Low-PIM shielding conductive adhesive tape

Abstract

The utility model relates to the technical field of conductive adhesive tapes, and particularly discloses a low-PIM shielding conductive adhesive tape which comprises a PIM flexible conductive substrate, at least one upper side and at least one lower side of the PIM flexible conductive substrate are coated with directionally-arranged conductive adhesive, release paper is laid on the directionally-arranged conductive adhesive, and the release paper is coated on the PIM flexible conductive substrate. The conductive adhesive tape prepared by matching the PIM flexible conductive base material and the directionally arranged conductive base material has excellent shielding effectiveness and flame retardant performance, meets the high-frequency use environment requirements of customers, effectively solves the problem of signal distortion and can shield additional interference signals, and compared with a shielding conductive adhesive tape in the prior art, the shielding conductive adhesive tape has the advantages that the shielding effect is good, and the cost is low. And the practicability is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to conductive tape technical field especially relates to a low PIM shielding conductive tape. BACKGROUND

[0002] Today, with the rapid development of communication technology, such as 5G, 6G high frequency base station, satellite communication and other fields, the quality and stability of signal transmission are extremely high; passive intermodulation (PIM) phenomenon will cause signal distortion, produce additional interference signals, and seriously affect the communication quality.

[0003] The traditional shielding conductive tape only shields electromagnetic waves, and has defects in flexibility and conductive particle distribution control, and cannot meet the strict requirements of modern high-frequency communication equipment on low PIM performance; therefore, the market urgently needs to develop a shielding conductive tape with low PIM, good flexibility and adjustable spacing between conductive particles. UTILITY MODEL CONTENT

[0004] In order to overcome the defects of the prior art, the utility model discloses a low PIM shielding conductive tape.

[0005] In order to achieve the above purpose, the technical scheme adopted by the utility model is: a low PIM shielding conductive tape, comprising a PIM flexible conductive base material, at least one side of the PIM flexible conductive base material is coated with directional arrangement conductive adhesive, and the directional arrangement conductive adhesive is laid with release paper.

[0006] Further preferably, the two sides of the PIM flexible conductive base material are respectively coated with directional arrangement conductive adhesive.

[0007] Further preferably, the thickness of the PIM flexible conductive base material is greater than the thickness of the directional arrangement conductive adhesive, which is greater than the thickness of the release film, which is greater than the thickness.

[0008] Further preferably, the surface impedance of the low PIM shielding conductive tape is less than 0.03Ω / inch.

[0009] Further preferably, the thickness of the low PIM shielding conductive tape is 0.05-1mm.

[0010] Further preferably, the shielding effectiveness of the low PIM shielding conductive tape is greater than or equal to 85db.

[0011] Further preferably, the flame retardant level of the low PIM shielding conductive tape is UL-94V0.

[0012] The utility model realizes the following beneficial effects:

[0013] The conductive adhesive tape prepared by matching the PIM flexible conductive substrate with the directionally arranged conductive substrate has excellent shielding performance and flame retardation performance, meets the high-frequency use environment requirements of customers, effectively solves the signal distortion and can shield additional interference signals, and has higher practicability compared with the shielding conductive adhesive tape in the prior art.

[0014] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art upon examination of the following or can be learned by practice of the present application. The objects and other advantages of the present application can be realized and attained by the structure particularly pointed out in the description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments consistent with the present disclosure and serve to explain the principles of the present disclosure.

[0016] Figure 1 The low-PIM shielding conductive adhesive tape disclosed in Example 1;

[0017] Figure 2 The low-PIM shielding conductive adhesive tape disclosed in Example 2;

[0018] In the drawings: 10, PIM flexible conductive substrate; 20, directionally arranged conductive adhesive; 30, release paper. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0020] In the description of the present application, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery" and the like indicate the orientation or positional relationship, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0021] Example 1

[0022] In order to solve the problem that the shielding conductive adhesive tape in the prior art only shields electromagnetic waves and has insufficient flexibility and conductive particle distribution regulation, reference is made to Figure 1As shown, the low PIM shielding conductive adhesive tape of the present application comprises a PIM flexible conductive substrate, at least the upper and lower sides of the PIM flexible conductive substrate are coated with a directional arrangement conductive adhesive 20, and a release paper 30 is laid on the directional arrangement conductive adhesive 20. It should be noted here that the PIM flexible conductive substrate 10 and the directional arrangement conductive adhesive 20 referred to in the present application are known materials that can be directly obtained on the market, and will not be described in detail here. Based on the above structure, the conductive adhesive tape prepared by cooperating the PIM flexible conductive substrate with the directional arrangement conductive adhesive substrate has excellent shielding effectiveness and flame retardant performance, meets the high frequency use environment requirements of customers, effectively solves the signal distortion and can shield additional interference signals, and has higher practicability compared with the shielding conductive adhesive tape in the prior art.

[0023] Embodiment 2

[0024] Based on Embodiment 1 and referring to Figure 2 As shown, the two sides of the PIM flexible conductive substrate of the present application are respectively coated with a directional arrangement conductive adhesive 20, and a release film is laid on the arrangement conductive adhesive on both sides. Since a layer of directional arrangement conductive adhesive 20 is added, the use performance of the present application can be further optimized.

[0025] Specifically, the thickness of the PIM flexible conductive substrate of the present application is greater than the thickness of the directional arrangement conductive adhesive 20, which is greater than the thickness of the release film, and the overall thickness is 0.05-1mm. According to the use needs of users, the thickness of the conductive adhesive tape can be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 1mm.

[0026] Based on Embodiment 2, the surface impedance of the low PIM shielding conductive adhesive tape prepared by the present application is <0.03Ω / inch, the shielding effectiveness is >=85db, and the flame retardant level is UL-94V0.

[0027] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0028] The above embodiments are only for illustrating the technical concept and characteristics of the present application, the purpose is to enable those skilled in the art to understand the content of the present application and to implement it, and it cannot limit the protection scope of the present application. Any equivalent transformation or modification made according to the spirit and essence of the present application should be covered within the protection scope of the present application.

Claims

1. A low PIM shielded conductive tape, characterized by, A PIM flexible conductive substrate coated with a conductive adhesive tape (20) on at least one side of the PIM flexible conductive substrate, and a release paper (30) laid on the conductive adhesive tape (20).

2. The low PIM shielded conductive tape of claim 1, wherein, The PIM flexible conductive substrate is coated with a conductive adhesive tape (20) on both sides of the PIM flexible conductive substrate.

3. The low PIM shielded conductive tape of claim 2, wherein, The thickness of the PIM flexible conductive substrate is greater than the thickness of the conductive adhesive tape (20) which is greater than the thickness of the release film which is greater than the thickness of the release paper.

4. The low PIM shielded conductive tape of claim 1, wherein, The surface impedance of the low PIM shielding conductive adhesive tape is < 0.03 Ω / inch.

5. The low PIM shielded conductive tape of claim 1, wherein, The thickness of the low PIM shielding conductive adhesive tape is 0.05-1 mm.

6. The low PIM shielded conductive tape of claim 1, wherein, The shielding effectiveness of the low PIM shielding conductive adhesive tape is > 85 db.

7. The low PIM shielded conductive tape of claim 1, wherein, The flame retardant rating of the low PIM shielding conductive adhesive tape is UL-94 V0.

Images