are provided with scale marks convenient for observing the overall height of the ejector pin; the length of the fixed end is greater than the thickness of the heating device; the beneficial effects are that the design of the wafer support PIN and the lifting tray has obvious beneficial effects in the aspects of wafer placement precision improvement, heating uniformity enhancement, convenient adjustment and operation, strong adaptability and the like, and has important significance in improvement of a semiconductor manufacturing technology and guarantee of process stability.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a wafer support PIN and lifting tray convenient for height adjustment. BACKGROUND

[0002] Physical vapor deposition (PVD) or sputtering deposition technology is the most widely used thin film manufacturing technology in the semiconductor industry, which refers to the thin film preparation process using physical methods. In the Hardmask (hard mask) PVD equipment, the Wafer (wafer) goes through two processes: degassing (Degas) and TiN deposition. In the degassing process, the Wafer is heated to about 350°C to remove water vapor and other volatile impurities on the substrate.

[0003] Figure 5 The degassing chamber structure schematic diagram includes degassing chamber 101, platform manipulator 102, heating upper cover 103, Wafer 104, PIN (top needle) lifting mechanism 105, heating device 106, chamber heat insulation 107, door valve 108, wherein the PIN lifting mechanism 105 includes three top needles 201, corrugated pipe welding assembly 212 and air cylinder 203, Figure 5 The air cylinder 203 is shown as the rising position. In the vacuum environment of the degassing chamber, the door valve 108 is opened, the PIN lifting mechanism 105 is lifted to the wafer transfer position by the air cylinder 203, the platform manipulator 102 transfers the Wafer 104 into the degassing chamber 101, the platform manipulator 102 is retracted after descending to the wafer transfer position, the Wafer 104 is placed on the three top needles 201 of the PIN lifting mechanism 105, the air cylinder 203 is lowered, the Wafer is placed on the upper surface of the heating device 106, and at the same time the door valve 108 is closed, the degassing process is carried out. After the Wafer 104 completes the degassing process, the door valve 108 is opened, the air cylinder 203 is lifted, the platform manipulator 102 enters the degassing chamber 101 to take the wafer to the platform, and the next process is carried out.

[0004] In the degassing process, the temperature uniformity of the Wafer 104 has a certain influence on the degassing effect of the Wafer 104 and the subsequent process. For example Figure 6 As shown, since the diameter of the heating device 106 is different from that of the Wafer 104, the difference is 2b mm (0 < b < 3), when the Wafer 104 is placed on the plane formed by the three top needles 201, the levelness is low, when the Wafer 104 is lowered to the upper surface of the heating device 106, the Wafer 104 will have a large deviation (the center line of the Wafer and the heating device is large), at this time the heating device 106 will heat the Wafer 104 unevenly.

[0005] Patent application number 201410136482.3 discloses a method for adjusting the level of a PIN lifting mechanism, including two methods: adjusting the height of the other two ejector pins separately and adjusting the tilt of the lifting bracket. However, the method of adjusting the height of the other two ejector pins separately involves adjusting the ejector pins at a position below the degassing chamber, which is inconvenient due to limited space. Furthermore, the disclosed adjustment method does not consider the tilt of the lifting bracket as a whole when calculating the adjustment height of the other two ejector pins, so the ejector pins are also tilted. Therefore, the calculated adjustment height is the adjustment height of the ejector pins in the vertical direction, not the actual extension length of the ejector pins. Thus, the adjustment is prone to errors and is not easy to operate. Utility Model Content

[0006] The purpose of this invention is to provide a wafer support pin and lifting tray that are easy to adjust in height in order to solve the above problems.

[0007] This utility model achieves the above objectives through the following technical solutions:

[0008] A wafer support pin with adjustable height includes a fixed end and a movable end. The lower part of the movable end is inserted into the fixed end, and the lower part of the movable end is connected to the fixed end by a thread. The upper end of the movable end is spherical. The lower part of the movable end and the outer surface of the fixed end are provided with scale lines to facilitate observation of the overall height of the pin. The length of the fixed end is greater than the thickness of the heating device.

[0009] Preferably, the lower part of the movable end includes a first connecting rod, a second connecting rod, and a threaded head. The second connecting rod is disposed at the lower end of the first connecting rod, and the threaded head is disposed at the lower end of the second connecting rod. The threaded head is threadedly connected to the fixed end.

[0010] Preferably, the fixed end has a sliding cavity at its upper end and a threaded cavity below the sliding cavity. The sliding cavity and the threaded cavity are connected. The threaded head at the lower part of the movable end is disposed in the threaded cavity and is adapted to the internal thread of the inner wall of the threaded cavity.

[0011] Preferably, a sleeve is fitted on the first connecting rod, and the upper and lower ends of the sleeve are respectively limited by a first set of shims and a second set of shims. The sleeve has an inner circle and an outer square shape, and the sliding cavity corresponds to the shape of the sleeve.

[0012] Preferably, both the first gasket group and the second gasket group include two gaskets, and the surfaces of the two gaskets that come into contact are a flat surface and an arc surface, respectively.

[0013] Preferably: the first connecting rod diameter is smaller than the second connecting rod diameter, the second gasket group is on the second connecting rod end; the movable end upper part is provided with an installation groove corresponding to the first gasket group position, and the depth of the installation groove is the same as the thickness of the first gasket group.

[0014] Preferably: the movable end upper part and the fixed end are both cylindrical with the same diameter.

[0015] Preferably: the sleeve is a hexagonal prism, and the sleeve and the fixed end sidewall are provided with size scale lines from the upper end 0 downward.

[0016] A wafer lifting tray comprises a ring-shaped main body and a fixing part, wherein the fixing part is installed on the support device through a screw, support pins A, B and C are installed on the ring-shaped main body of the lifting tray, and a wafer is placed on the three support pins, and the three support pins are the wafer support PINs with the height convenient to adjust.

[0017] Compared with the prior art, the wafer support PIN and the lifting tray have the following beneficial effects:

[0018] 1. The wafer placing precision is improved: through the designed wafer support PIN, the movable end and the fixed end are connected through threads and can be adjusted up and down in the fixed end, and the length of the movable end extending out of the fixed end can be accurately controlled by cooperating with the scale lines. This design enables the three wafer support PINs to be easily adjusted to the same height, thereby ensuring the horizontal placement of the wafer on the lifting tray and improving the wafer placing precision.

[0019] 2. The heating uniformity is enhanced: since the wafer needs to be uniformly heated in the physical vapor deposition (PVD) or sputtering (Sputtering) deposition technology, the parallelism between the wafer and the heating device is crucial to the heating uniformity. The wafer support PIN and the lifting tray design of the patent can ensure that the wafer and the heating device remain parallel, thereby avoiding the problem of uneven heating of the wafer due to deviation during the heating process and improving the stability and yield of the process.

[0020] 3. Convenient to adjust and operate: compared with the prior art, the wafer support PIN and the lifting tray adjustment mode provided by the patent are more convenient. The operator only needs to rotate the movable end to adjust its height, and can directly read the adjusted height through the scale lines, without the need for complex calculation or adjustment. This not only improves the operation efficiency, but also reduces the operation difficulty and error.

[0021] 4. Strong adaptability: the wafer support PIN and the lifting tray designed in the patent have certain universality, can be applied to wafers of different sizes and specifications and different semiconductor manufacturing equipment. Meanwhile, the upper end of the movable end is provided with a spherical type, which can better adapt to the point support requirement of the wafer, further improving the adaptability and stability of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0023] Figure 1 is the internal structure schematic diagram of the wafer support PIN convenient for height adjustment.

[0024] Figure 2 is the structure schematic diagram of the movable end of the wafer support PIN convenient for height adjustment.

[0025] Figure 3 is the main view structure schematic diagram of the wafer support PIN convenient for height adjustment.

[0026] Figure 4 is the working principle diagram of the wafer support PIN convenient for height adjustment.

[0027] Figure 5 is the whole schematic diagram of the existing technology after the wafer is placed in the degassing chamber;

[0028] Figure 6 is the wafer in Figure 5 contacting with the heating device schematic diagram;

[0029] Figure 7 is the structure schematic diagram of the wafer lifting tray.

[0030] The following is the explanation of the reference signs:

[0031] 1, fixed end; 2, movable end; 3, threaded cavity; 4, sliding cavity; 5, mounting groove; 6, first gasket set; 7, second gasket set; 8, first connecting rod; 9, second connecting rod; 10, threaded head; 11, sleeve; 101, degassing chamber; 102, platform manipulator; 103, heating upper cover; 104, wafer; 105, PIN lifting mechanism; 106, heating device; 107, chamber heat insulation; 108, gate valve; 201, ejector pin; 202, support device; 203, air cylinder; 204, lifting bracket; 208, screw; 212, corrugated tube welding assembly. DETAILED DESCRIPTION

[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application, in addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated, therefore, the features with "first", "second" and the like can explicitly or implicitly include one or more of the features, in the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0033] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication between two elements, for those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] The present application will be further described below in conjunction with the drawings:

[0035] As Figures 1-4As shown, a wafer support pin with adjustable height includes a fixed end 1 and a movable end 2. The lower part of the movable end 2 is inserted into the fixed end 1, and the lower part of the movable end 2 is connected to the fixed end 1 by a thread. The upper end of the movable end 2 is spherical to accommodate the point support of the wafer 104. Scale lines are provided on the lower part of the movable end 2 and the outer surface of the fixed end 1 to facilitate observation of the overall height of the pin 201. The length of the fixed end 1 is greater than the thickness of the heating device 106 to ensure that the fixed end 1 can completely pass through the heating device 106, facilitating observation of the extension length of the upper end of the pin 201.

[0036] The lower part of the movable end 2 includes a first connecting rod 8, a second connecting rod 9, and a threaded head 10. The second connecting rod 9 is located at the lower end of the first connecting rod 8, and the threaded head 10 is located at the lower end of the second connecting rod 9. The threaded head 10 is threadedly connected to the fixed end 1. The upper end of the fixed end 1 has a sliding cavity 4, and the lower part of the sliding cavity 4 has a threaded cavity 3. The sliding cavity 4 and the threaded cavity 3 are connected. The threaded head 10 at the lower part of the movable end 2 is located in the threaded cavity 3 and is adapted to the internal thread of the inner wall of the threaded cavity 3.

[0037] A sleeve 11 is fitted onto the first connecting rod 8. The upper and lower ends of the sleeve 11 are respectively limited by the first gasket group 6 and the second gasket group 7. The sleeve 11 is in the shape of an inner circle and an outer square. The sleeve 11 is a hexagonal prism. The sliding cavity 4 corresponds to the shape of the sleeve 11. The sleeve 11 and the fixed end 1 have a dimension scale line on the side wall from the top 0 point downwards.

[0038] The first gasket group 6 and the second gasket group 7 each include two gaskets, and the contact surfaces of the two gaskets are one flat and one curved, which reduces the sliding friction of the first gasket group 6 and the second gasket group 7 when the movable end 2 rotates and the sleeve 11 does not rotate.

[0039] The diameter of the first connecting rod 8 is smaller than that of the second connecting rod 9, and the second shim group 7 rests on the end of the second connecting rod 9; the upper part of the movable end 2 is provided with an installation groove 5 corresponding to the position of the first shim group 6, and the depth of the installation groove 5 is the same as the thickness of the first shim group 6, so that the upper end scale of the sleeve 11 starts from 0 and the extension length of the movable end 2 can be seen more intuitively.

[0040] The upper part of the movable end 2 and the fixed end 1 are both cylindrical with the same diameter, which makes it convenient for the ejector pin 201 to pass through the through hole of the heating device 106.

[0041] like Figure 7 As shown, this embodiment also provides a wafer 104 lifting tray, including an annular body and a fixing part, wherein the fixing part is mounted on the support device 202 by screws 208, and the support pins A201, B201 and C201 are all mounted on the annular body of the lifting tray 204. The wafer 104 is placed on the three pins 201, and the three pins 201 use the wafer support PINs that are easy to adjust in height as described above.

[0042] Working principle: as Figure 5 As shown in the figure, in use, the PIN lifting mechanism 105 drives the lifting tray to rise with the PIN, the pins 201 pass out of the through hole on the heating device 106 upward, and the fixed end 1 completely passes out of the upper surface of the heating device 106, taking one pin 201 of the support device 202 as a reference, adjusting the remaining two pins 201 to the same length of the pin 201 extending out of the upper surface of the heating device 106, so that the wafer 104 is placed on the pins 201, and the wafer 104 is parallel to the heating device 106, thereby avoiding the problem that the wafer 104 and the center line of the heating device 106 are greatly different, and the heating device 106 is not uniform when heating the wafer 104.

[0043] The basic principle, main features and advantages of the utility model are shown and described above, and the skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and the description in the specification are only to illustrate the principle of the utility model, and various changes and improvements of the utility model can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed.

Claims

1. A wafer support PIN for facilitating height adjustment, comprising a fixed end (1) and a movable end (2), characterized in that: The lower part of the movable end (2) is inserted into the fixed end (1), and the lower part of the movable end (2) is connected with the fixed end (1) through threads, the upper end of the movable end (2) is provided with a spherical shape, and the lower part of the movable end (2) and the outer surface of the fixed end (1) are provided with scale lines for observing the overall height of the thimble (201); the length of the fixed end (1) is greater than the thickness of the heating device (106).

2. The wafer support PIN with easy height adjustment as claimed in claim 1, wherein: The lower part of the movable end (2) comprises a first connecting rod (8), a second connecting rod (9) and a threaded head (10), the second connecting rod (9) is arranged at the lower end of the first connecting rod (8), and the threaded head (10) is arranged at the lower end of the second connecting rod (9) and is threadedly connected with the fixed end (1).

3. The wafer support PIN for facilitating height adjustment according to claim 2, wherein: The upper end of the fixed end (1) is provided with a sliding cavity (4), a threaded cavity (3) is arranged below the sliding cavity (4), the sliding cavity (4) and the threaded cavity (3) are in communication, and the threaded head (10) of the lower part of the movable end (2) is arranged in the threaded cavity (3) and is matched with the internal threads of the inner wall of the threaded cavity (3).

4. The wafer support PIN for easy height adjustment according to claim 3, wherein: The first connecting rod (8) is sleeved with a sleeve (11), the upper and lower ends of the sleeve (11) are limited by the first gasket set (6) and the second gasket set (7) respectively, the sleeve (11) has an inner circle and an outer square shape, and the sliding cavity (4) corresponds to the shape of the sleeve (11).

5. The wafer support PIN for facilitating height adjustment as claimed in claim 4 wherein: The first gasket set (6) and the second gasket set (7) each comprise two gaskets, and the surfaces of the two gaskets in contact with each other are a plane and an arc surface respectively.

6. The wafer support PIN for easy height adjustment according to claim 4, wherein: The diameter of the first connecting rod (8) is smaller than the diameter of the second connecting rod (9), the second gasket set (7) is arranged on the end of the second connecting rod (9), and the upper part of the movable end (2) is provided with a mounting groove (5) corresponding to the position of the first gasket set (6), and the depth of the mounting groove (5) is the same as the thickness of the first gasket set (6).

7. The wafer support PIN for easy height adjustment as claimed in claim 1 wherein: The upper part of the movable end (2) and the fixed end (1) are both cylindrical with the same diameter.

8. The wafer support PIN for easy height adjustment as claimed in claim 4 wherein: The sleeve (11) is a hexagonal prism, and the sleeve (11) and the side wall of the fixed end (1) are provided with size scale lines from the upper end 0 point downwards.

9. A wafer lift flat comprising a ring-shaped main body and a fixing part, wherein the fixing part is mounted on a support device (202) by a screw (208), the top pin (201) comprises a top pin A, a top pin B and a top pin C, the top pin A, the top pin B and the top pin C are all mounted on the ring-shaped main body of the lift bracket (204), and the wafer (104) is placed on the three top pins (201), characterized in that: Three thimbles (201) use the wafer support PIN with the height convenient to adjust according to any one of claims 1-8.

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