Adjustable communication chip heat dissipation structure

Abstract

The utility model discloses an adjustable communication chip heat radiation structure, which relates to the technical field of communication chips and comprises a heat conduction plate, a chip main body is arranged below the heat conduction plate, a circuit board is arranged at the bottom end of the chip main body, and the chip main body is fixedly connected with the circuit board through welding. The heat conduction plate is provided with a heat conduction mechanism used for improving the heat dissipation efficiency of the chip body. According to the utility model, through the heat conduction mechanism, heat on the chip main body can be efficiently conducted when air cooling heat dissipation is carried out on the circuit board through the fan outside, and the flow speed of air in the surrounding environment of the chip main body can be further improved, so that the heat dissipation efficiency of the chip main body can be further improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to communication chip technical field, concretely is a kind of adjustable communication chip heat dissipation structure. BACKGROUND

[0002] Communication chip is the integrated circuit of handling data transmission and communication protocol, is widely used in various electronic equipment, they can send, receive and handle data, support remote or local communication, and have data encoding and decoding, protocol processing, signal modulation and demodulation and connection management etc.

[0003] The existing adjustable communication chip in use, to prevent communication chip from appearing overheat damage, and ensure that chip can carry out long time stable work etc. demand, usually install fan on the case, to the overall air cooling of circuit board by this, but due to communication chip usually adopts high-density packaging form, to reduce volume and weight, causing the limited heat dissipation area of communication chip when heat dissipation, to further improve the efficiency of communication chip heat dissipation, based on this, now provide a kind of adjustable communication chip heat dissipation structure, can eliminate the drawbacks of existing device. SUMMARY

[0004] The utility model aims at providing a kind of adjustable communication chip heat dissipation structure to solve the problems in the background art.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of adjustable communication chip heat dissipation structure, including heat conduction plate, the lower portion of the heat conduction plate is provided with chip main body, the bottom end of the chip main body is provided with circuit board, the chip main body is fixedly connected with circuit board by welding, the heat conduction plate is provided with heat conduction mechanism for improving the heat dissipation efficiency of chip main body.

[0007] On the basis of the above technical scheme, the utility model further provides the following optional technical scheme:

[0008] In an alternative scheme: the heat conduction mechanism includes:

[0009] Heat conduction component is arranged on the heat conduction plate;

[0010] The heat conduction component is the heat conduction rubber pad fixedly connected at the bottom end of the heat conduction plate, and the heat conduction rubber pad is tightly attached to the upper surface of the chip main body;

[0011] Positioning assembly is arranged on the circuit board.

[0012] In an alternative scheme: the positioning assembly includes:

[0013] A plurality of fixed cylinders are circumferentially and equidistantly fixed to the top end of the circuit board, and the plurality of fixed cylinders are located outside the chip body, the heat-conducting plate is slidably sleeved on the outer wall of the plurality of fixed cylinders, and a connecting sleeve hole is formed in the position where the heat-conducting plate is connected with the fixed cylinder, and the inner wall bottom end of the connecting sleeve hole is in the shape of a circular truncated cone.

[0014] The fixed cylinder is provided with a limiting assembly.

[0015] In an alternative, the limiting assembly is an annular sleeve plate arranged on the upper surface of the fixed cylinder, and the annular sleeve plate is in contact with the upper surface of the heat-conducting plate.

[0016] The annular sleeve plate is provided with a fixing assembly.

[0017] In an alternative, the fixing assembly is a bolt arranged above the annular sleeve plate, the bolt penetrates through the annular sleeve plate to the inside of the fixed cylinder, and the bolt is threadedly connected with the fixed cylinder.

[0018] The heat-conducting plate is provided with a rotating assembly.

[0019] In an alternative, the rotating assembly is a connecting rotating rod arranged at the top end of the heat-conducting plate, and the connecting rotating rod is rotationally connected with the heat-conducting plate.

[0020] The heat-conducting plate is provided with a first heat-dissipation assembly.

[0021] In an alternative, the first heat-dissipation assembly comprises:

[0022] A plurality of first heat-dissipation fins are circumferentially and equidistantly fixed to the top end of the heat-conducting plate, and the plurality of first heat-dissipation fins are located outside the connecting rotating rod.

[0023] The connecting rotating rod is provided with a second heat-dissipation assembly.

[0024] In an alternative, the second heat-dissipation assembly comprises:

[0025] A plurality of second heat-dissipation fins are circumferentially and equidistantly fixed to the outer wall of the connecting rotating rod, the second heat-dissipation fins are located above the first heat-dissipation fins, and an opening is formed in the position where the second heat-dissipation fins are connected with the first heat-dissipation fins.

[0026] Compared with the prior art, the utility model has the beneficial effects as follows:

[0027] The heat-conducting mechanism can efficiently conduct the heat on the chip body when the circuit board is air-cooled by the fan, further improve the flow speed of air in the environment around the chip body, and further improve the efficiency of heat dissipation of the chip body. BRIEF DESCRIPTION OF DRAWINGS

[0028] Fig. 1 It is a structural schematic view of the utility model.

[0029] Fig. 2 It is a schematic view of the heat conduction plate and the heat conduction rubber pad connecting structure of the utility model.

[0030] Fig. 3 It is a schematic view of the second heat dissipation fin and the connecting rotating rod connecting structure of the utility model.

[0031] Mark annotation: 1, heat conduction plate;201, fixed cylinder;202, connecting sleeve hole;203, heat conduction rubber pad;204, first heat dissipation fin;205, bolt;206, annular sleeve plate;207, second heat dissipation fin;208, connecting rotating rod;209, opening;3, chip main body;4, circuit board. Specific implementation

[0032] In order to make the purpose, technical scheme and advantage of the utility model more clearly, the following is combined with the drawings and examples, and the utility model is further described in detail.

[0033] In one embodiment, as Figs. 1-3 Indicated, an adjustable communication chip heat dissipation structure includes heat conduction plate 1, the lower part of heat conduction plate 1 is provided with chip main body 3, the bottom end of chip main body 3 is provided with circuit board 4, chip main body 3 and circuit board 4 are fixedly connected by welding, heat conduction plate 1 is provided with heat conduction mechanism for improving the heat dissipation efficiency of chip main body 3;

[0034] Heat conduction mechanism includes: heat conduction component arranged on heat conduction plate 1;

[0035] Heat conduction component is heat conduction rubber pad 203 fixedly connected at the bottom end of heat conduction plate 1, and heat conduction rubber pad 203 is tightly combined with the upper surface of chip main body 3;

[0036] Circuit board 4 is provided with positioning assembly;

[0037] Positioning assembly includes: a plurality of fixed cylinders 201 are fixedly connected at the top end of circuit board 4 in equidistant circumferential direction, a plurality of fixed cylinders 201 are all located at the outer side of chip main body 3, heat conduction plate 1 is slidingly sleeved on the outer wall of a plurality of fixed cylinders 201, connecting sleeve hole 202 is formed at the position where heat conduction plate 1 and fixed cylinder 201 meet, and the inner wall bottom end of connecting sleeve hole 202 is in the shape of circular truncated cone;

[0038] Limiting assembly is arranged on fixed cylinder 201;

[0039] In the embodiment, when installed, the chip body 3 is fixedly connected to the top end of the circuit board 4 by welding, and then the heat conduction plate 1 is pushed to tightly adhere the heat conduction rubber pad 203 to the upper surface of the chip body 3. In this process, the heat conduction plate 1 is sleeved on the outer wall of the plurality of fixing cylinders 201 through the connecting sleeve hole 202. At this time, the bottom end of the inner wall of the connecting sleeve hole 202 in the shape of a circular truncated cone can conveniently slide the heat conduction plate 1 on the outer wall of the plurality of fixing cylinders 201, so as to conveniently position the heat conduction plate 1.

[0040] Then the heat conduction mechanism can be used to conveniently install and fix the heat conduction plate 1. In use, when the outside air is cooled and radiated on the circuit board 4 by the fan, the heat conduction mechanism can further increase the flow speed of the air around the chip body 3, thereby further improving the heat dissipation efficiency of the chip body 3.

[0041] In one embodiment, as shown in Figs. 1-2 The limiting component is an annular sleeve plate 206 arranged on the upper surface of the fixing cylinder 201, and the annular sleeve plate 206 is in contact with the upper surface of the heat conduction plate 1.

[0042] The annular sleeve plate 206 is provided with a fixing component.

[0043] The fixing component is a bolt 205 arranged above the annular sleeve plate 206, which penetrates the annular sleeve plate 206 to the inside of the fixing cylinder 201, and is threadedly connected with the fixing cylinder 201. Through the cooperation of the limiting component and the fixing component, the bolt 205 can conveniently fix the heat conduction plate 1.

[0044] The heat conduction plate 1 is provided with a rotating component.

[0045] In one embodiment, as shown in Figs. 1-3 The rotating component is a connecting rotating rod 208 arranged at the top end of the heat conduction plate 1, and the connecting rotating rod 208 is rotationally connected with the heat conduction plate 1.

[0046] The heat conduction plate 1 is provided with a first heat dissipation component.

[0047] The first heat dissipation component comprises a plurality of first heat dissipation fins 204 fixedly connected at the top end of the heat conduction plate 1 in a circumferential equidistant manner, and the plurality of first heat dissipation fins 204 are located outside the connecting rotating rod 208.

[0048] The connecting rotating rod 208 is provided with a second heat dissipation component.

[0049] The second heat dissipation assembly comprises a plurality of second heat dissipation fins 207 fixedly connected on the outer wall of the connecting rotating rod 208 at equal intervals in the circumferential direction, the second heat dissipation fins 207 are located above the first heat dissipation fins 204, and an opening 209 is formed at the joint position of the second heat dissipation fins 207 and the first heat dissipation fins 204. Through the cooperation of the rotating assembly, the first heat dissipation assembly and the second heat dissipation assembly, the heat dissipation efficiency of the chip main body 3 can be further improved under the driving of the wind force during air cooling.

[0050] The above embodiment discloses an adjustable communication chip heat dissipation structure. During installation, the chip main body 3 is fixedly connected to the top end of the circuit board 4 by welding, and then the heat conduction plate 1 is pushed to tightly adhere the heat conduction rubber pad 203 to the upper surface of the chip main body 3. In this process, the heat conduction plate 1 is sleeved on the outer wall of the plurality of fixed cylinders 201 through the connecting sleeve hole 202. At this time, the bottom end of the inner wall of the connecting sleeve hole 202 in the shape of a circular truncated cone can conveniently slide the heat conduction plate 1 on the outer wall of the plurality of fixed cylinders 201, so as to conveniently position the heat conduction plate 1.

[0051] Then, the annular sleeve plate 206 is sleeved on the outer wall of the bolt 205, and the bolt 205 is screwed with the fixed cylinder 201. At this time, the annular sleeve plate 206 is in contact with the upper surfaces of the fixed cylinder 201 and the heat conduction plate 1. Until the annular sleeve plate 206 is tightly adhered to the upper surfaces of the heat conduction plate 1 and the fixed cylinder 201 by extrusion, the heat conduction plate 1 can be conveniently installed and fixed.

[0052] In use, the heat conduction rubber pad 203 can make the heat conduction plate 1 conduct the heat on the chip main body 3 to the plurality of first heat dissipation fins 204, respectively. When the circuit board 4 is air-cooled by the fan, the plurality of second heat dissipation fins 207 are driven by the wind force to drive the connecting rotating rod 208 to rotate at the top end of the heat conduction plate 1, so as to further improve the flow speed of the air around the chip main body 3, thereby further improving the heat dissipation efficiency of the chip main body 3.

[0053] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which shall be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An adjustable communication chip heat dissipation structure, comprising a heat conduction plate (1), a chip body (3) is arranged below the heat conduction plate (1), a circuit board (4) is arranged at the bottom end of the chip body (3), and the chip body (3) and the circuit board (4) are fixedly connected through welding, characterized in that, The heat-conducting plate (1) is provided with a heat-conducting mechanism for improving the heat dissipation efficiency of the chip body (3).

2. The adjustable communication chip heat dissipation structure of claim 1, wherein, The heat-conducting mechanism comprises a heat-conducting component provided on the heat-conducting plate (1). The heat-conducting component is a heat-conducting rubber pad (203) fixedly connected to the bottom end of the heat-conducting plate (1), which is tightly attached to the upper surface of the chip body (3). The circuit board (4) is provided with a positioning component.

3. The adjustable communication chip heat dissipation structure of claim 2, wherein, The positioning component comprises a plurality of fixed cylinders (201) fixedly connected to the top end of the circuit board (4) at equal intervals in the circumferential direction, wherein the fixed cylinders (201) are located outside the chip body (3), the heat-conducting plate (1) is slidably sleeved on the outer wall of the fixed cylinders (201), the heat-conducting plate (1) is provided with a connecting sleeve hole (202) at the position where it is connected to the fixed cylinder (201), and the inner wall bottom end of the connecting sleeve hole (202) is in the shape of a circular truncated cone. The fixed cylinder (201) is provided with a limiting component.

4. The adjustable communication chip heat dissipation structure of claim 3, wherein, The limiting component is an annular sleeve plate (206) provided on the upper surface of the fixed cylinder (201), which is in contact with the upper surface of the heat-conducting plate (1). The annular sleeve plate (206) is provided with a fixing component.

5. The adjustable communication chip heat dissipation structure of claim 4, wherein, The fixing component is a bolt (205) provided above the annular sleeve plate (206), which penetrates through the annular sleeve plate (206) to the inside of the fixed cylinder (201), and is threadedly connected to the fixed cylinder (201). The heat-conducting plate (1) is provided with a rotating component.

6. The adjustable communication chip heat dissipation structure of claim 5, wherein, The rotating component is a connecting rotating rod (208) provided on the top end of the heat-conducting plate (1), which is rotatably connected to the heat-conducting plate (1). The heat-conducting plate (1) is provided with a first heat-dissipating component.

7. The adjustable communication chip heat dissipation structure of claim 6, wherein, The first heat-dissipating component comprises a plurality of first heat-dissipating fins (204) fixedly connected to the top end of the heat-conducting plate (1) at equal intervals in the circumferential direction, wherein the first heat-dissipating fins (204) are located outside the connecting rotating rod (208). The connecting rotating rod (208) is provided with a second heat-dissipating component.

8. The adjustable communication chip heat dissipation structure of claim 7, wherein, The second heat-dissipating component comprises a plurality of second heat-dissipating fins (207) fixedly connected to the outer wall of the connecting rotating rod (208) at equal intervals in the circumferential direction, wherein the second heat-dissipating fins (207) are located above the first heat-dissipating fins (204), and the second heat-dissipating fins (207) are provided with an opening (209) at the position where they are connected to the first heat-dissipating fins (204).

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