Semiconductor pin bending device

Abstract

A semiconductor pin bending device comprises a lower plate, a fixing plate is installed on the lower plate through screws, a lower pedestal is installed on the fixing plate through screws, and the lower pedestal is of a concave structure. The plastic package body is placed in the lower cushion seat, and the plastic package body is limited through the concave structure on the lower cushion seat, so that the bending and forming precision of the pins is ensured. The movable end of the first hydraulic cylinder is connected with a bending piece, the bending piece is of a concave structure, a forming groove is formed in the inner side of the vertical section of the bending piece, and a plurality of limiting grooves are formed in the inner wall of the vertical section of the bending piece. Outward moving plates are arranged on the lower plate, the edges of the outward moving plates are all R angles, the phenomenon that the pins are broken due to movement of the outward moving plates in the forming process is avoided, and the outward moving plates are located on the two sides of the lower pedestal. And the bending forming of the pin is performed twice, but only one-time positioning is needed, so that the forming precision and the forming efficiency are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing especially relates to a semiconductor pin bending device. BACKGROUND

[0002] The common semiconductor device is usually composed of a plastic package and pins arranged on both sides of the plastic package, wherein, in order to facilitate the welding of the semiconductor device and the circuit board, the pin is usually processed into a Z-shaped structure, and the horizontal section and the vertical section of the pin are approximately perpendicular. This method is used to facilitate the welding operation. The structure of the pin is usually formed by bending, and the existing method is usually a segmented forming method, that is, the pin is formed in a segmented manner according to the shape of the pin. However, this forming method is low in efficiency and poor in precision of the formed pin. SUMMARY

[0003] The utility model provides a semiconductor pin bending device to solve the above prior art, solve the problem of low efficiency of semiconductor pin forming, and has strong practicability.

[0004] In order to achieve the purpose of the utility model, the following technology is adopted:

[0005] A semiconductor pin bending device, comprising a lower plate, a plurality of vertical rods are installed on the lower plate, an upper plate is installed at the upper end of the vertical rod, a fixed plate is installed on the lower plate through a screw, a lower cushion seat is installed on the fixed plate through a screw, and the lower cushion seat is in a concave structure. The plastic package is placed in the lower cushion seat, and the concave structure on the plastic package is limited to ensure the precision of the pin bending forming.

[0006] A first hydraulic cylinder is installed on the upper plate, a bending piece is connected to the movable end of the first hydraulic cylinder, the bending piece is in a concave structure, a forming groove is formed in the inner side of the vertical section of the bending piece, a plurality of limiting grooves are formed in the inner wall of the vertical section of the bending piece, when the bending piece moves downward, the pin is bent into an L-shaped structure through the forming groove formed in the inner wall, and the pin is limited by the limiting groove during bending to prevent the pin from deviating, and in order to avoid the pin from breaking due to the action of the bending piece during bending forming, the position where the lower end surface of the bending piece contacts the pin is processed into an R angle.

[0007] Two pairs of strip holes are formed on the lower plate, a movable rod is arranged in the strip hole, a lower seat is arranged at the lower end of each pair of movable rods, and an outer moving plate is arranged at the upper end of each pair of movable rods. The edges of the outer moving plate are R angles to prevent the pin from breaking due to the movement of the outer moving plate during forming, and the outer moving plate is located on both sides of the lower cushion seat. After the pin is formed into an L-shaped structure, the outer moving plate on the inner side of the vertical section of the pin will move outward, and under the action of the lower end surface of the bending piece and the outer moving plate, the pin will be bent into a Z-shaped structure.

[0008] From the above description, it can be seen that the bending forming of the pin is only positioned once although it is formed twice, thereby improving the forming precision and efficiency.

[0009] Further, in order to facilitate positioning of the plastic package, a plurality of connecting vertical rods are provided on the bending member, the lower ends of the connecting vertical rods are provided with a pressing plate, springs are sleeved on the connecting vertical rods, the upper ends of the springs act on the inner wall of the bending member, and the lower ends of the springs act on the pressing plate.

[0010] Further, in order to avoid the connecting vertical rods from being separated from the bending member, end caps are arranged at the upper ends of the connecting vertical rods.

[0011] Further, in order to make the pin forming effect meet the design requirements, the limiting groove is arranged in a Z-shaped structure, and the horizontal section and the vertical section of the limiting groove are perpendicular to each other.

[0012] Further, in order to enable the outer moving plate to move outward at the same time, thereby improving the bending forming of the pin at the lower end horizontal section, an outer top member is installed on the lower seat, the outer top member is in a concave structure, a slant hole is formed in the outer top member, the upper end of the slant hole extends outward at an inclination, end vertical holes are arranged at the upper and lower ends of the slant hole, a pressing rod is movably arranged in the slant hole and the end vertical holes, a lifting horizontal plate is sleeved on the outer top member, the pressing rod is rotatably arranged at the two ends of the lifting horizontal plate, a pushing horizontal plate is installed at the two ends of the lifting horizontal plate through screws, pushing vertical rods are installed at the two ends of the pushing horizontal plate, the pushing vertical rods are sleeved on the lower plate, a pushing upper plate is installed at the upper end of the pushing vertical rods, a second hydraulic cylinder is connected to the pushing upper plate, the second hydraulic cylinder is installed on the upper plate, and the second hydraulic cylinder is arranged in a vertical posture, mainly for facilitating maintenance in the later period.

[0013] Further, in order to limit and guide the movement of the bending member and the pushing vertical rods, a guide seat is sleeved on the pushing vertical rods, and the guide seat is installed on the bending member through screws.

[0014] The above technical scheme has the following advantages:

[0015] The utility model discloses a bending forming of the pin can be carried out, and the efficiency and precision of forming are improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to make the purpose, technical scheme and advantage of the utility model more clearly, the utility model will be described in further detail below with the drawings.

[0017] Figure 1 A perspective structure of one of the embodiments is shown Figure 1 .

[0018] Figure 2A perspective view of one embodiment is shown Figure 2 .

[0019] Figure 3 A perspective view of the bending member is shown. DETAILED DESCRIPTION

[0020] As Figures 1-3 shown, a semiconductor pin bending device comprises a lower plate 1, a plurality of vertical rods 10 are installed on the lower plate 1, and an upper plate 12 is installed at the upper end of the vertical rods 10.

[0021] A fixing plate 3 is installed on the lower plate 1 by screws, a lower base 30 is installed on the fixing plate 3 by screws, and the lower base 30 has a concave structure.

[0022] A first hydraulic cylinder 2 is installed on the upper plate 12, a bending member 21 is connected to the movable end of the first hydraulic cylinder 2, the bending member 21 has a concave structure, a forming groove 22 is formed in the inner side of the vertical section of the bending member 21, a limiting groove 23 is formed in the inner wall of the vertical section of the bending member 21, the limiting groove 23 has a Z-shaped structure, and the horizontal section and the vertical section of the limiting groove 23 are perpendicular to each other. A plurality of connecting vertical rods 24 are provided through the bending member 21, a lower pressing plate 250 is provided at the lower end of the connecting vertical rods 24, springs 25 are provided on the connecting vertical rods 24, the upper end of the springs 25 acts on the inner wall of the bending member 21, the lower end of the springs 25 acts on the lower pressing plate 250, and end caps 251 are provided at the upper end of the connecting vertical rods 24.

[0023] Two pairs of strip-shaped holes 11 are formed on the lower plate 1, movable rods 50 are provided through the strip-shaped holes 11, lower seats 49 are provided at the lower end of each pair of movable rods 50, outer moving plates 51 are provided at the upper end of each pair of movable rods 50, and the outer moving plates 51 are located on both sides of the lower base 30. An outer top piece 53 is installed on the lower seat 49, the outer top piece 53 has a concave structure, an inclined hole 47 is formed on the outer top piece 53, the upper end of the inclined hole 47 extends outwardly and obliquely, end vertical holes 48 are respectively provided at the upper and lower ends of the inclined hole 47, a pressing rod 46 is movably provided in the inclined hole 47 and the end vertical holes 48, a lifting horizontal plate 45 is provided through the outer top piece 53, the pressing rod 46 is rotatably provided at both ends of the lifting horizontal plate 45, a lower pushing horizontal plate 44 is installed on both ends of the lifting horizontal plate 45 by screws, lower pushing vertical rods 43 are respectively installed on both ends of the lower pushing horizontal plate 44, guide seats 42 are provided on the lower pushing vertical rods 43, the guide seats 42 are installed on the bending member 21 by screws, the lower pushing vertical rods 43 are provided through the lower plate 1, a lower pushing upper plate 41 is installed at the upper end of the lower pushing vertical rods 43, a second hydraulic cylinder 4 is connected to the lower pushing upper plate 41, and the second hydraulic cylinder 4 is installed on the upper plate 12.

[0024] In application, the semiconductor is placed on the lower base 30, and the two sides of the semiconductor plastic package are limited by the side walls on both sides of the lower base 30, in order to further ensure the accuracy of the plastic package after placement, a pair of positioning cylinders can be arranged on the lower plate 1, the movable end of the positioning cylinder is provided with or without a positioning block, when the plastic package is placed on the lower base 30, the two ends of the plastic package are positioned by the movable end of the positioning cylinder or the positioning block thereon. Then start the first hydraulic cylinder 2, under the driving of the first hydraulic cylinder 2, the bending piece 21 and the lower pressing plate 250 thereon move downward, in the moving process, the lower pressing plate 250 first acts on the plastic package, so as to position the plastic package, then the limiting groove 23 on the lower end surface of the bending piece 21 acts on the pin in horizontal posture when the bending piece 21 moves downward, so as to bend the pin to L-shaped structure under the support of the upper end surface of the lower base 30, the bending piece 21 remains after bending, at this time, part of the vertical section of the pin extends out of the lower end surface of the lower base 30. Then, start the second hydraulic cylinder 4, under the driving of the second hydraulic cylinder 4, the lower pushing vertical rod 43 moves downward, under the movement of the lower pushing vertical rod 43, the lifting horizontal plate 45 moves downward, and when the lifting horizontal plate 45 moves downward, the pressing rod 46 thereon acts on the inclined hole 47, so that the outer top piece 53 moves outward, and through the movement of the outer top piece 53, the outer moving plate 51 at the upper end thereof moves outward, and through the action of the outer moving plate 51, the pin is bent to Z-shaped structure, finally the semiconductor is taken off.

[0025] The preferred embodiments of the present application are described above, but the present application is not limited to the above, and it is obvious that those skilled in the art can make various modifications and changes to the present application without departing from the spirit and scope of the present application. Therefore, if these modifications and changes of the present application belong to the scope of the claims of the present application and equivalent technologies, the present application also intends to include these modifications and changes.

Claims

1. A semiconductor pin bending apparatus characterized by comprising: It comprises a lower plate (1), a plurality of vertical rods (10) are installed on the lower plate (1), and the upper end of the vertical rod (10) is provided with an upper plate (12); The lower plate (1) is provided with a fixed plate (3) installed through screws, the fixed plate (3) is provided with a lower base (30) installed through screws, and the lower base (30) is in a concave structure; The upper plate (12) is provided with a first hydraulic cylinder (2), the movable end of the first hydraulic cylinder (2) is connected with a bending piece (21), the bending piece (21) is in a concave structure, a shaped groove (22) is formed in the inner side of the vertical section of the bending piece (21), and a limiting groove (23) is formed in the inner wall of the vertical section of the bending piece (21); A pair of strip-shaped holes (11) are formed in the lower plate (1), the movable rod (50) is arranged in the strip-shaped hole (11), the lower end of each pair of movable rods (50) is provided with a lower seat (49), and the upper end of each pair of movable rods (50) is provided with an outward moving plate (51).

2. The semiconductor lead bending apparatus according to claim 1, characterized by A plurality of connecting vertical rods (24) are arranged on the bending piece (21), the lower end of the connecting vertical rod (24) is provided with a lower pressing plate (250), the spring (25) is arranged on the connecting vertical rod (24), the upper end of the spring (25) acts on the inner wall of the bending piece (21), and the lower end of the spring (25) acts on the lower pressing plate (250).

3. The semiconductor lead bending apparatus according to claim 2, wherein The upper end of the connecting vertical rod (24) is provided with an end cap (251).

4. The semiconductor lead bending apparatus according to claim 1, wherein The limiting groove (23) is in a Z-shaped structure, and the horizontal section and the vertical section of the limiting groove (23) are perpendicular to each other.

5. The semiconductor lead bending apparatus according to claim 1, wherein The outer top piece (53) is in a concave structure, the inclined hole (47) is formed in the outer top piece (53), the upper end of the inclined hole (47) extends outwardly and downwardly, the upper and lower ends of the inclined hole (47) are respectively provided with end vertical holes (48), the pressure rod (46) is movably arranged in the inclined hole (47) and the end vertical hole (48), the lifting horizontal plate (45) is arranged in the outer top piece (53), the pressure rod (46) is rotatably arranged at the two ends of the lifting horizontal plate (45), the lower pushing horizontal plate (44) is arranged at the two ends of the lifting horizontal plate (45) through screws, the lower pushing vertical rod (43) is arranged at the two ends of the lower pushing horizontal plate (44), the lower pushing vertical rod (43) is arranged in the lower plate (1), the lower pushing upper plate (41) is arranged at the upper end of the lower pushing vertical rod (43), the second hydraulic cylinder (4) is connected to the lower pushing upper plate (41), and the second hydraulic cylinder (4) is arranged on the upper plate (12).

6. The semiconductor lead bending apparatus according to claim 5, wherein The guide seat (42) is arranged on the bending piece (21) through screws.

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