Mask assembly

Abstract

The mask assembly includes a stage, a mask frame disposed on an upper surface of the stage, and a mask disposed on an upper surface of the mask frame. The mask frame includes a frame opening defined by a first side extending in a first direction and a second side extending in a second direction. An upper surface of the mask frame faces the mask in the third direction. The lower surface of the mask frame faces the upper surface of the stage in the fourth direction. The lower surface of the mask frame includes a first surface surrounding the frame opening in a plan view and a second surface adjacent to an edge of the mask frame in the plan view. The first surface is disposed on an upper surface of the stage. The second surface is spaced from an upper surface of the stage.

Description

[0001] Cross Reference to Related Applications

[0002] This United States nonprovisional patent application claims priority to and the benefit of Korean Patent Application No. 10-2023-0179196, filed on December 12, 2023, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure relates generally to a mask assembly. BACKGROUND

[0004] Display devices generally output videos or images through a display area to provide various visual information to users. Among display devices, an organic light emitting display device has a relatively wide viewing angle, a relatively excellent contrast ratio, and a relatively high (or fast) response speed. The display area of such an organic light emitting display device can include pixels. The pixels can form the display area through a deposition process of depositing a material.

[0005] A deposition apparatus can include (or utilize) a mask, a mask frame, and a stage as part of one or more stages of deposition. The mask can be stretched and fixed to the mask frame. The mask frame can be deformed due to the stretching of the mask.

[0006] The background provided herein is for the purpose of presenting the context of the disclosure. To the extent that the descriptions in this Background section contain work by the inventor(s) that was not previously disclosed in the prior art, such work is not, and should not be deemed to be, expressly or impliedly admitted as prior art against the present disclosure. SUMMARY

[0007] Some aspects provide a mask assembly capable of reducing frictional force generated between a mask frame and a stage disposed on a lower surface of the mask frame.

[0008] Additional aspects will be set forth in the detailed description to follow, and in part will be apparent from the disclosure, or can be learned by practice of the disclosed embodiments and / or claims, including realization or discovery of certain method steps by others skilled in the art.

[0009] According to some embodiments, a mask assembly includes a table, a mask frame, and a mask. The mask frame is disposed on an upper surface of the table. The mask frame includes a frame opening bounded by a first side extending in a first direction and a second side extending in a second direction that intersects the first direction. The mask is disposed on an upper surface of the mask frame such that the upper surface of the mask frame faces the mask in a third direction that intersects both the first direction and the second direction, and a lower surface of the mask frame faces the upper surface of the table in a fourth direction opposite the third direction. The lower surface of the mask frame includes a first surface that surrounds the frame opening in a plan view and a second surface that is adjacent to an edge of the mask frame in the plan view. The first surface is disposed on the upper surface of the table. The second surface is spaced apart from the upper surface of the table in the third direction.

[0010] In some embodiments, a first distance between the second surface and the upper surface of the table in the third direction can be greater than a second distance between the first surface and the upper surface of the table in the third direction.

[0011] In some embodiments, a difference between the first distance and the second distance can be in a range from about 0.05 mm to about 0.15 mm.

[0012] In some embodiments, the lower surface of the mask frame can further include a third surface. The third surface can include a (3-1) surface extending in the second direction and a (3-2) surface extending in the first direction. A third distance between the third surface and the upper surface of the table in the third direction can be greater than the first distance.

[0013] In some embodiments, the second surface can include a (2-1) surface extending in the second direction along one of the second sides of the mask frame, a (2-2) surface adjacent to one of the corners of the mask frame, and a (2-3) surface extending in the first direction along one of the first sides of the mask frame.

[0014] In some embodiments, the (3-1) surface can be disposed between the first surface and the (2-1) surface in the plan view, and the (3-2) surface can be disposed between the first surface and the (2-3) surface in the plan view.

[0015] In some embodiments, the first surface can include: a first (1-1) surface adjacent to the frame opening; a first (1-2) surface extending in the second direction along one of the second sides of the mask frame; and a first (1-3) surface extending in the first direction along one of the first sides of the mask frame. The first (3-1) surface can be disposed between the first (1-1) surface and the first (1-2) surface in the plan view. The first (3-2) surface can be disposed between the first (1-1) surface and the first (1-3) surface in the plan view.

[0016] In some embodiments, the first (3-1) surface can extend in the second direction from one first side of the mask frame to another first side of the mask frame. The one first side of the mask frame and the another first side of the mask frame can be opposite to each other in the second direction. The first (3-2) surface can extend in the first direction from one second side of the mask frame to another second side of the mask frame. The one second side of the mask frame and the another second side of the mask frame can be opposite to each other in the first direction.

[0017] In some embodiments, the second surface can be one of a plurality of second surfaces. Each of the plurality of second surfaces can be disposed adjacent to a corresponding one of the corners of the mask frame. The first (3-1) surface can be disposed between second surfaces of the plurality of second surfaces that are adjacent to each other in the second direction. The first (3-2) surface can be disposed between second surfaces of the plurality of second surfaces that are adjacent to each other in the first direction.

[0018] In some embodiments, the mask frame can include: a first portion including the first surface and the second surface; and a second portion extending from the upper surface of the first portion. The second portion can protrude further toward the frame opening than the first portion. Inner surfaces of corresponding portions of the first portion and the second portion that bound the frame opening can be inclined from at least one of the first direction and the second direction.

[0019] In some embodiments, the frame opening can include: a first opening bounded by the inner surface of the first portion; and a second opening bounded by the inner surface of the second portion. The first opening can be fluidically connected to the second opening within the mask frame.

[0020] In some embodiments, the mask assembly can further include: a first rod disposed between the mask frame and the mask in the third direction; and a second rod disposed between the first rod and the mask in the third direction. The first rod can extend in the first direction. The second rod can extend in the second direction. Each of the first rod and the second rod can be disposed in a corresponding slot in the upper surface of the second portion.

[0021] According to some embodiments, a mask assembly can include a table, a mask frame, and a mask. The mask frame is disposed on an upper surface of the table. The mask frame includes a frame opening. The mask is disposed on an upper surface of the mask frame such that the upper surface of the mask frame faces the mask in a first direction and a lower surface of the mask frame faces the upper surface of the table in a second direction opposite the first direction. The lower surface of the mask frame includes a first surface surrounding the frame opening in a plan view and a second surface adjacent to an edge of the mask frame in the plan view. A step connects the first surface and the second surface.

[0022] In some embodiments, a first distance between the second surface and the upper surface of the table in the first direction can be greater than a second distance between the first surface and the upper surface of the table in the first direction.

[0023] In some embodiments, the lower surface of the mask frame can further include a third surface surrounding the first surface in the plan view. A third distance between the third surface and the upper surface of the table in the first direction can be greater than the first distance.

[0024] In some embodiments, the second surface can extend along at least one of first sides of the mask frame extending in a third direction intersecting the first direction, or extend along at least one of second sides of the mask frame extending in a fourth direction intersecting both the first direction and the third direction.

[0025] In some embodiments, the second surface can be disposed further away from the frame opening than the third surface.

[0026] In some embodiments, the second surface can be one of a plurality of second surfaces. Each of the plurality of second surfaces can be disposed adjacent to a corresponding one of corners of the mask frame.

[0027] In some embodiments, the lower surface of the mask frame can further include a third surface extending in a third direction and a fourth direction in the plan view. The third direction and the fourth direction can both intersect the first direction. The third surface can be disposed between second surfaces adjacent to each other in the third direction among the plurality of second surfaces and between second surfaces adjacent to each other in the fourth direction among the plurality of second surfaces. The third surface can be disposed further away from the frame opening than the first surface.

[0028] In some embodiments, the first surface can directly contact the upper surface of the table.

[0029] The foregoing general description and the following detailed description are explanatory and are intended to provide further explanation of the claimed subject matter. BRIEF DESCRIPTION OF DRAWINGS

[0030] The various embodiments disclosed herein are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like references indicate similar elements.

[0031] FIG. 1 A cross-sectional view of a deposition apparatus according to some embodiments is schematically illustrated.

[0032] FIG. 2A A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 1

[0033] FIG. 2B A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 2A

[0034] FIG. 3 A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 2A

[0035] FIG. 4A A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 3

[0036] FIG. 4B A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 4A

[0037] FIG. 4C A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 4A

[0038] FIG. 5A A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 4C

[0039] FIG. 5B A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 3

[0040] FIG. 6A A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 6B

[0041] FIG. 7A A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. FIG. 7B FIG. 7C A perspective view of a mask assembly in the deposition apparatus according to some embodiments is schematically illustrated. ​​​​​​​​​​

[0042] FIG. 8 schematically illustrates a deposition process in a display panel according to some embodiments. FIG. 2A A cross-sectional view of a representative pixel in the display panel is schematically illustrated.

[0043] FIG. 9 schematically illustrates a deposition process in a display panel according to some embodiments. FIG. 8 A cross-sectional view of a representative pixel in the display panel is schematically illustrated.

[0044] FIG. 10 schematically illustrates a deposition process in a display panel according to some embodiments. FIG. 1 A cross-sectional view of a representative pixel in the display panel is schematically illustrated. FIG. 8 A cross-sectional view of a representative pixel in the display panel is schematically illustrated. DETAILED DESCRIPTION

[0045] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations. The term“embodiment” and“implementation” can be used interchangeably to describe one or more non-limiting examples of the systems, devices, methods, etc. described herein. It will be apparent, however, that various embodiments can be practiced without

[0046] Unless otherwise specified, the illustrated embodiments are to be understood as providing examples of the various features of the different details of some embodiments. Thus, unless otherwise specified, the features, components, modules, layers, films, areas, aspects, structures, etc. (individually or collectively referred to as“elements”) that are described in connection with one embodiment are not necessarily excluded from other embodiments, and the specific features, components, modules, layers, films, areas, aspects, structures, etc. of one embodiment can be interchanged with or used in combination with those of another embodiment. Moreover, the features, components, modules, layers, films, areas, aspects, structures, etc. of the various embodiments can be used in any desired combination.

[0047] The use of cross-hatching and / or shading in the drawings is generally provided to illustrate the boundaries and / or transitions of adjacent elements. As such, unless otherwise specified, the presence or absence of cross-hatching or shading in a drawing is neither intended nor indicated to convey any preference or requirement for particular materials, material properties, sizes, proportions, commonalities and / or differences between elements, any other characteristic, attribute, property, etc. of the elements shown. Additionally, in the drawings, the size and relative sizes of elements can be exaggerated for clarity and / or descriptive purposes. As such, the dimensions and relative sizes of various elements in the drawings are not necessarily to scale. When an embodiment can be implemented differently, a particular sequence of processes can be performed differently. For example, two consecutively described processes can be performed substantially simultaneously, or in an order opposite to the described order. Furthermore, like drawing references and / or reference numerals designate like elements.

[0048] When an element (such as a layer) is referred to as being “on”, “above”, “connected to” or “coupled to” another element, it can be directly on, above, connected or coupled to the other element or one or more intervening elements can also be present. In contrast, when an element is referred to as being “directly on”, “directly connected to” or “directly coupled to” another element, there are no intervening elements present. Other terms of relationship for describing the relationship between elements are to be construed in a like fashion, such as “between” versus “directly between”, “adjacent” versus “directly adjacent”, “on” versus “directly on”, “contacting” versus “directly contacting”, “touching” versus “directly touching”, and the like. Furthermore, the term “connected” can refer to physical or electrical and / or fluidic connectivity. To that end, for purposes of the present disclosure, the phrase “fluidically connected” can be used for volumes, plenums, holes, openings, and the like that can be directly connected to one another or connected to one another via one or more intervening components or volumes to form a fluidic connection, similar to how the phrase “electrically connected” is used for components connected to form an electrical connection. If the phrase “fluidically interposed” is used, it can be used to refer to a component, volume, plenum, hole, opening, and the like that is in fluid connection with at least two other components, volumes, plenums, holes, openings, and the like, such that fluid flowing from one of those other components, volumes, plenums, holes, openings, and the like to the other or another of those components, volumes, plenums, holes, openings, and the like will first flow through the “fluidically interposed” component before reaching the other or another of those components, volumes, plenums, holes, openings, and the like. For example, if a pump is fluidically interposed between a reservoir and an outlet, fluid flowing from the reservoir to the outlet will first flow through the pump before reaching the outlet. If the phrase “fluidically adjacent” is used, it refers to fluidic elements being placed relative to another fluidic element such that no potentially structural fluidic interposition is between the two elements that could potentially interrupt fluid flow between the two fluidic elements. For example, in a flow path having a first valve, a second valve, and a third valve arranged in sequence, the first valve will be fluidically adjacent to the second valve, the second valve will be fluidically adjacent to both the first valve and the third valve, and the third valve will be fluidically adjacent to the second valve.

[0049] For the purposes of the present disclosure, the first axis extending along the first direction DR1, the second axis extending along the second direction DR2, and the third axis extending along the third direction DR3 are not limited to the three axes of an orthogonal coordinate system, such as the x-axis, the y-axis, and the z-axis of a Cartesian coordinate system, and can be interpreted in a broader sense. For example, the first axis, the second axis, and the third axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. Furthermore, if used herein, the phrase “at least one of X, Y, …, and Z” and “at least one selected from the group consisting of X, Y, …, and Z” can be interpreted to mean only X, only Y, …, only Z, or any combination of two or more of X, Y, …, and Z, such as, for example, XYZ, XY, YZ, and XZ. Furthermore, if used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0050] Although the terms “first,” “second,” “third,” etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of the present disclosure. As such, the use of such identifiers (e.g., “first element”) should not be interpreted to imply that there is an inherent preference for one element over another. Furthermore, if any of the ordinal indicators, such as (a), (b), (c), …, or (1), (2), (3), …, are used in this disclosure and the accompanying claims, they are to be understood to not convey any particular order or sequence, unless specifically indicated otherwise. For example, if there are three steps labeled (i), (ii), and (iii), these steps can be taken in any order (or even at the same time, unless otherwise dictated), unless a particular order or sequence is specified. For example, if step (ii) involves processing an element created in step (i), step (ii) can be considered to occur at some point after step (i). In a similar manner, if step (i) involves processing an element created in step (ii), step (ii) can be considered to occur at some point before step (i).

[0051] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper", "on", "over", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the term "below" can encompass both an orientation of above and below. Moreover, the device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and, accordingly, the spatially relative descriptors used herein are to be interpreted in the context of the specific applications to which they are applied and should not be limited to the orientations depicted in the figures.

[0052] The terminology used herein is for the purpose of describing some embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be understood that the terms "for each of one or more <items>", "each of one or more <items>" and / or similar phrases, if used herein, include both single and multiple item groups, i.e., the phrase "for each of... " is used with the meaning in programming languages to refer to each item in any group of items referenced. For example, if the group of items referenced is a single item, "each" would refer only to that single item (although the dictionary definition of "each" often defines the term to refer to "each of two or more things") and would not imply that there must be at least two of the items. Similarly, the term "set" or "subset" should not be taken by itself to necessarily include multiple items - it should be understood that a set or subset can include only one member or multiple members (unless the context indicates otherwise).

[0053] The terms “comprise(s),” “comprising,” “include(s),” “including,” “contain(s),” “containing,” “have(s),” “having,” “hold(s),” and / or “holding” when used in this specification and in claims, if any, shall not be construed as specifying the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but rather to encompass the presence or addition of one or more features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used in this document, the terms “substantially,” “approximately,” “about,” and other similar terms, used by themselves, are not intended to be limiting and are understood to mean that the value is within 5% of the stated value. Thus, for example, substantially vertical can mean within ±5% of vertical. In addition, unless otherwise indicated, the terms “between,” “within,” if used in this document in reference to a numerical range, shall be understood to include the start and end values of the range. For example, between 1 and 5 should be understood to include the numbers 1, 2, 3, 4, and 5, and not just 2, 3, and 4.

[0054] Various implementations are described herein with reference to schematic cross-sectional, isometric, perspective, orthographic, and / or exploded views of illustrative depictions as idealized implementations and / or intermediate structures. As such, variations to the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances, should be expected. Thus, the implementations disclosed herein should not be construed as limited to the particular shapes of regions as illustrated, but rather, should include shapes that are determined by the limits of the region, such as the variation in the shape that results from the manufacturing. To the extent that the regions illustrated in the drawings are circular, it is understood that the regions can not be perfectly circular due to the manufacturing techniques and / or tolerances, and thus, the regions can be considered to be substantially circular. For this reason, the regions shown in the drawings can be schematic and the shapes of the regions can not reflect the actual shapes of the regions of the device, and thus, are not intended to be limiting.

[0055] As is conventional in the art, some embodiments can be described and shown in the drawings with respect to functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules can be physically implemented by an electrical circuit (or optical circuit), such as a logic circuit, a discrete component, a microprocessor, a hardwired circuit, a memory element, a wire connector, etc., which can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. In the case of blocks, units, and / or modules that are implemented by a microprocessor or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform various functions discussed herein, and can be selectively driven by firmware and / or software. It is also contemplated that each block, unit, and / or module can be implemented by dedicated hardware, or can be implemented as a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions. In addition, each block, unit, and / or module in some embodiments can be physically separated into two or more interacting and discrete blocks, units, and / or modules without departing from the scope of the disclosure. Moreover, blocks, units, and / or modules in some embodiments can be physically combined into more complex blocks, units, and / or modules without departing from the scope of the disclosure.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0057] In the following, various embodiments will be described in detail with reference to the attached drawings.

[0058] FIG. 1 A cross-sectional view of a deposition apparatus according to some embodiments is schematically illustrated. FIG. 2A A perspective view of a mask assembly in FIG. 1 according to some embodiments is schematically illustrated. FIG. 2B An exploded perspective view of a mask assembly in FIG. 2A according to some embodiments is schematically illustrated.

[0059] With reference to FIG. 1 , a deposition apparatus ED according to embodiments can comprise a chamber CB, a mask assembly MSA, a deposition source EP, and a holding member PP. The mask assembly MSA can comprise a stage STG, a mask frame MF, and a mask MK.

[0060] The chamber CB can provide an inner space, and the deposition source EP and the mask assembly MSA can be disposed at least partially in the inner space of the chamber CB, but embodiments are not limited thereto. In some cases, the chamber CB can form an enclosed space, and a deposition (or ambient) condition in the chamber CB can be set to a vacuum or a relatively low pressure, such as a pressure lower than an atmospheric pressure. The chamber CB can include at least one door (or a transfer port), and can be opened and closed by (or through) the door. The mask assembly MSA and the substrate SUB can be put into and taken out of the chamber CB through the door disposed in the chamber CB.

[0061] The chamber CB can include a bottom surface BP, a top surface, and side walls. The bottom surface BP of the chamber CB can be parallel to a plane defined by the first direction DR1 and the third direction DR3. A direction perpendicular to the bottom surface BP of the chamber CB can be parallel to the second direction DR2.

[0062] The fixing member PP can be disposed at least partially inside the chamber CB, and the fixing member PP and the deposition source EP can face each other in the third direction DR3. The substrate SUB can be closely adhered to the mask MK by the fixing member PP, but embodiments are not limited thereto. For example, the mask MK can be spaced apart from the substrate SUB, and the substrate SUB can be supported by the fixing member PP in the chamber CB. In some embodiments, the fixing member PP can include a magnet that at least partially causes the substrate SUB to be closely adhered to the mask MK, or vice versa. For example, the magnet can generate a magnetic force and / or an electrostatic force that attracts the mask MK toward the fixing member PP with the substrate SUB disposed between the mask MK and the fixing member PP. In this way, the mask MK and the substrate SUB can be closely adhered (e.g., clamped) to the fixing member PP. However, embodiments are not limited thereto, and the fixing member PP can include a mechanical arm, a clamp to hold the mask MK, etc.

[0063] The substrate SUB can be disposed between the mask MK and the fixing member PP. The substrate SUB can be an object to be processed, such as a wafer, and for this, a deposition material can be deposited on the substrate SUB. In some cases, the substrate SUB can include a support substrate, and a synthetic resin material can be disposed on the support substrate. The deposition material can include an organic light emitting material for forming a display panel DP (e.g., see FIG. 9 The deposition material EV that can be sublimated or evaporated can be sprayed toward (or distributed adjacent to) the substrate SUB through the nozzle NZ. The deposition material EV can pass through one or more mask openings OP-MK of (or in) the mask MK (also see FIG. 2B) and can be deposited on the substrate SUB. Coupling slots can be defined in the corners of the stage STG to secure the stage STG to the coupling member, which will be described in more detail later. The stage STG can be secured to the coupling member by any suitable fastener (e.g., a fastening bolt, screw, magnet, rivet, anchor, pin, clip, strap, buckle, bar, etc.) through the coupling slots.

[0064] The stage STG can include a mounting surface SE1 and a rear surface SE2 opposite the mounting surface SE1. The mounting surface SE1 and the rear surface SE2 of the stage STG can each be (or form) a plane parallel to the first direction DR1 and the second direction DR2, the second direction DR2 intersecting the first direction DR1.

[0065] Hereinafter, a direction substantially perpendicularly intersecting the plane defined by the first direction DR1 and the second direction DR2 will be defined as a third direction DR3. Furthermore, as used herein, the phrase “in plan view” can be defined as a state in which an object is observed in the third direction DR3, or a state in which the object is observed in a direction perpendicular to, for example, an upper surface of the object. In some cases, the direction perpendicular to the upper surface of the object can correspond to the third direction DR3.

[0066] Referring to FIG. 1 , FIG. 2A and FIG. 2B In the chamber CB, the stage STG can be disposed between the deposition source EP and the fixation member PP. In the chamber CB, the stage STG can be disposed in a movement path of the deposition material EV supplied from the deposition source EP toward the substrate SUB. In this way, the position and / or orientation of the fixation member PP can be controlled before, during, and / or after one or more deposition processes.

[0067] The mounting surface SE1 and the rear surface SE2 of the stage STG can be disposed (or arranged) substantially perpendicular to the bottom surface BP of the chamber CB, although embodiments are not limited thereto. Thus, the deposition process can be performed when the rear surface of each of the mask MK and the mask frame MF disposed on the mounting surface SE1 of the stage STG is substantially perpendicular to the bottom surface BP of the chamber CB. Accordingly, it can be possible to prevent (or at least mitigate) a mask MK having a relatively large area from sagging in a vertical deposition process due to gravity. In turn, this can not only improve the reliability of the deposition process, but also increase the throughput and productivity with more consistent and repeatable results.

[0068] However, implementations are not limited thereto. According to some implementations, the mounting surface SE1 and the rear surface SE2 of the stage STG can be disposed substantially parallel to the bottom surface BP of the chamber CB, and the rear surface of each of the mask frame MF and the mask MK can be disposed substantially parallel to the bottom surface BP of the chamber CB. However, it is conceivable that, in some deposition scenarios, the mounting surface SE1 and the rear surface SE2 of the stage STG and the substrate SUB and the mask assembly MSA disposed on the substrate SUB can be angled with respect to the bottom surface BP of the chamber CB.

[0069] In a view perpendicular to the rear surface SE2, the stage STG can have a quadrilateral frame shape with at least one short side extending in the first direction DR1 and at least one long side extending in the second direction DR2, but implementations are not limited thereto. For example, the stage STG can have any suitable shape such as a circular shape, a triangular shape, a pentagonal shape, a hexagonal shape, and the like. In some cases, the stage STG can assume a freeform shape. The stage opening OP-ST can be defined in the stage STG having, for example, a quadrilateral frame shape. The stage opening OP-ST can have a quadrilateral shape in a view perpendicular to the rear surface SE2, but implementations are not limited thereto. For example, the stage opening OP-ST can have any suitable shape that can be similar to or different from the shape of the stage STG. For convenience hereinafter, the shape of the stage STG and the stage opening OP-ST will be assumed to be quadrilateral.

[0070] Hereinafter, the mounting surface SE1 of the stage STG will be referred to as the upper surface SE1 of the stage STG, and the rear surface SE2 of the stage STG will be referred to as the lower surface SE2 of the stage STG.

[0071] The mask frame MF can be disposed on the upper surface SE1 of the stage STG. A lower surface of the mask frame MF can be disposed on the upper surface SE1 of the stage STG. The stage STG can support the mask frame MF.

[0072] As an example, the edges of the mask frame MF can be disposed inwardly of the edges of the stage STG. In a plan view, the area of the mask frame MF can be less than the area of the stage STG.

[0073] In a view perpendicular to the upper surface of the mask frame MF, the mask frame MF can have a quadrilateral frame shape with at least one short side extending in the first direction DR1 and at least one long side extending in the second direction DR2. However, it is conceivable that the mask frame MF can have any other suitable shape that can be similar to or different from the shape of the stage STG. A frame opening OP-MF can be defined in the mask frame MF having the quadrilateral frame shape. The frame opening OP-MF can have a quadrilateral shape in a view perpendicular to the upper surface of the mask frame MF, but can utilize any other shape. The frame opening OP-MF can overlap with the stage opening OP-ST. In some cases, a central axis of the frame opening OP-MF extending in, for example, the third direction DR3 can be axially aligned with a central axis of the stage opening OP-ST. Further, the frame opening OP-MF and the stage opening OP-ST can be continuously defined in the third direction DR3.

[0074] The first grooves GR1 arranged (e.g., spaced apart from each other) in the second direction DR2 and the second grooves GR2 arranged in the first direction DR1 can be defined (or formed) in the upper surface of the mask frame MF. In a plan view, the first grooves GR1 can be arranged along the long sides of the mask frame MF defining the frame opening OP-MF. In a plan view, the second grooves GR2 can be arranged along the short sides of the mask frame MF defining the frame opening OP-MF. In some cases, the first ends of the first grooves GR1 and the first ends of the second grooves GR2 can extend to the frame opening OP-MF and, thereby, can be in fluid connection with the frame opening OP-MF (see also FIG. 3 、 FIG. 4A 、 FIG. 4B 、 FIG. 6A 、 FIG. 7A and FIG. 7B ). The second ends of the first grooves GR1 and the second ends of the second grooves GR2 can be spaced apart from the respective outer boundaries of the mask frame MF, but embodiments are not limited thereto. The distance between the first grooves GR1 adjacent to each other in the second direction DR2 can be the same as each other. The distance between the second grooves GR2 adjacent to each other in the first direction DR1 can be the same as each other. However, in some cases, at least one of the distances between the adjacent first grooves GR1 and / or at least one of the distances between the adjacent second grooves GR2 can be different.

[0075] The mask frame MF can have a defined or selected stiffness. For example, the mask frame MF can include metallic materials such as stainless steel (SUS), Invar alloy (FeNi36), nickel (Ni), cobalt (Co), etc., or any suitable combination thereof. In some cases, the mask frame MF may also include a protective coating that can prevent or at least reduce the possibility of arcing, residue buildup, corrosion, etching, wear, peeling, etc. It is also conceivable that the coating can increase the lifespan of the mask frame MF by increasing, for example, the ability to clean and reuse the mask frame MF. In some implementations, the coating may be formed on the mask frame MF as part of the initial exposure to one or more process gases (such as at least one of nitrogen, oxygen, argon, hydrogen, etc.).

[0076] The mask assembly MSA may also include rods ST. Rods ST may include a first rod ST1 and a second rod ST2. The first rod ST1 may be disposed on the upper surface of the mask frame MF. The first rod ST1 may be arranged in a second direction DR2 and extend in a first direction DR1. The first rod ST1 may span the frame opening OP-MF. The central portion of the first rod ST1 may overlap with the frame opening OP-MF. The two opposite sides of each of the first rods ST1 in the first direction DR1 may be at least partially disposed in the first slot GR1.

[0077] The second rod ST2 can be set on top of the first rod ST1. The second rod ST2 can intersect with the first rod ST1. As an example, the second rod ST2 can be set (e.g., directly on top of).

[0078] The first rod ST1 is located on the first rod. However, the implementation is not limited to this, and the first rod ST1 may be located on the second rod ST2. It is also conceivable that the second rod ST2 may be spaced apart from the first rod ST1 on a third-direction DR3.

[0079] The second rod ST2 can be arranged on the first direction DR1 and extend on the second direction DR2. As an example, the length of each of the second rods ST2 on the second direction DR2 can be greater than the length of each of the first rods ST1 on the first direction DR1. The second rod ST2 can span the frame opening OP-MF. The central portion of the second rod ST2 can overlap with the frame opening OP-MF. The two opposite sides of each of the second rods ST2 on the second direction DR2 can be at least partially disposed in the second slot GR2.

[0080] The first rod ST1 and the second rod ST2 may comprise non-magnetic materials. For example, the first rod ST1 and the second rod ST2 may comprise aluminum. However, this is merely an example, and the materials of the first rod ST1 and the second rod ST2 are not limited thereto. Similar to the mask frame MF, the first rod ST1 and the second rod ST2 may comprise a protective coating formed thereon.

[0081] The masks MK can be disposed on the upper surface of the mask frame MF. The masks MK can extend in the first direction DR1 and can be arranged in the second direction DR2. In a plan view, the masks MK can each have a rectangular shape with a long side extending in the first direction DR1 and a short side extending in the second direction DR2. However, it is conceivable that any other suitable shape can be used for the masks MK.

[0082] Opposite sides of each of the masks MK can be connected to (and / or supported by) the mask frame MF. The masks MK can be stretched to cover the frame openings OP-MF. As an example, the masks MK can be stretched in the first direction DR1 due to a force acting in the first direction DR1 and in a direction opposite to the first direction DR1. The stretched masks MK can be connected to the mask frame MF by, for example, laser welding, however, any other suitable technique such as electron beam welding, pulsed arc welding, ultrasonic welding, spot welding, friction stir welding, etc. can be utilized.

[0083] The masks MK can be disposed on the first stems ST1 and the second stems ST2. The first stems ST1 and the second stems ST2 can prevent (or at least reduce the likelihood of) the masks MK from being separated from the mask frame MF. For example, the first stems ST1 and the second stems ST2 can act as supports for the masks MK.

[0084] The masks MK can comprise a metal. For example, the masks MK can be defined as fine metal masks. Similar to the mask frame MF, the masks MK can comprise a protective coating.

[0085] The cell areas CEA and the non-cell areas NCE can be defined on (or in) the upper surface of the masks MK. As an example, the cell areas CEA can have a rectangular shape with a long side in the first direction DR1 and a short side in the second direction DR2. However, the shape of the cell areas CEA is not limited thereto. The non-cell areas NCE can be portions of the masks MK other than the cell areas CEA. The non-cell areas NCE can surround the cell areas CEA in a plan view.

[0086] The cell areas CEA can be arranged in the first direction DR1. As an example, five cell areas CEA are arranged in the first direction DR1 on the upper surface of each of the masks MK, but the number of cell areas CEA is not limited thereto. For example, one or more masks MK can comprise fewer than five cell areas CEA, or can comprise six or more cell areas CEA.

[0087] The element region CEA can overlap with the frame opening OP-MF in the assembled state of the mask assembly MSA. The element region CEA may not overlap with the mask frame MF. The first rod ST1 and the second rod ST2 may not overlap with the element region CEA. The first rod ST1 and the second rod ST2 may overlap with the surrounding area NCE.

[0088] The mask opening OP-MK can be defined within the cell region CEA. The mask opening OP-MK can be arranged in the first direction DR1 and the second direction DR2. For example, the mask opening OP-MK can be arranged in a matrix; however, any other suitable arrangement can be utilized. In a plan view, the mask opening OP-MK can overlap with the frame opening OP-MF in the assembled state of the mask assembly MSA. The stage opening OP-ST, the frame opening OP-MF, and the mask opening OP-MK can be continuously defined in the third direction DR3 in the assembled state of the mask assembly MSA. Therefore, as... FIG. 1 As shown, the deposited material EV can pass through the stage opening OP-ST, the frame opening OP-MF, and the mask opening OP-MK, and can be deposited on the substrate SUB, such as deposited on the substrate SUB according to the pattern of the mask opening OP-MK.

[0089] refer to FIG. 1 The deposition source EP can be located inside the chamber CB and can face the fixed member PP on the third-direction DR3. The deposition source EP may include a storage chamber containing the deposition material EV and at least one nozzle NZ. In some cases, the deposition material EV can be remotely stored and supplied to the deposition source EP via one or more conduits fluidly connected to the deposition source EP. The deposition material EV may include at least one of metallic, organic, and inorganic materials. The deposition material EV may flow into the pressurized chamber volume defined by the chamber CB in a sublimated or evaporated state. In some cases, the deposition source EP may be configured to sublimate or evaporate the deposition material EV, and / or the deposition material may flow into the deposition source EP in a sublimated or evaporated state. In some cases, the sublimated or evaporated deposition material EV may be entrained in one or more gases (such as one or more process gases, dilution gases, carrier gases, etc.). According to some implementations, the deposition material EV may include materials for forming a light-emitting layer EML (e.g., see...). FIG. 10 The organic light-emitting material (EV) is used. Therefore, the sublimated or evaporated deposited material EV can be ejected (or flowed in the direction of the substrate SUB) through the nozzle NZ. In some cases, the flow of the deposited material EV can be additionally or optionally controlled via one or more vents in the chamber CB. In either case, the deposited material EV can pass through the mask opening OP-MK in the mask MK and can be deposited on the substrate SUB in a pattern corresponding to the pattern of the mask opening OP-MK.

[0090] In addition to the above configuration, the deposition apparatus ED can further include additional mechanical devices to realize an internal linkage system. The deposition apparatus ED according to some embodiments can further include a coupling member. The coupling member can be fixed to one or more side walls of the chamber CB, and the stage STG can be connected to (and / or supported by) the coupling member and stably fixed inside the chamber CB. Thus, even if the stage STG is vertically disposed, the deposition process can be stably performed.

[0091] The deposition apparatus ED according to some embodiments can further include an alignment device. The alignment device can adjust the positions of the stage STG and the mask frame MF relative to each other and / or relative to, for example, the bottom surface BP of the chamber CB. Thus, in the case where the deposition material EV flows through the stage opening OP-ST of the stage STG and the frame opening OP-MF of the mask frame MF and is deposited on the substrate SUB, the occurrence of defects can be prevented (or mitigated).

[0092] FIG. 3 schematically shows a perspective view of the mask assembly in the deposition apparatus ED according to some embodiments. FIG. 2A schematically shows an orthogonal view of the stage and the mask frame of the mask assembly in the deposition apparatus ED according to some embodiments. FIG. 4A schematically shows a perspective view of the mask frame in the deposition apparatus ED according to some embodiments. FIG. 3 schematically shows a perspective view of the mask frame in the deposition apparatus ED according to some embodiments. FIG. 4B schematically shows an orthogonal view of the lower surface of the mask frame in the deposition apparatus ED according to some embodiments. FIG. 4A schematically shows an orthogonal view of the lower surface of the mask frame in the deposition apparatus ED according to some embodiments. FIG. 4C schematically shows a perspective detail view of the first area AA1 in the deposition apparatus ED according to some embodiments. FIG. 4A schematically shows a cross-sectional view of the mask assembly in the deposition apparatus ED according to some embodiments, taken along the section line II-II'. FIG. 5A schematically shows a cross-sectional view of the mask assembly in the deposition apparatus ED according to some embodiments, taken along the section line I-I'. FIG. 4C schematically shows a cross-sectional view of the mask assembly in the deposition apparatus ED according to some embodiments, taken along the section line I-I'. FIG. 5B schematically shows a cross-sectional view of the stage and the mask frame in the deposition apparatus ED according to some embodiments, taken along the section line I-I'. FIG. 3 schematically shows a cross-sectional view of the stage and the mask frame in the deposition apparatus ED according to some embodiments, taken along the section line I-I'.

[0093] As an example, FIG. 4A to FIG. 4C shows the mask frame MF shown in the deposition apparatus ED in a vertically inverted orientation, such that the lower surface of the mask frame MF faces upward. FIG. 3 As an example,

[0094] As an example, FIG. 5A and FIG. 5B shows cross-sectional views of the (2-1)th surface PL2-1 and the (3-1)th surface PL3-1, but the cross sections of the (2-3)th surface PL2-3 and the (3-2)th surface PL3-2 can have substantially the same shape as the cross sections of the (2-1)th surface PL2-1 and the (3-1)th surface PL3-1.

[0095] FIG. 5A and FIG. 5A the first and second trenches GR1 and GR2 depicted in FIG. 5A are identical to the first and second trenches GR1 and GR2 depicted in

[0096] With reference to FIG. 5B , FIG. 1 and FIG. 1 , the mask frame MF can comprise a first portion PT1 and a second portion PT2. The second portion PT2 can be disposed on (and / or extend from) an upper surface MF-U1 of the first portion PT1. A side of the second portion PT2 opposite to another side of the second portion PT2 in the first direction DR1 can protrude further towards the frame opening OP-MF than a side of the first portion PT1 opposite to another side of the first portion PT1 in the first direction DR1. The side of the second portion PT2 in FIG. 2B is shown in connection with the second opening OP2, which will be described later. The side of the first portion PT1 opposite to another side of the first portion PT1 in the first direction DR1 can be an inner side delimiting at least a portion of the frame opening OP-MF. The side of the first portion PT1 in FIG. 2B is shown in connection with the first opening OP1, which will be described later. Similarly, the aforementioned side of the second portion PT2 can be an inner side delimiting at least another portion of the frame opening OP-MF.

[0097] At least one side of the first portion PT1 can be an inclined surface. As shown in FIG. 3 and FIG. 4A , only one side of the first portion PT1 is an inclined surface. The sides of the second portion PT2 opposite to each other in the first direction DR1 and the other sides can each be an inclined surface. The side of the first portion PT1 and the side of the second portion PT2 can each have an inclined surface, and for this, once the deposition material EV (see FIG. 4B ) passes through the stage opening OP-ST, a portion of the deposition material EV can be deposited on the substrate SUB (see FIG. 4B ) according to a projection of the inclined surface of the side of the second portion PT2 on the substrate SUB.

[0098] The frame opening OP-MF can include a first opening OP1 and a second opening OP2. A side of the first portion PT1 can define or bound at least a portion of the first opening OP1. A side of the second portion PT2 can define or bound at least a portion of the second opening OP2. The first opening OP1 and the second opening OP2 can be continuous in the third direction DR3. For example, as part of at least one stage of deposition, the first opening OP1 can be in fluid connection with the second opening OP2 to enable the flow of deposition material EV through the frame opening OP-MF. An area of the first opening OP1 in a plane parallel to a plane defined by the first direction DR1 and the second direction DR2 can be greater than a corresponding area of the second opening OP2.

[0099] The first groove GR1 and the second groove GR2 can be formed in the upper surface MF-U2 of the second portion PT2. The first groove GR1 can be arranged along the second direction DR2. The second groove GR2 can be arranged along the first direction DR1. The first stem ST1 (see FIG. 4C ) can be disposed at least partially in the first groove GR1. The second stem ST2 (see FIG. 5A ) can be disposed at least partially in the second groove GR2.

[0100] Referring to FIG. 5B , FIG. 4C and FIG. 5A , the lower surface MF-B of the first portion PT1 can include a first surface PL1, a second surface PL2 and a third surface PL3. The first surface PL1 can be defined as a portion of the lower surface corresponding to an inner edge of the first portion PT1 that bounds at least a portion of the first opening OP1. The first surface PL1 can be adjacent to the first opening OP1. In a plan view, the first surface PL1 can surround the frame opening OP-MF. In a plan view, the first surface PL1 can surround the second portion PT2.

[0101] Referring to FIG. 5B , FIG. 4A to FIG. 4C , FIG. 4C and FIG. 4C , the second surface PL2 can be disposed further outward (relative to the frame opening OP-MF) than the first surface PL1. The second surface PL2 can be defined as a portion of the lower surface corresponding to an outer edge of the mask frame MF. The second surface PL2 can include a (2-1)st surface PL2-1, a (2-2)nd surface PL2-2 and a (2-3)rd surface PL2-3.

[0102] Each of the (2-1) surfaces PL2-1 can be defined as a lower surface corresponding to an edge extending along a long side of the mask frame MF. The (2-1) surfaces PL2-1 can be adjacent to the long side of the mask frame MF. The (2-1) surfaces PL2-1 can extend in the second direction DR2 along the long side of the mask frame MF. The (2-1) surfaces PL2-1 can be disposed further outward (relative to the frame opening OP-MF) than the first surface PL1.

[0103] As depicted in the lower surface MF-B of the first portion PT1 facing upward FIG. 2A and FIG. 2B As shown in (2-1) surfaces PL2-1 can be disposed lower than the first surface PL1 in a direction opposite to the third direction DR3. As an example, a first distance L1 defined as a difference between a height of each of the (2-1) surfaces PL2-1 and a height of the first surface PL1 can be about 0.05 mm to about 0.15 mm.

[0104] As depicted in the lower surface MF-B of the first portion PT1 facing upward FIG. 4C As shown in (2-1) surfaces PL2-1 can be disposed lower than the first surface PL1 in a direction opposite to the third direction DR3. As an example, a first distance L1 defined as a difference between a height of each of the (2-1) surfaces PL2-1 and a height of the first surface PL1 can be about 0.05 mm to about 0.15 mm.

[0105] Referring to FIG. 5B Each of the (2-2) surfaces PL2-2 can be defined as a lower surface of the first portion PT1 adjacent to a corner of the mask frame MF. The (2-2) surfaces PL2-2 can be adjacent to an outer corner of the mask frame MF. The (2-2) surfaces PL2-2 can each be a flat surface parallel to a plane defined by the first direction DR1 and the second direction DR2. As an example, in a plan view, the (2-2) surfaces PL2-2 can each have a quadrilateral shape, but embodiments are not limited thereto.

[0106] As depicted in the lower surface MF-B of the first portion PT1 facing upward FIG. 1 As shown in (2-1) surfaces PL2-1 can be disposed lower than the first surface PL1 in a direction opposite to the third direction DR3. As an example, a first distance L1 defined as a difference between a height of each of the (2-1) surfaces PL2-1 and a height of the first surface PL1 can be about 0.05 mm to about 0.15 mm.

[0107] Although not shown, in a case where the lower surface MF-B of the first portion PT1 faces the upper surface SE1 of the stage STG, the height of the (2-2)th surface PL2-2 can be greater than the height of the first surface PL1. For example, the (2-2)th surface PL2-2 can be further away from the upper surface SE1 of the stage STG in the third direction DR3 than the first surface PL1. Thus, the first surface PL1 can be disposed on the upper surface SE1 of the stage STG, and the (2-2)th surface PL2-2 can be spaced apart from the upper surface SE1 of the stage STG by, for example, the first distance L1.

[0108] Each of the (2-3)th surfaces PL2-3 can be defined as a lower surface corresponding to an edge extending along a short side of the mask frame MF. The (2-3)th surfaces PL2-3 can be adjacent to the short side of the mask frame MF. The (2-3)th surfaces PL2-3 can extend in the first direction DR1 along the short side of the mask frame MF. The (2-3)th surfaces PL2-3 can be disposed further outward (relative to the frame opening OP-MF) than the first surface PL1.

[0109] As depicted in FIG. 2A, the lower surface MF-B of the first portion PT1 faces upward FIG. 1 As shown in FIG. 2B, the (2-3)th surfaces PL2-3 can be disposed lower than the first surface PL1. The height of each of the (2-3)th surfaces PL2-3 from the upper surface MF-U1 of the first portion PT1 can be substantially the same as the respective heights of the (2-1)th surface PL2-1 and the (2-2)th surface PL2-2. For example, the difference between the height of each of the (2-3)th surfaces PL2-3 in the third direction DR3 and the height of the first surface PL1 in the third direction DR3 can be about 0.05 mm to about 0.15 mm.

[0110] Although not shown, in a case where the lower surface MF-B of the first portion PT1 faces the upper surface SE1 of the stage STG, the height of the (2-3)th surface PL2-3 can be greater than the height of the first surface PL1. For example, the (2-3)th surface PL2-3 can be further away from the upper surface SE1 of the stage STG in the third direction DR3 than the first surface PL1. Thus, the first surface PL1 can be disposed on the upper surface SE1 of the stage STG, and the (2-3)th surface PL2-3 can be spaced apart from the upper surface SE1 of the stage STG by, for example, the first distance L1.

[0111] Reference is made to FIG. 1 , FIG. 1 , FIG. 4B to FIG. 5B and FIG. 4CIn a case where the mask MK is stretched, the mask MK can have a characteristic of returning to a shape before the stretching, for example, the mask MK can be elastically deformed in response to the stretching. Thus, the mask MK can have a characteristic of recovering in a direction opposite to a direction in which the mask MK is stretched in response to the applied stretching force being removed.

[0112] The mask MK connected to the mask frame MF can apply a restoring force to the mask frame MF. Thus, the mask frame MF can be deformed. As an example, a long side of the mask frame MF can be concavely bent toward the frame opening OP-MF. The deformed mask frame MF can have a characteristic of returning to a shape before the deformation, for example, the mask frame MF can be elastically deformed in response to the restoring force applied to the mask frame MF by the mask MK.

[0113] In a case where the mask frame MF recovers, a frictional force can be generated between the upper surface SE1 of the stage STG and a lower surface of the mask frame MF, such as the first surface PL1 of the mask frame MF. The frictional force can be proportional to a contact area between the upper surface SE1 of the stage STG and the lower surface of the mask frame MF, for example, the first surface PL1 of the mask frame MF. A direction of the frictional force acting on the mask frame MF and a direction of the mask frame MF recovering can be opposite to each other.

[0114] As the contact area between the lower surface of the mask frame MF and the upper surface SE1 of the stage STG increases, the frictional force acting between the lower surface of the mask frame MF and the upper surface SE1 of the stage STG can become relatively large, and thus, the mask frame MF can not completely recover to its shape before the deformation. Thus, the mask MK connected to the mask frame MF can not maintain the stretched state, and each shape of the mask openings OP-MK in the cell area CEA can be deformed. This can at least partially cause one or more defects to occur in a case where the deposition material EV (see FIG. 2B ) is deposited on the substrate SUB (see FIG. 5A ).

[0115] However, according to some embodiments including the mask frame MF disposed on the stage STG, the height of the second surface PL2 can be greater than the height of the first surface PL1. For example, a step can exist between the first surface PL1 and the second surface PL2.

[0116] Because the height of the second surface PL2 can be greater than the height of the first surface PL1, the first surface PL1 can be disposed on the upper surface SE1 of the stage STG, and the second surface PL2 can be spaced apart from the upper surface SE1 of the stage STG. Accordingly, the contact area between the upper surface SE1 of the stage STG and the lower surface (e.g., the first surface PL1) of the mask frame MF can be reduced. Accordingly, the frictional force generated between the upper surface SE1 of the stage STG and the lower surface (e.g., the first surface PL1) of the mask frame MF can be reduced, and the mask frame MF can thus easily recover to its original shape. Accordingly, the mask MK connected to the mask frame MF can maintain a stretched state, thereby preventing or at least reducing the possibility of one or more defects occurring in the case where the deposition material EV (see FIG. 5B ) is deposited on the substrate SUB (see FIG. 6A ).

[0117] Referring to FIG. 6B , in a plan view, the third surface PL3 can surround the first surface PL1. The third surface PL3 can be disposed further outward (with respect to the frame opening OP-MF) than the first surface PL1. The third surface PL3 can be disposed further inward (with respect to the frame opening OP-MF) than the second surface PL2. For example, the third surface PL3 can be disposed between the first surface PL1 and the second surface PL2.

[0118] As shown in FIG. 6B , the stem groove SGR can be defined in the lower surface MF-B of the first portion PT1. In some embodiments, the mask assembly MSA( FIG. 6A ) can further include an auxiliary stem, and the auxiliary stem can be at least partially disposed in the stem groove SGR.

[0119] The third surface PL3 can be defined as a bottom surface of the stem groove SGR. The auxiliary stem can be disposed between the third surface PL3 and the upper surface SE1 of the stage STG. The auxiliary stem can be omitted.

[0120] As shown in FIG. 6A , in the case where the lower surface MF-B of the first portion PT1 is disposed to face upward, the third surface PL3 can be disposed lower than the second surface PL2 with respect to the first surface PL1. Although not shown, in the case where the lower surface MF-B of the first portion PT1 faces the upper surface SE1 of the stage STG, the height of the third surface PL3 can be greater than the height of the second surface PL2 in terms of the distance from the upper surface SE1 of the stage STG.

[0121] The third surface PL3 can include a first (3-1) surface PL3-1 and a second (3-2) surface PL3-2. The first (3-1) surface PL3-1 can be disposed between the first surface PL1 and the second (2-1) surface PL2-1 in the first direction DR1.

[0122] The first (3-1) surface PL3-1 can extend in the second direction DR2 along the long side of the mask frame MF. The first (3-1) surface PL3-1 can extend from a first side of the mask frame MF to a second side of the mask frame MF, the first and second sides can be opposite each other in the second direction DR2. In a plan view, the first (3-1) surface PL3-1 can be disposed between the first surface PL1 and the second (2-1) surface PL2-1. Opposite ends of each of the first (3-1) surface PL3-1, which are opposite each other in the second direction DR2, can pass between the second (2-2) surface PL2-2 and the third (2-3) surface PL2-3 in a plan view.

[0123] The second (3-2) surface PL3-2 can extend in the first direction DR1 along the short side of the mask frame MF. The second (3-2) surface PL3-2 can extend from a third side of the mask frame MF to a fourth side of the mask frame MF, the third and fourth sides can be opposite each other in the first direction DR1. In a plan view, the second (3-2) surface PL3-2 can be disposed between the first surface PL1 and the third (2-3) surface PL2-3 in the second direction DR2. Opposite ends of each of the second (3-2) surface PL3-2, which are opposite each other in the first direction DR1, can pass between the first (2-1) surface PL2-1 and the second (2-2) surface PL2-2. In a plan view, the first (3-1) surface PL3-1 and the second (3-2) surface PL3-2 can cross each other.

[0124] Reference FIG. 6B The stage STG can be disposed on a lower surface (e.g., the first surface PL1) of the mask frame MF. The pneumatic opening AOP can be defined in the stage STG according to some embodiments. The pneumatic opening AOP can overlap the first surface PL1 in the third direction DR3.

[0125] Although not shown, air can be introduced into the pneumatic opening AOP through an external device connected to the stage STG. The air introduced through the pneumatic opening AOP can be blown toward the mask frame MF. The air can apply pressure to the first surface PL1 in the third direction DR3. The air pressure can be applied to the mask frame MF in a direction opposite to the direction of gravity. Accordingly, frictional force generated between the stage STG and the mask frame MF can be reduced. However, this is an example, and the pneumatic opening AOP can be omitted according to some embodiments.

[0126] Although not shown, because the second surface PL2 can be spaced apart from the upper surface SE1 of the stage STG, air can flow between the second surface PL2 and the upper surface SE1 of the stage STG. Thus, air can also exert a pressure on the second surface PL2.

[0127] FIG. 6A and FIG. 6B A perspective view and a partial perspective detail view of a lower surface of a mask frame according to some embodiments are schematically shown. As an example, FIG. 4C is FIG. 3 a magnified perspective view of a second region AA2 in

[0128] As an example, FIG. 6A and FIG. 6B A mask frame MFa is shown in a vertically inverted orientation, such that a lower surface (e.g., a first surface PL1a) of the mask frame MFa faces upward.

[0129] Because FIG. 2A and FIG. 2B the third surface PL3, the (2-2)nd surface PL2-2, the frame opening OP-MF, the second portion PT2, the first groove GR1, and the second groove GR2 in FIG. 6B are identical to the third surface PL3, the (2-2)nd surface PL2-2, the frame opening OP-MF, and the second portion PT2 in FIG. 2A and the first groove GR1 and the second groove GR2 in

[0130] Referring to FIG. 2B and FIG. 2A , the lower surface MF-Ba of the first portion PT1a can include the first surface PL1a, the (2-2)nd surface PL2-2, and the third surface PL3. The first surface PL1a can include a (1-1)st surface PL1-1, a (1-2)nd surface PL1-2, and a (1-3)rd surface PL1-3.

[0131] The (1-1)st surface PL1-1 can be adjacent to a first opening OP1 forming or at least partially bounding a portion of the frame opening OP-MF. The (1-1)st surface PL1-1 can be defined as a portion of the lower surface corresponding to an inner edge of the first portion PT1a defining (or at least partially bounding) the first opening OP1.

[0132] The (1-1)th surface PL1-1 can be adjacent to the first opening OP1. The (1-1)th surface PL1-1 can be defined as a lower surface of a portion corresponding to an inner edge of the first opening OP1 defined (or at least partially delimited) by the first portion PT1a. In a plan view, the (1-1)th surface PL1-1 can surround the second portion PT2. In a plan view, the (1-1)th surface PL1-1 can surround the first opening OP1.

[0133] The (1-2)th surface PL1-2 can be adjacent to a long side of the mask frame MFa. The (1-2)th surface PL1-2 can be defined as a lower surface of an edge of the first portion PT1a extending along the long side of the mask frame MFa. The (1-2)th surface PL1-2 can extend in the second direction DR2 along the long side of the mask frame MFa.

[0134] The (1-3)th surface PL1-3 can be adjacent to a short side of the mask frame MFa. The (1-3)th surface PL1-3 can be defined as a lower surface of an edge of the first portion PT1a extending along the short side of the mask frame MFa. The (1-3)th surface PL1-3 can extend in the first direction DR1 along the short side of the mask frame MFa.

[0135] The (1-1)th surface PL1-1, the (1-2)th surface PL1-2, and the (1-3)th surface PL1-3 can have the same height with respect to the upper surface of the mask frame MFa. Although not shown, in a case where the mask frame MFa is disposed on the upper surface SE1 of the stage STG in FIG. 2B and FIG. 2B The (1-1)th surface PL1-1, the (1-2)th surface PL1-2, and the (1-3)th surface PL1-3 can be disposed on the upper surface SE1 of the stage STG.

[0136] The (2-2)th surface PL2-2 can be defined as a lower surface of the first portion PT1a adjacent to a corner of the mask frame MFa. The (2-2)th surface PL2-2 can be adjacent to the corner of the mask frame MFa.

[0137] As shown in FIG. 2A , in a case where the lower surface MF-Ba of the first portion PT1a is disposed to face upward, the (2-2)th surface PL2-2 can be disposed lower than the first surface PL1a with respect to the upper surface of the mask frame MFa. In a case where the lower surface MF-Ba of the first portion PT1a is disposed on the upper surface SE1 of the stage STG (see FIG. 2B and FIG. 2AIn the case of the first surface PL1a, the height of the second surface PL2-2 can be greater than that of the first surface PL1a relative to the distance from the upper surface SE1 of the STG. Therefore, the first surface PL1a can be set on the upper surface SE1 of the STG (see...). FIG. 2B and FIG. 2A ) on, and the (2-2)th surface PL2-2 can be connected to the upper surface SE1 of the STG (see FIG. 2B () are separated.

[0138] In the possibility of passing through mask MK (see FIG. 2A and FIG. 2B In the case where the deformed mask frame MFa returns to its original shape, the lower surface of the mask frame MFa and the upper surface SE1 of the stage STG (see...) FIG. 1 and FIG. 1 Frictional forces may be generated between them. The frictional force can be at its maximum on the lower surface of the portion adjacent to the corner of the mask frame MFa (e.g., in the portion corresponding to surface PL2-2 of the (2-2)th surface).

[0139] Because surface PL2-2 (2-2) can be adjacent to the corner of mask frame MFa, the corner of mask frame MFa and the upper surface SE1 of STG (see...) FIG. 7A and FIG. 7B The two surfaces can be spaced apart from each other. Therefore, the lower surface of the mask frame MFa and the upper surface SE1 of the stage STG (see...) FIG. 7C and FIG. 7B The frictional forces generated between the elements can be reduced. Therefore, the mask frame MFa can be easily restored, and frictional forces can be prevented (or at least mitigated) in the deposited material EV (see [link to documentation]). FIG. 7A Deposited on substrate SUB (see FIG. 7C Defects occur in cases involving ( ).

[0140] The (3-1) surface PL3-1 can be disposed on the first direction DR1 between the (1-1) surface PL1-1 and the (1-2) surface PL1-2. The opposite ends of each of the (3-1) surfaces PL3-1 on the second direction DR2 can be disposed between the (2-2) surface PL2-2 and the (1-3) surface PL1-3.

[0141] The (3-2) surface PL3-2 can be disposed on the second direction DR2 between the (1-1) surface PL1-1 and the (1-3) surface PL1-3. The opposite ends of each of the (3-2) surfaces PL3-2 that are opposite to each other on the first direction DR1 can be disposed between the (2-2) surface PL2-2 and the (1-2) surface PL1-2.

[0142] FIG. 2A, FIG. 2B and FIG. 7A A perspective view, partial perspective detail view, and cross-sectional view of a mask frame according to some embodiments are schematically shown. As an example, FIG. 7B yes FIG. 7A to FIG. 7C A magnified stereoscopic view of the third region AA3 in the image, and FIG. 6B It is based on some implementation methods and is set in the STG on the platform (see FIG. 2A and FIG. 7A to FIG. 7C A cross-sectional view of the mask frame MFb on the ), wherein the section of the mask frame MFb is cut along section line III-III'.

[0143] As an example, FIG. 6B and FIG. 7B A mask frame MFb is shown in a vertically inverted orientation, with the lower surface MF-Bb of the mask frame MFb facing upwards.

[0144] Because FIG. 7C The (1-1)th surface PL1-1, the (1-2)th surface PL1-2, the (1-3)th surface PL1-3, the second part PT2, the frame opening OP-MF, and the stage STG are all located in the center. FIG. 7B The (1-1)th surface PL1-1, the (1-2)th surface PL1-2, the (1-3)th surface PL1-3, the second part PT2, the frame opening OP-MF, and FIG. 6B The STGs in the text are the same, so they will be omitted or briefly repeated.

[0145] refer to FIG. 7B The lower surface MF-Bb of the first part PT1b may include a first surface PL1a, a second surface PL2a and a third surface PL3a.

[0146] Because the first surface PL1a and FIG. 6B The first surface PL1a is essentially the same, so repeated descriptions of the first surface PL1a will be omitted.

[0147] The second surface PL2a may be adjacent to the corner of the mask frame MFb. The second surface PL2a may be defined as the lower surface of the first portion PT1b adjacent to the corner of the mask frame MFb.

[0148] like FIG. 7C As shown, when the lower surface MF-Bb of the first part PT1b is set to face upwards, the height of the second surface PL2a relative to the upper surface of the mask frame MFb can be less than the height of the first surface PL1a. FIG. 7CAs shown in FIG. 1, in a case where the mask frame MFb is disposed on the stage STG, the height of the second surface PL2a can be greater than the height of the (1-1)th surface PL1-1, for example, the second surface PL2a can be disposed further away from the upper surface SE1 of the stage STG than the (1-1)th surface PL1-1. Thus, the second surface PL2a can not be in contact with the upper surface SE1 of the stage STG.

[0149] The third surface PL3a can include a (3-1)th surface PL3-1a and a (3-2)th surface PL3-2a. The (3-1)th surface PL3-1a can be disposed between the (1-1)th surface PL1-1 and the (1-2)th surface PL1-2 in the first direction DR1. The (3-1)th surface PL3-1a can be disposed between second surfaces PL2a adjacent to each other in the second direction DR2. In a plan view, the (3-1)th surface PL3-1a can extend between second surfaces PL2a adjacent to each other in the second direction DR2 in the second direction DR2. The sum of the length of the (3-1)th surface PL3-1a in the first direction DR1 and the length of the (1-2)th surface PL1-2 in the first direction DR1 can be the same as the length of the second surface PL2a in the first direction DR1, but the embodiments are not limited thereto.

[0150] The (3-2)th surface PL3-2a can be disposed between the (1-1)th surface PL1-1 and the (1-3)th surface PL1-3 in the second direction DR2. The (3-2)th surface PL3-2a can be disposed between second surfaces PL2a adjacent to each other in the first direction DR1. In a plan view, the (3-2)th surface PL3-2a can extend between second surfaces PL2a adjacent to each other in the first direction DR1 in the first direction DR1. The sum of the length of the (3-2)th surface PL3-2a in the second direction DR2 and the length of the (1-3)th surface PL1-3 in the second direction DR2 can be the same as the length of the second surface PL2a in the second direction DR2, but the embodiments are not limited thereto.

[0151] For example, in a case where the second surface PL2a in the mask frame MFb is compared with the (2-2)th surface PL2-2 in the mask frame MFa, FIG. 2A For example, in a case where the second surface PL2a in the mask frame MFb is compared with the (2-2)th surface PL2-2 in the mask frame MFa, FIG. 2B For example, in a case where the second surface PL2a in the mask frame MFb is compared with the (2-2)th surface PL2-2 in the mask frame MFa, FIG. 1 For example, in a case where the second surface PL2a in the mask frame MFb is compared with the (2-2)th surface PL2-2 in the mask frame MFa, FIG. 1 For example, in a case where the second surface PL2a in the mask frame MFb is compared with the (2-2)th surface PL2-2 in the mask frame MFa,

[0152] For example, in a case where the second surface PL2a in the mask frame MFb is compared with the (2-2)th surface PL2-2 in the mask frame MFa, FIG. 8) contact, so the frictional force generated between the lower surface MF-Bb of the mask frame MFb and the upper surface SE1 (see FIG. 2A ) of the stage STG can be reduced. Thus, the mask frame MFb that can be deformed by the mask MK (see FIG. 8 and FIG. 2A ) can be easily restored. Thus, defects can be prevented (or at least mitigated) from occurring in a case where the deposition material EV (see FIG. 2B ) is deposited on the substrate SUB (see FIG. 1 ).

[0153] FIG. 8 An orthogonal view of a display panel manufactured using the mask assembly described in connection with FIG. 8 some embodiments is schematically illustrated.

[0154] Referring to FIG. 1 , the display panel DP can have a rectangular shape having a short side extending in a first direction DR1 and a long side extending in a second direction DR2, but the shape of the display panel DP is not limited thereto. The display panel DP can include a display portion DA and a non-display portion NDA surrounding the display portion DA (or at least disposed outside the display portion DA). The display portion DA can be a region in which an image can be displayed, and the non-display portion NDA can be a region in which an image is not displayed.

[0155] The display panel DP can be an emissive display panel. The display panel DP can be an organic light emitting display panel or a quantum dot light emitting display panel, but embodiments are not limited thereto. The light emitting layer of the organic light emitting display panel can include an organic light emitting material. The light emitting layer of the quantum dot light emitting display panel can include quantum dots, quantum rods, etc. Hereinafter, the display panel DP will be described as an organic light emitting display panel.

[0156] The display panel DP can include pixels PX, scan lines SL1 to SLm, data lines DL1 to DLn, emission lines EL1 to ELm, first and second control lines CSL1 and CSL2, first and second power lines PLL1 and PLL2, connection lines CNL, and pads PD. It should be noted that "m" and "n" are natural numbers greater than or equal to 2.

[0157] The pixels PX can be disposed in the display portion DA. The scan driver SDV and the emission driver EDV can be disposed in portions of the non-display portion NDA adjacent to the long sides of the display panel DP, respectively. The data driver DDV can be disposed in the non-display portion NDA adjacent to any one of the short sides of the display panel DP. In a plan view, the data driver DDV can be adjacent to the lower end of the display panel DP in some embodiments.

[0158] The scan lines SL1 to SLm can extend in the first direction DR1 and can be connected to the pixels PX and the scan driver SDV. The data lines DL1 to DLn can extend in the second direction DR2 and can be connected to the pixels PX and the data driver DDV. The emission lines EL1 to ELm can extend in the first direction DR1 and can be connected to the pixels PX and the emission driver EDV.

[0159] The first power line PLL1 can extend in the second direction DR2 and can be disposed in the non-display area NDA. The first power line PLL1 can be disposed between the display area DA and the emission driver EDV, but embodiments are not limited thereto. For example, the first power line PLL1 can be disposed between the display area DA and the scan driver SDV.

[0160] The connection line CNL can extend in the first direction DR1 and can be arranged in the second direction DR2. The connection line CNL can be connected to the first power line PLL1 and the pixel PX. The first voltage can be applied to the pixel PX through the connection line CNL and the first power line PLL1 connected to each other.

[0161] The second power line PLL2 can be disposed in the non-display area NDA. The second power line PLL2 can extend along the long side of the display panel DP and the other short side of the display panel DP around which the data driver DDV is not disposed. The second power line PLL2 can be disposed on a side further outward than the scan driver SDV and the emission driver EDV. For example, the second power line PLL2 can at least partially surround the scan driver SDV and the emission driver EDV in a plan view.

[0162] Although not shown, the second power line PLL2 can extend toward the display area DA and can be connected to the pixel PX. A second voltage having a lower level than the first voltage can be applied to the pixel PX through the second power line PLL2. In some cases, the second voltage can correspond to ground or have a zero potential voltage.

[0163] The first control line CSL1 can be connected to the scan driver SDV and can extend toward a lower end of the display panel DP in a plan view. The second control line CSL2 can be connected to the emission driver EDV and can extend toward the lower end of the display panel DP in a plan view. The data driver DDV can be disposed between the first control line CSL1 and the second control line CSL2.

[0164] The pad PD can be disposed on the display panel DP in the non-display area NDA. The pad PD can be more adjacent to a lower end of the display panel DP than the data driver DDV, but embodiments are not limited thereto. The data driver DDV, the first power line PLL1, the second power line PLL2, the first control line CSL1, and the second control line CSL2 can be connected to the pad PD. The data lines DL1 to DLn can be connected to the data driver DDV, and the data driver DDV can be connected to the pad PD corresponding to the data lines DL1 to DLn.

[0165] The light emitting element of the display panel DP can be formed in a unit area CEA of FIG. 1 and FIG. 1 .

[0166] A unit area corresponding to such a display panel DP can be defined on the above-described substrate SUB (see FIG. 9 ). In some cases, after the light emitting element is formed in the unit area, the unit area can be cut. Thus, the display panel DP in FIG. 8 can be manufactured.

[0167] Although not shown, a timing controller for controlling operations of the scan driver SDV, the data driver DDV, and the emission driver EDV, and a voltage generator for generating the first voltage and the second voltage can be disposed on a printed circuit board which can be electrically connected to one or more portions of the display panel DP. The timing controller and the voltage generator can be connected (e.g., electrically connected and physically connected) to the corresponding pad PD through the printed circuit board.

[0168] The scan driver SDV can generate a scan signal, and the scan signal can be applied to the pixel PX through the scan lines SL1 to SLm. The data driver DDV can generate a data voltage, and the data voltage can be applied to the pixel PX through the data lines DL1 to DLn. The emission driver EDV can generate an emission signal, and the emission signal can be applied to the pixel PX through the emission lines EL1 to ELm.

[0169] The pixel PX can receive the data voltage in response to the scan signal. The pixel PX can display an image by emitting light having a luminance corresponding to the data voltage in response to the emission signal. An emission time of the pixel PX can be controlled by the emission signal.

[0170] The above-described lines can include the data lines DL1 to DLn. The pads connected to the above-described lines can include the pads PD in FIG. 8 . The display panel DP in which a light emitting layer of the pixel PX has not yet been formed can be defined as the above-described substrate SUB (see FIG. 9 ).

[0171] The pad PD can be formed on the substrate SUB (see FIG. 8 ), and the substrate SUB (see FIG. 8 ) can be defined in a state in which the printed circuit board is not connected. The pad PD can be connected to a ground terminal, and the pad PD and the data lines DL1 to DLn can be grounded.

[0172] FIG. 8 A cross-sectional view of a representative pixel in the display panel 100 according to some embodiments is schematically illustrated. FIG. 9

[0173] Referring to FIG. 10 and FIG. 1 , the pixel PX can be disposed on the base substrate BS and include a transistor TR and a light emitting element OLED. The transistor TR and the light emitting element OLED of the pixel PX can be electrically connected to the first power line PLL1 and the second power line PLL2 and the data lines DL1 to DLn described above.

[0174] The transistor TR and the light emitting element OLED of the pixel PX can be electrically connected to the pad PD in the display panel 100 through the data lines DL1 to DLn (see FIG. 8 ) and the first power line PLL1 and the second power line PLL2 (see FIG. 10 ). FIG. 1

[0175] The light emitting element OLED can include a first electrode AE, a second electrode CE, a hole control layer HCL, an electron control layer ECL, and a light emitting layer EML. The first electrode AE can be an anode electrode, and the second electrode CE can be a cathode electrode, or vice versa.

[0176] The transistor TR and the light emitting element OLED can be disposed on the base substrate BS. A single transistor TR is illustrated as an example, but in substance, the pixel PX can include a plurality of transistors and at least one capacitor for driving the light emitting element OLED.

[0177] The display part DA can include a light emitting part PA corresponding to the pixel PX and a non-light emitting part NPA surrounding the light emitting part PA. The light emitting element OLED can be disposed at least in the light emitting part PA.

[0178] The base substrate BS can include a flexible plastic substrate. For example, the base substrate BS can include transparent polyimide (PI), but embodiments are not limited thereto. The buffer layer BFL can be disposed on the base substrate BS, and the buffer layer BFL can be an inorganic layer or can include an inorganic layer.

[0179] ​​A semiconductor pattern can be disposed on the buffer layer BFL. The semiconductor pattern can include polysilicon. However, embodiments are not limited thereto. For example, the semiconductor pattern can include amorphous silicon or metal oxide.

[0180] The semiconductor pattern can be doped with an N-type dopant or a P-type dopant. The semiconductor pattern can include a heavily doped region and a lightly doped region. The heavily doped region can have a higher conductivity than the lightly doped region and can substantially function as a source electrode and a drain electrode of the transistor TR. The lightly doped region can substantially correspond to an active (or channel) region of the transistor.

[0181] The source region S, the active region A, and the drain region D of the transistor TR can be formed of the semiconductor pattern. The first insulating layer INS1 can be disposed on the semiconductor pattern. The gate electrode G of the transistor TR can be disposed on the first insulating layer INS1. The second insulating layer INS2 can be disposed on the gate electrode G. The third insulating layer INS3 can be disposed on the second insulating layer INS2.

[0182] The connection electrode CNE can be disposed between and electrically connect the transistor TR and the light emitting element OLED. The connection electrode CNE can include a first connection electrode CNE1 and a second connection electrode CNE2.

[0183] The first connection electrode CNE1 can be disposed on the third insulating layer INS3 and connected to the drain region D through a first contact hole CH1 defined in the first to third insulating layers INS1 to INS3. The fourth insulating layer INS4 can be disposed on the first connection electrode CNE1. The fifth insulating layer INS5 can be disposed on the fourth insulating layer INS4.

[0184] The second connection electrode CNE2 can be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 can be connected to the first connection electrode CNE1 through a second contact hole CH2 defined in the fifth insulating layer INS5. The sixth insulating layer INS6 can be disposed on the second connection electrode CNE2. Each of the first to sixth insulating layers INS1 to INS6 can be an inorganic layer and / or an organic layer.

[0185] The first electrode AE can be disposed on the sixth insulating layer INS6. The first electrode AE can be electrically connected to the second connection electrode CNE2 through a third contact hole CH3 defined in the sixth insulating layer INS6. A pixel defining film PDL exposing a portion of the first electrode AE can be disposed on the first electrode AE and the sixth insulating layer INS6. An opening PX_OP exposing the portion of the first electrode AE can be defined in the pixel defining film PDL.

[0186] A hole control layer HCL can be disposed on the first electrode AE and the pixel definition film PDL. The hole control layer HCL can be commonly disposed in the light emitting part PA and the non-light emitting part NPA. The hole control layer HCL can include a hole transport layer and a hole injection layer.

[0187] An emission layer EML can be disposed on the hole control layer HCL. The emission layer EML can be disposed in an area corresponding to the opening PX_OP. As FIG. 1 The emission layer EML can extend into a part of the non-light emitting part NPA, as shown in the middle. The emission layer EML can include an organic material and / or an inorganic material. The emission layer EML can generate light having any one color among red, green, and blue, but embodiments are not limited thereto. For example, the emission layer EML can be configured to emit white light.

[0188] An electron control layer ECL can be disposed on the emission layer EML and the hole control layer HCL. The electron control layer ECL can be commonly disposed in the light emitting part PA and the non-light emitting part NPA. The electron control layer ECL can include an electron transport layer and an electron injection layer.

[0189] A second electrode CE can be disposed on the electron control layer ECL. The second electrode CE can be commonly disposed in the pixel PX.

[0190] A thin film encapsulation layer TFE can be disposed on the light emitting element OLED. The thin film encapsulation layer TFE can be disposed on the second electrode CE and cover the pixel PX. The thin film encapsulation layer TFE can include at least two inorganic layers and an organic layer between the inorganic layers. The inorganic layers can protect the pixel PX from moisture, oxygen, etc. The organic layer can protect the pixel PX from foreign substances such as dust particles, etc.

[0191] A first voltage can be applied to the first electrode AE through the transistor TR, and a second voltage having a lower level than the first voltage can be applied to the second electrode CE. Holes and electrons injected into the emission layer EML can combine to form excitons, and as the excitons transition to a ground state, the light emitting element OLED can emit light.

[0192] FIG. 10 A deposition process in a display panel in FIG. 1 is schematically shown during a stage of FIG. 8 is schematically shown during a stage of

[0193] For ease of description, FIG. 10 is shown FIG. 1 The substrate SUB and the mask MK in FIG. 8 are rotated by about 90 degrees in a clockwise direction, for example, relative to the vertical orientation as in ​is shown in a horizontal orientation.

[0194] Referring to ​ , ​ and ​ , the base substrate BS can be defined as at least in combination with the substrate SUB described above in connection with ​ The substrate SUB can include the data lines DL1 to DLn defined by the lines described above in connection with ​ and the pads PD electrically connected to the data lines DL1 to DLn.

[0195] The mask MK can be disposed to face the substrate SUB. The mask MK can be disposed close to the substrate SUB. In some cases, the mask MK can be spaced apart from the substrate SUB to avoid direct contact between the mask MK and the substrate SUB. The deposition material EV can be disposed (or deposited) on the substrate SUB through the mask opening OP-MK defined in the upper surface of the mask MK. The light-emitting layer EML can be formed on the substrate SUB through the deposition of the deposition material EV.

[0196] According to some embodiments, the lower surface of the mask frame can include a first surface surrounding the frame opening defined in the mask frame and a second surface adjacent to the edge of the mask frame. The first surface can be disposed on the upper surface of the stage, and the second surface can be spaced apart from the upper surface of the stage. Accordingly, the contact area between the lower surface of the mask frame and the upper surface of the stage can be reduced. Accordingly, in the case where the mask frame is deformed by the mask and then restored to its original shape, the frictional force generated between the lower surface of the mask frame and the upper surface of the stage can be reduced, and the mask frame can thus be easily restored to its original shape.

[0197] While the foregoing embodiments have been described in some detail for purposes of clarity and understanding, it will be appreciated that certain changes and modifications can be practiced within the scope of the appended claims. It should be noted that there are many alternative ways of implementing the disclosed embodiments. Accordingly, the embodiments are to be considered as illustrative and not restrictive, and the embodiments are not to be limited to the details given herein.

Claims

1. A mask assembly, characterized by comprising: a table; a mask frame disposed on an upper surface of the table, the mask frame comprising a frame opening bounded by a first side extending in a first direction and a second side extending in a second direction intersecting the first direction; and a mask disposed on an upper surface of the mask frame, wherein: a lower surface of the mask frame comprises: a first surface surrounding the frame opening in a plan view; and a second surface adjacent an edge of the mask frame in the plan view, the first surface disposed on the upper surface of the table, and the second surface spaced apart from the upper surface of the table in a third direction intersecting both the first direction and the second direction. a first distance in the third direction between the second surface and the upper surface of the table is greater than a second distance in the third direction between the first surface and the upper surface of the table, and 2. The mask assembly of claim 1, wherein, a difference between the first distance and the second distance is in a range of 0.05 mm to 0.15 mm.

3. The mask assembly of claim 2, wherein: the lower surface of the mask frame further comprises a third surface comprising a (3-1)th surface extending in the second direction and a (3-2)th surface extending in the first direction, and a third distance in the third direction between the third surface and the upper surface of the table is greater than the first distance. the second surface comprises:

4. The mask assembly of claim 3, wherein, a (2-1)th surface extending in the second direction along one of the second sides of the mask frame; a (2-2)th surface adjacent one of the corners of the mask frame; and a (2-3)th surface extending in the first direction along one of the first sides of the mask frame. in the plan view:

5. The mask assembly of claim 4, wherein, the (3-1)th surface is disposed between the first surface and the (2-1)th surface, and the (3-2)th surface is disposed between the first surface and the (2-3)th surface.

6. The mask assembly of claim 3, wherein: the first surface comprises: a (1-1)th surface adjacent the frame opening; a (1-2)th surface extending in the second direction along one of the second sides of the mask frame; and a (1-3)th surface extending in the first direction along one of the first sides of the mask frame, and in the plan view, the (3-1)th surface is disposed between the (1-1)th surface and the (1-2)th surface, and in the plan view, the (3-2)th surface is disposed between the (1-1)th surface and the (1-3)th surface.

7. The mask assembly of claim 6, wherein: ​ the first (3-1) surface extends in the second direction from one first side of the mask frame to another first side of the mask frame, the one first side of the mask frame and the another first side of the mask frame being opposite to each other in the second direction, and the first (3-2) surface extends in the first direction from one second side of the mask frame to another second side of the mask frame, the one second side of the mask frame and the another second side of the mask frame being opposite to each other in the first direction.

8. The mask assembly of claim 6, wherein the second surface is one of a plurality of second surfaces, each of the plurality of second surfaces is disposed adjacent to a corresponding one of corners of the mask frame, the first (3-1) surface is disposed between second surfaces of the plurality of second surfaces that are adjacent to each other in the second direction, and the first (3-2) surface is disposed between second surfaces of the plurality of second surfaces that are adjacent to each other in the first direction.

9. The mask assembly of claim 1, wherein the mask frame comprises: a first portion comprising the first surface and the second surface; and a second portion extending from an upper surface of the first portion, the second portion protrudes further than the first portion towards the frame opening, and inner surfaces of corresponding portions of the first portion and the second portion that bound the frame opening are inclined from at least one of the first direction and the second direction, and the frame opening comprises: a first opening bounded by the inner surfaces of the first portion; and a second opening bounded by the inner surfaces of the second portion, and the first opening is fluidically connected to the second opening within the mask frame.

10. The mask assembly of claim 9, wherein, further comprising: a first rod disposed in the third direction between the mask frame and the mask, the first rod extending in the first direction; and a second rod disposed in the third direction between the first rod and the mask, the second rod extending in the second direction, wherein each of the first rod and the second rod is disposed in a respective slot in an upper surface of the second portion. ​

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