Quantum cascade laser packaging heat dissipation device
By combining a shell, heat sink, semiconductor thermoelectric cooling components, and heat dissipation fins, the problem of heat accumulation during the operation of quantum cascade lasers is solved, achieving efficient heat dissipation and extending the lifespan of the laser.
Patent Information
- Application Number
- CN202520240608.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2035-02-14
AI Technical Summary
Quantum cascade lasers generate a lot of heat during operation, leading to problems such as decreased gain and shortened lifetime.
It adopts an encapsulation structure consisting of a shell, heat sink, semiconductor thermoelectric cooling component, and multiple heat dissipation fins. Heat is conducted to the semiconductor thermoelectric cooling component through the heat sink for cooling, and the heat dissipation fins further dissipate heat, achieving efficient heat dissipation.
It effectively reduces the temperature of quantum cascade lasers, ensuring normal operation and extending their service life.
Smart Images
Figure CN223757840U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to semiconductor laser technical field especially relates to a quantum cascade laser package heat abstractor. BACKGROUND
[0002] Quantum cascade laser (Quantum Cascade Lasers, QCL) is a new type of unipolar semiconductor device based on the sub-band transition of the conduction band of the electron in the semiconductor quantum well and the phonon-assisted resonant tunneling principle. Quantum cascade laser has a multi-layer quantum well structure, and when the electron jumps from a high-energy state to a low-energy state, a photon is emitted, accompanied by the release of light energy and heat energy.
[0003] When the quantum cascade laser works, the active region generates heat, and the active region is in the central region, so the heat cannot dissipate by itself. At this time, the temperature of the laser rises due to heat accumulation, and the carriers in the active region have the opportunity to be thermally excited to a higher energy continuum, resulting in electron leakage; at the same time, the electrons in the next injection region may also backfill to the lasing lower level in the previous active region. These two cases will cause the carrier inversion number between the lasing energy levels to drop, resulting in a decrease in the gain of the laser, which affects the normal operation of the device. In addition, due to the influence of temperature rise, the difference in thermal expansion coefficient between the layers of materials in the quantum cascade laser will cause local stress between the layers of materials, and intensify the atomic diffusion between the layers of materials, ultimately leading to device degradation and shortening the service life of the quantum cascade laser. SUMMARY
[0004] The quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application aims to solve the problem that the quantum cascade laser generates a large amount of heat when it works and cannot dissipate by itself, thereby inducing a decrease in the gain of the laser and shortening the service life.
[0005] The quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application comprises an outer shell, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration assembly, and a plurality of heat dissipation fins. Each of the heat dissipation fins is vertically arranged on the inner bottom surface of the outer shell. The heat sink is arranged inside the outer shell, and the bottom end surface of the heat sink abuts to one end of the plurality of heat dissipation fins away from the inner bottom surface of the outer shell. The quantum cascade laser is arranged on the top end surface of the heat sink and connected to the top end of the semiconductor thermoelectric refrigeration assembly. The top end of the semiconductor thermoelectric refrigeration assembly is attached to the top end surface of the heat sink. The heat sink is used to control the working temperature of the quantum cascade laser. The semiconductor thermoelectric refrigerator in the semiconductor thermoelectric refrigeration assembly is connected to the heat sink to adjust the temperature of the heat sink. Each of the heat dissipation fins is used to absorb the heat of the semiconductor thermoelectric refrigeration assembly.
[0006] In some embodiments, the water cooling channel is arranged in multiple bends inside the heat sink.
[0007] In some embodiments, the semiconductor thermoelectric refrigeration assembly comprises the semiconductor thermoelectric refrigerator and a temperature measurement assembly; the semiconductor thermoelectric refrigerator is connected to the heat sink; the temperature measurement assembly is arranged on the top end surface of the semiconductor thermoelectric refrigerator to be attached to the top end surface of the heat sink and abut to the quantum cascade laser.
[0008] In some embodiments, the heat dissipation fins comprise a plurality of first heat dissipation fins and a plurality of second heat dissipation fins; the top ends of the first heat dissipation fins abut to the semiconductor thermoelectric refrigerator in the semiconductor thermoelectric refrigeration assembly, and the bottom ends of the first heat dissipation fins abut to the inner bottom surface of the housing; the top ends of the second heat dissipation fins abut to the bottom end of the heat sink, and the bottom ends of the second heat dissipation fins abut to the inner bottom surface of the housing.
[0009] In some embodiments, the opposite two side walls of the housing are respectively provided with a first heat dissipation fan and a second heat dissipation fan; each of the heat dissipation fins is arranged between the first heat dissipation fan and the second heat dissipation fan; the extension axis of each of the heat dissipation fins is parallel to the line between the first heat dissipation fan and the second heat dissipation fan.
[0010] In some embodiments, the housing comprises a base and a protective shell; the protective shell is connected to the base from above; each of the heat dissipation fins is vertically arranged on the inner bottom surface of the base; the protective shell is provided with a laser window; the laser window is opposite to the quantum cascade laser for the laser generated by the quantum cascade laser to pass through.
[0011] In some embodiments, the base comprises a support bottom plate and an enclosing wall; the enclosing wall is connected to the top end of the support bottom plate; each of the heat dissipation fins is vertically arranged on the top surface of the support bottom plate; the quantum cascade laser, the heat sink, the semiconductor thermoelectric refrigeration assembly and each of the heat dissipation fins are enclosed by the enclosing wall; the enclosing wall is provided with a lens window opposite to and communicating with the laser window.
[0012] In some embodiments, the laser window is symmetrically arranged in the opposite two side walls of the protective shell; the lens window is symmetrically arranged in the opposite two side walls of the enclosing wall; each of the laser windows is provided with a lens mount; the lens mount is connected with a lens facing the quantum cascade laser.
[0013] In some embodiments, the enclosing wall is provided with a limiting clamping tooth protruding therefrom; the edge of the heat sink is fixedly clamped to the limiting clamping tooth.
[0014] In some embodiments, a ventilation hole is formed on the shell, and the ventilation hole is in communication with the inside of the shell and the outside of the shell, and is used to provide flowing air for heat dissipation.
[0015] The quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application comprises a shell, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration assembly and a plurality of heat dissipation fins, each of the heat dissipation fins is vertically arranged on the inside bottom surface of the shell, the heat sink is arranged in the inside of the shell, and the bottom end surface of the heat sink is abutted to one end of a plurality of heat dissipation fins of the plurality of heat dissipation fins which is away from the inside bottom surface of the shell, the quantum cascade laser is arranged on the top end surface of the heat sink, and is connected to the top end of the semiconductor thermoelectric refrigeration assembly, the top end of the semiconductor thermoelectric refrigeration assembly is attached to the top end surface of the heat sink, the heat sink is used to control the working temperature of the quantum cascade laser, the semiconductor thermoelectric refrigerator in the semiconductor thermoelectric refrigeration assembly is connected to the heat sink, and is used to adjust the temperature of the heat sink, and each of the heat dissipation fins is used to absorb the heat of the semiconductor thermoelectric refrigeration assembly. The embodiment of the present application can realize the conduction of the heat generated by the quantum cascade laser during operation to the heat sink, and the semiconductor thermoelectric refrigeration assembly performs refrigeration according to the temperature of the heat sink to reduce the temperature of the heat sink, so that heat dissipation is realized. In addition, the heat dissipation fins can absorb and further dissipate the heat transmitted by the semiconductor thermoelectric refrigeration assembly, so that efficient and rapid heat dissipation of the quantum cascade laser is realized, the service life of the quantum cascade laser can be prolonged while the normal operation of the quantum cascade laser is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.
[0017] Figure 1 The exploded structure schematic diagram of the quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application is shown in the figure.
[0018] Figure 2 Another angle schematic diagram of the quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application after disassembly is shown in the figure.
[0019] Figure 3 The cross-sectional view of the heat sink in the quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application is shown in the figure.
[0020] Figure 4The connecting schematic view of the top end of the heat sink, the quantum cascade laser and the temperature measuring component in the quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application is shown in the figure;
[0021] Figure 5 The connecting schematic view of the bottom end of the heat sink and the semiconductor thermoelectric refrigerator in the quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application is shown in the figure;
[0022] Figure 6 The cross-sectional view of the quantum cascade laser packaging heat dissipation device provided by the embodiment of the present application is shown in the figure.
[0023] Specifically, the reference signs are as follows:
[0024] 10, quantum cascade laser packaging heat dissipation device; 100, shell; 110, first heat dissipation fan; 120, second heat dissipation fan; 130, protective shell; 131, laser window; 140, base; 141, support bottom plate; 142, enclosing wall; 143, lens window; 144, limiting clamping tooth; 150, ventilation hole; 200, quantum cascade laser; 210, metal electrode layer; 220, active region; 300, heat sink; 310, water cooling channel; 400, semiconductor thermoelectric refrigerator component; 410, semiconductor thermoelectric refrigerator; 420, temperature measuring component; 421, thermistor; 422, resistance mounting seat; 500, heat dissipation fin; 510, first heat dissipation fin; 520, second heat dissipation fin; 600, lens bayonet; 610, lens. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0026] It should be understood that, when used in the specification and the appended claims, the terms "comprise" and "include" indicate the existence of described features, integers, steps, operations, elements and / or components, but do not exclude one or more other features, integers, steps, operations, elements, components and / or sets thereof.
[0027] It should also be understood that the terms used in the present application are merely for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, unless otherwise clearly indicated by the context, the singular forms "a", "an" and "the" are intended to include the plural forms.
[0028] It should be further understood that the term "and / or" as used in the specification and in the claims, if any, means any one and / or any combination of one or more of the associated listed items.
[0029] Please refer to Figures 1-6 As Figure 1 and Figure 2 It is shown that the application embodiment provides a quantum cascade laser packaging heat dissipation device 10, which comprises a shell 100, a quantum cascade laser 200, a heat sink 300, a semiconductor thermoelectric refrigeration assembly 400 and a plurality of heat dissipation fins 500; each heat dissipation fin 500 is vertically arranged on the inner bottom surface of the shell 100; the heat sink 300 is arranged in the shell 100, and the bottom end surface of the heat sink 300 abuts to one end of the plurality of heat dissipation fins away from the inner bottom surface of the shell 100; the quantum cascade laser 200 is arranged on the top end surface of the heat sink 300, and is connected to the top end of the semiconductor thermoelectric refrigeration assembly 400; the top end of the semiconductor thermoelectric refrigeration assembly 400 is attached to the top end surface of the heat sink 300; the heat sink 300 is used for controlling the working temperature of the quantum cascade laser 200; the semiconductor thermoelectric refrigeration assembly 400 is connected to the heat sink 300, and is used for adjusting the temperature of the heat sink 300; each heat dissipation fin 500 is used for absorbing the heat of the semiconductor thermoelectric refrigeration assembly 400.
[0030] In the embodiment, the shell 100 is a containing structure with a cavity, and the cavity inside the shell 100 is used to contain the quantum cascade laser 200, the heat sink 300, the semiconductor thermoelectric refrigeration assembly 400 and the heat dissipation fins 500. Inside the shell 100, the heat dissipation fins 500 are fixedly connected to the inner bottom surface of the shell 100, and each of the heat dissipation fins 500 is perpendicular to the inner bottom surface of the shell 100, forming a vertical plate-shaped heat dissipation structure. Since each of the heat dissipation fins 500 is perpendicular to the inner bottom surface of the shell 100, and the top ends of each of the heat dissipation fins 500 are flush with each other, the top ends of all the heat dissipation fins 500 are located in a support plane, and the heat sink 300 is placed on the semiconductor thermoelectric refrigeration assembly 400. The heat sink 300 is a metal plate-shaped structure with a certain thickness, which can be made of high thermal conductivity materials, such as pure copper or aluminum. The number of the quantum cascade lasers 200 can be one or more, and each of the quantum cascade lasers 200 has a metal electrode layer 210 at the bottom end, and each of the quantum cascade lasers 200 is connected to the top end of the heat sink 300 through the metal electrode layer 210 at the bottom end, and realizes heat conduction through the metal electrode layer 210 and the heat sink 300. Above the metal electrode layer 210 is an active region 220 of the quantum cascade laser 200, and the heat generated by the active region 220 is transmitted to the heat sink 300 through the metal electrode layer 210. Further, the heat generated by the quantum cascade laser 200 during operation can be transmitted to the heat sink 300, and further transmitted to the semiconductor thermoelectric refrigeration assembly 400 and then to the heat dissipation fins 500 by the heat sink 300.
[0031] The semiconductor thermoelectric refrigerator 410 in the semiconductor thermoelectric refrigeration assembly 400 is connected to the heat sink 300, the top end of the semiconductor thermoelectric refrigeration assembly 400 (in particular, the temperature measurement assembly 420 at the top end of the semiconductor thermoelectric refrigeration assembly 400) is attached to the top end surface of the heat sink 300 to be connected with the quantum cascade laser 200, and the bottom end surface of the semiconductor thermoelectric refrigeration assembly 400 (in particular, the semiconductor thermoelectric refrigerator 410) is in contact with the top end surface of the heat dissipation fin 500, which has a refrigeration circuit inside and can perform refrigeration to reduce the temperature of the heat sink 300. Further, after the heat generated by the quantum cascade laser 200 is absorbed by the heat sink 300, the semiconductor thermoelectric refrigeration assembly 400 can timely reduce the temperature of the heat sink 300 to dissipate the heat generated by the quantum cascade laser 200, thereby reducing the temperature of the quantum cascade laser 200 itself and ensuring the normal operation of the quantum cascade laser 200. At the same time, another part of the heat transferred to the heat dissipation fin 500 is dissipated through the large-area contact between the heat dissipation fin 500 and the air. Further, the semiconductor thermoelectric refrigeration assembly 400 can effectively dissipate the heat absorbed by the heat sink 300, and the heat dissipation fin 500 can further dissipate the remaining heat. Each heat dissipation fin 500 can be arranged in parallel to achieve uniform heat absorption and dissipation, and the heat dissipation fin 500 can be made of pure copper or aluminum to ensure the efficiency of heat absorption and dissipation.
[0032] In an embodiment, as shown in Figure 1 The water cooling channel 310 is provided inside the heat sink 300 and extends through the two end walls of the heat sink 300 for flowing cooling water to reduce the temperature of the heat sink 300.
[0033] In this embodiment, the heat sink 300 has a certain thickness, and the water cooling channel 310 extending through the two end walls of the heat sink 300 can be provided therein. Specifically, the two ends of the water cooling channel 310 are opened on the side walls of the heat sink 300, and the plane through which the water cooling channel 310 passes can be parallel to the top end and the bottom surface of the heat sink 300 to ensure the efficiency of heat dissipation. In the specific design and production, a through hole can be provided on the shell 100 for a cooling water pipe to access the water cooling channel 310, so that flowing cooling water is introduced into the water cooling channel 310 to accelerate the heat dissipation effect of the cooling water. The refrigeration effect generated by the semiconductor thermoelectric refrigeration assembly 400 also acts on the cooling water in the water cooling channel 310, and more heat is taken away by the cooled cooling water. As shown in Figure 6
[0034] In an embodiment, as shown in Figure 3 As shown, the water cooling channel 310 is formed in the interior of the heat sink 300 in multiple bends.
[0035] In the embodiment, the water cooling channel 310 can be provided only one, which is bent multiple times in the interior of the heat sink 300, presents multiple continuous S-shaped structures, and the multiple S-shaped structures in the water cooling channel 310 are uniformly distributed in the interior of the heat sink 300, which can realize uniform heat dissipation of the heat sink 300 at each position.
[0036] In an embodiment, as shown in Figure 4 and Figure 5 The semiconductor thermoelectric refrigeration assembly 400 includes a semiconductor thermoelectric refrigerator 410 and the temperature measurement assembly 420; the semiconductor thermoelectric refrigerator 410 is connected to the heat sink 300; the temperature measurement assembly 420 is arranged on the top end surface of the semiconductor thermoelectric refrigerator 410 to be attached to the top end surface of the heat sink 300 and abut to the quantum cascade laser 200.
[0037] In the embodiment, the semiconductor thermoelectric refrigerator 410 is the main device for refrigeration, which can reduce its internal energy through Peltier effect (also known as thermoelectric effect), thereby realizing refrigeration. The semiconductor thermoelectric refrigerator 410 is connected to the surface of the heat sink 300 and fully contacts the heat sink 300, thereby being able to fully reduce the surface temperature of the heat sink 300. At the same time, the single temperature measurement assembly 420 includes a thermistor 421 and a resistance mounting seat 422, the resistance mounting seat 422 can be fixedly connected to the heat sink 300, and the thermistor 421 is fixedly connected to the heat sink 300 through the resistance mounting seat 422. The single temperature measurement assembly 420 corresponds to the single quantum cascade laser 200, the thermistor 421 in the temperature measurement assembly 420 abuts to the quantum cascade laser 200, which can sensitively sense the temperature change of the quantum cascade laser 200 and adjust the working state and refrigeration rate of the semiconductor thermoelectric refrigerator through the connection with the semiconductor thermoelectric refrigerator 410. Specifically, the current direction of the semiconductor inside the semiconductor thermoelectric refrigerator 410 can be changed according to the temperature feedback of the thermistor 421, thereby adjusting the cooling rate of the semiconductor thermoelectric refrigerator 410.
[0038] In an embodiment, as shown in Figures 1-6As shown, the heat dissipation fins 500 include a plurality of first heat dissipation fins 510 and a plurality of second heat dissipation fins 520; the top ends of the plurality of first heat dissipation fins 510 abut the semiconductor thermoelectric refrigeration device 410 in the semiconductor thermoelectric refrigeration assembly 400, and the bottom ends of the plurality of first heat dissipation fins 510 abut the inner bottom surface of the housing 100; the top ends of the plurality of second heat dissipation fins 520 abut the bottom end of the heat sink 300, and the bottom ends of the plurality of second heat dissipation fins 520 abut the inner bottom surface of the housing 100.
[0039] In the present embodiment, the semiconductor thermoelectric refrigeration assembly 400 is arranged on the bottom end of the heat sink 300 and on the heat dissipation fins, so as to simultaneously cool the heat sink 300 and the heat dissipation fins 500, and further improve the heat dissipation efficiency. The number and arrangement of the heat dissipation fins are arranged according to the size of the bottom area of the heat sink 300 and the size of the semiconductor thermoelectric refrigeration assembly 400. More specifically, the heat dissipation fins 500 are divided into two types, i.e., the first heat dissipation fins 510 and the second heat dissipation fins 520; the first heat dissipation fins 510 have their top ends abutting the semiconductor thermoelectric refrigeration device 410 in the semiconductor thermoelectric refrigeration assembly 400, and their bottom ends abutting the inner bottom surface of the housing 100, so that the semiconductor thermoelectric refrigeration device 410 can be used to simultaneously cool the heat sink 300 and the heat dissipation fins 500. The first heat dissipation fins 510 have their top ends abutting the bottom end of the heat sink 300, and the second heat dissipation fins 520 have their bottom ends abutting the inner bottom surface of the housing 100, so that the heat in the heat sink 300 can also be transferred to the second heat dissipation fins 520 for heat dissipation.
[0040] In an embodiment, as shown in Figure 1 and Figure 2 shown, the first heat dissipation fan 110 and the second heat dissipation fan 120 are respectively arranged on the opposite side walls of the housing 100; each heat dissipation fin 500 is arranged between the first heat dissipation fan 110 and the second heat dissipation fan 120; and the extension axis of each heat dissipation fin 500 is parallel to the line connecting the first heat dissipation fan 110 and the second heat dissipation fan 120.
[0041] In the embodiment, the first heat dissipation fan 110 and the second heat dissipation fan 120 are arranged on the opposite side walls of the shell 100, and the first heat dissipation fan 110 and the second heat dissipation fan 120 are both in communication with the inside and outside of the shell 100. Further, when the first heat dissipation fan 110 and the second heat dissipation fan 120 work simultaneously, strong air flow can be formed inside the shell 100. Each heat dissipation fin 500 is a plate-shaped structure with a certain length, and the axis is arranged in a direction parallel to the line connecting the first heat dissipation fan 110 and the second heat dissipation fan 120. Further, the air driven by the first heat dissipation fan 110 and the second heat dissipation fan 120 can uniformly flow through the two side walls with a larger area of each heat dissipation fin 500, further accelerating the dissipation of the heat absorbed by the heat dissipation fin 500.
[0042] In an embodiment, as shown in Figure 1 The shell 100 includes a base 140 and a protective shell 130. The protective shell 130 is connected to the base 140 from above. Each heat dissipation fin 500 is vertically arranged on the inner bottom surface of the base 140. The protective shell 130 is provided with a laser window 131. The laser window 131 is opposite to the quantum cascade laser 200, and is used for the laser generated by the quantum cascade laser 200 to pass out.
[0043] In the embodiment, the shell 100 includes a base 140 at the bottom and a protective shell 130 sleeved on the base 140. The protective shell 130 is made of metal material to stably protect the quantum cascade laser 200 inside the shell 100. The protective shell 130 is detachably connected with the base 140. When the protective shell 130 is detached from the base 140, the overall structure of the quantum cascade laser 200, the heat sink 300 and the semiconductor thermoelectric refrigeration assembly 400 inside the shell 100 can also be detached for maintenance and maintenance. The base 140 and the heat dissipation fin 500 are arranged in an integrated structure to ensure the stability of support and heat dissipation. At the same time, the side wall of the protective shell 130 is also provided with a laser window 131 to guide the laser generated by the quantum cascade laser 200 to the outside of the shell 100 when the quantum cascade laser 200 works.
[0044] The laser window 131 can be arranged according to the specific position of the quantum cascade laser 200, such as being arranged on the opposite side walls of the protective shell 130.
[0045] In an embodiment, as shown in Figure 2 and Figure 6As shown, the base 140 comprises a support bottom plate 141 and an enclosing wall 142; the enclosing wall 142 is connected to the top end of the support bottom plate 141; each heat dissipation fin 500 is vertically arranged on the top surface of the support bottom plate 141; the quantum cascade laser 200, the heat sink 300, the semiconductor thermoelectric refrigeration assembly 400 and each heat dissipation fin 500 are enclosed by the enclosing wall 142; the enclosing wall 142 is provided with a lens window 143 opposite to and communicating with the laser window 131.
[0046] In the embodiment, the support bottom plate 141 is a flat plate structure, which can be made of metal material to further dissipate the heat absorbed by the heat dissipation fins 500. The enclosing wall 142 is protrudingly arranged at the top end of the support bottom plate 141, which has four side walls connected head to tail, forming a four-sided enclosing structure. The central part of the enclosing wall 142 forms an enclosing cavity, in which the quantum cascade laser 200, the heat sink 300, the semiconductor thermoelectric refrigeration assembly 400 and each heat dissipation fin 500 are located, so as to fix and protect each device. Specifically, the edges of the heat sink 300 can be arranged to fit on the inner side walls of the enclosing wall 142, so as to stably fix the heat sink 300. Meanwhile, one of the side walls of the enclosing wall 142 is provided with the lens window 143 opposite to and communicating with the laser window 131, so as to smoothly guide the laser out of the shell 100. When the protective shell 130 is sleeved on the base 140, the inner side walls of the protective shell 130 fit on the outer side walls of the enclosing wall 142.
[0047] In an embodiment, the laser window 131 is symmetrically arranged on the two opposite side walls of the protective shell 130; the lens window 143 is symmetrically arranged on the two opposite side walls of the enclosing wall 142; each laser window 131 is sleeved with a lens mount 600; the lens mount 600 is connected with a lens 610 facing the quantum cascade laser 200.
[0048] In the embodiment, the laser window 131 is arranged on the two opposite side walls of the protective shell 130, and correspondingly, the lens window 143 is symmetrically arranged on the two opposite side walls of the enclosing wall 142. In addition, the lens 610 for adjusting the laser can be installed on the laser window 131. Specifically, a lens mount 600 can be sleeved on the laser window 131, and the lens 610 is installed on the lens mount 600. The outer contour of the lens 610 is matched with the laser window 131, so as to collimate the laser generated by the quantum cascade laser 200 during operation. The lens mount 600 can further be provided with a movable adjusting assembly to adjust the focal length of the lens 610.
[0049] In an embodiment, as shown in Figure 6 the enclosing wall 142 is protrudingly provided with a limiting clamping tooth 144; the edges of the heat sink 300 are fixedly clamped to the limiting clamping tooth 144.
[0050] In the embodiment, the limiting clamping teeth 144 are protruded on the inner side wall of the enclosing wall 142, and can be clamped on the base 140 by the limiting clamping teeth 144 when the heat sink 300 is installed into the base 140 from above, so as to prevent loosening and ensure the stability of the quantum cascade laser package heat dissipation device 10 during operation.
[0051] In an embodiment, as shown in Figure 2 and Figure 6 The shell 100 is provided with a ventilation hole 150; the ventilation hole 150 is connected between the inside of the shell 100 and the outside of the shell 100, and is used to provide flowing air for heat dissipation.
[0052] In the embodiment, the ventilation hole 150 is provided on the side wall of the shell 100, and needs to be provided on two opposite side walls of the shell 100, so as to ensure the air circulation in the shell 100 and further ensure the heat dissipation effect. The two ventilation holes 150 located on the two opposite side walls and facing each other are a group of ventilation holes 150, and multiple groups of ventilation holes 150 can be provided on the side wall of the shell 100 to accelerate the heat dissipation efficiency.
[0053] In summary, the quantum cascade laser package heat dissipation device provided by the embodiment of the application comprises a shell, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration assembly and multiple heat dissipation fins; each of the heat dissipation fins is vertically arranged on the inner bottom surface of the shell; the heat sink is arranged in the shell, and the bottom end surface of the heat sink is abutted to one end of some of the heat dissipation fins of the multiple heat dissipation fins, which is away from the inner bottom surface of the shell; the quantum cascade laser is arranged on the top end surface of the heat sink, and is connected to the top end of the semiconductor thermoelectric refrigeration assembly; the top end of the semiconductor thermoelectric refrigeration assembly is attached to the top end surface of the heat sink; the heat sink is used to control the working temperature of the quantum cascade laser; the semiconductor thermoelectric refrigerator in the semiconductor thermoelectric refrigeration assembly is connected to the heat sink, and is used to adjust the temperature of the heat sink; each of the heat dissipation fins is used to absorb the heat of the semiconductor thermoelectric refrigeration assembly. The embodiment of the application can realize the conduction of the heat generated by the quantum cascade laser during operation to the heat sink, and the semiconductor thermoelectric refrigeration assembly can be refrigerated according to the temperature of the heat sink to reduce the temperature of the heat sink, so as to realize heat dissipation. In addition, the heat dissipation fins can absorb and further dissipate the heat transferred by the semiconductor thermoelectric refrigeration assembly, so as to realize efficient and rapid heat dissipation of the quantum cascade laser, ensure the normal operation of the quantum cascade laser, and prolong the service life of the quantum cascade laser.
[0054] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present application, and these modifications or replacements should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A quantum cascade laser package heat spreading device, comprising: The application relates to a quantum cascade laser device, which comprises a shell, a quantum cascade laser, a heat sink, a semiconductor thermoelectric refrigeration assembly and a plurality of heat dissipation fins; the heat dissipation fins are vertically arranged on the inner bottom surface of the shell; the heat sink is arranged in the shell, and the bottom end surface of the heat sink is abutted to one end of some heat dissipation fins of the plurality of heat dissipation fins, which is far away from the inner bottom surface of the shell; the quantum cascade laser is arranged on the top end surface of the heat sink and is connected with the top end of the semiconductor thermoelectric refrigeration assembly; the top end of the semiconductor thermoelectric refrigeration assembly is attached to the top end surface of the heat sink; the heat sink is used for controlling the working temperature of the quantum cascade laser; the semiconductor thermoelectric refrigerator in the semiconductor thermoelectric refrigeration assembly is connected to the heat sink and is used for adjusting the temperature of the heat sink; the heat dissipation fins are used for absorbing the heat of the heat sink and the semiconductor thermoelectric refrigeration assembly; a water cooling channel is arranged in the heat sink; the water cooling channel penetrates through both ends of the heat sink and is used for passing cooling water to reduce the temperature of the heat sink.
2. The quantum cascade laser package heat spreading device of claim 1, wherein, The water cooling channel is arranged in the heat sink in a plurality of bending modes.
3. The quantum cascade laser package heat spreading device of claim 1, wherein, The semiconductor thermoelectric refrigeration assembly comprises the semiconductor thermoelectric refrigerator and a temperature measuring assembly; the semiconductor thermoelectric refrigerator is connected to the heat sink; the temperature measuring assembly is arranged on the top end surface of the semiconductor thermoelectric refrigerator and is attached to the top end surface of the heat sink and abutted to the quantum cascade laser.
4. The quantum cascade laser package heat spreading device of claim 3, wherein, The heat dissipation fins comprise a plurality of first heat dissipation fins and a plurality of second heat dissipation fins; the top end of the first heat dissipation fins is abutted to the semiconductor thermoelectric refrigerator in the semiconductor thermoelectric refrigeration assembly, and the bottom end of the first heat dissipation fins is abutted to the inner bottom surface of the shell; the top end of the second heat dissipation fins is abutted to the bottom end of the heat sink, and the bottom end of the second heat dissipation fins is abutted to the inner bottom surface of the shell.
5. The quantum cascade laser package heat spreading device of claim 1, wherein, The opposite two side walls of the shell are respectively provided with a first heat dissipation fan and a second heat dissipation fan; the heat dissipation fins are arranged between the first heat dissipation fan and the second heat dissipation fan; the extension axis of the heat dissipation fins is parallel to the line between the first heat dissipation fan and the second heat dissipation fan.
6. The quantum cascade laser package heat spreading device of claim 1, wherein, The shell comprises a base and a protective shell; the protective shell is connected to the base in a sleeved mode from the top of the base; the heat dissipation fins are vertically arranged on the inner bottom surface of the base; a laser window is arranged on the protective shell; the laser window is opposite to the quantum cascade laser and is used for allowing the laser generated by the quantum cascade laser to pass out.
7. The quantum cascade laser package heat spreading device of claim 6, wherein, The base comprises a supporting bottom plate and an enclosing wall; the enclosing wall is connected to the top end of the supporting bottom plate; the heat dissipation fins are vertically arranged on the top surface of the supporting bottom plate; The quantum cascade laser, the heat sink, the semiconductor thermoelectric refrigeration assembly and the heat dissipation fins are enclosed by the enclosing wall; a lens window is arranged on the enclosing wall and is opposite to and communicates with the laser window.
8. The quantum cascade laser package heat spreading device of claim 7, wherein, The laser windows are symmetrically arranged on two opposite side walls of the protection shell; the lens windows are symmetrically arranged on two opposite side walls of the enclosing wall; a lens socket is arranged on each laser window; and a lens is connected to the lens socket and faces the quantum cascade laser.
9. The quantum cascade laser package heat spreading device of claim 7, wherein, A limiting clamping tooth is protruded on the enclosing wall; and an edge of the heat sink is fixedly connected to the limiting clamping tooth.
10. The quantum cascade laser package heat spreading device of claim 1, wherein, Ventilation holes are arranged on the shell; the ventilation holes are connected between the inside of the shell and the outside of the shell, and are used for providing flowing air to dissipate heat.