Circuit board assembly and vehicle-mounted camera

Abstract

The utility model relates to a circuit board assembly and a vehicle-mounted camera. The circuit board assembly comprises a circuit board, the front surface and / or the back surface of the circuit board is provided with a chip mounting area; and the reinforcing sheet is embedded in the circuit board, the size of the reinforcing sheet is larger than that of the chip patch area, the size of the reinforcing sheet is smaller than that of the circuit board, and the position of the reinforcing sheet corresponds to that of the chip patch area so as to reinforce the structure of the circuit board in the chip patch area. According to the circuit board assembly, the reinforcing sheet is embedded in the part of the chip patch area of the circuit board, so that the thickness of the circuit board is not influenced, and the deformation of the chip patch area of the circuit board due to temperature influence can be reduced, thereby solving the problem of temperature drift of the vehicle-mounted camera.

Description

TECHNICAL FIELD

[0001] The utility model relates to camera technical field especially line board subassembly and vehicle camera. BACKGROUND

[0002] With the development of the automation technology of the automobile, the requirement of the automobile to the pixel of the vehicle camera is gradually improved. Among them, the flatness of the line board in the vehicle camera is one factor affecting the pixel of the vehicle camera, and with the improvement of the requirement of the pixel of the vehicle camera, the requirement of the flatness of the line board is also higher and higher.

[0003] The thickness of the line board of the existing vehicle camera is thick, and it is not necessary to reinforce under the conventional design, but the line board is easy to deform under the influence of temperature, which leads to the decline of the flatness of the line board, thereby leading to the temperature drift problem of the vehicle camera, and affecting the imaging of the vehicle camera.

[0004] In order to improve the flatness of the line board, the steel sheet can be increased to reinforce, and there are two ways to reinforce the line board at present, one scheme is to bond the steel sheet on the back of the conventional line board by using glue, which will increase the thickness of the line board, and after reinforcing the steel sheet, the back of the line board cannot be SMT pasted, and the line board of the vehicle camera on the market is mostly double-sided SMT pasted piece, and reinforcing the steel sheet on the back of the line board will reduce the position of the SMT pasting of the line board, increase the volume of the line board, and is not conducive to the miniaturization of the line board. Another scheme is to embed a steel sheet with the same area in the line board, but the line board made by the scheme is easy to have the problem of difficult plate separation due to the difficulty in cutting the steel sheet, and the line board is easy to deform and cannot rebound under the influence of stress, which leads to the deterioration of the flatness. Utility model content

[0005] Therefore, it is necessary to provide a line board subassembly and a vehicle camera aiming at the problem that the existing line board is easy to deform under the influence of temperature and leads to the deterioration of the flatness.

[0006] A line board subassembly comprises:

[0007] The line board has a chip pasting area on the front and / or back; and

[0008] The reinforcing sheet is embedded in the line board, the size of the reinforcing sheet is larger than the size of the chip pasting area, and the size of the reinforcing sheet is smaller than the size of the line board, the position of the reinforcing sheet corresponds to the chip pasting area, so as to strengthen the structure of the line board in the chip pasting area.

[0009] In one of the embodiments, the reinforcing sheet is provided with a plurality of avoiding holes, and the circuit board is provided with a plurality of through holes passing through the avoiding holes, the diameter of the through holes being smaller than that of the avoiding holes.

[0010] In one of the embodiments, the axis of the through hole coincides with that of the avoiding hole.

[0011] In one of the embodiments, the circuit board comprises a plurality of laminated board bodies arranged by pressing and a glue layer arranged between the laminated board bodies, and the reinforcing sheet is arranged between two of the laminated board bodies.

[0012] In one of the embodiments, the total thickness of the laminated board body and the glue layer on the front side of the reinforcing sheet is equal to that on the back side of the reinforcing sheet.

[0013] In one of the embodiments, the circuit board is a polyethylene board or a copper clad board.

[0014] In one of the embodiments, the reinforcing sheet is a steel sheet or a copper sheet.

[0015] In one of the embodiments, the thickness of the reinforcing sheet is greater than or equal to 0.25 mm.

[0016] In one of the embodiments, the reinforcing sheet is rectangular.

[0017] A vehicle-mounted camera, characterized in that it comprises:

[0018] a camera main body; and

[0019] The circuit board assembly as described in any of the above is installed in the camera main body.

[0020] The circuit board assembly described above embeds the reinforcing sheet in the part of the chip mounting area of the circuit board, which neither affects the thickness of the circuit board nor makes the chip mounting area of the circuit board deform due to temperature, thereby solving the temperature drift problem of the vehicle-mounted camera. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 A cross-sectional view of the circuit board assembly provided for one of the embodiments of the present application;

[0022] Figure 2 An enlarged cross-sectional view of the circuit board assembly provided for one of the embodiments of the present application;

[0023] Figure 3 A flatness test area division diagram of a specific example of the circuit board assembly provided for one of the embodiments of the present application;

[0024] Figure 4 A 3D flatness diagram of a flatness test of a specific example of a circuit board assembly provided for an embodiment of the present application.

[0025] The drawings show: 10, circuit board; 11, chip patch area; 12, via; 13, laminated plate body; 14, adhesive layer; 20, reinforcing sheet; 21, avoiding hole. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings. In the following description, a large number of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0028] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0029] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0031] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not the only embodiment.

[0032] Based on the existing line board, the deformation caused by the temperature influence leads to the problem of poor flatness, the application provides a kind of line board assembly and vehicle-mounted camera. The line board assembly is embedded in the part of the chip patch area of the line board by reinforcing sheet, which does not affect the thickness of the line board, and can reduce the deformation of the chip patch area of the line board caused by temperature influence, thereby solving the temperature drift problem of vehicle-mounted camera.

[0033] Specifically, please refer to Figure 1 The application provides a kind of line board assembly, the line board 10 and reinforcing sheet 20, the front and / or back of the line board 10 has chip patch area 11, the reinforcing sheet 20 is embedded in the line board 10, the size of the reinforcing sheet 20 is greater than the size of the chip patch area 11, and the size of the reinforcing sheet 20 is less than the size of the line board 10, the position of the reinforcing sheet 20 corresponds to the chip patch area 11, to strengthen the structure of the line board 10 in the chip patch area 11. In other words, the projection area of the chip patch area 11 on the front or back of the line board 10 is located in the projection area of the reinforcing sheet 20 on the front or back of the line board 10.

[0034] It can be understood that the circuit board assembly will embed the reinforcing sheet 20 in the circuit board 10, by controlling the size of the reinforcing sheet 20, so that the reinforcing sheet 20 can cover the chip mounting area 11, using the structural strength of the reinforcing sheet 20 to strengthen the part of the chip mounting area 11 of the circuit board 10, which can reduce the deformation of the chip mounting area 11 affected by temperature, thereby improving the flatness of the circuit board 10. In addition, since the size of the steel sheet is smaller than the size of the circuit board 10, there is no stress on the steel sheet when the circuit board 10 is profiled, thereby avoiding stress during cutting to deform the circuit board 10.

[0035] More specifically, as shown in Figure 1 In some embodiments, since the circuit board 10 adopts a double-sided SMT mounting structure, a via hole 12 is usually provided on the circuit board 10 to enable the circuit elements on the front and back surfaces of the circuit board 10 to be connected. However, since the drill used to drill the via hole 12 cannot drill the reinforcing sheet 20, the reinforcing sheet 20 of the present application is provided with a plurality of avoiding holes 21, and the circuit board 10 is provided with a plurality of via holes 12 passing through the avoiding holes 21, and the diameter of the via hole 12 is smaller than that of the avoiding hole 21. In other words, before the reinforcing sheet 20 is embedded in the circuit board 10, the avoiding holes 21 can be pre-drilled on the reinforcing sheet 20 according to the actual hole design of the circuit board 10, and then the via holes 12 are drilled on the circuit board 10 after the reinforcing sheet 20 is embedded in the circuit board 10. The size difference between the avoiding hole 21 and the via hole 12 can be used as a processing allowance to avoid the drill bit of the drill contacting the reinforcing sheet 20 when drilling the via hole 12.

[0036] Preferably, as shown in Figure 1 In one embodiment, the axis of the via hole 12 coincides with the axis of the avoiding hole 21. In this way, the gap between the via hole 12 and the avoiding hole 21 is equal, so that the processing allowance around the via hole 12 is uniform, avoiding the drill bit of the drill contacting the reinforcing sheet 20 when drilling the via hole 12 due to insufficient allowance on one side of the via hole 12.

[0037] Further, as shown in Figure 2 In some embodiments, the circuit board 10 includes a plurality of laminated board bodies 13 and an adhesive layer 14, the adhesive layer 14 is arranged between the laminated board bodies 13, and the reinforcing sheet 20 is arranged between two adjacent laminated board bodies 13, and the laminated board bodies 13 are arranged in compression.

[0038] It can be understood that when the circuit board assembly is manufactured, the circuit board 10 can be formed by laminating the plurality of laminated board bodies 13 and the adhesive layer 14, and when the reinforcing sheet 20 is embedded between two laminated board bodies 13, the thickness of the part of the circuit board 10 in the chip mounting area 11 will inevitably be increased, but the circuit board assembly of the present application can utilize the fluidity and deformability of the adhesive layer 14 to make the thickness of the part of the circuit board 10 in the chip mounting area 11 thinner, and the thickness of other parts of the circuit board 10 thicker, thereby keeping the overall thickness of the circuit board 10 consistent, and making the circuit board 10 have a thinner overall thickness while having a better flatness.

[0039] Preferably, in one embodiment, the total thickness of the laminated board body 13 and the adhesive layer 14 on the front surface of the reinforcing sheet 20 is equal to the total thickness of the laminated board body 13 and the adhesive layer 14 on the back surface of the reinforcing sheet 20. In other words, by controlling the number of laminated board bodies 13 and adhesive layers 14 on the front surface and the back surface of the reinforcing sheet 20 to be equal or similar, embedding the reinforcing sheet 20 in the middle of the circuit board 10, and keeping the reinforcing effect of the reinforcing sheet 20 on the front surface and the back surface of the circuit board 10 consistent, the front surface and the back surface of the circuit board 10 can both have a better flatness.

[0040] Optionally, in some embodiments, the circuit board 10 includes but is not limited to a polyethylene board (PP board) or a copper-clad board (FR4 board).

[0041] Optionally, in some embodiments, the reinforcing sheet 20 includes but is not limited to a steel sheet or a copper sheet. The thermal expansion coefficient of the steel sheet and the copper sheet is lower than that of the polyethylene board or the copper-clad board, and the steel sheet and the copper sheet have better rigidity and processability, and are suitable for being embedded in the circuit board 10 as the reinforcing sheet 20. In addition, other materials with a small thermal expansion coefficient, good rigidity and processability can also be made into the reinforcing sheet 20 embedded in the circuit board 10.

[0042] Preferably, in one of the embodiments, the thickness of the reinforcing sheet 20 can be adjusted according to the actual thickness of the circuit board 10, but the thickness of the reinforcing sheet 20 is preferably greater than or equal to 0.25 mm, so as to ensure that the reinforcing sheet 20 has sufficient structural strength to ensure the flatness of the circuit board 10.

[0043] Preferably, in one of the embodiments, since the circuit board 10 of the vehicle-mounted camera is mostly rectangular, and the chip mounting area 11 is also arranged in a rectangular structure as much as possible, the shape of the reinforcing sheet 20 of the present application is preferably rectangular, so as to ensure that the reinforcing sheet 20 can cover the entire chip mounting area 11 with a smaller area.

[0044] Exemplarily, the circuit board assembly of the present application is further described below in combination with a specific example of flatness test. As shown in FIG. 6, the flatness test is performed on the circuit board 10 of the vehicle-mounted camera. Figure 3The flatness test area division schematic diagram of the specific example of the circuit board assembly of the present application is shown, the example circuit board assembly is divided into 9 test areas, and the 3D flatness test is performed on the example circuit board 10, and the test results are as follows Figure 4 The 3D flatness schematic diagram of the flatness test of the specific example of the circuit board assembly of the present application is shown, and the specific data measured is shown in the following table.

[0045] Height difference (mm) Maximum height (mm) Minimum height (mm) Maximum - Minimum (mm) Zone 1 0.0025 0.0032 0.0015 0.0018 Zone 2 0.0059 0.0065 0.0051 0.0013 Zone 3 -0.0071 -0.0062 -0.0081 0.0019 Zone 4 -0.0087 -0.0071 -0.0108 0.0037 Zone 5 0.0069 0.0072 0.0066 0.0006 Zone 6 0.0054 0.0064 0.0045 0.0019 Zone 7 -0.0231 -0.0217 -0.0248 0.0031 Zone 8 -0.0024 -0.0018 -0.0030 0.0012 Zone 9 0.0014 0.0022 0.0004 0.0018 Total -0.0192 -0.0113 -0.0286 0.0173 Maximum 0.0069 0.0072 0.0066 0.0037 Minimum -0.0231 -0.0217 -0.0248 0.0006 Average -0.0021 -0.0013 -0.0032 0.0019 Standard deviation 0.0091 0.0088 0.0095 0.0009 3σ 0.0273 0.0264 0.0284 0.0027

[0046] From the data in the table, the standard deviation values of the height differences of each area of the circuit board assembly of the present application are all less than 0.01mm, the normal distribution 3σ of the height differences of each area is within 0.03, and therefore the example circuit board assembly has good flatness.

[0047] Further, the present application provides a vehicle-mounted camera, which can include a camera main body and the circuit board assembly as described in any of the above, and the circuit board assembly is installed in the camera main body. The vehicle-mounted camera can avoid the problem of temperature drift during use due to the good flatness of the circuit board assembly, and has good imaging quality.

[0048] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered as within the scope of the present application.

[0049] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A wiring board assembly, characterized by comprising: The circuit board has a front surface and / or a back surface with a chip mounting area. The reinforcing sheet is embedded in the circuit board, has a size larger than that of the chip mounting area, a size smaller than that of the circuit board, and is positioned corresponding to the chip mounting area to reinforce the structure of the circuit board in the chip mounting area. The reinforcing sheet has a plurality of avoiding holes, and the circuit board has a plurality of through holes passing through the avoiding holes, the through holes having a smaller diameter than the avoiding holes. The axis of the through holes coincides with that of the avoiding holes.

2. The wiring board assembly according to claim 1, wherein The circuit board comprises a plurality of laminated board bodies arranged in a press-fit manner and adhesive layers arranged between the laminated board bodies, and the reinforcing sheet is arranged between two laminated board bodies.

3. The wiring board assembly according to claim 2, wherein The total thickness of the laminated board bodies and the adhesive layers on the front surface of the reinforcing sheet is equal to that on the back surface of the reinforcing sheet.

4. The circuit board assembly of claim 1, wherein, The circuit board is a polyethylene board or a copper-clad board.

5. The circuit board assembly of claim 4, wherein, The reinforcing sheet is a steel sheet or a copper sheet.

6. The wiring board assembly according to any one of claims 1 to 5, wherein The thickness of the reinforcing sheet is greater than or equal to 0.25 mm.

7. The wiring board assembly according to any one of claims 1 to 5, wherein The reinforcing sheet has a rectangular shape.

8. The wiring board assembly according to any one of claims 1 to 5, wherein The camera body; 9. The wiring board assembly according to any one of claims 1 to 5, wherein The circuit board assembly as claimed in any one of claims 1 to 9 is mounted in the camera body.

10. A vehicle camera, characterized by comprising: ​ ​ ​ ​

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