Electronic package
By employing packaging module stacking and shielding layer design in semiconductor packaging, the problem of large packaging area is solved, achieving a smaller packaging area and stronger electromagnetic interference shielding, without requiring new materials or equipment.
Patent Information
- Application Number
- CN202423155736.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-12-02
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-20
AI Technical Summary
In existing semiconductor packages, electronic components are placed on the same side, resulting in a large package area and occupying a lot of space in the end product, making it difficult to meet the modern technical requirements of being thin, light, and compact.
By adopting a stacked packaging module structure, the shielding layer is placed between the first electronic component and the second electronic component. The conductive pillars and shielding components provide electromagnetic interference shielding effect and reduce the area of the circuit structure layout.
This achieves a reduction in packaging area, enhanced electromagnetic interference shielding, and avoids additional cost expenditures.
Smart Images
Figure CN223743673U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor packaging technology, and more particularly to an electronic package with shielding function. Background Technology
[0002] With the evolution of semiconductor technology, semiconductor products have been developed in different packaging forms. In order to improve electrical quality, many semiconductor products have shielding functions to prevent the generation of electromagnetic interference (EMI).
[0003] like Figure 1 As shown, in order to avoid EMI, a conventional semiconductor package 1 electrically connects multiple electronic components 11, 12, such as radio frequency and non-radio frequency chips, to a package substrate 10, and a metal frame 17 is disposed on the package substrate 10 and located between each electronic component 11, 12. Then, an encapsulation layer 15, such as epoxy resin, is used to cover each electronic component 11, 12 and the metal frame 17. After that, multiple solder balls 19 are implanted on the underside of the package substrate 10, so as to prevent the electronic components 11, 12 from interfering with each other through the metal frame 17.
[0004] However, in the existing semiconductor package 1, all the electronic components 11, 12 are located on the same side of the package substrate 10, resulting in a very large package area of the package substrate 10. When placed on the circuit board of the terminal product, it occupies a lot of space on the circuit board of the terminal product, making it difficult for the terminal product to meet the requirements of modern technology for thin, light and small products.
[0005] Therefore, overcoming the problems of the existing technologies mentioned above has become a pressing issue that the industry urgently needs to address. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides an electronic package, comprising: a circuit structure; a first electronic component disposed on the circuit structure; a package layer disposed on the circuit structure to cover the first electronic component; a package module stacked on the circuit structure and electrically connected to the circuit structure, wherein the package module includes a carrier structure and a second electronic component disposed on the carrier structure such that the second electronic component corresponds to the position of the first electronic component, such that the first electronic component and the second electronic component have overlapping surfaces; and a shielding layer disposed between the first electronic component and the second electronic component.
[0007] The present application also provides a method for manufacturing an electronic package, comprising: disposing a first electronic component on a circuit structure; forming a packaging layer on the circuit structure so as to cover the first electronic component; stacking a packaging module on the circuit structure, and electrically connecting the packaging module to the circuit structure, wherein the packaging module comprises a supporting structure and a second electronic component disposed on the supporting structure, so that the second electronic component corresponds to the position of the first electronic component, and the first electronic component and the second electronic component have an overlapping surface; and forming a shielding layer between the first electronic component and the second electronic component.
[0008] In the aforementioned electronic package and the method for manufacturing the same, the shielding layer is disposed on the packaging layer to cover the first electronic component. For example, the shielding layer contacts the first electronic component. Alternatively, the shielding layer extends to the surface edge of the packaging layer, or even extends to the side surface of the packaging layer. Further, another shielding layer is disposed on the outer surface of the packaging module, and the shielding layer can be connected to the another shielding layer.
[0009] In the aforementioned electronic package and the method for manufacturing the same, the shielding layer is disposed on the packaging module to cover the second electronic component.
[0010] In the aforementioned electronic package and the method for manufacturing the same, a shielding member is further formed on the circuit structure, and the shielding layer is grounded to the shielding member.
[0011] In the aforementioned electronic package and the method for manufacturing the same, a shielding member is further formed on the supporting structure, and the shielding layer is grounded to the shielding member.
[0012] In the aforementioned electronic package and the method for manufacturing the same, a plurality of conductive columns are further disposed on the circuit structure, so that the packaging module is stacked on the plurality of conductive columns and electrically connected to the plurality of conductive columns.
[0013] As can be seen from the above, the electronic package of the present application mainly stacks the packaging module on the conductive column, and disposes the shielding layer between the first electronic component and the second electronic component, so as to provide the effect of electromagnetic interference (EMI) shielding. Therefore, compared with the prior art, the electronic package of the present application not only can reduce the layout area of the circuit structure, but also can increase the effect of shielding signal interference.
[0014] Furthermore, the present application only needs to use existing materials and existing processes and machines to complete, so that there is no need to develop new processes and new materials, and there is no need to purchase new machines, and therefore the present application will not generate a large amount of additional cost expenditure. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 FIG. 1 is a schematic cross-sectional view of a conventional semiconductor package.
[0016] Figures 2A-2D A cross-sectional view of an electronic package of the present application. Figure 2C-1 A top view of Figure 2C
[0017] Figure 2E Figure 2F Figure 2G A cross-sectional view of other embodiments of Figure 2D
[0018] Figure 3A Figure 3B A cross-sectional view of other different embodiments of Figure 2D
[0019] Figure 4 A cross-sectional view of another embodiment of Figure 2D
[0020] BRIEF DESCRIPTION OF DRAWINGS
[0021] 1 semiconductor package
[0022] 10 package substrate
[0023] 11, 12 electronic components
[0024] 15 package layer
[0025] 17 metal frame
[0026] 19 solder balls
[0027] 2, 3, 4 electronic package
[0028] 2a package module
[0029] 20 routing structure
[0030] 20a first side
[0031] 20b second side
[0032] 200 routing layer
[0033] 201 electrical contact pads
[0034] 202 contacts
[0035] 203 ground pads
[0036] 21, 31 first electronic component
[0037] 210, 220, 262 conductive bumps
[0038] 22 second electronic component
[0039] 23 conductive posts
[0040] 23a end face
[0041] 24 Coating Layers
[0042] 25 Encapsulation layer
[0043] 26 Load-bearing structure
[0044] 26a First Surface
[0045] 26b Second Surface
[0046] 260 Wiring Layer
[0047] 261 Functional Components
[0048] 27,47 Shielding components
[0049] 27a end face
[0050] 28, 28a, 28b, 38, 48 shielding layers
[0051] 29 Conductive elements
[0052] 30. Insulation layer. Detailed Implementation
[0053] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0054] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0055] Figures 2A-2D This is a cross-sectional schematic diagram of the manufacturing method of the electronic package 2 of this application.
[0056] like Figure 2A As shown, a circuit structure 20 is provided, having a first side 20a and a second side 20b opposite to each other, such that at least one first electronic component 21, a plurality of conductive posts 23 and at least one shield 27 are disposed on the first side 20a of the circuit structure 20.
[0057] The circuit structure 20 is, for example, a package substrate with or without a core layer, and has a plurality of circuit layers 200, such as fan-out type redistribution layers (RDLs).
[0058] In this embodiment, the circuit layer 200 has a plurality of electrical contact pads 201, contacts 202, and ground pads 203.
[0059] It should be understood that the circuit structure 20 can also be other carrier units that can carry electronic components such as chips, such as lead frames, and is not limited to the above.
[0060] The first electronic component 21 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.
[0061] In this embodiment, the first electronic component 21 is flip-chip mounted on the contacts 202 by a plurality of conductive bumps 210 such as solder material and is electrically connected to the circuit layer 200; or the first electronic component 21 can be wire-bonded to the contacts 202 by a plurality of wires (not shown); or the first electronic component 21 can directly contact the contacts 202. However, the manner in which the first electronic component 21 is electrically connected to the circuit structure 20 is not limited to the above.
[0062] The conductive pillar 23 is used to externally connect other electronic devices, and there are many types, such as bump combinations.
[0063] In this embodiment, the conductive pillar 23 is a metal pillar such as a copper pillar, which is combined to the electrical contact pads 201 of the circuit layer 200 of the circuit structure 20 by solder material (not shown). It should be understood that solder balls can also be used as conductive pillars 23, but are not limited to the above.
[0064] The shielding member 27 is arranged around the first electronic component 21, and the conductive pillar 23 is located outside the shielding member 27.
[0065] In this embodiment, the shielding member 27 is a metal pillar formed in a manner such as electroplating copper, which is electrically connected (such as grounded) to the ground pads 203 of the circuit structure 20.
[0066] For example, Figure 2BAs shown, an encapsulation layer 25 is formed on the first side 20a of the circuit structure 20, so that the encapsulation layer 25 covers the first electronic component 21, the shield 27 and the conductive pillar 23, and exposes a portion of the surface of the first electronic component 21, the shield 27 and the conductive pillar 23 to the encapsulation layer 25.
[0067] In this embodiment, the encapsulation layer 25 is an insulating material, such as polyimide (PI), dry film, encapsulating colloid or molding compound such as epoxy resin, which can be formed by lamination or molding.
[0068] Furthermore, a leveling process can be used to make the surface of the encapsulation layer 25 flush with the upper surface of the first electronic component 21, the end face 27a of the shield 27, and the end face 23a of the conductive post 23, so that the shield 27 and the conductive post 23 are exposed in the encapsulation layer 25. For example, a grinding process can be used to remove part of the material of the encapsulation layer 25 and the conductive post 23, and even part of the material of the shield 27. It should be understood that the conductive post 23 or the shield 27 can also be embedded in the encapsulation layer 25, with an opening to expose the conductive post 23 or the shield 27 in the encapsulation layer 25.
[0069] like Figure 2C As shown, a shielding layer 28 is formed on the encapsulation layer 25 so that the shielding layer 28 covers the first electronic component 21 and is electrically connected (grounded) to the shielding member 27 but not electrically connected to the conductive post 23.
[0070] In this embodiment, the shielding layer 28 is a metal layer, which is formed on the encapsulation layer 25 by electroplating, chemical plating, sputtering, or other coating methods, such as... Figure 2C-1 As shown. For example, the shielding layer 28 only contacts the shielding member 27 and the first electronic component 21, but not the conductive post 23. It should be understood that there are many types of shielding layers 28, such as thin film forms, and they are not limited to those described above.
[0071] like Figure 2D As shown, a packaging module 2a is stacked on the conductive pillar 23 to obtain the electronic package 2. The packaging module 2a includes a carrier structure 26, at least one second electronic component 22 disposed on the carrier structure 26, and a covering layer 24 covering the second electronic component 22.
[0072] The supporting structure 26 has a first surface 26a and a second surface 26b facing each other, such that the first surface 26a of the supporting structure 26 faces the first side 20a of the circuit structure 20.
[0073] In this embodiment, the carrier structure 26 is, for example, a package substrate with a core layer and a wiring structure or a coreless wiring structure having a plurality of wiring layers 260, such as fan out type redistribution layers (RDLs).
[0074] Furthermore, a plurality of conductive bumps 262 can be disposed on the first surface 26a of the carrier structure 26 for flip-chip bonding to the conductive pillars 23.
[0075] In addition, at least one functional element 261, such as an active element, a passive element or a combination thereof, can be disposed on the second surface 26b of the carrier structure 26 as needed.
[0076] The second electronic element 22 is disposed on the first surface 26a of the carrier structure 26 to correspond to the position of the first electronic element 21, so that the first electronic element 21 and the second electronic element 22 are separated by the shielding layer 28.
[0077] In this embodiment, the second electronic element 22 is an active element, a passive element or a combination thereof, wherein the active element is, for example, a semiconductor chip, and the passive element is, for example, a resistor, a capacitor or an inductor. For example, the second electronic element 22 is flip-chip mounted on the wiring layer 260 by means of a plurality of conductive bumps 220, such as solder material; or the second electronic element 22 can be wire-bonded to the wiring layer 260 by means of a plurality of wire bonds (not shown). However, the manner in which the second electronic element 22 is electrically connected to the wiring structure 20 is not limited to the above.
[0078] The encapsulation layer 24 is formed on the first surface 26a and the second surface 26b of the carrier structure 26 to encapsulate the second electronic element 22 and the functional element 261.
[0079] In this embodiment, the encapsulation layer 24 is an insulating material, such as polyimide (PI), a dry film, an encapsulation adhesive such as epoxy or a molding compound. Therefore, the encapsulation layer 24 can be formed by means of liquid encapsulation, injection, lamination or compression molding. It should be understood that the material forming the encapsulation layer 25 can be the same as or different from the material forming the encapsulation layer 24.
[0080] In subsequent processes, the second side 20b of the circuit structure 20 can form a plurality of conductive elements 29, such as solder balls, for external connection of the electronic package 2 to an electronic device such as a circuit board, circuit structure, package structure or other (figure not shown).
[0081] Furthermore, such as Figure 2E As shown, in other embodiments, the shielding layer 28 may not contact the first electronic component 31, that is, the first electronic component 31 is not exposed to the encapsulation layer 25; or, as... Figure 2F As shown, in other embodiments, the shielding layer 28a may extend to cover the upper surface edge of the encapsulation layer 25, but still not contact the conductive post 23; even, as... Figure 2G As shown, in other embodiments, the shielding layer 28 may extend to the side of the encapsulation layer 25 and the side of the circuit structure 20, and does not contact the conductive post 23.
[0082] Furthermore, in other embodiments, such as Figure 3A The electronic package 3 shown may have an insulating layer 30, such as a primer, formed between the package module 2a and the package layer 25, so that the insulating layer 30 covers the conductive bump 262, and a shielding layer 38 may be formed on the outer surface of the package module 2a (or even the electronic package 3). It should be understood that, as Figure 3B As shown, in other embodiments, the shielding layer 38 may be further electrically connected to the shielding layer 28 disposed on the encapsulation layer 25.
[0083] Additionally, in another embodiment, such as Figure 4 The electronic package 4 shown may also have a shielding layer 48 disposed on the second electronic component 22 of the package module 2a, and a shielding member 27 disposed on the first surface 26a of the support structure 26, and the shielding layer 48 electrically connected (grounded) to the shielding member 27.
[0084] Therefore, the electronic package of this application mainly provides electromagnetic interference (EMI) shielding by stacking the package module 2a on the circuit structure 20 (conductive pillar 23) and placing the shielding layers 28, 28a, 28b, 38, 48 between the first electronic component 21, 31 and the second electronic component 22. Thus, compared with the prior art, the electronic package 2, 3, 4 of this application can not only reduce the layout area of the first side 20a of the circuit structure 20, but also increase the effect of shielding signal interference.
[0085] Furthermore, this application can be completed using existing materials, processes, and equipment, so there is no need to develop new processes and materials, nor to purchase new equipment. Therefore, this application will not incur a large amount of additional cost expenditure.
[0086] The present application also provides an electronic package 2, 3, 4, which comprises a circuit structure 20, a first electronic element 21, 31, a plurality of conductive pillars 23, a packaging layer 25, a shielding layer 28, 28a, 28b, 48, and a packaging module 2a.
[0087] The first electronic element 21, 31 is disposed on the circuit structure 20 and electrically connected to the circuit structure 20.
[0088] The conductive pillars 23 are disposed on the circuit structure 20 and electrically connected to the circuit structure 20.
[0089] The packaging layer 25 is disposed on the circuit structure 20 to cover the first electronic element 21, 31 and the plurality of conductive pillars 23.
[0090] The packaging module 2a is stacked on the circuit structure 20 and electrically connected to the conductive pillars 23, wherein the packaging module 2a comprises a supporting structure 26, and at least one second electronic element 22 disposed on the supporting structure 26, so that the second electronic element 22 corresponds to the position of the first electronic element 21, 31, and the first electronic element 21, 31 and the second electronic element 22 have an overlapping surface.
[0091] The shielding layer 28, 28a, 28b, 48 is disposed between the first electronic element 21, 31 and the second electronic element 22.
[0092] In an embodiment, the shielding layer 28, 28a, 28b is disposed on the packaging layer 25 to cover the first electronic element 21, 31. For example, the shielding layer 28, 28a contacts the first electronic element 21. Alternatively, the shielding layer 28a extends to the upper surface edge of the packaging layer 25, or even the shielding layer 28b extends to the side surface of the packaging layer 25. Further, a shielding layer 38 is formed on the outer surface of the packaging module 2a or the electronic package 3, and the shielding layers 28, 38 can be electrically connected to each other.
[0093] In an embodiment, the shielding layer 48 is disposed on the packaging module 2a to cover the second electronic element 22.
[0094] In an embodiment, the electronic package 2, 3 further comprises a shielding member 27 disposed on the circuit structure 20.
[0095] In an embodiment, the electronic package 4 further comprises a shielding member 47 disposed on the supporting structure 26.
[0096] In summary, the electronic package of the present application can provide electromagnetic interference shielding effect by stacking the package module on the circuit structure and disposing the shielding layer between the first electronic element and the second electronic element, so that the electronic package of the present application can not only reduce the layout area of the circuit structure, but also increase the shielding signal interference effect.
[0097] Furthermore, the electronic package of the present application only needs to use existing materials and existing processes and machines, so that it does not need to develop new processes and new materials, and does not need to purchase new machines, so that the electronic package of the present application will not generate a large amount of additional cost.
[0098] The above embodiments are used to exemplarily illustrate the principles and effects of the present application, but are not used to limit the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be subject to the claims.
Claims
1. An electronic package, characterized by Comprising: a circuit structure; a first electronic component disposed on the circuit structure; a packaging layer disposed on the circuit structure to cover the first electronic component; a packaging module stacked on the circuit structure and electrically connected to the circuit structure, wherein the packaging module includes a carrier structure and a second electronic component disposed on the carrier structure, such that the second electronic component corresponds to the position of the first electronic component, so that the first electronic component and the second electronic component have an overlapping surface; and a shielding layer disposed between the first electronic component and the second electronic component. The shielding layer is disposed on the packaging layer to cover the first electronic component.
2. The electronic package of claim 1, wherein, The shielding layer contacts the first electronic component.
3. The electronic package of claim 2, wherein, The shielding layer extends to the upper surface edge of the packaging layer.
4. The electronic package of claim 2, wherein, The shielding layer extends to the side surface of the packaging layer.
5. The electronic package of claim 2, wherein, The electronic package further includes another shielding layer disposed on the outer surface of the packaging module.
6. The electronic package of claim 1, wherein, The shielding layer is connected to the other shielding layer.
7. The electronic package of claim 6, wherein, The shielding layer is disposed on the packaging module to cover the second electronic component.
8. The electronic package of claim 1, wherein, The electronic package further includes a shielding member disposed on the circuit structure, and the shielding layer is grounded to the shielding member.
9. The electronic package of claim 1, wherein, The electronic package further includes a shielding member disposed on the carrier structure, and the shielding layer is grounded to the shielding member.
10. The electronic package of claim 1, wherein, The electronic package further includes a plurality of conductive pillars disposed on the circuit structure, so that the packaging module is stacked on the plurality of conductive pillars and electrically connected to the plurality of conductive pillars.
11. The electronic package of claim 1, wherein,