Vapor chamber radiator and electronic equipment

Abstract

The utility model provides a vapor chamber radiator and electronic equipment, and relates to the technical field of heat dissipation. The vapor chamber radiator comprises a body, the body is provided with an evaporation area and a condensation area opposite to the evaporation area, the evaporation area is used for being connected with a part to be radiated, the evaporation area is provided with an evaporation cavity, the condensation area is provided with a plurality of condensation cavities, the condensation cavities deviate from the evaporation area and are arranged at intervals and communicated with one another, and the evaporation cavity is communicated with the adjacent condensation cavities; and the capillary structure is arranged in the evaporation cavity. The evaporation cavity is separated from the condensation cavities, mutual influence of gaseous phase change working media and liquid phase change working media is reduced, the phase change working media are gasified in the evaporation cavity to absorb heat, are liquefied through the condensation cavities to flow back to the lower portions of the condensation cavities and reach the evaporation cavity through the capillary structures, one-way loop circulation heat dissipation is achieved, flowing resistance is reduced, the flowing speed is increased, and the heat dissipation effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a vapor chamber radiator and an electronic device. BACKGROUND

[0002] With the development of artificial intelligence, the demand for computing power is increasing, and the heat dissipation problem has become a bottleneck restricting the development of computing power. For example, during the operation of an electronic device, a large amount of heat is generated by heat sources such as processing chips inside the electronic device. If the heat cannot be dissipated in time, the processing chips may be burned out or the circuit may fail.

[0003] In the prior art, a vapor chamber radiator in the field of air cooling is used for heat dissipation. The vapor chamber radiator is a flat cavity, which has an evaporation surface and a condensation surface inside the cavity. The inner wall of the cavity is provided with a capillary structure. A phase change working medium is arranged in the cavity. The phase change working medium evaporates at the evaporation surface and carries away heat to the condensation surface. The phase change working medium condenses into a liquid state at the condensation surface and returns to the evaporation surface through the capillary structure.

[0004] However, the gaseous phase change working medium and the liquid phase change working medium inside the vapor chamber radiator are prone to reverse operation, which increases the flow resistance and may cause turbulent flow, affecting the heat dissipation effect. CONTENT OF THE INVENTION

[0005] The present application provides a vapor chamber radiator and an electronic device, which are used to solve the problem that the gaseous working medium and the liquid working medium inside the vapor chamber are prone to reverse operation, causing turbulent flow or vortex flow, and affecting the heat dissipation effect.

[0006] In one aspect, the present application provides a vapor chamber radiator, which comprises: a body, the body having an evaporation zone and a condensation zone arranged opposite to the evaporation zone, the evaporation zone being used to connect with a heat dissipation object, the evaporation zone having an evaporation cavity, the condensation zone having a plurality of condensation cavities, each condensation cavity being arranged spaced apart from the evaporation zone and being in communication with each other, and the evaporation cavity being in communication with the adjacent condensation cavities; and a capillary structure arranged in the evaporation cavity, the phase change working medium being vaporized to absorb heat in the evaporation cavity, being liquefied to flow back to the lower part of the condensation cavity through the capillary structure, and being returned to the evaporation cavity through the capillary structure.

[0007] In one possible implementation, the vapor chamber radiator provided by the present application embodiment has a flow guide body, the flow guide body is connected with the evaporation zone, the flow guide body has a plurality of condensation cavities in the flow guide body, each condensation cavity is arranged spaced apart, and each condensation cavity is in communication.

[0008] In one possible implementation, the vapor chamber radiator provided by the present application embodiment has a flow guide body, the flow guide body is connected with the evaporation zone, the flow guide body has a plurality of condensation cavities in the flow guide body, each condensation cavity is arranged spaced apart, and each condensation cavity is in communication.

[0009] In a possible implementation, the heat spreader provided by the embodiment of the present application includes a flow guide having a plurality of condensing surfaces, each condensing surface is arranged in a direction away from the evaporation cavity, and opposite two condensing surfaces form a condensing cavity.

[0010] In a possible implementation, the heat spreader provided by the embodiment of the present application includes a condensing surface having a flow guide layer.

[0011] In a possible implementation, the heat spreader provided by the embodiment of the present application further includes a heat spreading member, the flow guide has a plurality of heat dissipation surfaces, the heat dissipation surfaces are located on a side of the flow guide away from the condensing surface, opposite two heat dissipation surfaces form a heat dissipation cavity, the heat dissipation cavity is in communication with the outside, and the heat spreading member is at least partially arranged in the heat dissipation cavity.

[0012] In a possible implementation, the heat spreader provided by the embodiment of the present application includes a body having an evaporation end, a middle part of the evaporation end has a protruding area, an inner wall of the protruding area is provided with the capillary structure, and a side surface of the evaporation area is located outside a side surface of the condensing area.

[0013] In a possible implementation, the heat spreader provided by the embodiment of the present application includes a body having a phase change capillary structure or a heat dissipation fin on an outer surface of the body.

[0014] In a possible implementation, the heat spreader provided by the embodiment of the present application further includes a connecting member arranged on the body and used for connecting with a heat dissipation member.

[0015] In another aspect, the embodiment of the present application further provides an electronic device including a heat dissipation member and the heat spreader provided by any one of the above embodiments arranged on the heat dissipation member.

[0016] The vapor chamber radiator and electronic device provided in this application, by setting up a main body, has an evaporation zone and a condensation zone opposite to the evaporation zone. The evaporation zone is used to connect with the component to be radiated and has an evaporation chamber. The condensation zone has multiple condensation chambers, each condensation chamber is spaced apart from the evaporation zone and interconnected. The evaporation chamber is interconnected with adjacent condensation chambers. A capillary structure is set in the evaporation chamber. The heat generated by the component to be radiated is transferred to the evaporation chamber through the connecting surface of the main body, causing the phase change working fluid in the evaporation chamber to absorb heat and vaporize. The vaporized phase change working fluid flows to the condensation zone separated from the evaporation chamber due to the pressure difference. In the condensation chamber, the vaporized phase change working fluid is cooled and re-condenses into liquid, flowing into the lower part of the condensation chamber. Subsequently, the liquid phase change working fluid returns to the evaporation chamber through the capillary structure. This cycle is repeated to achieve continuous circulation of the phase change working fluid and efficient circulating heat dissipation. By separating the evaporation chamber from multiple condensation chambers, the mutual influence between the gaseous and liquid phase change working fluids is reduced. The phase change working fluid vaporizes and absorbs heat in the evaporation chamber, then liquefies in the condensation chamber and flows back to the lower part of the condensation chamber. It then flows back to the evaporation chamber through a capillary structure, realizing a unidirectional loop circulation for heat dissipation. The reduced mutual influence between the vaporized and liquefied phase change working fluids lowers flow resistance, increases the flow rate of the phase change working fluid, reduces the difficulty of the phase change working fluid flowing back to the evaporation chamber, and improves the heat dissipation effect. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] Figure 1 A schematic diagram of the structure of the vapor chamber radiator provided in the embodiments of this application. Figure 1 ;

[0019] Figure 2 This is a schematic diagram of the liquid working fluid flow in a vapor chamber radiator provided in an embodiment of this application;

[0020] Figure 3 for Figure 1 Another structural schematic diagram of the heat sink with a medium-temperature plate;

[0021] Figure 4 A schematic diagram of the structure of the vapor chamber radiator provided in the embodiments of this application. Figure 2 .

[0022] Explanation of reference numerals in the attached figures:

[0023] 100 - Body; 111 - Evaporation zone; 112 - Condensation zone; 113 - Raised zone;

[0024] 110 - Evaporation chamber;

[0025] 120 - Condensation chamber;

[0026] 130 - flow guide

[0027] 131 - communication cavity; 132 - condensing surface; 133 - radiating surface; 134 - radiating cavity

[0028] 200 - liquid phase-change working medium area

[0029] 300 - capillary structure

[0030] 400 - connecting piece

[0031] 500 - heat spreading piece

[0032] The specific embodiments have been shown and described in the above-described drawings, and will be described in more detail hereinafter. These drawings and detailed description are not intended to limit the scope of the present application in any way, but to explain the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0033] The exemplary embodiments will be described in detail herein with reference to the accompanying drawings. In the following description, like reference numerals refer to like elements throughout the description. The following exemplary embodiments are described in enough detail to enable those skilled in the art to practice the application, and it is understood that other embodiments can be utilized and that logical, mechanical, electrical and other changes can be made without departing from the scope of the present application. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present application is defined only by the appended claims.

[0034] In general, terminology can be understood at least in part from usage in context. For example, terms, such as "one or more" as used herein, can be understood as encompassing a singular as well as plural usage unless the context clearly indicates otherwise. Similarly, terms, such as "a" or "an" as used herein can be understood to encompass both singular and plural usage unless the context clearly indicates otherwise.

[0035] In the prior art, a heat spreader in the field of air cooling is used for heat dissipation. The heat spreader is a flat cavity, which has an evaporation surface and a condensation surface. Capillary structures are arranged on the inner wall of the cavity. A phase-change working medium is arranged in the cavity. The phase-change working medium evaporates at the evaporation surface and carries away heat to the condensation surface. The phase-change working medium condenses into liquid at the condensation surface and returns to the evaporation surface through the capillary structures. However, the gaseous working medium and the liquid working medium in the heat spreader are prone to reverse operation, causing turbulence or vortex, which affects the heat dissipation effect. Moreover, the capillary structures are arranged on the condensation surface, which increases the condensation heat transfer resistance and is not conducive to condensation heat transfer.

[0036] In addition, the heat spreader of the vapor chamber works in the environment of the phase change immersion, and two phase change processes exist. Since the external environment is the immersion environment, there is no problem of the condensed liquid returning to the evaporation surface. For the external phase change, increasing the heat exchange area and strengthening the phase change capillary structure are most beneficial to reduce the thermal resistance of the process. For the internal phase change working medium, since the condensed working medium needs to return to the evaporation end through the capillary channel under the action of the capillary force, the evaporation-condensation phase change cycle is adjusted. Since the power of the capillary force is limited, the shorter the return path of the working medium, the more conducive to the circulation of the entire working medium, so that the size of the flat cavity is limited. If the size is too large, the internal circulation is blocked, and the internal thermal resistance is increased. Therefore, the size requirements of the internal circulation and the external circulation for the cavity of the vapor chamber are contradictory, so that the two cannot reach a better thermal resistance condition, and the heat dissipation effect is limited.

[0037] Therefore, the present application provides a vapor chamber heat spreader and electronic equipment, comprising: a body, the body has an evaporation area and a condensation area opposite to the evaporation area, the evaporation area is used for connecting with a heat dissipation component, the evaporation area has an evaporation cavity, the condensation area has a plurality of condensation cavities, each condensation cavity is spaced apart from the evaporation area and is in communication with each other, the evaporation cavity is in communication with the adjacent condensation cavity; a capillary structure is arranged in the evaporation cavity. The heat generated by the heat dissipation component is transmitted to the evaporation cavity through the connecting surface of the body, so that the phase change working medium in the evaporation cavity is gasified after absorbing heat, the gasified phase change working medium flows to the condensation area separated from the evaporation cavity due to the pressure difference, and the gasified phase change working medium is condensed and liquefied in the condensation cavity, and then flows into the lower part of the condensation cavity. Subsequently, the liquid phase change working medium returns to the evaporation cavity through the capillary structure, and the cycle is repeated, so that the phase change working medium circulates continuously and circulates efficiently. By separating the evaporation cavity and the condensation cavity, the phase change working medium is prevented from affecting each other, the phase change working medium is gasified and absorbs heat in the evaporation cavity, the liquefied phase change working medium flows back to the lower part of the condensation cavity through the condensation cavity, and the phase change working medium is circulated through the capillary structure to the evaporation cavity, so that the gasified phase change working medium and the liquefied phase change working medium do not affect each other, and the heat dissipation effect is improved. The technical solutions of the present application and how the technical solutions of the present application solve the above technical problems will be described in detail below with specific examples.

[0038] The following specific examples can be combined with each other, and the same or similar concepts or processes may not be described again in some examples. The vapor chamber heat spreader and electronic equipment of the present application will be described below in combination with Figure 1 、 Figure 3 、 Figure 2 、 Figure 4 and specific examples. It should be noted that the phase change working medium in the examples of the present application can be water or other medium, and the examples of the present application do not limit this.

[0039] In one aspect, the application provides a vapor chamber heat spreader, comprising: a body 100, the body 100 having an evaporation area 111 and a condensation area 112 opposite to the evaporation area 111, the evaporation area 111 being configured to be connected with a heat-dissipating component, the evaporation area 111 having an evaporation cavity 110, the condensation area 112 having a plurality of condensation cavities 120, each condensation cavity 120 being spaced apart from the evaporation area 111 and being in communication with each other, and the evaporation cavity 110 being in communication with adjacent condensation cavities 120; and a capillary structure 300 arranged in the evaporation cavity 110, wherein a phase-change working medium 200 is gasified by absorbing heat in the evaporation cavity 110, and is then liquefied in the condensation cavities 120 and flows back to the lower part of the condensation cavities 120, and then flows back to the evaporation cavity 110 through the capillary structure 300.

[0040] The body 100 has the evaporation area 111 and the condensation area 112, the evaporation area 111 has a connecting surface configured to be attached to the heat-dissipating component, the evaporation area 111 has the evaporation cavity 110, the connecting surface transmits heat generated by the heat-dissipating component to the evaporation cavity 110, so that the phase-change working medium is gasified by absorbing heat, the gasified phase-change working medium flows to the condensation area 112, and is then liquefied in the condensation cavities 120, and flows into the lower part of the condensation cavities 120, the capillary structure 300 connects the evaporation cavity 110 and the lower part of the condensation cavities 120, so as to realize the circulation flow and heat dissipation of the phase-change working medium. The condensation area 112 is configured to dissipate heat. It should be noted that the connecting surface of the evaporation area 111 of the body 100 and the heat-dissipating component can be tightly attached by using a heat-conducting paste, a heat-conducting pad or other heat-conducting medium, so as to ensure good contact and reduce the contact thermal resistance.

[0041] The condensation area 112 has the plurality of condensation cavities 120, each condensation cavity 120 is spaced apart from the evaporation area 111 in the body 100, and each condensation cavity 120 is in communication with each other, so as to provide a liquefaction channel for the phase-change working medium during heat dissipation.

[0042] The lower part of the condensation cavity 120 is a phase-change working medium area 200 in liquid state, which is configured to contain the phase-change working medium in liquid state, and the liquefied phase-change working medium falls into the lower part of the condensation cavity 120 under the action of gravity. In some embodiments, when used horizontally, the capillary structure 300 is arranged at the side wall of the condensation cavity 120 in communication with the evaporation cavity 110, and the other end of the opposite condensation cavity 120 in communication with the evaporation cavity 110 is free of the capillary structure 300, the gasified phase-change working medium flows to the lower part of the condensation cavity 120 through the liquefaction of the condensation cavity 120 from the end free of the capillary structure 300, and then flows back to the evaporation cavity 110 through the end having the capillary structure 300. When used vertically, both ends of the condensation cavity 120 in communication with the evaporation cavity 110 can be free of the capillary structure 300, and the capillary structure 300 can only be arranged on the inner wall of the evaporation cavity 110.

[0043] The capillary structure 300 is arranged on the side of the evaporation cavity 110 facing the condensation cavity 120 and is connected with the lower part of the condensation cavity 120. The capillary structure 300 uses its special physical properties to realize the conduction of the phase change working medium between the evaporation cavity 110 and the lower part of the condensation cavity 120. The embodiments of the present application do not limit the structure of the capillary structure 300. For example, the capillary structure 300 can be a porous material such as sintered metal powder, polymer porous material, etc. with appropriate pore size and porosity.

[0044] When the heat-dissipating component is in operation, the evaporation area 111 of the body 100 is tightly attached to the heat-dissipating component through the connecting surface. The heat generated by the heat-dissipating component is transmitted to the evaporation cavity 110 through the connecting surface. The phase change working medium in the evaporation cavity 110 vaporizes after absorbing heat, and the vaporized phase change working medium flows to the condensation area 112 due to the pressure difference. In the condensation cavity 120, the vaporized phase change working medium recondenses and liquefies after being cooled, and flows into the lower part of the condensation cavity 120. Then, the liquid working medium returns to the evaporation cavity 110 through the capillary structure 300, and the cycle continues, realizing the continuous circulation and efficient circulation heat dissipation of the phase change working medium. The outer surface of the condensation area 112 can dissipate heat to the surrounding environment, ensuring the continuous heat dissipation process.

[0045] In vertical use, the lower part of the condensation cavity 120 is the liquid phase change working medium area 200, and the vaporized phase change working medium recondenses and liquefies after being cooled and returns to the liquid phase change working medium area 200 under the action of gravity.

[0046] In some embodiments, the area of the evaporation area 111 is greater than the area of the condensation area 112, which is beneficial for the rapid heat transmission of the heat-dissipating component, the rapid flow of the vaporized phase change working medium, and the surface heat dissipation of the evaporation area 111.

[0047] The heat-dissipating component generates heat which is transmitted to the evaporation cavity 110 through the connecting surface of the body 100, so that the phase change working medium in the evaporation cavity 110 vaporizes after absorbing heat. The vaporized phase change working medium flows to the condensation area 112 separated from the evaporation cavity 110 due to the pressure difference, and in the condensation cavity 120, the vaporized phase change working medium recondenses and liquefies after being cooled, and flows into the lower part of the condensation cavity 120. Then, the liquid phase change working medium returns to the evaporation cavity 110 through the capillary structure 300, and the cycle continues, realizing the continuous circulation and efficient circulation heat dissipation of the phase change working medium. The outer surface of the condensation area 112 dissipates heat to the surrounding environment, ensuring the continuous heat dissipation process. By separating the evaporation cavity 110 and the condensation cavity 120, the phase change working mediums do not affect each other. The vaporized phase change working medium absorbs heat in the evaporation cavity 110, and the liquefied phase change working medium returns to the lower part 200 of the condensation cavity through the capillary structure 300, realizing the circulation heat dissipation. The vaporized phase change working medium and the liquefied phase change working medium do not affect each other, improving the heat dissipation effect.

[0048] In one possible implementation, the vapor chamber radiator provided in this application embodiment has a condensation zone 112 with a guide fluid 130 connected to the evaporation zone 111. The guide fluid 130 has a plurality of condensation chambers 120, which are spaced apart and connected to each other.

[0049] The guide fluid 130 has a guide plate with a condensation surface 132. The vaporized liquid working fluid condenses on the condensation surface 132 and flows into the lower part of the condensation chamber 120 along the condensation surface 132. This application does not limit the number of condensation surfaces 132. There are two condensation surfaces 132, and the opposite condensation surfaces 132 form the condensation chamber 120.

[0050] It is understood that the ends of each guide vane may or may not be on the same horizontal plane, and this application embodiment does not limit this.

[0051] In one possible implementation, the heat exchanger provided in this application embodiment has a connecting cavity 131 at both ends of the fluid guide 130, and each condensation cavity 120 is connected through the connecting cavity 131. The condensation cavity 120 is connected to the evaporation cavity 110 through the connecting cavity 131, and the inner wall of at least one connecting cavity 131 has a capillary structure 300.

[0052] Specifically, multiple parallel condensing chambers 120 and connecting chambers 131 form a condensation path. The number of condensing chambers 120 depends on the actual heat dissipation and power consumption requirements, and this embodiment does not limit this. The multiple condensing chambers 120 are connected by the connecting chambers 131 to form a parallel ring circuit. A capillary structure 300 is provided on the inner surface of the evaporation end that is in contact with the heat source. When the radiator is used vertically, the phase change working fluid of the liquid in the lower part of the condensing chamber 120 is drawn to the evaporation zone by capillary force, which facilitates the horizontal and vertical use of the vapor chamber radiator.

[0053] Each guide fluid 130 has a guide plate, and a condensation chamber 120 is formed between two adjacent guide plates. Another condensation chamber 120 is formed between the inner wall of the condensation zone 112 and the adjacent guide fluid 130. The inner wall of the evaporation zone 111 is surrounded to form an evaporation chamber 110. The two ends of the guide plate and the inner walls on opposite sides of the guide fluid 130 are provided with gaps to form a connecting cavity 131 so that the evaporation chamber 110 and the condensation chamber 120 are connected.

[0054] Both ends of two adjacent guide plates are on the same horizontal plane. The ends of each guide fluid 130 are set on the same horizontal plane to reduce the flow resistance of the vaporized phase change working fluid, so that the phase change working fluid can flow smoothly from the evaporation chamber 110 into the condensation chamber 120.

[0055] In one possible implementation, the heat exchanger provided in this application embodiment has a heat guide 130 having a plurality of condensing surfaces 132, each condensing surface 132 being spaced apart along a direction away from the evaporation chamber 110, and two opposite condensing surfaces 132 surrounding a condensing chamber 120.

[0056] Specifically, the vaporized phase change working fluid enters the condensation chamber 120 through the connecting cavity 131, forming condensate on the condensation surface 132. Under the action of gravity, the condensate flows along the condensation surface 132 to the lower part of the condensation chamber 120, forming a unidirectional annular running channel. The unidirectional flow channel has low flow resistance and fast circulation speed, which is conducive to improving the maximum heat dissipation capacity of the radiator. At the same time, it increases the area of ​​the condensation surface, further enhancing the heat dissipation potential of the radiator.

[0057] Understandably, with each additional condensing chamber 120, the main body 100 gains two additional condensing surfaces 132, while simultaneously gaining two additional external heat dissipation surfaces 133. This significantly increases the external heat exchange area, substantially reducing external heat exchange resistance and minimizing the external evaporative heat exchange temperature difference. Adding heat exchange extension fins to the external heat dissipation surfaces 133 creates a highly efficient air-cooled three-dimensional vapor chamber radiator. Furthermore, sintering a reinforced heat exchange capillary structure onto the outer surface of the chambers can create a highly efficient three-dimensional vapor chamber immersion phase change radiator.

[0058] In one possible implementation, the vapor chamber radiator provided in this application embodiment has a flow guide layer on the condensation surface 132.

[0059] A flow-guiding layer is provided on the surface of the condensing surface 132. It is understood that the structure of the flow-guiding layer is not limited in this embodiment. For example, the flow-guiding layer can be a hydrophobic layer or a smooth layer, so that the phase change working fluid can flow into the lower part of the condensing cavity 120 along the flow-guiding layer. The flow-guiding layer of the condensing surface 132 adopts a smooth surface or a hydrophobic surface structure, which removes the thermal resistance caused by the capillary structure on the condensing surface and maximizes the benefits of condensation heat transfer.

[0060] The internal condensing surface 132 has a smooth hydrophobic structure, which can quickly drain the condensed liquid working fluid, reduce the steam flow resistance, and reduce the working fluid flow velocity. At the same time, the absence of capillary structure on the condensing surface also reduces the heat exchange resistance of the condensing surface and improves the heat exchange efficiency.

[0061] In one possible implementation, the heat exchange plate radiator provided in this application embodiment further includes a heat expansion member 500. The guide fluid 130 has multiple heat dissipation surfaces 133. The heat dissipation surfaces 133 are located on the side of the guide fluid 130 away from the condensation surface 132. Two opposing heat dissipation surfaces 133 form a heat dissipation cavity 134. The heat dissipation cavity 134 is in communication with the outside. The heat expansion member 500 is at least partially disposed in the heat dissipation cavity 134.

[0062] It is understood that, while increasing the area of ​​the inner condensing surface 132 and the outer evaporating surface 133 in the embodiments of this application, the flow resistance of the phase change working fluid in the condensing cavity 120 and the evaporating cavity 110 is reduced by relying on the unidirectional phase change working fluid heat dissipation cycle, the flow rate of the phase change working fluid is increased, the difficulty of the phase change working fluid flowing back to the evaporating surface of the evaporating cavity 110 is reduced, the capillary structure 300 of the condensing surface 132 is avoided, and the heat transfer resistance of the condensing surface 132 is reduced.

[0063] The heat-expanding component 500 is used to increase the heat dissipation area to improve the heat dissipation effect. It should be noted that the heat-expanding component 500 can be heat dissipation fins to increase the area of ​​the evaporation end. The heat dissipation fins are disposed in the heat dissipation cavity 134 and connected to the heat dissipation surface 133. The heat dissipation fins increase the area of ​​the evaporation zone 111, thereby increasing the heat dissipation area. When the heat sink is working, heat is transferred from the component to be cooled to the evaporation zone 111. The heat dissipation fins can more effectively dissipate heat to the surrounding environment, improving the heat dissipation effect. For example, in electronic chip heat dissipation applications, heat dissipation fins can quickly transfer the heat generated by the chip to a larger space, preventing the chip from overheating and causing performance degradation or damage.

[0064] In one possible implementation, the vapor chamber radiator provided in this application embodiment has a body 100 with an evaporation end, a raised area 113 in the middle of the evaporation end, a capillary structure 300 on the inner wall of the raised area 113, and the side of the evaporation area 111 located outside the side of the condensation area 112.

[0065] A raised area 113 is disposed in the evaporation area 111. The raised area 113 is used to connect with the component to be cooled and to conduct the heat generated by the component to the evaporation chamber 110, thereby dissipating heat from the evaporation chamber 110. It should be noted that the raised area 113 is designed to fit the component to be cooled, such as for fitting a recessed chip.

[0066] In one possible implementation, the vapor chamber radiator provided in this application embodiment has a phase change capillary structure or heat dissipation fins on the outer surface of the body 100. Adding a phase change capillary structure helps reduce thermal resistance during phase change heat dissipation. The phase change capillary structure can be a porous metal structure, mainly formed by sintering metal powder or copper mesh. Thermal resistance refers to the ratio between the temperature difference across an object and the power of the heat source when heat is transferred. It should be noted that the heat expansion element 500 can also be heat dissipation fins, and a phase change capillary structure can be added to the heat dissipation fins.

[0067] It should be noted that the heat dissipation fins can be disposed on the outer surface of the body 100 or partially disposed on the outer surface of the fluid guide 130. If the heat dissipation fins are disposed on the outer surface of the fluid guide 130, the embodiments of this application do not limit the structure of the heat dissipation fins. For example, the heat dissipation fins are in the form of sheets or arc sheets, and the angle with the heat dissipation surface is 90 degrees or 75 degrees, so that they have a certain tilt angle with the heat dissipation surface.

[0068] In one possible implementation, the heat exchanger provided in this application embodiment further includes a connector 400, which is disposed on the body 100 and is used to connect to the component to be cooled.

[0069] The connector 400 is a connecting hole, which is provided on the body 100. The number of connecting holes is not limited in this application embodiment. For example, there are multiple connecting holes, and each connecting hole is spaced apart on the periphery of the evaporation zone 111 to fix the heat spreader plate radiator and the heat dissipation component securely.

[0070] On the other hand, embodiments of this application also provide an electronic device, including a heat sink and a vapor chamber heat sink as described in any of the above embodiments disposed on the heat sink.

[0071] This application does not limit the heat sink component. For example, the heat sink component can be a central processing unit (CPU), graphics processing unit (GPU), power supply module, power amplifier, or any other electronic component that generates heat. The connecting surface of the evaporation zone 111 of the vapor chamber heat sink is attached to the surface of the heat sink component to effectively absorb the heat generated by the heat sink component.

[0072] For example, the component to be cooled can be a chip protruding on a circuit board, and the connecting surface of the evaporation area 111 of the heat spreader is attached to the chip. Alternatively, the component to be cooled can be a chip recessed on the circuit board, and the connecting surface of the protrusion area 113 of the heat spreader is attached to the chip.

[0073] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0074] It should be readily understood that “on,” “above,” and “above” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “above” means not only “above something” or “above,” but also “above something” or “above” without an intermediate feature or layer therebetween, i.e., directly on something.

[0075] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0076] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A vapor chamber heat spreader, characterized by, The application relates to a heat spreader, which comprises: a body (100) having an evaporation area (111) and a condensation area (112) arranged opposite to the evaporation area (111), the evaporation area (111) being used for connecting with a heat dissipating element, the evaporation area (111) having an evaporation cavity (110), and the condensation area (112) having a plurality of condensation cavities (120), each of the condensation cavities (120) being arranged apart from the evaporation area (111) and being communicated with each other, and the evaporation cavity (110) being communicated with adjacent condensation cavities (120); a capillary structure (300) arranged in the evaporation cavity (110), a phase change working medium being gasified in the evaporation cavity (110) to absorb heat, being liquefied in the condensation cavities (120) to flow back to lower parts of the condensation cavities (120), and being guided to the evaporation cavity (110) through the capillary structure (300).

2. The vapor chamber heat spreader of claim 1, wherein, The condensation area (112) has a flow guide (130) connected with the evaporation area (111), and the flow guide (130) has a plurality of condensation cavities (120) arranged apart from each other and communicated with each other.

3. The vapor chamber heat spreader of claim 2, wherein, Opposite ends of the flow guide (130) have communicating cavities (131), each of the condensation cavities (120) is communicated through the communicating cavities (131), the condensation cavities (120) are communicated with the evaporation cavity (110) through the communicating cavities (131), and at least one inner wall of the communicating cavities (131) has a capillary structure (300).

4. The vapor chamber heat spreader of claim 2, wherein, The flow guide (130) has a plurality of condensation surfaces (132) arranged apart from each other in a direction away from the evaporation cavity (110), and opposite two condensation surfaces (132) form the condensation cavities (120).

5. The vapor chamber heat spreader of claim 4, wherein, The condensation surface (132) has a flow guide layer.

6. The vapor chamber heat spreader of claim 4 or 5, wherein, The application further comprises a heat spreading element (500), the flow guide (130) has a plurality of heat dissipation surfaces (133) arranged on a side of the flow guide (130) away from the condensation surfaces (132), opposite two heat dissipation surfaces (133) form a heat dissipation cavity (134), the heat dissipation cavity (134) is communicated with the outside, and the heat spreading element (500) is arranged at least partially in the heat dissipation cavity (134).

7. The vapor chamber heat spreader of any of claims 1-5, wherein, The evaporation area (111) has an evaporation end, a middle part of the evaporation end has a protruding area (113), an inner wall of the protruding area (113) is provided with the capillary structure (300), and a side surface of the evaporation area (111) is located outside a side surface of the condensation area (112).

8. The vapor chamber heat spreader of any of claims 1-5, wherein, An outer surface of the body (100) has a phase change capillary structure or a heat dissipation fin.

9. The vapor chamber heat spreader of any of claims 1-5, wherein, The application further comprises a connecting element (400) arranged on the body (100) and used for connecting with the heat dissipating element.

10. An electronic device, comprising: The application further comprises a heat spreader according to any one of claims 1-9 and a heat dissipating element, and the heat spreader is arranged on the heat dissipating element.

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