Lens module and electronic device

Abstract

The embodiment of the utility model provides a lens module and an electronic device. The lens module comprises a substrate, a shielding cover and a first electronic element, the substrate is provided with a groove. The shielding cover is arranged on the substrate and covers the groove. At least part of the first electronic component is arranged in the groove. By arranging the groove on the substrate, the first electronic element can be embedded into the groove, so that the space which is possibly wasted originally can be effectively utilized, the height of the whole module is reduced, and the module is more suitable for the requirement of ultrathin equipment. The first electronic component is placed in the groove, the electronic component with a larger specification can be used without being limited to a smaller electronic component or being split into a series-parallel connection mode, and therefore the flexibility and performance of the design are improved. The optimized space design can reduce the requirements for complex and expensive series-parallel design, thereby reducing the production cost and the use of materials.

Description

Technical Field

[0001] This application relates to the field of optical component technology, specifically to lens modules and electronic devices. Background Technology

[0002] As electronic devices (such as laptops) become thinner and smaller, camera modules within these devices are becoming increasingly smaller. These camera modules typically consist of a circuit board and electronic components mounted on it, with most of the electronic components housed within a shield to prevent damage from electrostatic discharge.

[0003] However, in some ultra-thin models, the limited height space inside the shielding cover restricts the types and sizes of electronic components that can be accommodated. During component assembly, to avoid interference between the components and the shielding cover, smaller components must be selected, or the components must be broken down into multiple parts and connected in series or parallel. Besides increasing cost, series and parallel connections increase the area used on the circuit board, making them difficult to implement in miniaturized modules. Utility Model Content

[0004] To address the shortcomings of the existing technology, it is necessary to provide a lens module and an electronic device comprising the lens module.

[0005] This application provides a lens module including a substrate, a shielding cover, and a first electronic component. The substrate has a groove. The shielding cover is disposed on the substrate and covers the groove. At least a portion of the first electronic component is disposed within the groove.

[0006] This application utilizes recesses on a substrate, allowing at least a portion of a first electronic component to be embedded within them. This effectively utilizes potentially wasted space, reducing the overall height of the lens module and making it more suitable for ultra-thin devices. Placing at least a portion of the first electronic component within the recess allows for the use of larger components, rather than being limited to smaller ones or splitting them into series-parallel configurations, thus improving design flexibility and performance. The optimized space design reduces the need for complex and expensive series-parallel designs, thereby lowering production costs and material usage.

[0007] In some embodiments of this application, the substrate includes an upper surface and a lower surface disposed opposite to each other, a groove is disposed on the upper surface, a shielding cavity is formed between the shielding cover and the upper surface, the groove communicates with the shielding cavity, and a first electronic component extends from the groove into the shielding cavity.

[0008] In some embodiments of this application, the groove does not penetrate the lower surface.

[0009] In some embodiments of the present application, the lens module further comprises a second electronic component, the height of the second electronic component is less than the height of the first electronic component, and the second electronic component is fixed to the upper surface.

[0010] In some embodiments of the present application, the bottom wall of the recess is provided with a solder pad, and the first electronic component is electrically connected to the substrate through the solder pad.

[0011] In some embodiments of the present application, the depth of the recess is 0.1mm to 0.2mm.

[0012] In some embodiments of the present application, the substrate comprises a substrate layer, a circuit layer and a solder mask layer arranged in sequence, the shielding cover is arranged on the solder mask layer, the solder mask layer is used to cover at least part of the circuit layer, and the recess penetrates through the solder mask layer, the circuit layer and part of the substrate layer.

[0013] In some embodiments of the present application, the lens module further comprises a lens holder and a lens arranged in the lens holder, the lens holder is fixed to the substrate, the number of the shielding covers is two, and the two shielding covers are located on opposite sides of the lens holder.

[0014] In some embodiments of the present application, the material of the shielding cover is iron.

[0015] The embodiments of the present application further provide an electronic device comprising the lens module described above. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a schematic view of an embodiment of the lens module of the present application.

[0017] Figure 2 is Figure 1 is an exploded schematic view of the lens module shown in FIG. 1.

[0018] Figure 3 is Figure 1 is a sectional view along the section line III-III of the lens module shown in FIG. 1.

[0019] Figure 4 is Figure 3 is an enlarged view of IV shown in FIG. 1.

[0020] MAIN ELEMENT SYMBOL EXPLANATION:

[0021] The lens module 10, the substrate 100, the shielding cover 200, the first electronic component 300, the second electronic component 301, the recess 101, the shielding cavity 201, the upper surface 111, the lower surface 112, the solder pad 400, the substrate layer 500, the circuit layer 600, the solder mask layer 700, the lens holder 800 and the lens 801.

[0022] The following specific embodiments will further illustrate the present application in conjunction with the above drawings. DETAILED DESCRIPTION

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have a component that is centrally located. When a component is considered to be "located" on another component, it can be directly located on the other component or may also have a component that is centrally located.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] Please see Figure 1 This application provides a lens module 10, including a substrate 100, a shielding cover 200, and a first electronic component 300. The substrate 100 is provided with a groove 101. The shielding cover 200 is disposed on the substrate 100 and covers the groove 101. At least a portion of the first electronic component 300 is disposed within the groove 101.

[0027] This application, by providing a recess 101 on the substrate 100, allows at least a portion of the first electronic component 300 to be embedded within the recess 101. This effectively utilizes space that might otherwise be wasted, reducing the overall height of the lens module 10 and making it more suitable for ultra-thin devices. Placing at least a portion of the first electronic component within the recess 101 allows the use of larger electronic components, rather than being limited to smaller components or splitting them into series-parallel configurations, thereby improving design flexibility and performance. The optimized space design reduces the need for complex and expensive series-parallel designs, thus lowering production costs and material usage.

[0028] Please see Figure 2 and Figure 3In some embodiments of the present application, the substrate 100 comprises an upper surface 111 and a lower surface 112 arranged oppositely, the recess 101 is arranged on the upper surface 111, the shielding cover 200 and the upper surface 111 form a shielding cavity 201, the recess 101 communicates with the shielding cavity 201, and the first electronic component 300 extends into the shielding cavity 201 from the recess 101. Since the first electronic component can extend into the shielding cavity 201, the vertical space utilization of the overall structure is more efficient, which can effectively meet the strict requirements for space in ultra-thin devices. Embedding part of the electronic components in the recess 101 and extending them into the shielding cavity 201 can reduce the need for component splitting and series-parallel connection, thereby simplifying the assembly process and reducing the potential risk of assembly errors. This design can support more functional integration and improve overall performance under the premise of miniaturization, enabling electronic devices to achieve more technical innovations and applications.

[0029] Referring to Figure 4 In some embodiments of the present application, the recess 101 does not penetrate the lower surface 112. The recess 101 not penetrating the lower surface 112 can simplify the production and processing process, reduce the manufacturing cost and technical difficulty, and improve the yield. The non-penetrating design can better cooperate with the sealing of the shielding cover 200, enhance the shielding effect of the space, and help improve the anti-interference ability of the device. The recess 101 not penetrating the lower surface 112 can provide strong support for the first electronic component 300.

[0030] Referring to Figure 2 and Figure 3 In some embodiments of the present application, the lens module 10 further comprises a second electronic component 301, the height of the second electronic component 301 is less than the height of the first electronic component 300, and the second electronic component 301 is fixed on the upper surface 111. There are two types of electronic components on the substrate 100, which are the first electronic component 300 with a larger thickness and the second electronic component 301 with a smaller thickness, and only the first electronic component 300 with a larger thickness needs to be placed in the recess 101.

[0031] Referring to Figure 4In some embodiments of the present application, the bottom wall of the recess 101 is provided with a solder pad 400, and the first electronic component 300 is electrically connected to the substrate 100 through the solder pad 400. By arranging the solder pad 400 on the bottom wall of the recess 101, it is ensured that the first electronic component 300 can be stably connected through the solder pad 400, thereby improving the reliability of electrical connection and reducing the risk of poor contact. Since the first electronic component 300 is directly fixed to the bottom of the recess 101 through the solder pad 400, the use of other support structures or connection structures is avoided, thereby further saving installation space and meeting the needs of ultra-thin design. In the design, the position and shape of the solder pad 400 can also be flexibly adjusted according to different types and needs of the first electronic component 300 and the second electronic component 301, thereby providing more design freedom.

[0032] Referring to Figure 4 In some embodiments of the present application, the depth of the recess 101 is 0.1mm to 0.2mm.

[0033] Referring to Figure 4 In some embodiments of the present application, the substrate 100 includes a substrate layer 500, a circuit layer 600 and a solder mask layer 700 arranged in sequence, the shielding cover 200 is arranged on the solder mask layer 700, the solder mask layer 700 is used to cover at least part of the circuit layer 600, and the recess 101 penetrates through the solder mask layer 700, the circuit layer 600 and part of the substrate layer 500. It can prevent accidental short circuit and environmental influence (such as moisture, etc.), protect the stability and safety of the circuit, and increase the durability of the substrate 100. In order to enable the first electronic component 300 that is too high to be fixed at the recess 101 on the substrate 100 and located in the shielding cavity 201 of the shielding cover 200, the solder mask layer 700, the circuit layer 600 and part of the substrate layer 500 are removed to make the first electronic component 300 sink relative to the upper surface 111 of the substrate 100, so as to avoid the collision of the first electronic component 300 with the shielding cover 200 due to the excessive height of the first electronic component 300 or to avoid the first electronic component 300 cannot be placed in the shielding cavity 201. Reasonable design of the substrate layer 500, the circuit layer 600 and the solder mask layer 700 can also select to improve the adhesion between layers, so that the overall substrate 100 is more stable in physics and electricity.

[0034] Referring to Figures 1 to 4In some embodiments of the present application, the lens module 10 further comprises a lens seat 800 and a lens 801 arranged in the lens seat 800. The lens seat 800 is fixed on the substrate 100. The number of shielding covers 200 is two, and the two shielding covers 200 are located on opposite sides of the lens seat 800. The direct fixing design of the lens seat 800 makes the assembly process more convenient, reduces the assembly steps, and improves the production efficiency. The lens seat 800 is located on one side of the shielding cover 200, which helps to optimize the overall space utilization, reasonably layout the electronic components, the lens seat 800 and other components, and avoid the influence of space limitation on the design flexibility. This design helps to integrate the lens 801 and its corresponding electronic components more closely, reduces the occupied space of the overall lens module 10, and meets the market demand for miniaturization.

[0035] Please refer to Figure 2 In some embodiments of the present application, the material of the shielding cover 200 is iron. Iron is a good conductive material, which has good shielding effect on electromagnetic waves and electrostatic discharge (ESD), and can effectively protect the internal electronic components from external interference. Iron has high mechanical strength, which can provide good protection for the internal structure and prevent physical impact and external environment from damaging the electronic components.

[0036] The embodiments of the present application also provide an electronic device comprising the lens module 10 described above. Integrating the lens module 10 into the electronic device can improve its image acquisition and shooting capability, especially in ultra-thin devices. This can meet the demand for high image quality and improve user experience. The structure of the lens module 10 is optimized, which helps to realize the lightweight design of the overall electronic device, is suitable for the trend of miniaturization of today's consumer electronics products, and meets the market and user demand.

[0037] The above embodiments are only used to illustrate the technical solutions of the present application rather than limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and essence of the technical solutions of the present application.

Claims

1. A lens module, characterized in that, The lens module comprises: a substrate provided with a recess; a shielding cover arranged on the substrate and covering the recess; and a first electronic component, at least a part of which is arranged in the recess. The substrate comprises an upper surface and a lower surface arranged oppositely, the recess is arranged on the upper surface, a shielding cavity is formed between the shielding cover and the upper surface, the recess communicates with the shielding cavity, and the first electronic component further extends into the shielding cavity from the recess.

2. The lens module according to claim 1, wherein, The recess does not penetrate the lower surface.

3. The lens module according to claim 2, wherein, The lens module further comprises a second electronic component, the height of the second electronic component is less than the height of the first electronic component, and the second electronic component is fixed to the upper surface.

4. The lens module according to claim 2, wherein, A bottom wall of the recess is provided with a solder pad, and the first electronic component is electrically connected to the substrate through the solder pad.

5. The lens module according to claim 2, wherein, The depth of the recess is 0.1-0.2 mm.

6. The lens module according to claim 1, wherein, The substrate comprises a substrate layer, a circuit layer and a solder mask layer arranged in sequence, the shielding cover is arranged on the solder mask layer, the solder mask layer is used for covering at least part of the circuit layer, and the recess penetrates the solder mask layer, the circuit layer and part of the substrate layer.

7. The lens module according to claim 1, wherein, The lens module further comprises a lens holder and a lens arranged in the lens holder, the lens holder is fixed to the substrate, the number of the shielding covers is two, and the two shielding covers are located on opposite sides of the lens holder. 8.The lens module according to claim 1, wherein, The shielding cover is made of iron. 9.The lens module according to claim 1, wherein, The lens module comprises any one of claims 1-9.

10. An electronic device, comprising: The lens module comprises any one of claims 1-9.

Images