Electronic package
By forming conductive vias in electronic components and constructing a three-layer vertical stacked structure, the problem of excessively long connection paths between optical chips and conversion chips is solved, achieving more efficient signal transmission and reduced costs.
Patent Information
- Application Number
- CN202520294445.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-02-17
- Filing Date
- 2025-02-24
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-02-24
AI Technical Summary
In existing co-packaged optical devices, the connection path between the optical chip and the conversion chip is too long, resulting in slow signal transmission and loss, which affects the performance of the end product.
Multiple conductive vias are formed in the electronic components, and the optoelectronic module is directly connected to the electronic components. The electronic components and the substrate are electrically connected through the conductive vias to form a three-layer vertical stacked structure to shorten the electrical transmission path.
By shortening the electrical transmission path through a vertical stacking structure, signal transmission loss is reduced, data transmission efficiency is improved, and production costs are lowered.
Smart Images
Figure CN223743671U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor structure, and more particularly to an electronic package with an optoelectronic module. Background Technology
[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading the industry to replace electricity with light as the data transmission medium. This aims to improve transmission capacity, efficiency, and distance while reducing energy consumption during transmission. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technologies.
[0003] Please see Figure 1A and Figure 1B The diagram shows a cross-sectional view and a partial top view of an existing co-packaged optical device 1. It mainly consists of a photoelectric module 11 mounted on a circuit board 10. The photoelectric module 11 includes a semiconductor chip 112 formed in a packaging structure 111 and an optical chip 113 mounted on the packaging structure 111, so that optical signals can be transmitted to the photoelectric module 11 for communication. At the same time, a switching chip 12 needs to be mounted on the circuit board 10 to be used in the terminal product. The switching chip 12 is first mounted on a substrate 13 and then mounted on the circuit board 10 through the substrate 13.
[0004] However, the optical chip 113 and the conversion chip 12 in the aforementioned co-packaged optical device 1 need to be connected by electrical circuits in the circuit board 10 and substrate 13. However, the path is too long, which causes the signal transmission to be too slow and lossy, resulting in problems in the application of end products.
[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides an electronic package, including: a substrate having a first side and a second side opposite to each other; an electronic component having a first surface and a second surface opposite to each other, and having the second surface attached to the first side of the substrate, and having a plurality of conductive through holes penetrating the first surface and the second surface; and an optoelectronic module attached to the first surface of the electronic component and electrically connected to the plurality of conductive through holes of the electronic component.
[0007] In the aforementioned electronic package, the electronic component is a switching application-specific integrated circuit.
[0008] In the aforementioned electronic package, the electronic component is electrically connected to the substrate via a plurality of conductive bumps on the second surface.
[0009] In the aforementioned electronic package, the optoelectronic module includes a package structure, a semiconductor element disposed within the package structure, and an optical element disposed on the package structure. In one embodiment, the semiconductor element is an electronic integrated circuit element. In one embodiment, the optical element is an optical chip or an optical module. In one embodiment, the optical module includes a coupler, an optical chip, a total reflection mirror, and a fiber optic array unit.
[0010] In the aforementioned electronic package, the optoelectronic module is connected to the first surface of the electronic component and electrically connected to the electronic component via a conductive element disposed on the package structure.
[0011] In the aforementioned electronic package, a plurality of conductive elements are implanted on the second side of the substrate.
[0012] In the aforementioned electronic package, the substrate, the electronic component, and the optoelectronic module constitute a three-layer vertically stacked structure.
[0013] As can be seen from the above, the electronic package of this application mainly forms multiple conductive vias in the electronic component, and places the electronic component on the substrate, and directly connects the optoelectronic module containing optical components and semiconductor components to the electronic component, so that the optoelectronic module can be electrically connected to the electronic component and the substrate through the multiple conductive vias, thereby shortening the electrical transmission path and reducing data transmission loss. Attached Figure Description
[0014] Figure 1A and Figure 1B This is a cross-sectional view and a partial top view of an existing co-packaged optical device.
[0015] Figure 2A and Figure 2B This is a cross-sectional view and a partial top view of the electronic package of this application.
[0016] Explanation of reference numerals in the attached figures
[0017] 1. Co-packaged optical devices
[0018] 10 Circuit Boards
[0019] 11 Optoelectronic Modules
[0020] 111 Package Structure
[0021] 112 Semiconductor Chips
[0022] 113 Optical Chip
[0023] 12 conversion chips
[0024] 13 substrate
[0025] 2 Electronic Packages
[0026] 20 circuit boards
[0027] 21 Optoelectronic Modules
[0028] 211 Package Structure
[0029] 212 Semiconductor Components
[0030] 213 Optical Components
[0031] 214 Conductive components
[0032] 22 Electronic components
[0033] 22a First Surface
[0034] 22b Second Surface
[0035] 221 Conductive Through-hole
[0036] 222 Conductive bump
[0037] 23 substrate
[0038] 23a First side
[0039] 23b Second side
[0040] 230 Insulation Layer
[0041] 231 Line Layer
[0042] 24. Conductive elements. Detailed Implementation
[0043] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0044] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0045] Please see Figure 2A and Figure 2B The figures shown are a cross-sectional view and a partial top view of the electronic package 2 of this application.
[0046] The electronic package includes a substrate 23, an electronic component 22 disposed on the substrate 23, and an optoelectronic module 21 disposed on the electronic component 22.
[0047] The substrate 23 is, for example, a core substrate with a core layer or a coreless substrate without a core layer, and has opposing first sides 23a and second sides 23b.
[0048] In this embodiment, the substrate 23 includes an insulating layer 230 and a circuit layer 231 bonded to the insulating layer 230. The insulating layer 230 is made of dielectric materials such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP). The circuit layer 231 is, for example, a fan-out type redistributed circuit layer, and its material is, for example, metallic copper.
[0049] The electronic component 22 is disposed on the first side 23a of the substrate 23 and electrically connected to the substrate 23.
[0050] The electronic component 22 is, for example, a switch ASIC, having opposing first surfaces 22a and second surfaces 22b, and having a plurality of conductive vias 221 (e.g., conductive silicon vias) extending through the first surface 22a and the second surface 22b. The electronic component 22 is electrically connected to the circuit layer 231 of the substrate 23 via the second surface 22b through a plurality of conductive bumps 222 (e.g., solder bumps or copper bumps).
[0051] The optoelectronic module 21 is disposed on the first surface 22a of the electronic component 22 and is electrically connected to a plurality of conductive through holes 221 of the electronic component 22.
[0052] The optoelectronic module 21 includes a package structure 211, a semiconductor element 212 disposed in the package structure 211, and an optical element 213 disposed on the package structure 211. The package structure 211 is, for example, a fan-out stacked package structure (FO-PoP), the semiconductor element 212 is, for example, an electronic integrated circuit element (EIC), and the optical element 213 is, for example, an optical chip or an optical PIC module. The optical module includes a coupler, an optical chip, a total reflection mirror, a fiber optic array unit (FAU), etc.
[0053] The optoelectronic module 21 can be attached to and electrically connected to the electronic component 22 via a conductive element 214 (e.g., a solder bump or a copper bump) disposed on the packaging structure 211, on the first surface 22a of the electronic component 22. Figure 2B As shown, the positions of the multiple conductive vias 221 of the electronic component 22 are located within the vertical projection area of the optoelectronic module 21, so that the optoelectronic module 21 can directly use the conductive vias 221 of the electronic component 22 to electrically connect the electronic component 22, the substrate 23 or other components, thereby shortening the electrical transmission path and reducing data transmission loss.
[0054] In addition, multiple conductive elements 24 (e.g., solder bumps or copper bumps) can be implanted on the second side 23b of the substrate 23 for subsequent electrical connection of the substrate 23 to the circuit board 20 through the multiple conductive elements 24.
[0055] Accordingly, the electronic package of this application vertically stacks electronic components with multiple conductive through holes on a substrate, and then vertically stacks an optoelectronic module containing EIC / PIC on the electronic components to form a three-layer vertically stacked electronic package, thereby accelerating electrical communication between them through vertical electrical conduction.
[0056] In summary, the electronic package of this application mainly involves forming multiple conductive vias in the electronic component, placing the electronic component on a substrate, and directly attaching an optoelectronic module containing optical and semiconductor elements to the electronic component. This allows the optoelectronic module to be electrically connected to the electronic component and the substrate through the multiple conductive vias, thereby shortening the electrical transmission path and reducing data transmission losses. Furthermore, this electronic package technology is highly feasible and can be manufactured using existing semiconductor packaging processes without the need to develop special processes or purchase specialized equipment, thus reducing product manufacturing costs.
[0057] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An electronic package, characterized by Comprising: a substrate having opposite first and second sides; an electronic component having opposite first and second surfaces, and disposed with its second surface on the first side of the substrate, and the electronic component formed with a plurality of conductive vias through the first and second surfaces; and an optoelectronic module disposed on the first surface of the electronic component and electrically connected to the plurality of conductive vias.
2. The electronic package of claim 1, wherein, The electronic component is a conversion specific application integrated circuit.
3. The electronic package of claim 1, wherein, The electronic component is electrically connected to the substrate through the second surface by a plurality of conductive bumps.
4. The electronic package of claim 1, wherein, The optoelectronic module includes a package structure, a semiconductor component disposed in the package structure, and an optical component disposed on the package structure.
5. The electronic package of claim 4, wherein, The semiconductor component is an electronic integrated circuit component.
6. The electronic package of claim 4, wherein, The optical component is an optical chip or an optical module.
7. The electronic package of claim 6, wherein, The optical module includes a coupler, an optical chip, a total reflection mirror, and an optical fiber array unit.
8. The electronic package of claim 4, wherein, The optoelectronic module is disposed on the first surface of the electronic component and electrically connected to the electronic component by a conductive member disposed on the package structure.
9. The electronic package of claim 1, wherein, The second side of the substrate is provided with a plurality of conductive elements.
10. The electronic package of claim 1, wherein, The substrate, the electronic component, and the optoelectronic module form a three-layer vertical stack structure.