Multi-layer composite press-fit cushion

Abstract

The utility model relates to the technical field of circuit board printing press-fit buffering, and discloses a multi-layer composite press-fit buffering cushion which comprises an elastic buffering layer and an attaching layer, storage bags are evenly arranged between the elastic buffering layer and the attaching layer, an input pipe and an output pipe are fixedly arranged at the top of each storage bag, an input valve is arranged in the middle of each input pipe, and an output valve is arranged in the middle of each output pipe. And an output valve is arranged in the middle of the output pipe. The outer wall of the storage bag is made of plastic or rubber. And a second damp-proof layer is adhered between the attaching layer and the storage bag through an adhesive. A first damp-proof layer is adhered to one side, far away from the storage bag, of the elastic buffer layer through an adhesive. According to the utility model, the cooling liquid is input from the inside of the input pipe by opening the input valve, so that the problem that kraft paper is required to be placed on the pressing surface of the substrate as a buffer material during the pressing operation in the traditional printed circuit board manufacturing process, and the kraft paper is required to be frequently replaced due to the limited heat resistance of the kraft paper is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board printing press -hardening buffer technical field especially relates to multilayer composite press -hardening buffer pad. BACKGROUND

[0002] In the manufacturing process of printed circuit board (PCB), press -hardening buffer pad plays an indispensable key role. When multilayer PCB carries out press -hardening procedure, its core task is to ensure that each layer circuit board, prepreg and other materials are closely and uniformly attached together, and press -hardening buffer pad is the faithful assistant to achieve this goal. From the physical properties, it usually has good elasticity and flexibility, can effectively disperse the huge pressure from the hot press in the press -hardening process, prevents local pressure from being too high to cause damage to fine circuit layer, such as circuit indentation, open circuit and other problems. In high temperature environment, the buffer pad can still maintain stable performance, ensure that heat is evenly transmitted to each layer of plate material during hot pressing, promote the prepreg to fully melt, flow and fill the gap between layers, realize reliable bonding, protect the interlayer bonding force of PCB and improve the overall structural strength. Furthermore, press -hardening buffer pad can also absorb the vibration in the press -hardening process, reduce the influence of slight vibration caused by machine operation on the alignment accuracy of circuit board, ensure the accurate alignment of each layer circuit and meet the increasingly precise production demand of PCB. With these characteristics, press -hardening buffer pad provides a solid guarantee for mass production of high-quality printed circuit board and effectively promotes the continuous development of electronic manufacturing industry.

[0003] In the traditional manufacturing process of printed circuit board, kraft paper must be placed as a buffer material on the substrate press -hardening surface during the press operation, and because the heat resistance of kraft paper is limited, it needs to be replaced frequently. UTILITY MODEL CONTENT

[0004] In order to make up for the above shortcomings, the utility model provides a multilayer composite press -hardening buffer pad, which aims at improving the problem that kraft paper must be placed as a buffer material on the substrate press -hardening surface during the press operation in the traditional manufacturing process of printed circuit board, and because the heat resistance of kraft paper is limited, it needs to be replaced frequently.

[0005] In order to achieve the above purpose, the utility model provides the following technical scheme: a multilayer composite press -hardening buffer pad, which comprises an elastic buffer layer and a bonding layer, and storage bags are uniformly arranged between the elastic buffer layer and the bonding layer, input pipes and output pipes are fixedly arranged on the top of the storage bags, input valves are arranged in the middle of the input pipes, and output valves are arranged in the middle of the output pipes.

[0006] Preferably, the outer wall of the storage bag is made of plastic or rubber.

[0007] Preferably, a second moisture-proof layer is adhered between the bonding layer and the storage bag by an adhesive.

[0008] Preferably, the first moisture-proof layer is attached to the side of the elastic buffer layer away from the storage bag by an adhesive.

[0009] Preferably, the first moisture-proof layer is attached to the side of the elastic buffer layer away from the storage bag by an adhesive.

[0010] Preferably, the second moisture-proof layer and the first moisture-proof layer are internally provided with moisture-proof microcapsules.

[0011] Preferably, the moisture-proof microcapsules comprise a capsule wall and a desiccant inside the capsule wall, the desiccant is a silica gel desiccant, and the capsule wall is a polyurea material.

[0012] Preferably, the material of the fitting layer is a piece of silica gel or a piece of plush fabric.

[0013] Preferably, the elastic buffer layer comprises nitrile rubber and silicone rubber, and the nitrile rubber and the silicone rubber are arranged in a staggered manner in the horizontal direction.

[0014] Preferably, the material of the wear-resistant protective layer is a polyimide film.

[0015] The utility model has the following beneficial effects:

[0016] 1. In the utility model, the input valve is opened to input the cooling liquid from the inside of the input pipe, the output valve is closed to continuously increase the volume of the storage bag when the air is completely discharged from the inside of the storage bag, the output valve is opened to discharge the cooling liquid from the output pipe when the volume reaches the buffer requirement, and the heat transferred from the circuit board is taken away, thereby improving the process of manufacturing the printed circuit board.

[0017] 2. In the utility model, the moisture-proof microcapsules contained in the first moisture-proof layer and the second moisture-proof layer can play a role in preventing moisture, when there is water vapor in the circuit board, the capsule wall is broken to make the desiccant contact with the moisture to absorb the moisture, thereby achieving the purpose of avoiding the damage of the circuit board by the water molecules. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a front view of the multi-layer composite pressing buffer pad according to the utility model;

[0019] Figure 2 It is a front view of the multi-layer composite pressing buffer pad according to the utility model;

[0020] Figure 3 It is a front view of the multi-layer composite pressing buffer pad according to the utility model;

[0021] Figure 4 The utility model discloses a three -dimensional structure schematic view of the storage bag place of multilayer composite compression cushion pad is provided for the utility model puts forward.

[0022] Figure 5 The utility model discloses the internal structure schematic view of capsule wall place of multilayer composite compression cushion pad is provided for the utility model puts forward.

[0023] Figure 6 The utility model discloses the internal structure schematic view of buffer layer place of multilayer composite compression cushion pad is provided for the utility model puts forward.

[0024] Legend:

[0025] 1, input pipe, 2, input valve, 3, storage bag, 4, output pipe, 5, output valve, 6, wear-resistant protective layer, 7, first moisture-proof layer, 8, elastic buffer layer, 9, second moisture-proof layer, 10, fit layer, 11, drying agent, 12, capsule wall, 13, nitrile rubber, 14, silicone rubber. Specific implementation

[0026] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments only are a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor all belong to the range of protection of the utility model.

[0027] Refer to Figures 1-4 Including elastic buffer layer 8 and fit layer 10, and the storage bag 3 is evenly arranged between elastic buffer layer 8 and fit layer 10, the top of storage bag 3 is fixedly provided with input pipe 1 and output pipe 4, the middle part of input pipe 1 is provided with input valve 2, the middle part of output pipe 4 is provided with output valve 5, and the outer wall of storage bag 3 is plastic or rubber.

[0028] Specifically, the elastic buffer layer 8 can effectively absorb and disperse the pressure in the pressing process, and play a buffering protection role. The fitting layer 10 can directly contact the object to be pressed, so that the buffer pad is closely attached to the object, avoiding scratching the surface of the object, and the pressure can be uniformly distributed. The storage bag 3 can store liquid or gas, so as to change the volume of the storage bag 3, and then change the buffering mechanical properties of the buffer pad. When the liquid is stored, the heat transmitted from the circuit board can be absorbed, thereby improving the heat resistance of the buffer pad. The input pipe 1 can function as an input fluid, the output pipe 4 can function as an output fluid, the input valve 2 can open or close the input pipe 1, and the output valve 5 can open or close the output pipe 4. When the gas in the storage bag 3 needs to be increased, the output valve 5 is closed, and the gas is filled from the input pipe 1. The overall thickness of the buffer pad will increase. When subjected to pressure, the gas can be compressed, thereby absorbing and dispersing more energy. When cooling is needed, the input valve 2 and the output valve 5 are opened at the same time, and the liquid is input from the input pipe 1 into the storage bag 3, thereby absorbing heat. The heated liquid is discharged from the output pipe 4, thereby taking away the heat.

[0029] Referring to Figures 1-3 , the fitting layer 10 and the storage bag 3 are bonded by a second moisture-proof layer 9 through an adhesive. The side of the elastic buffer layer 8 away from the storage bag 3 is bonded by a first moisture-proof layer 7 through an adhesive. The side of the first moisture-proof layer 7 away from the elastic buffer layer 8 is bonded by a wear-resistant protective layer 6 through an adhesive.

[0030] Specifically, the second moisture-proof layer 9 and the first moisture-proof layer 7 can absorb water vapor, preventing water molecules from damaging the circuit board. The wear-resistant protective layer 6 can resist external friction, collision and chemical substance erosion, providing protection for the internal structure of the buffer pad and prolonging the service life of the buffer pad.

[0031] Referring to Figures 1-5 , the second moisture-proof layer 9 and the first moisture-proof layer 7 are internally provided with moisture-proof microcapsules. The moisture-proof microcapsules include a capsule wall 12 and a desiccant 11. The desiccant 11 is located inside the capsule wall 12. The desiccant 11 is a silica gel desiccant. The capsule wall 12 is a polyurea material.

[0032] Specifically, the moisture-proof microcapsules can absorb moisture. The desiccant 11 is a silica gel desiccant, which can change little in physical state after absorbing moisture, and will not produce corrosive substances, further protecting the circuit board. The capsule wall 12 is a polyurea material, which can protect the silica gel desiccant inside, thereby preventing accidental rupture of the moisture-proof microcapsules.

[0033] Referring to Figures 1-3 , the material of the fitting layer 10 is a plush fabric or a silica gel sheet.

[0034] Specifically, the soft touch of the circuit board is realized by the plush fabric or the silica gel sheet, and the circuit board is protected.

[0035] With reference to Figures 1-6 The elastic buffer layer 8 comprises nitrile rubber 13 and silicone rubber 14, and the nitrile rubber 13 and the silicone rubber 14 are arranged in a staggered manner in the horizontal direction.

[0036] Specifically, the hardness of the silicone rubber 14 is higher than that of the nitrile rubber 13, and the staggered arrangement of the nitrile rubber 13 and the silicone rubber 14 in the horizontal direction can realize targeted arrangement, so that corresponding support can be provided in different areas of the circuit board.

[0037] With reference to Figures 1-3 The material of the wear-resistant protective layer 6 is a polyimide film.

[0038] Specifically, the polyimide film has high wear resistance, high temperature resistance and chemical stability, so as to resist external friction, collision and chemical substance erosion, and protect the internal structure of the buffer pad.

[0039] Working principle: the input valve 2 is opened and the output valve 5 is closed, and then the cooling liquid is injected into the storage bag 3 through the input pipe 1, when the volume of the storage bag 3 reaches the buffer requirement, the output valve 5 is opened, so that the cooling liquid enters the inside of the storage bag 3 at the same time as it is discharged, so as to take away the heat on the circuit board, and the pressure and vibration force of the adhering layer 10 are absorbed and then dispersed through the storage bag 3 and the elastic buffer layer 8, so as to protect the circuit board, when there is water vapor, the capsule wall 12 in the second moisture-proof layer 9 and the first moisture-proof layer 7 is broken, so that the desiccant 11 contacts with the water vapor and absorbs the moisture to protect the circuit board.

[0040] Finally, it should be pointed out that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included in the protection scope of the present application.

Claims

1. A multi-layered composite compression cushion pad comprising an elastic cushion layer and a skin layer, characterized in that: The elastic buffer layer and the fitting layer are uniformly arranged with storage bags, the top of the storage bag is fixedly provided with an input pipe and an output pipe, the middle of the input pipe is provided with an input valve, and the middle of the output pipe is provided with an output valve.

2. The multi-layered composite press pad cushion of claim 1, wherein: The outer wall of the storage bag is plastic or rubber.

3. The multi-layered composite press pad cushion of claim 1, wherein: The fitting layer and the storage bag are bonded with a second moisture-proof layer through an adhesive.

4. The multi-layered composite press pad cushion of claim 1, wherein: The side of the elastic buffer layer away from the storage bag is bonded with a first moisture-proof layer through an adhesive.

5. The multi-layered composite press pad cushion of claim 4, wherein: The side of the first moisture-proof layer away from the elastic buffer layer is bonded with a wear-resistant protective layer through an adhesive.

6. The multi-layered composite press pad cushion of claim 3, wherein: The second moisture-proof layer and the first moisture-proof layer are internally provided with moisture-proof microcapsules.

7. The multi-layered composite press pad cushion of claim 6, wherein: The moisture-proof microcapsules comprise a capsule wall and a desiccant, the desiccant is located inside the capsule wall, the desiccant is a silica gel desiccant, and the capsule wall is a polyurea material.

8. The multi-layered composite press pad cushion of claim 1, wherein: The material of the fitting layer is a plush fabric or a silica gel sheet.

9. The multi-layered composite press pad cushion of claim 5, wherein: The elastic buffer layer comprises nitrile rubber and silicone rubber, and the nitrile rubber and the silicone rubber are arranged in a staggered manner in the horizontal direction.

10. The multi-layered composite press pad cushion of claim 5, wherein: The material of the wear-resistant protective layer is a polyimide film.

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