Heat dissipation structure of image processing equipment

Abstract

The utility model discloses a heat dissipation structure of image processing equipment. The heat dissipation structure comprises an upper shell, a lower shell and a heat dissipation plate, the image processing device comprises a heating element, the heating element is integrated on a PCB, a heat dissipation plate and the PCB are located between an upper shell and a lower shell, and the heat dissipation plate is located above the PCB. Heat dissipation fins are arranged at the top of the heat dissipation plate, a heat dissipation fan is arranged between the heat dissipation fins and the upper shell, and heat dissipation ventilation holes are formed in the position, corresponding to the heat dissipation fan, of the upper shell; a heat-conducting copper pipe and a heat-conducting piece are arranged at the bottom of the radiating plate The heat conduction copper pipe is fixed on the heat dissipation plate through a heat conduction piece, and the bottom of the heat conduction piece is in contact with a heating element on the PCB. Compared with the prior art, the heat dissipation efficiency is improved, and the heat dissipation requirement of the current high-operand image processing equipment can be met. The number of the FPGA processors is increased, the task quantity capable of being processed in parallel is increased, all the core processors are designed to the outside and links between the core processors, and the core processors can be flexibly used according to needs.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation in computer equipment, and specifically to a heat dissipation structure for an image processing device. Background Technology

[0002] Computer image processing refers to all processes, technologies, or systems that utilize computers to perform image-related tasks, including the processing, analysis, and understanding of digital images, the acquisition of digital images of real-world objects using sensing devices, and the digital representation of image processing results.

[0003] In recent years, with the development and large-scale industrialization of information acquisition technology, the types and frequency of obtainable image data have increased significantly, and the acquisition cost has also decreased significantly. This has led to an order-of-magnitude increase in the computing power of current image processing equipment, and has also put forward new requirements for the heat dissipation capacity of image processing equipment.

[0004] Chinese utility model patent CN220935227U discloses a video image processing device. This device, through the coordinated arrangement of a threaded cylinder, threaded rod, mounting frame, heat dissipation filter plate, limiting hole, dust filter plate, bolts, and fan, facilitates the installation and removal of the heat dissipation filter plate and dust filter plate, allowing for the cleaning of filtered dust and preventing clogging that could affect internal heat dissipation. Its drawback is that its heat dissipation efficiency is relatively low, failing to meet the heat dissipation requirements of current high-computational-load image processing equipment. Summary of the Invention

[0005] This application provides a heat dissipation structure for an image processing device to solve the technical problem that the heat dissipation efficiency of existing video image processing device heat dissipation structures is relatively low and cannot meet the heat dissipation requirements of current high-computation image processing devices.

[0006] To achieve the above objectives, this application adopts the following technical solution.

[0007] A heat dissipation structure for an image processing device is provided, comprising an upper housing, a lower housing, and a heat sink; the image processing device includes a heating element integrated on a PCB board, the heat sink and the PCB board are located between the upper housing and the lower housing, and the heat sink is located above the PCB board;

[0008] The top of the heat sink is provided with heat dissipation fins, and a cooling fan is provided between the heat dissipation fins and the upper outer shell. A heat dissipation ventilation hole is provided on the upper outer shell at a position corresponding to the cooling fan.

[0009] The bottom of the heat sink is provided with a heat-conducting copper pipe and a heat-conducting component; the heat-conducting copper pipe is fixed to the heat sink via the heat-conducting component, and the bottom of the heat-conducting component is in contact with the heat-generating elements on the PCB board. The heat-generating elements include the processor and other electronic components that generate heat during operation.

[0010] In some embodiments, the heat-generating element includes a first FPGA processor, a second FPGA processor, a CPU processor, and a PCIe switch chip; the first FPGA processor and the second FPGA processor are electrically connected to each other, the CPU processor is electrically connected to the first FPGA processor and the second FPGA processor respectively, and the PCIe switch chip is electrically connected to the CPU processor, the first FPGA processor, and the second FPGA processor respectively.

[0011] In some embodiments, the heat-conducting component includes a first heat-conducting component and a second heat-conducting component; the heat-conducting copper tube is fixed to the heat sink plate through the first heat-conducting component; the top surface of the second heat-conducting component is in contact with the bottom surface of the first heat-conducting component, and the bottom surface of the second heat-conducting component is in contact with the top surface of the heating element.

[0012] In some embodiments, multiple first and second heat-conducting components are provided, and each first and second heat-conducting component is matched with a heating element. Each first heat-conducting component has the same thickness, and the sum of the thickness of each second heat-conducting component and the height of its corresponding heating element is equal to the distance between the bottom surface of its corresponding first heat-conducting component and the top surface of the PCB board.

[0013] In some embodiments, one end of the heat sink is provided with a side cover plate, which is located between the upper and lower housings. The side cover plate is provided with a vent and a debugging interface, and the debugging interface is electrically connected to the PCIe switching chip.

[0014] This application has at least the following technical effects or advantages: it improves heat dissipation efficiency, meeting the heat dissipation requirements of current high-computational-load image processing equipment; it increases the number of FPGA processors, increasing the amount of tasks that can be processed in parallel; and, in addition, the design of each core processor and its interconnections has been fully considered, allowing for flexible and on-demand use. Attached Figure Description

[0015] Figure 1 This is an exploded view of the heat dissipation structure of an image processing device in one embodiment of this application;

[0016] Figure 2 This is a three-dimensional structural diagram of the heat dissipation structure of an image processing device in one embodiment of this application (viewpoint 1);

[0017] Figure 3This is a three-dimensional structural diagram of the heat dissipation structure of the image processing device in one embodiment of this application (viewpoint two);

[0018] Figure 4 This is a schematic diagram of the side cover plate in one embodiment of this application. Detailed Implementation

[0019] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0020] See Figure 1 and Figure 2 A heat dissipation structure for an image processing device includes an upper housing 1, a lower housing 2, a side cover 3, and a heat sink 4. The image processing device includes a heating element integrated on a PCB board 6. The heat sink 4 and the PCB board 6 are located between the upper housing 1 and the lower housing 2, with the heat sink 4 positioned above the PCB board 6. The side cover 3 is located between the upper and lower housings, with one end of the heat sink 4.

[0021] The top of the heat sink 4 is provided with heat sink fins 51, and a cooling fan 52 is provided between the heat sink fins 51 and the upper outer shell 1. A heat dissipation ventilation hole 53 is provided on the upper outer shell 1 at the position corresponding to the cooling fan 52.

[0022] The bottom of the heat sink 4 is provided with a heat-conducting copper pipe 54, a first heat-conducting element 55, and a second heat-conducting element 56. The heat-conducting copper pipe 54 is fixed to the heat sink 4 through the first heat-conducting element 55. The top surface of the second heat-conducting element 56 is in contact with the bottom surface of the first heat-conducting element 55, and the bottom surface of the second heat-conducting element 56 is in contact with the top surface of the heating element.

[0023] Multiple first heat-conducting components 55, second heat-conducting components 56, and heating elements are provided, and each first heat-conducting component 55 and second heat-conducting component 56 is matched with a heating element. Each first heat-conducting component 55 has the same thickness, and the sum of the thickness of each second heat-conducting component 56 and the height of its corresponding heating element is equal to the distance between the bottom surface of its corresponding first heat-conducting component 55 and the top surface of the PCB board 6.

[0024] Specifically, the heat-generating components include a first FPGA processor, a second FPGA processor, a CPU processor, and a PCIe switch chip; the first FPGA processor and the second FPGA processor are electrically connected to each other, the CPU processor is electrically connected to both the first FPGA processor and the second FPGA processor, and the PCIe switch chip is electrically connected to the CPU processor, the first FPGA processor, and the second FPGA processor. The side cover 3 is provided with a ventilation port 31 and a debugging interface 32, the debugging interface 32 being electrically connected to the PCIe switch chip.

[0025] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A heat dissipation structure of an image processing device, comprising an upper shell, a lower shell and a heat dissipation plate; the image processing device comprises a heating element integrated on a PCB board, the heat dissipation plate and the PCB board are located between the upper shell and the lower shell, and the heat dissipation plate is located above the PCB board; characterized in that: a heat dissipation fin is arranged on the top of the heat dissipation plate, a heat dissipation fan is arranged between the heat dissipation fin and the upper shell, and a heat dissipation vent hole is arranged on the upper shell corresponding to the heat dissipation fan; a heat conduction copper pipe and a heat conduction piece are arranged on the bottom of the heat dissipation plate; the heat conduction copper pipe is fixed on the heat dissipation plate through the heat conduction piece, and the bottom of the heat conduction piece is in contact with the heating element on the PCB board.

2. The heat dissipation structure of the image processing device according to claim 1, characterized by: The heating element comprises a first FPGA processor, a second FPGA processor, a CPU processor and a PCIE exchange chip; the first FPGA processor and the second FPGA processor are electrically connected, the CPU processor is electrically connected with the first FPGA processor and the second FPGA processor respectively, and the PCIE exchange chip is electrically connected with the CPU processor, the first FPGA processor and the second FPGA processor respectively.

3. The heat dissipation structure of the image processing device according to claim 2, characterized by: The heat conduction piece comprises a first heat conduction piece and a second heat conduction piece; the heat conduction copper pipe is fixed on the heat dissipation plate through the first heat conduction piece; the top surface of the second heat conduction piece is in contact with the bottom surface of the first heat conduction piece, and the bottom surface of the second heat conduction piece is in contact with the top surface of the heating element.

4. The heat dissipation structure of the image processing device according to claim 3, characterized by: The first heat conduction piece and the second heat conduction piece are provided in plurality, each first heat conduction piece and each second heat conduction piece are matched with each heating element one by one; the thickness of each first heat conduction piece is the same, and the thickness of each second heat conduction piece and the height of the corresponding heating element are equal to the distance between the bottom surface of the corresponding first heat conduction piece and the top surface of the PCB board.

5. The heat dissipation structure of the image processing device according to any one of claims 2 to 4, characterized in that: One end of the heat dissipation plate is provided with a side cover plate, the side cover plate is located between the upper shell and the lower shell, and the side cover plate is provided with a vent and a debugging interface; the debugging interface is electrically connected with the PCIE exchange chip.

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