Power module with double-sided heat dissipation and electrical protection function
By adopting a double-sided heat dissipation structure in the IGBT/SiC module, the problems of poor heat dissipation and discharge short circuit are solved, achieving more efficient heat dissipation and electrical protection.
Patent Information
- Application Number
- CN202423016029.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-09
AI Technical Summary
Existing IGBT/SiC modules suffer from poor heat dissipation, leading to overheating and affecting device performance and reliability. In addition, single-sided heat dissipation can easily cause discharge and short circuits.
The chip is upside down inside the packaged device and an insulating heat dissipation layer is added to the conductive heat dissipation component to form a dual-channel heat dissipation structure, which avoids close contact with other conductive components to prevent discharge and short circuit.
The module's heat dissipation capacity has been improved, and the heat dissipation area has been increased to ensure stable operation of the device in high-temperature environments and prevent discharge and short circuits.
Smart Images
Figure CN223743654U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to power semiconductor technical field especially a power module of double -sided heat dissipation and have electric property protection function. BACKGROUND
[0002] IGBT and SiC module are two different power semiconductor devices, which have a wide range of applications in the field of power electronics.
[0003] IGBT (insulated gate bipolar transistor) module is a power module composed of IGBT, which has high voltage resistance, large current, high frequency and other characteristics, and is widely used in alternating current motor, frequency converter, switching power supply and other fields.
[0004] SiC (silicon carbide) module is a power device made of SiC material, which has higher temperature resistance, lower on-resistance and faster switching speed, and is suitable for high-voltage, high-frequency and high-efficiency power conversion occasions.
[0005] IGBT / SiC module has many hazards caused by poor heat dissipation and overheating. First, the device module itself has a certain power. The module itself generates heat, so the overall performance and reliability of IGBT / SiC module are affected by temperature. Usually, the design rules are used to compare the number of failure rates. According to the design guidelines, one of the design rules shows that when the component works in an environment above 65℃, the failure rate doubles for every 10℃ increase in temperature. Therefore, it is extremely important to dissipate heat for IGBT / SiC module.
[0006] The existing module structure is generally a chip vertical mounting, and a heat sink is added at the bottom of the chip. Single-channel heat dissipation has a great limitation on the module. In addition, if a heat sink is designed on the upper surface of the power module, it is easy to cause discharge and short circuit due to the short distance with other metal conductive components. INVENTION CONTENTS
[0007] In view of the above technical problems, the purpose of the utility model patent is to provide a power module with double-sided heat dissipation and electric property protection function, which can solve the limitations of single-sided heat dissipation, realize double-channel heat dissipation, and the chip is inverted, so that a conductive heat dissipation part can be added on the front of the product, and a heat sink can be added on the front of the product, forming a double-sided heat sink, greatly increasing the heat dissipation capacity, and completely eliminating discharge and short circuit caused by the short distance with other conductive heat dissipation parts after increasing the heat dissipation area.
[0008] A power module with double-sided heat dissipation and electric property protection function, comprising a tube shell, a bottom plate and at least one packaged device;
[0009] The bottom plate is arranged in the tube shell;
[0010] The lower surface of the bottom plate is provided with a lower heat sink;
[0011] The package device is electrically connected to the bottom plate.
[0012] In the package device, at least one chip is flip-chipped on the conductive support in the package device, and the back surface of the flip-chipped chip is exposed above the plastic package body.
[0013] The back surface of the flip-chipped chip is provided with a conductive heat dissipation member, and an insulating heat dissipation layer is arranged on the upper surface of the conductive heat dissipation member.
[0014] Optionally, in all the package devices, only the lower surface of the insulating heat dissipation layer has a metal connecting layer, and the metal connecting layer is connected to the conductive heat dissipation member.
[0015] Optionally, in all the package devices, the upper and lower surfaces of the insulating heat dissipation layer have metal connecting layers.
[0016] The metal connecting layer on the lower surface of the insulating heat dissipation layer is connected to the conductive heat dissipation member.
[0017] The metal connecting layer on the upper surface of the insulating heat dissipation layer is connected to an upper heat sink.
[0018] Optionally, in all the package devices, the upper and lower surfaces of the insulating heat dissipation layer have metal connecting layers, and the lower surface of the insulating heat dissipation layer has a metal connecting layer in at least one package device.
[0019] In the insulating heat dissipation layer with the upper and lower surfaces having metal connecting layers, the metal connecting layer on the lower surface is connected to the conductive heat dissipation member, and the metal connecting layer on the upper surface is connected to an upper heat sink.
[0020] Further, the upper heat sink is an integral upper heat sink.
[0021] Specifically, the insulating heat dissipation layer is made of ceramic, and the metal connecting layer is a copper clad layer.
[0022] Specifically, the upper heat sink and / or the lower heat sink are connected by metal solder or adhesive or ultrasonic welding.
[0023] Compared with the prior art, the power module with double-sided heat dissipation and electrical protection function has the following advantages:
[0024] The independent double-sided heat dissipation package structure is inverted, a conductive heat dissipation piece is added on the top of the packaged device, and an insulating copper plate is added on the conductive heat dissipation piece for heat dissipation. The plate can be single-sided copper-clad, that is, the bottom of the plate is coupled with the conductive heat dissipation piece to directly dissipate heat in a large area. The plate can be double-sided copper-clad, one side is coupled with the conductive heat dissipation piece, and a metal heat sink is added on the other side. After the heat dissipation area is increased, discharge and short circuit caused by close distance with other conductive heat dissipation pieces are completely eliminated. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 A structure diagram of a double-sided heat dissipation and discharge prevention power module of embodiment 1 is shown.
[0026] Figure 2 A structure diagram of a double-sided heat dissipation and discharge prevention power module of embodiment 1 is shown.
[0027] Figure 3 A structure diagram of a double-sided heat dissipation and discharge prevention power module of embodiment 2 is shown.
[0028] Figure 4 A structure diagram of a double-sided heat dissipation and discharge prevention power module of embodiment 2 is shown. DETAILED DESCRIPTION
[0029] The specific embodiments of the utility model patent will be further described in detail below with reference to the accompanying drawings.
[0030] In each of the following embodiments, the number of chips in a single packaged device is 1, the material of the insulating heat dissipation layer is ceramic, and the metal connecting layer is a copper-clad layer.
[0031] Embodiment 1
[0032] As shown in Figure 1 , a double-sided heat dissipation and discharge prevention power module, comprising a tube shell (not shown in the figure), a bottom plate 1 and at least one packaged device 2.
[0033] The bottom plate 1 is arranged in the tube shell.
[0034] The lower surface of the bottom plate 1 is provided with a lower heat sink 3.
[0035] The packaged device 2 is electrically connected to the bottom plate 1.
[0036] As shown in Figure 2 , in the packaged device 2, the chip 4 is inverted on the conductive support 5 in the packaged device 2, and the back of the inverted chip 4 is exposed above the plastic package (not shown in the figure).
[0037] The back of the inverted chip 4 is provided with a conductive heat dissipation piece 6, and the upper surface of the conductive heat dissipation piece 6 is provided with a ceramic copper-clad bv plate 7.
[0038] In the embodiment, the ceramic copper clad plate 7 has the copper clad layer 8 only on the lower surface in all the packaging devices 2, and the copper clad layer 8 is connected with the conductive heat sink 6.
[0039] The independent double-sided heat dissipation packaging structure is inverted, a conductive heat sink is added on the top of the packaging, and an insulating heat dissipation layer is added on the conductive heat sink for heat dissipation. The plate is single-sided copper clad, that is, the bottom of the plate is connected with the conductive heat sink, and direct large-area heat dissipation is performed.
[0040] In the embodiment, the lower heat sink is connected by metal solder or adhesive or ultrasonic welding
[0041] Embodiment 2
[0042] As shown in Figure 3 A double-sided heat dissipation and discharge prevention power module includes a tube shell (not shown in the figure), a bottom plate 1 and at least one packaging device 2.
[0043] The bottom plate 1 is arranged in the tube shell.
[0044] The lower surface of the bottom plate 1 is provided with a lower heat sink 3.
[0045] The packaging device 2 is electrically connected to the bottom plate 1.
[0046] As shown in Figure 4 In the packaging device 2, the chip 4 is inverted on the conductive support 5 in the packaging device 2, and the back of the inverted chip 4 is exposed above the plastic package (not shown in the figure).
[0047] The back of the inverted chip 4 is provided with a conductive heat sink 6, and the upper surface of the conductive heat sink 6 is provided with a ceramic copper clad plate 7.
[0048] In the embodiment, the ceramic copper clad plate 7 has the copper clad layer on the upper and lower surfaces in all the packaging devices 2.
[0049] The copper clad layer 8 on the lower surface of the ceramic copper clad plate 7 is connected with the conductive heat sink 6.
[0050] The copper clad layer 9 on the upper surface of the ceramic copper clad plate 7 is connected with an upper heat sink 10.
[0051] In the embodiment, the upper heat sink 10 is an integral upper heat sink, which further improves the heat dissipation effect.
[0052] In the embodiment, the chip is inverted, the module bottom is normally provided with a radiator for heat dissipation, the independent double-sided heat dissipation packaging structure is inverted, a conductive heat dissipation piece is added on the packaging top, an insulating heat dissipation layer is added above the conductive heat dissipation piece for heat dissipation, the insulating heat dissipation layer is double-sided copper-clad, one side is connected with the conductive heat dissipation piece, and a metal radiator is added on the other side, so that the heat dissipation area is increased, and the discharge and short circuit caused by the short distance between other conductive heat dissipation pieces are completely eliminated.
[0053] In the embodiment, the upper radiator and / or the lower radiator are connected by metal solder or adhesive or ultrasonic welding
[0054] In addition, according to actual needs, in all the packaging devices, at least one of the packaging devices can be designed to have metal connecting layers on the upper and lower surfaces of the insulating heat dissipation layer, and at least one of the packaging devices can be designed to have a metal connecting layer only on the lower surface of the insulating heat dissipation layer; in the insulating heat dissipation layer with the metal connecting layers on the upper and lower surfaces, the metal connecting layer on the lower surface is connected with the conductive heat dissipation piece, and the metal connecting layer on the upper surface is connected with the upper radiator.
[0055] The preferred embodiments of the utility model have been specifically described above, but the utility model is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the utility model, and these equivalent modifications or replacements are all included in the range defined by the claims of the present application.
Claims
1. A power module with double-sided heat dissipation and electrical protection function, characterized in that, it comprises a tube shell, a bottom plate and at least one packaged device; the bottom plate is arranged in the tube shell; a lower surface of the bottom plate is provided with a lower heat sink; the packaged device is electrically connected to the bottom plate; in the packaged device, at least one chip is flip-chipped on a conductive support in the packaged device, and the back surface of the flip-chipped chip is exposed above the plastic package; the back surface of the flip-chipped chip is provided with a conductive heat dissipation member, and an upper surface of the conductive heat dissipation member is provided with an insulating heat dissipation layer.
2. The power module of claim 1, wherein, in all the packaged devices, only the lower surface of the insulating heat dissipation layer is provided with a metal connecting layer, and the metal connecting layer is connected to the conductive heat dissipation member.
3. The power module of claim 1, wherein the power module is a double-sided cooling power module with electrical protection function. in all the packaged devices, the upper and lower surfaces of the insulating heat dissipation layer are provided with metal connecting layers; the metal connecting layer on the lower surface of the insulating heat dissipation layer is connected to the conductive heat dissipation member; the metal connecting layer on the upper surface of the insulating heat dissipation layer is connected to an upper heat sink.
4. The power module of claim 1, wherein, in all the packaged devices, the upper and lower surfaces of the insulating heat dissipation layer in at least one packaged device are provided with metal connecting layers, and the insulating heat dissipation layer in at least one packaged device has only the lower surface provided with a metal connecting layer; in the insulating heat dissipation layer with the metal connecting layers on the upper and lower surfaces, the metal connecting layer on the lower surface is connected to the conductive heat dissipation member, and the metal connecting layer on the upper surface is connected to the upper heat sink.
5. The power module of claim 3 or 4, wherein the power module is a double-sided cooling power module with electrical protection function, characterized in that the upper heat sink is an integral upper heat sink.
6. A power module with double-sided heat dissipation and electrical protection function according to any one of claims 2-4, characterized in that, the material of the insulating heat dissipation layer is ceramic, and the metal connecting layer is a copper clad layer.
7. The power module of claim 3, wherein the power module is double-sided heat dissipating and has an electrical protection function. the upper heat sink and / or the lower heat sink are connected by metal solder or adhesive or ultrasonic welding.