Paster lead of electronic component

Abstract

The utility model discloses a patch lead of an electronic component, which comprises a lead main body, at least one rectangular soldering lug is welded and fixed on the inner side wall of the lead main body, and the distance between the outer side wall of the soldering lug and the inner side wall of the lead main body is 0.07-0.15 mm. According to the utility model, the soldering lug is directly welded and fixed on the inner side wall of the lead, so that the size and the position of the soldering lug are fixed, a uniform tin layer of which the thickness tolerance is less than or equal to + / -0.05 mm is just formed between the lead and the component main body when the lead is welded with the component main body, and the lead and the component main body are firmly combined into a whole; therefore, the assembly quality of the electronic component is ensured. Moreover, after the lead structure is adopted, a welding machine can be adopted to weld the lead and the component main body, so that the processing efficiency is improved, and the stability of the welding quality is ensured.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of patch lead, especially relates to a patch lead of electronic component. BACKGROUND

[0002] In prior art, the lead, the soldering pad and the electronic component body are independent, and the patch lead is fixed on the two sides of the electronic component body by using the soldering pad through manual welding during the assembly of the electronic component. The size and position of the soldering pad directly determine the welding quality, and if the size and position of the soldering pad are not appropriate, the solder will overflow into the gap between the electronic components or the area of the welding spot will be insufficient after the welding, so that the patch lead and the electronic component body are not firmly combined, the shear force is not enough, and the performance of the electronic component is affected. Moreover, the manual welding method has the problems of unstable welding quality and low work efficiency.

[0003] Therefore, how to solve the defects of the prior art has become the direction of efforts of the technical personnel in the field. CONTENT OF THE UTILITY MODEL

[0004] The utility model aims at providing a patch lead of electronic component, which can completely solve the defects of the prior art.

[0005] The utility model discloses a patch lead of electronic component, lead body, at least one rectangular soldering pad is welded and fixed in the inner side wall of the lead body, the interval between the outer side wall of the soldering pad and the inner side wall of the lead body is 0.07-0.15mm, and the length, width and thickness of the soldering pad are matched with the electronic component body, so that when the lead and the electronic component body are welded, the uniform tin layer with thickness tolerance of ≤±0.05mm is formed between the lead and the electronic component body, so that the lead and the electronic component body are combined as a whole.

[0006] The utility model discloses a patch lead of electronic component, lead body, at least one rectangular soldering pad is welded and fixed in the inner side wall of the lead body, the interval between the outer side wall of the soldering pad and the inner side wall of the lead body is 0.07-0.15mm, and the length, width and thickness of the soldering pad are matched with the electronic component body, so that when the lead and the electronic component body are welded, the uniform tin layer with thickness tolerance of ≤±0.05mm is formed between the lead and the electronic component body, so that the lead and the electronic component body are combined as a whole.

[0007] Further, the soldering pad is welded and fixed in the inner side wall of the lead body by a welding machine.

[0008] Further, the soldering pad is a tin-lead alloy soldering pad.

[0009] Compared with the prior art, the utility model has the beneficial effects that the soldering pad is directly welded and fixed in the inner side wall of the lead, so that the size and position of the soldering pad are fixed, a uniform tin layer is formed between the lead and the electronic component body when the lead and the electronic component body are welded, the lead and the electronic component body are firmly combined as a whole, and the assembly quality of the electronic component is ensured. Moreover, after adopting the lead structure, the lead and the component body can be welded by a welding machine, the processing efficiency is improved, and the stability of the welding quality is ensured.BRIEF DESCRIPTION OF DRAWINGS BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a structural schematic diagram of the present application;

[0011] Figure 2 is a cooperation diagram of the present application and the electronic component body;

[0012] Figure 3 is an exploded view of the present application;

[0013] Figure 4 is a front view of embodiment 1 of the present application;

[0014] Figure 5 is a side view of embodiment 1 of the present application;

[0015] Figure 6 is a front view of embodiment 2 of the present application;

[0016] Figure 7 is a side view of embodiment 2 of the present application;

[0017] Figure 8 is a front view of embodiment 3 of the present application;

[0018] Figure 9 is a side view of embodiment 3 of the present application;

[0019] Figure 10 is a front view of embodiment 4 of the present application;

[0020] Figure 11 is a side view of embodiment 4 of the present application;

[0021] Figure 12 is a front view of embodiment 5 of the present application;

[0022] Figure 13 is a side view of embodiment 5 of the present application;

[0023] Figure 14 is a front view of embodiment 6 of the present application;

[0024] Figure 15 is a side view of embodiment 6 of the present application. DETAILED DESCRIPTION

[0025] Exemplary embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings; however, these are examples only and the present disclosure should not be construed as limited thereto. Rather, the present disclosure is intended to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure. Like numbers refer to like elements throughout the description of the figures.

[0026] As Figures 1 to 3 shown, a kind of electronic component's patch lead, lead body 1, the inside wall welding of the lead body 1 is fixed with soldering pad 2. According to the shape, size of lead body 1, soldering pad 2 can be 1 piece, 2 pieces, 3 pieces, 4 pieces etc. The interval between the outside wall of the soldering pad 2 and the inside wall of the lead body 1 is 0.07-0.15mm, and the length, width, thickness of the soldering pad 2 match the electronic component body 3, so that when lead and electronic component body 3 are welded, the uniform tin layer with thickness tolerance ≤±0.05mm is formed between them, so that lead and electronic component body 3 are combined into one.

[0027] Specifically, the soldering pad 2 is welded and fixed in the inside wall of the lead body 1 by welding machine.

[0028] The soldering pad 2 in the embodiment is a tin-lead alloy soldering pad. The soldering pad 2 is rectangular.

[0029] The length, width and thickness of the soldering pad 2 match the electronic component body 3. Different models of electronic component body correspond to different length, width and thickness of soldering pad 2, so that a uniform solder layer is formed between lead and electronic component body when lead and electronic component body are welded, and lead and electronic component body are firmly combined into one, so as to ensure the assembly quality of electronic component.

[0030] The interval between the outside wall of the soldering pad 2 and the inside wall of the lead body 1 is 0.07-0.15mm. The thickness of the soldering pad 2 is 0.07-0.15mm, the width is 0.73-1.5mm, and the length is 1.3-24.85mm.

[0031] Example 1:

[0032] Referring to Figure 4 and Figure 5 , three soldering pads 2 are arranged on the lead body 1 from top to bottom, the interval between the soldering pads 2 is 1.6mm, the length L of the lead body 1 is 4.63mm, the width W is 9mm, the thickness H is 0.15mm, the length L1 of the soldering pad 2 is 3.3mm, the width W1 is 1mm, and the thickness H1 is 0.15mm.

[0033] Example 2:

[0034] Referring to Figure 6 and Figure 7 , two soldering pads 2 are arranged on the lead body 1, the interval between the soldering pads 2 is 1.178mm, the length L of the lead body 1 is 5.08mm, the width W is 5.7mm, the thickness H is 0.15mm, the length L1 of the soldering pad 2 is 4.42mm, the width W1 is 1.16mm, and the thickness H1 is 0.07mm.

[0035] Example 3:

[0036] Referring to Figure 8 and Figure 9 , the lead body 1 is provided with three soldering pads 2 spaced from top to bottom, the interval between the soldering pads 2 is 1.43mm, the length L of the lead body 1 is 3.15mm, the width W is 9mm, the thickness H is 0.15mm, the length L1 of the soldering pad 2 is 1.74mm, the width W1 is 1.16mm, and the thickness H1 is 0.07mm.

[0037] Example 4:

[0038] Referring to Figure 10 and Figure 11 , the lead body 1 is provided with three soldering pads 2 spaced from top to bottom, the interval between the soldering pads 2 is 1.43mm, the length L of the lead body 1 is 3.15mm, the width W is 9mm, the thickness H is 0.15mm, the length L1 of the soldering pad 2 is 1.74mm, the width W1 is 1.16mm, and the thickness H1 is 0.07mm.

[0039] Example 5:

[0040] Referring to Figure 12 and Figure 13 , the lead body 1 is provided with one soldering pad 2, the length L of the lead body 1 is 3mm, the width W is 3mm, the thickness H is 0.15mm, the length L1 of the soldering pad 2 is 1.7mm, the width W1 is 1.05mm, and the thickness H1 is 0.07mm.

[0041] Example 6:

[0042] Referring to Figure 14 and Figure 15 , the lead body 1 is provided with four soldering pads 2 spaced from top to bottom, the interval between the soldering pads 2 is 2.12mm, the length L of the lead body 1 is 22.86mm, the width W is 11.8mm, the thickness H is 0.25mm, the length L1 of the soldering pad 2 is 24.85mm, the width W1 is 0.73mm, and the thickness H1 is 0.07mm.

[0043] The soldering pad 2 is directly welded and fixed on the inner side wall of the lead body 1, so that the size and position of the soldering pad are fixed, and a uniform tin layer is formed between the lead and the component body when the lead and the component body are welded, so that the lead and the component body are firmly combined as a whole, thereby ensuring the assembly quality of the electronic component. Moreover, after adopting this lead structure, the lead and the component body can be welded by using a welding machine, thereby improving the processing efficiency and ensuring the stability of the welding quality.

[0044] Table 1, comparison between the utility model and prior art.

[0045] Comparison item Prior art The present scheme Advantages Soldering pad positioning method Randomly placed by hand Precise fixed in advance Position accuracy improved by 90% Solder layer uniformity Dependence on worker operation Structure-guided natural formation Thickness tolerance ≤ ± 0.05 mm Production efficiency Single piece hand welding Batch machine welding Production capacity increased by 4-6 times Quality stability CPK < 1.0 CPK ≥ 1.67 Process capability significantly improved

[0046] CPK is a process capability index.

[0047] As shown in Table 1, the lead structure of the utility model adopts the way of pre-fixing the soldering sheet to break the inherent combination mode of the traditional "lead-soldering sheet-electronic component main body". Although various lead structures are known in the art, no one has ever thought to pre-integrate the soldering sheet as a component part of the lead. This reverse thinking converts the intermediate part originally used to connect two independent parts into a part of the structure, achieving the synergistic effect of 1+1>2. Moreover, it is beneficial to improve the position accuracy and productivity, and significantly improve the process capability.

[0048] Similarly, it is to be understood that, in the description of the example embodiments of the utility model above, the various features of the utility model are sometimes grouped into single embodiments, figures, or descriptions of them for the purpose of simplicity of the disclosure and to help understand one or more of the various aspects of the utility model. However, the method of the disclosure should not be interpreted as reflecting the intention that the claimed utility model requires more features than the features explicitly recorded in each claim. Rather, as reflected in the following claims, the utility model aspects are in less than all the features of the single embodiment disclosed earlier. Therefore, the claims following the specific embodiments are hereby expressly incorporated into the specific embodiments, in which each claim itself is a separate embodiment of the utility model.

[0049] Those skilled in the art can understand that the modules in the device in the embodiments can be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments can be combined into one module or unit or component, and in addition, they can be divided into multiple sub-modules or sub-units or sub-components. Except that at least some of such features and / or processes or units are mutually exclusive, all features disclosed in the specification (including the accompanying claims, abstract and drawings) and all processes or units of any method or device disclosed thus can be combined in any combination. Unless explicitly stated otherwise, each feature disclosed in the specification (including the accompanying claims, abstract and drawings) can be replaced by an alternative feature providing the same, equivalent or similar purpose.

[0050] In addition, those skilled in the art can understand that although some embodiments herein include certain features rather than others included in other embodiments, the combination of features of different embodiments means within the scope of the utility model and forms different embodiments.

[0051] It should be noted that the above embodiments illustrate the present application rather than limit the present application, and alternative embodiments can be designed by those skilled in the art without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word comprising does not exclude the presence of elements or steps not listed in the claim. The word a or an preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and the present application can be implemented with the aid of a suitably programmed computer. In a unit claim enumerating several means, the several means can be embodied by one and the same item of hardware. The use of the words first, second and third, etc. does not imply any ordering. These words have been used to name the elements for the sake of ease of reading only.

[0052] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A paster lead for electronic components, the lead body characterized by: The inner side wall of the lead body is welded with at least one rectangular soldering sheet, the distance between the outer side wall of the soldering sheet and the inner side wall of the lead body is 0.07-0.15mm, and the length, width and thickness of the soldering sheet match the main body of the electronic component, so that when the lead and the main body of the electronic component are welded, a uniform tin layer with a thickness tolerance of ≤±0.05mm is formed between them, thereby combining the lead and the main body of the electronic component into one.

2. The potted electronic device of claim 1, wherein: The soldering sheet is welded and fixed on the inner side wall of the lead body by a reflow soldering machine.

3. The potted electronic device of claim 1, wherein: The soldering sheet is a tin-lead alloy soldering sheet.

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