Integrated driving electronic device
By encapsulating diodes and resistors in the same package, the high cost and large space requirements of traditional discrete devices are solved, enabling efficient and low-cost integrated drive electronic device manufacturing.
Patent Information
- Application Number
- CN202520258694.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-18
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-02-18
AI Technical Summary
Traditional diodes and resistors are separate devices, individually packaged and connected to the PCB board, resulting in high production costs and large space occupation, making it difficult to meet the needs of high-density, high-heat-dissipation, and small-size electronic products.
The diode and resistor chip are connected and encapsulated in the same package, electrically connected through a lead frame, and encapsulated with epoxy resin components.
It improved production efficiency, saved on frame and mold development costs, reduced PCB space usage, lowered production costs, and improved assembly efficiency.
Smart Images
Figure CN223745186U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor technical field especially an integrated drive electronic device. BACKGROUND
[0002] Traditional diode and resistance are separate devices, and are separately packaged and connected to a PCB (Printed Circuit Board) board. With the continuous development of electronic products, the production of electronic products is higher and higher, product models are diversified, and competition is increasingly fierce. The demand for product packaging is also higher and higher, such as high density, high strength, high heat dissipation, low cost, etc. At the same time, the power of electronic products is getting larger and larger, and the size is getting smaller and smaller. The size and heat dissipation of components are also getting higher and higher. In limited space, integrating high power, strong heat dissipation and small size has become a trend. SUMMARY
[0003] The utility model discloses a kind of integrated drive electronic devices to solve the problem that traditional diode and resistance are separate devices, and are separately packaged and connected to a PCB board.
[0004] To achieve the above object, the technical scheme adopted by the utility model is:
[0005] An integrated drive electronic device includes a diode and a resistance chip, the diode and the resistance chip are connected by a lead, and the diode and the resistance chip are combined and sealed in a package.
[0006] The integrated drive electronic device of the utility model connects the diode and the resistance chip and combines and seals them in the same package, thereby improving production efficiency, saving frame and mold development cost. At the same time, in customer use, assembly efficiency is improved, and PCB space is saved, thereby reducing production cost. The integrated drive electronic device has simple structure, convenient manufacturing and good effect.
[0007] As a preferred technical scheme of the utility model, the integrated drive electronic device further includes a lead frame, and the diode and the resistance chip are arranged on the lead frame respectively.
[0008] As a further preferred technical scheme of the utility model, the lead frame includes at least two, and the diode and the resistance chip are arranged on two lead frames respectively.
[0009] As a preferred technical scheme of the utility model, the resistance chip includes two and is arranged in parallel, and the diode is arranged in series with one of the resistance chips.
[0010] The packaging body is an epoxy resin component.
[0011] In summary, due to the adoption of the above technical scheme, the present application has the following beneficial effects:
[0012] The integrated driving electronic device has the advantages of simple structure, convenient manufacturing, good effect, and reduced production cost. BRIEF DESCRIPTION OF DRAWINGS
[0013] Fig. 1 FIG. 1 is a structural schematic diagram of an integrated driving electronic device;
[0014] Fig. 2 FIG. 1 is a structural schematic diagram of an integrated driving electronic device;
[0015] In the figure, 1 is a diode, 2 is a resistance chip, 3 is a lead frame, 4 is a lead, and 5 is a packaging body. DETAILED DESCRIPTION
[0016] The present application will be further described in detail below in combination with test examples and specific embodiments. However, it should not be understood that the above-mentioned subject matter of the present application is limited to the following examples only, and any technology realized based on the content of the present application falls within the scope of the present application.
[0017] In the description of the specific embodiments of the present application, the terms indicating the orientation or position relationship such as "up", "down", "left", "right", "center", "inner", "outer", etc. are expressed based on the orientation or position relationship shown in the drawings, or the orientation or position relationship used when the product / device / apparatus of the present application is normally used. These terms of orientation or position relationship are only used to facilitate the description of the present application or simplify the description in the specific embodiments, so as to enable the skilled person to quickly understand the scheme, and do not indicate or imply that a specific device / component / element must have a specific orientation or be constructed and operated in a specific position relationship, and therefore cannot be understood as a limitation on the present application.
[0018] In addition, if the terms "horizontal", "vertical", "overhanging", "parallel" and the like appear, it does not mean that the corresponding device / component / element is absolutely horizontal or vertical or overhanging or parallel, but can be slightly inclined or have a deviation. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined. Alternatively, it can be simplified to understand that the corresponding device / component / element is arranged in the direction of "horizontal", "vertical", "overhanging", "parallel" and the like, and can have an error / deviation of ±10% relative to the corresponding direction, more preferably an error / deviation of ±8%, more preferably an error / deviation of ±6%, more preferably an error / deviation of ±5%, more preferably an error / deviation of ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its role in the utility model scheme.
[0019] In addition, the terms "first", "second", "third" and the like in the terms are only used to distinguish the description of the same or similar parts, and should not be understood as emphasizing or implying the relative importance of the specific parts.
[0020] In addition, in the description of the embodiments of the utility model, "several", "a plurality of", "several" represent at least 2. It can be 2, 3, 4, 5, 6, 7, 8, 9 and any other situation, or even more than 9.
[0021] In addition, in the description of the technical scheme of the utility model, unless otherwise specified / limited / limited, the terms "set", "install", "connect", "connect", "set", "lay", "arrange" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, which can be welding, riveting, bolting, screwing and other commonly used connection means in the art. The connection can be mechanical connection, electrical connection or communication connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication between two elements.
[0022] In the related art, the traditional diode and resistor are separate devices, which are packaged separately and connected to the PCB. With the continuous development of electronic products, the production of electronic products is increasing, the product model is diversified, the competition is increasingly fierce, and the demand for product packaging is increasingly high, such as high density, high strength, high heat dissipation, low cost, etc. At the same time, the power of electronic products is getting larger and the size is getting smaller, and the size and heat dissipation of components are getting higher and higher, and in limited space, integrating high power, strong heat dissipation and small size has become a trend. Therefore, the technical scheme of the present application is generated, which will be described below in combination with Figs. 1-2 .
[0023] Embodiment 1
[0024] like Fig. 1 and Fig. 2 As shown, the integrated driving electronic device of this utility model includes a diode 1 and a resistor chip 2. The diode 1 and the resistor chip 2 are connected by a lead wire 4. The diode 1 and the resistor chip 2 are encapsulated in a package 5. The specific package form is not limited, and the number of output pins is also not limited.
[0025] In an optional embodiment, the integrated driving electronics further includes a lead frame 3, on which the diode 1 and the resistor chip 2 are respectively disposed. The lead frame 3 includes at least two leads, on which the diode 1 and the resistor chip 2 are disposed respectively.
[0026] In this embodiment, as Fig. 1 As shown, two lead frames 3 are arranged opposite each other. A diode 1 is mounted on one lead frame 3 and electrically connected to it. Two resistor chips 2 are insulatedly mounted on the other lead frame 3, and each resistor chip 2 is electrically connected to the lead frame 3 via a lead 4. One resistor chip 2 is electrically connected to the diode 1 via a lead 4, and the other resistor chip 2 is electrically connected to the lead frame 3 containing the diode 1 via a lead 4. This forms a circuit where the diode 1 and one of the resistor chips 2 are connected in series, and the two resistor chips 2 are connected in parallel. Fig. 2 As shown.
[0027] In an optional embodiment, the encapsulation body 5 is an epoxy resin component.
[0028] The integrated driving electronic device described in this embodiment connects the diode 1 and the resistor chip 2 and encapsulates them in the same package 5, thereby improving production efficiency and saving frame and mold development costs. At the same time, in customer use, it not only improves assembly efficiency but also saves PCB space, thereby reducing production costs. This integrated driving electronic device has a simple structure, is easy to manufacture, and has good performance.
[0029] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. An integrated drive electronics, characterized by, The diode (1) and the resistance chip (2) are connected by lead wires (4), and are encapsulated in a package (5).
2. The integrated drive electronics of claim 1, wherein, The diode (1) and the resistance chip (2) are respectively arranged on the lead frame (3).
3. The integrated drive electronics of claim 2, wherein, The lead frame (3) comprises at least two, and the diode (1) and the resistance chip (2) are respectively arranged on the two lead frames (3).
4. The integrated drive electronics of claim 1, wherein, The resistance chip (2) comprises two and is arranged in parallel, and the diode (1) is arranged in series with one of the resistance chips (2).
5. The integrated drive electronics of any one of claims 1-4, wherein, The package (5) is an epoxy resin component.