Tubular heating furnace in semiconductor heat treatment equipment

Abstract

The utility model discloses a tubular heating furnace in semiconductor heat treatment equipment, the outer surface of a furnace body is sleeved with a heat preservation tank, the top end of the heat preservation tank is connected with a liquid storage tank through a supporting piece, the liquid storage tank is internally provided with a recovery assembly, the recovery assembly comprises an annular gas pipe fixedly connected to the inner surface of the liquid storage tank, and the annular gas pipe is provided with a gas inlet and a gas outlet. The bottom end of the annular air pipe extends out of the liquid storage tank and is fixedly connected with an air inlet pipe, the end, away from the annular air pipe, of the air inlet pipe is fixedly connected with an air pump, the air pump is connected with a transverse pipe through a connecting air pipe, air inlet branch pipes are welded to the bottom end of the transverse pipe at equal intervals, and under the action of the air pump, the air inlet branch pipes are communicated with the air inlet pipe. Heat in the furnace body flows to the annular air pipe through the air inlet branch pipe, and the annular air pipe is fixedly wound in the liquid storage tank, so that the heat of the annular air pipe heats liquid in the liquid storage tank, the heat of the furnace body is transferred into the liquid storage tank to be stored, and heat loss is effectively avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor heat treatment equipment, specifically, relates to a tubular heating furnace in semiconductor heat treatment equipment. BACKGROUND

[0002] Many products need to carry out heat treatment process in the heating furnace in production and manufacture, for example, in semiconductor wafer manufacturing, the film coating, diffusion, oxidation of photovoltaic cell piece, annealing of metal material and so on process, the tubular heating furnace as the core component of heat treatment equipment reaction chamber provides the heat source for the various processes of silicon wafer in the process cavity, and the temperature on the surface of silicon wafer in the reaction chamber has strict requirements, needs to ensure that the temperature of all silicon wafer surfaces in the reaction cavity is uniform as far as possible.

[0003] For the tubular heating furnace, the traditional tubular heating furnace does not have the function of heat recovery and reuse, so that after the semiconductor heat treatment, there is still a large amount of heat in the heating furnace, under normal circumstances, these heat will be naturally cooled in the furnace body, which will cause the waste of energy.

[0004] For the problems in the related art, no effective solution has been proposed so far. UTILITY MODEL CONTENT

[0005] For the problems in the related art, the utility model provides a tubular heating furnace in semiconductor heat treatment equipment to overcome the above technical problems existing in the prior art.

[0006] Therefore, the utility model adopts the specific technical scheme as follows:

[0007] A tubular heating furnace in semiconductor heat treatment equipment, including the furnace body, the furnace body inner surface is provided with heating module at equal distance, the outer surface of the furnace body is provided with the heat preservation tank, the heat preservation tank with the furnace body between being equipped with heating cavity, the heating cavity is equipped with heating assembly, the top of the heat preservation tank is connected with the liquid storage tank through the support, the liquid storage tank is equipped with recovery assembly, the recovery assembly includes the annular air pipe fixedly connected on the inner surface of the liquid storage tank, the top of the annular air pipe extends to the outside of the liquid storage tank and is fixedly connected with the air outlet pipe, the bottom of the annular air pipe extends to the outside of the liquid storage tank and is fixedly connected with the air inlet pipe, the end of the air inlet pipe away from the annular air pipe is fixedly connected with the air pump, the air pump is connected with the cross pipe through the connecting air pipe, the cross pipe is welded on the heat preservation tank, the bottom of the cross pipe is welded with the air inlet branch pipe at equal distance, the bottom of the air inlet branch pipe penetrates the heating cavity and extends to the inside of the furnace body, the connecting air pipe is equipped with the air inlet valve.

[0008] Further, in order to utilize the recycled heat, the heating assembly comprises a ring-shaped water pipe fixedly connected in the heating cavity, one end of the ring-shaped water pipe extends out of the heat preservation tank and is fixedly connected with an outlet water pipe, the end of the outlet water pipe away from the ring-shaped water pipe is fixedly connected with the liquid storage tank, the other end of the ring-shaped water pipe extends out of the heat preservation tank and is fixedly connected with an inlet water pipe, the end of the inlet water pipe away from the ring-shaped water pipe is fixedly connected with a water pump, and the water pump is fixedly installed on the liquid storage tank and connected with the liquid storage tank through a connecting water pipe.

[0009] Further, in order to avoid heat transfer of the heating module to the liquid storage tank when the heating module works, an outlet valve is fixedly installed on the outlet water pipe, and an inlet valve is fixedly installed on the inlet water pipe.

[0010] Further, in order to monitor the temperature in the furnace body and the liquid storage tank in real time, a first temperature sensor is fixedly connected at the top center of the furnace body, and a second temperature sensor is fixedly connected at the top center of the liquid storage tank.

[0011] Further, in order to facilitate control, a controller is arranged at one end of the outer surface of the heat preservation tank, and the controller is electrically connected with the first temperature sensor and the second temperature sensor.

[0012] Further, in order to avoid external gas entering the ring-shaped air pipe, a check valve is fixedly connected at the top end of the air outlet pipe.

[0013] Further, in order to make the heat preservation tank stable on the ground, support legs are welded around the bottom end of the heat preservation tank.

[0014] The beneficial effects of the utility model are as follows:

[0015] 1. After the semiconductor heat treatment, the air pump starts to work, under the action of the air pump, the heat in the furnace body flows to the horizontal pipe through the air inlet branch pipe, the heat in the horizontal pipe flows to the air pump through the connecting air pipe, the air pump delivers the heat to the ring-shaped air pipe, the heat of the ring-shaped air pipe heats the liquid in the liquid storage tank due to the fixed winding of the ring-shaped air pipe in the liquid storage tank, so that the heat of the furnace body is transferred to the liquid storage tank for storage, until the value of the second temperature sensor is greater than that of the first temperature sensor, at this time, the air inlet valve is closed, however, the heated gas is discharged through the air outlet pipe, the setting of the check valve avoids air entering the ring-shaped air pipe through the air outlet pipe, resulting in heat loss in the liquid storage tank, and the heat is transferred to the liquid storage tank, effectively avoiding heat loss.

[0016] 2, if the furnace body is heated, the water pump starts to work, the liquid in the liquid storage tank flows into the annular water pipe through the connecting water pipe, the annular water pipe is fixedly wound outside the furnace body in the heating cavity, and then the heating cavity is heated, the heat in the heating cavity is transmitted to the furnace body, and the furnace body is heated, until the value of the first temperature sensor is greater than that of the second temperature sensor, at this time, the liquid inlet valve and the liquid outlet valve are closed, the liquid is delivered to the annular water pipe, so that the heat is reused, and the workload of the heating module is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0018] Figure 1 is a structure schematic view of a tubular heating furnace in a semiconductor heat treatment equipment according to an embodiment of the present application;

[0019] Figure 2 is Figure 1 the enlarged view of A in figure

[0020] Figure 3 is a partial sectional view of a liquid storage tank in a tubular heating furnace in a semiconductor heat treatment equipment according to an embodiment of the present application;

[0021] Figure 4 is a partial sectional view of a heat preservation tank in a tubular heating furnace in a semiconductor heat treatment equipment according to an embodiment of the present application;

[0022] Figure 5 is Figure 4 the enlarged view of B in figure

[0023] In the figure:

[0024] 1, furnace body;2, heating module;3, heat preservation tank;4, heating cavity;5, annular water pipe;6, support;7, liquid storage tank;8, liquid outlet pipe;9, liquid outlet valve;10, liquid inlet pipe;11, liquid inlet valve;12, water pump;13, connecting water pipe;14, annular air pipe;15, air outlet pipe;16, check valve;17, air inlet pipe;18, air pump;19, connecting air pipe;20, air inlet valve;21, cross pipe;22, air inlet branch pipe;23, first temperature sensor;24, second temperature sensor;25, controller;26, support leg. DETAILED DESCRIPTION

[0025] Clearly and completely, the technical scheme in the embodiments of the utility model will be described in combination with the drawings in the embodiments of the utility model, apparently, the described embodiments are only a part of the embodiments of the utility model, and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative labor belong to the scope of protection of the utility model.

[0026] According to the embodiment of the utility model, a tubular heating furnace in semiconductor heat treatment equipment is provided.

[0027] Embodiment one;

[0028] As Figures 1-5As shown, according to the tubular heating furnace in the semiconductor heat treatment equipment of the embodiment of the utility model, including the furnace body 1 for carrying out heat treatment, the opening of furnace body 1 is equipped with furnace cover through hinge, the inside of furnace body 1 is placed with carrier, the semiconductor is placed on carrier, the outer surface of furnace body 1 is equipped with heat preservation tank 3, the bottom end of heat preservation tank 3 is welded with support leg 26 all around, the one end of heat preservation tank 3 outer surface is equipped with controller 25, controller 25 is electrically connected with power supply, the inside surface of furnace body 1 is equipped with heating module 2 at equal distance, heating module 2 is electrically connected with controller 25, heating module 2 is composed of electric heating wire, heating cavity 4 is equipped between heat preservation tank 3 and furnace body 1, heating assembly is equipped in heating cavity 4, the top end of heat preservation tank 3 is connected with liquid storage tank 7 through support 6, recovery assembly is equipped in liquid storage tank 7, recovery assembly includes annular air pipe 14 fixedly connected on the inner surface of liquid storage tank 7, the top end of annular air pipe 14 extends to the outside of liquid storage tank 7 and is fixedly connected with outlet pipe 15, check valve 16 is fixedly connected on the top end of outlet pipe 15, injection pipe is welded on the end of liquid storage tank 7 away from outlet pipe 15, pipe cover is threadedly connected on injection pipe, the bottom end of annular air pipe 14 extends to the outside of liquid storage tank 7 and is fixedly connected with inlet pipe 17, the end of inlet pipe 17 away from annular air pipe 14 is fixedly connected with air pump 18, air pump 18 is electrically connected with controller 25, air pump 18 is connected with cross pipe 21 through connecting air pipe 19, cross pipe 21 is welded on heat preservation tank 3, inlet branch pipe 22 is welded on the bottom end of cross pipe 21 at equal distance, the bottom end of inlet branch pipe 22 penetrates heating cavity 4 and extends to furnace body 1, first temperature sensor 23 is fixedly connected on the inside top center of furnace body 1, first temperature sensor 23 is electrically connected with controller 25, inlet valve 20 is equipped on connecting air pipe 19, inlet valve 20 is solenoid valve and is electrically connected with controller 25, the outer surface of outlet pipe 15, annular air pipe 14, connecting air pipe 19 and cross pipe 21 exposed to the outside are all pasted with heat preservation layer, avoid the loss of heat, after the heat treatment of semiconductor, at this time, air pump 18 starts to work, under the action of air pump 18, the heat in furnace body 1 flows to cross pipe 21 through inlet branch pipe 22, the heat in cross pipe 21 flows to air pump 18 through connecting air pipe 19, air pump 18 transports heat to annular air pipe 14, because annular air pipe 14 is fixedly wound in liquid storage tank 7, the heat of annular air pipe 14 heats the liquid of liquid storage tank 7, thereby making the heat of furnace body 1 transfer to liquid storage tank 7 and store, until the value of second temperature sensor 24 is greater than the value of first temperature sensor 23, at this time, inlet valve 20 is closed, however, the heated gas is discharged through outlet pipe 15, the setting of check valve 16 avoids that air enters annular air pipe 14 through outlet pipe 15, causes the heat loss in liquid storage tank 7, by transferring heat to liquid storage tank 7, effectively avoid heat loss.

[0029] Embodiment two;

[0030] Please refer to Figure 1 And Figures 3-5 In order to utilize the recycled heat, the heating assembly comprises an annular water pipe 5 fixedly connected in the heating cavity 4, one end of the annular water pipe 5 extends out of the heat preservation tank 3 and is fixedly connected with an outflow water pipe 8, an outflow valve 9 is fixedly installed on the outflow water pipe 8, the outflow valve 9 is an electromagnetic valve and is electrically connected with the controller 25, the end of the outflow water pipe 8 away from the annular water pipe 5 is fixedly connected with the liquid storage tank 7, the other end of the annular water pipe 5 extends out of the heat preservation tank 3 and is fixedly connected with an inflow water pipe 10, an inflow valve 11 is fixedly installed on the inflow water pipe 10, the inflow valve 11 is an electromagnetic valve and is electrically connected with the controller 25, the end of the inflow water pipe 10 away from the annular water pipe 5 is fixedly connected with a water pump 12, the water pump 12 is electrically connected with the controller 25, the water pump 12 is fixedly installed on the liquid storage tank 7, the water pump 12 is connected with the liquid storage tank 7 through a connecting water pipe 13, a second temperature sensor 24 is fixedly connected to the center of the top of the inside of the liquid storage tank 7, the second temperature sensor 24 is electrically connected with the controller 25, the outer surfaces of the outflow water pipe 8, the annular water pipe 5, the inflow water pipe 10 and the connecting water pipe 13 exposed to the outside are all pasted with heat preservation layers to avoid heat loss, if the furnace body 1 is heated, the water pump 12 starts to work to flow the liquid in the liquid storage tank 7 to the annular water pipe 5 through the connecting water pipe 13, since the annular water pipe 5 is fixedly wound around the furnace body 1 in the heating cavity 4, the heating cavity 4 is heated, the heat in the heating cavity 4 is transferred to the furnace body 1 and heats the furnace body 1, until the value of the first temperature sensor 23 is greater than the value of the second temperature sensor 24, at this time, the inflow valve 11 and the outflow valve 9 are closed, the liquid is delivered to the annular water pipe 5 to recycle the heat and reduce the workload of the heating module 2.

[0031] In order to facilitate the understanding of the above technical solutions of the present application, the working principle or operation mode of the present application in the actual process will be described in detail.

[0032] In actual application, after the semiconductor heat treatment, first, open the inlet valve 20, and close the inlet valve 11 and outlet valve 9, at this time, the air pump 18 starts to work, under the action of the air pump 18, the heat in the furnace body 1 flows to the horizontal pipe 21 through the inlet branch pipe 22, the heat in the horizontal pipe 21 flows to the air pump 18 through the connecting air pipe 19, the air pump 18 delivers the heat to the annular air pipe 14, since the annular air pipe 14 is fixedly wound in the liquid storage tank 7, the heat of the annular air pipe 14 heats the liquid in the liquid storage tank 7, so that the heat of the furnace body 1 is transferred to the liquid storage tank 7 for storage, until the value of the second temperature sensor 24 is greater than that of the first temperature sensor 23, at this time, the inlet valve 20 is closed, however, the heated gas is discharged through the outlet pipe 15, the setting of the check valve 16 avoids that air enters the annular air pipe 14 through the outlet pipe 15, causing the heat loss in the liquid storage tank 7, if the furnace body 1 is heated, open the inlet valve 11 and outlet valve 9, the water pump 12 starts to work, the liquid in the liquid storage tank 7 flows to the annular water pipe 5 through the connecting water pipe 13, since the annular water pipe 5 is fixedly wound outside the furnace body 1 in the heating cavity 4, the heating cavity 4 is heated, the heat in the heating cavity 4 is transferred to the furnace body 1, and the furnace body 1 is heated, until the value of the first temperature sensor 23 is greater than that of the second temperature sensor 24, at this time, the inlet valve 11 and outlet valve 9 are closed, by delivering the liquid to the annular water pipe 5, the heat is reused, thereby reducing the workload of the heating module 2.

[0033] The above only describes the preferred embodiments of the present application and is not intended to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A tubular heating furnace in a semiconductor heat treatment apparatus comprising a furnace body (1), characterized in that, The equal distance heating module (2) is arranged on the inner surface of the furnace body (1), the outer surface of the furnace body (1) is sleeved with the heat preservation tank (3), the heat preservation tank (3) and the furnace body (1) are provided with the heating cavity (4), the heating cavity (4) is provided with the heating assembly, the top end of the heat preservation tank (3) is connected with the liquid storage tank (7) through the support (6), the liquid storage tank (7) is provided with the recovery assembly, the recovery assembly comprises an annular air pipe (14) fixedly connected to the inner surface of the liquid storage tank (7), the top end of the annular air pipe (14) extends out of the liquid storage tank (7) and is fixedly connected with the air outlet pipe (15), the bottom end of the annular air pipe (14) extends out of the liquid storage tank (7) and is fixedly connected with the air inlet pipe (17), one end of the air inlet pipe (17) away from the annular air pipe (14) is fixedly connected with the air pump (18), the air pump (18) is connected with the cross pipe (21) through the connecting air pipe (19), the cross pipe (21) is welded on the heat preservation tank (3), the bottom end of the cross pipe (21) is welded with the air inlet branch pipe (22) at equal distance, the bottom end of the air inlet branch pipe (22) penetrates through the heating cavity (4) and extends into the furnace body (1), and the connecting air pipe (19) is provided with the air inlet valve (20).

2. A tubular heating furnace in a semiconductor heat treatment apparatus according to claim 1, wherein The heating assembly comprises an annular water pipe (5) fixedly connected in the heating cavity (4), one end of the annular water pipe (5) extends out of the heat preservation tank (3) and is fixedly connected with the liquid outlet pipe (8), the end of the liquid outlet pipe (8) away from the annular water pipe (5) is fixedly connected with the liquid storage tank (7), the other end of the annular water pipe (5) extends out of the heat preservation tank (3) and is fixedly connected with the liquid inlet pipe (10), the end of the liquid inlet pipe (10) away from the annular water pipe (5) is fixedly connected with the water pump (12), and the water pump (12) is fixedly installed on the liquid storage tank (7).

3. A tubular heating furnace in a semiconductor heat treatment apparatus according to claim 2, wherein The liquid outlet valve (9) is fixedly installed on the liquid outlet pipe (8), and the liquid inlet valve (11) is fixedly installed on the liquid inlet pipe (10).

4. The tubular heating furnace in a semiconductor heat treatment apparatus according to claim 1, wherein The first temperature sensor (23) is fixedly connected to the top center of the inner part of the furnace body (1), and the second temperature sensor (24) is fixedly connected to the top center of the inner part of the liquid storage tank (7).

5. A tubular heating furnace in a semiconductor heat treatment apparatus according to claim 4, wherein The controller (25) is arranged on one end of the outer surface of the heat preservation tank (3), and the controller (25) is electrically connected with the first temperature sensor (23) and the second temperature sensor (24).

6. A tubular heating furnace in a semiconductor heat treatment apparatus according to claim 1, wherein The check valve (16) is fixedly connected to the top end of the air outlet pipe (15).

7. A tubular heating furnace in a semiconductor heat treatment apparatus according to claim 5, wherein The support legs (26) are welded around the bottom end of the heat preservation tank (3).

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