Embedded heat pipe heat dissipation structure of circuit board

Abstract

The utility model discloses a circuit board embedded heat pipe heat radiation structure, comprising a board body, the middle part of which is provided with a cavity; the water cooling assembly is arranged in the cavity, the water cooling assembly is filled with a heat dissipation medium, and the heat dissipation medium can circulate in the cavity so as to be suitable for reducing heat of the plate body; the heat dissipation assembly is arranged at the bottom of the plate body, and the heat dissipation assembly can rotate at the bottom of the plate body so as to be suitable for dissipating heat of the plate body.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely relates to a circuit board embedded heat pipe heat dissipation structure. BACKGROUND

[0002] The name of circuit board has: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, super thin circuit board, super thin circuit board, printing (copper etching technology) circuit board etc.

[0003] The heat dissipation mode of the existing circuit board is generally through the combination of the heat dissipation teeth and the heat dissipation fan to dissipate heat, and this heat dissipation mode is better used on small circuit boards, but larger circuit boards need to use multiple fans to dissipate heat, thereby leading to cost increase. SUMMARY

[0004] The utility model aims at at least one of the technical problems in the related art to some extent. To this end, one purpose of the utility model is to provide a circuit board embedded heat pipe heat dissipation structure, comprising:

[0005] The board body is provided with a cavity in the middle part;

[0006] The water cooling assembly is arranged in the cavity, and the water cooling assembly is filled with a heat dissipation medium, and the heat dissipation medium can circulate in the cavity to reduce the heat of the board body;

[0007] The heat dissipation assembly is arranged at the bottom of the board body, and the heat dissipation assembly can rotate at the bottom of the board body to dissipate the heat of the board body.

[0008] Preferably, the water cooling assembly comprises:

[0009] The pipeline is laid in the cavity;

[0010] The micro water pump is communicated with the water outlet and the water inlet of the pipeline.

[0011] Preferably, the heat dissipation medium circulates in the pipeline.

[0012] Preferably, the cavity is filled with a graphite sheet, and the height of the graphite sheet is flush with the height of the pipeline.

[0013] Preferably, the top and bottom of the graphite sheet and the bottom of the pipeline are coated with a first heat-conducting double-sided adhesive.

[0014] Preferably, the heat dissipation assembly comprises:

[0015] The heat dissipation tooth is arranged at the bottom of the plate body.

[0016] The heat dissipation fan is arranged at the bottom of the heat dissipation tooth.

[0017] Preferably, the heat dissipation tooth and the plate body are coated with a second heat-conducting double-sided adhesive tape.

[0018] Preferably, the heat dissipation medium is deionized pure water or ethylene glycol.

[0019] Preferably, the bottom of the heat dissipation fan is provided with a filter screen.

[0020] The above scheme of the utility model has at least the following beneficial effects:

[0021] When the plate body works, heat is generated, the heat dissipation medium in the water cooling assembly circulates in the cavity, and the heat dissipated by the plate body is reduced through the circulating heat dissipation medium; the bottom of the plate body is further provided with a heat dissipation assembly, and the heat dissipation assembly can blow cold air to the plate body or dissipate the heat of the plate body when rotating;

[0022] The cooperation of the water cooling assembly and the heat dissipation assembly can efficiently reduce the heat of the plate body, and the water cooling is embedded in the plate body, without occupying the external space of the circuit board, so that the structure is miniaturized and compacted; this is favorable for the installation and layout of the circuit board in the limited space, and improves the overall integration and aesthetic degree of the electronic equipment.

[0023] The additional aspects and advantages of the utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from the structure shown in these drawings without creative labor.

[0025] Figure 1 It is the structure schematic view of the circuit board embedded heat pipe heat dissipation structure provided in the embodiments of the utility model;

[0026] Figure 2 It is the A part of the enlarged view of Figure 1

[0027] Figure 3 It is the B-B sectional structure schematic view of Figure 1

[0028] Figure 4 It is​​Figure 3 Enlarged view of C part of Fig. 1;

[0029] Figure 5 It is the structure schematic view of water cooling assembly provided in the embodiment of the utility model.

[0030] Explanation of reference numerals:

[0031] 1, plate body, 2, water cooling assembly, 3, heat dissipation assembly;

[0032] 201, pipeline, 202, micro water pump, 203, graphite sheet, 204, first heat-conducting double-sided adhesive;

[0033] 301, heat dissipation tooth, 302, heat dissipation fan, 303, second heat-conducting double-sided adhesive.

[0034] The realization, functional features and advantages of the utility model will be further explained by combining with the embodiments and referring to the drawings. DETAILED DESCRIPTION

[0035] The embodiments of the utility model will be described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the utility model, and cannot be understood as a limitation of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0036] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the utility model.

[0037] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0038] In the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connect, can be mechanical connection, also can be electrical connection, can be direct connection, also can indirectly connect through intermediate medium, can be the intercommunication of two elements.

[0039] In the utility model, unless another definite provision and limitation, first feature is "on" or "under" second feature can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through another feature between them.

[0040] The circuit board embedded heat pipe heat dissipation structure of the utility model embodiment is described in detail below with reference to the drawings.

[0041] Please refer to Figures 1 to 5 In the embodiment, including: the plate body 1, the middle part of the plate body 1 is equipped with a cavity, the water cooling assembly 2 is arranged in the cavity, the water cooling assembly 2 is filled with heat dissipation medium, the heat dissipation medium can circulate in the cavity to reduce the heat of the plate body 1, the heat dissipation assembly 3 is arranged at the bottom of the plate body 1, the heat dissipation assembly 3 can rotate at the bottom of the plate body 1 to dissipate the heat of the plate body 1, when the plate body 1 works and emits heat, the heat dissipation medium in the water cooling assembly 2 circulates in the cavity, the heat emitted by the plate body 1 is reduced through the circulating heat dissipation medium, the bottom of the plate body 1 is also equipped with the heat dissipation assembly 3, the heat dissipation assembly 3 can blow cold wind to the plate body 1 or dissipate the heat of the plate body 1 when rotating,

[0042] The cooperation of the water cooling assembly 2 and the heat dissipation assembly 3 can efficiently reduce the heat of the plate body 1, and the water cooling is embedded in the plate body 1, without occupying the external space of the circuit board, realizing the miniaturization and compactness of the structure, which is conducive to the installation and layout of the circuit board in limited space, improves the overall integration and aesthetic degree of the electronic equipment.

[0043] In the embodiment, the water cooling assembly 2 comprises: a pipeline 201 laid in the cavity; a micro water pump 202 in communication with the water outlet and the water inlet of the pipeline 201; a heat dissipation medium circulating in the pipeline 201; the water pump drives the heat dissipation medium to circulate in the pipeline 201, so that the heat dissipation medium can effectively reduce the temperature of the board 1; and the pipeline 201 covers in the cavity, greatly increasing the heat dissipation area, so that the heat can be quickly conducted and taken away by the heat dissipation medium, thereby improving the heat dissipation efficiency; the heat dissipation medium in the pipeline 201 can continuously and stably transfer heat, avoiding the problem of uneven heat dissipation caused by the change of fan speed, thereby ensuring the stable operation of the circuit board.

[0044] In the embodiment, the cavity is filled with a graphite sheet 203, and the height of the graphite sheet 203 is flush with the height of the pipeline 201; the graphite sheet 203 can effectively uniformly disperse heat and also transfer heat to the pipeline 201, thereby accelerating the reduction of the temperature of the board 1.

[0045] In the embodiment, the top and bottom of the graphite sheet 203 and the bottom of the pipeline 201 are coated with a first heat-conducting double-sided adhesive 204; the first heat-conducting double-sided adhesive 204 can fill the gaps between the top and bottom of the graphite sheet 203 and the cavity and the gaps between the bottom of the pipeline 201 and the cavity, effectively conducting heat from the board 1 to the pipeline 201, thereby improving the heat dissipation efficiency, and also transferring heat to the heat dissipation assembly 3 at the bottom of the board 1, so that the heat dissipation assembly 3 and the water cooling assembly 2 simultaneously dissipate heat from the board 1.

[0046] In the embodiment, the heat dissipation assembly 3 comprises: a heat dissipation tooth 301 arranged at the bottom of the board 1; and a heat dissipation fan 302 arranged at the bottom of the heat dissipation tooth 301; heat at the bottom of the board 1 is conducted to the heat dissipation tooth 301 and then dissipated by the heat dissipation fan 302, thereby assisting the water cooling assembly 2 to dissipate heat from the board 1, so that the board 1 can work stably without overheating.

[0047] In the embodiment, a second heat-conducting double-sided adhesive 303 is coated between the heat dissipation tooth 301 and the board 1; the board 1 effectively conducts heat from the board 1 to the heat dissipation tooth 301 through the second heat-conducting double-sided adhesive 303, thereby improving the heat dissipation efficiency of the board 1.

[0048] In the embodiment, the heat dissipation medium is deionized pure water or ethylene glycol; pure water is a good heat dissipation medium with high specific heat capacity, which can effectively absorb and conduct heat. At the same time, pure water is relatively cheap, environmentally friendly and non-polluting; ethylene glycol is a commonly used cooling liquid component with excellent heat conduction performance and anti-freezing performance; ethylene glycol can operate in extremely cold environments, and also has the characteristics of corrosion resistance and antibiosis.

[0049] In the embodiment, the bottom of the heat dissipation fan 302 is provided with a filter screen, which can prevent dust and other impurities from adhering to the heat dissipation fan 302, thereby ensuring that the heat dissipation fan 302 can work stably.

[0050] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0051] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation made by using the utility model specification and the contents of the drawings, or direct / indirect application in other related technical fields under the utility model concept of the utility model are included in the patent protection range of the utility model.

Claims

1. A heat pipe cooling structure for a circuit board, characterized by comprising: The utility model relates to a water-cooling and heat-dissipation board, comprising: a plate body, a middle part of the plate body being provided with a cavity; a water-cooling assembly, the water-cooling assembly being arranged in the cavity, the water-cooling assembly being filled with a heat-dissipation medium, the heat-dissipation medium being flowable in the cavity to reduce the heat of the plate body; a heat-dissipation assembly, the heat-dissipation assembly being arranged at the bottom of the plate body, the heat-dissipation assembly being rotatable at the bottom of the plate body to dissipate the heat of the plate body.

2. The circuit board embedded heat pipe heat sink structure of claim 1, wherein, The water-cooling assembly comprises: a pipeline, the pipeline being laid in the cavity; a micro water pump, the micro water pump being in communication with the water outlet and the water inlet of the pipeline.

3. The circuit board embedded heat pipe heat sink structure of claim 1, wherein, The heat-dissipation medium flows in the pipeline.

4. The circuit board embedded heat pipe heat sink structure of claim 1, wherein, The cavity is filled with a graphite sheet, the height of the graphite sheet being flush with the height of the pipeline.

5. The circuit board embedded heat pipe heat sink structure of claim 3, wherein, The top and bottom of the graphite sheet and the bottom of the pipeline are coated with a first heat-conducting double-sided adhesive tape.

6. The circuit board embedded heat pipe heat sink structure of claim 1, wherein, The heat-dissipation assembly comprises: a heat-dissipation tooth, the heat-dissipation tooth being arranged at the bottom of the plate body; a heat-dissipation fan, the heat-dissipation fan being arranged at the bottom of the heat-dissipation tooth.

7. The circuit board embedded heat pipe heat sink structure of claim 1, wherein, The heat-dissipation tooth and the plate body are coated with a second heat-conducting double-sided adhesive tape.

8. The circuit board embedded heat pipe heat sink structure of claim 1, wherein, The heat-dissipation medium is deionized pure water or ethylene glycol.

9. The circuit board embedded heat pipe heat sink structure of claim 1, wherein, The bottom of the heat-dissipation fan can be provided with a filter screen.

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