Assembled heat-conducting silica gel
By using the tenon and mortise structure of the assemblable thermally conductive silicone and the internal buffer and shock absorption design, the problems of poor mechanical strength and poor thermal conductivity are solved, achieving assembly stability and efficient heat dissipation.
Patent Information
- Application Number
- CN202422463917.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-12
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-10-12
AI Technical Summary
Existing thermally conductive and insulating materials have poor mechanical strength, are difficult to assemble flexibly, are easily damaged, and have poor thermal conductivity, which affects the heat transfer effect.
It adopts an assemblable thermal conductive silicone design, forming a mortise and tenon structure with connecting pins and connecting grooves, and is fixed with a micro suction cup. It is equipped with a buffer airbag and shock absorption chamber inside, and has a heat-conducting plate and heat dissipation groove for multiple heat dissipation.
It improves assembly stability, enhances mechanical strength, and improves thermal conductivity, achieving flexible assembly and multiple heat dissipation effects.
Smart Images
Figure CN223758581U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat conduction silica gel related technical field, concretely is a kind of heat conduction silica gel of assembly type. BACKGROUND
[0002] With the development of integration technology and microelectronic assembly densification, the heat generated by electronic equipment accumulates and increases rapidly, and the performance and reliability of electronic components will directly decrease with the increase of their temperature, so timely heat dissipation becomes an important factor affecting their service life. To ensure that electronic components can maintain normal working condition under the temperature of use environment, a layer of heat conduction silica gel pad is usually arranged on the heat exchange interface of related components as a heat conduction interface material to quickly transfer the heat of heating elements to heat dissipation equipment, so as to ensure the normal operation of electronic equipment. The heat conduction silica gel sheet is a kind of heat conduction medium sheet with silica gel as base material, which is also called heat conduction silica gel pad, heat conduction silica gel sheet, soft heat conduction pad and heat conduction silica gel gasket in the industry. It is designed and produced for transferring heat through gaps, can fill gaps, complete heat transfer between heating parts and heat dissipation parts, and also play the role of insulation, shock absorption and sealing. It can meet the design requirements of equipment miniaturization and ultrathin design, has high processability and usability, and has wide thickness application range. It is an excellent heat conduction silica gel sheet, so there is an urgent need for a heat conduction silica gel of assembly type.
[0003] At present, the heat conduction insulation materials provided on the market mainly adopt a simple single-layer silicone rubber heat conduction insulation gasket. Most of the silicone rubber gaskets have poor mechanical strength, are inconvenient to flexibly assemble, are easily damaged by external impact, have poor heat conduction effect, are inconvenient to multi-heat dissipate, and affect the heat conduction effect. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing a heat conduction silica gel of assembly type to solve the problem that the heat conduction insulation materials provided on the market mainly adopt a simple single-layer silicone rubber heat conduction insulation gasket, most of the silicone rubber gaskets have poor mechanical strength, are inconvenient to flexibly assemble, are easily damaged by external impact, have poor heat conduction effect, are inconvenient to multi-heat dissipate, and affect the heat conduction effect.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a heat conduction silica gel of assembly type, which comprises a heat conduction silica gel assembly. The periphery of the heat conduction silica gel assembly is uniformly provided with symmetrically distributed connecting circular grooves. The inner wall of the connecting circular groove is provided with a connecting pin block matched therewith. Two adjacent heat conduction silica gel assemblies are connected and fixed by the connecting pin blocks. The periphery corner of the heat conduction silica gel assembly is provided with a disassembly auxiliary groove. The bottom of the heat conduction silica gel assembly is uniformly provided with a micro suction cup.
[0006] Preferably, the heat-conducting silica gel assembly comprises a heat-conducting silica gel body, a buffer air bag is arranged at the top of the heat-conducting silica gel body, a damping cavity is arranged in the buffer air bag, telescopic connecting rods are arranged on the inner wall of the damping cavity, and damping springs are arranged on the inner wall of the damping cavity.
[0007] Preferably, a heat-dissipating plate is arranged at the bottom of the heat-conducting silica gel body, heat-dissipating holes are uniformly arranged on the heat-dissipating plate, and a heat-conducting plate is arranged at the bottom of the heat-dissipating plate.
[0008] Preferably, heat-conducting metal wires are uniformly arranged in the heat-conducting silica gel assembly, outer heat-dissipating grooves are arranged on the outer walls of the heat-conducting silica gel assembly, and an inner heat-dissipating groove penetrating through the front and back is arranged at the bottom of the heat-conducting silica gel assembly.
[0009] Preferably, wear-resistant rubber pads are arranged at the top of the heat-conducting silica gel assembly.
[0010] Preferably, damping springs are arranged outside the telescopic connecting rods, and the telescopic connecting rods and the damping springs are linearly distributed.
[0011] Preferably, a heat-dissipating plate is arranged on the inner wall of the inner heat-dissipating groove.
[0012] Compared with the prior art, the heat-conducting silica gel assembly has the following beneficial effects:
[0013] 1. The heat-conducting silica gel assembly is convenient to assemble and connect two adjacent heat-conducting silica gel assemblies through the mortise and tenon structure formed between the connecting pin block and the connecting circular groove, and the heat-conducting silica gel assembly is tightly connected and can be disassembled through the disassembly auxiliary groove, is convenient to adsorb a plane through the micro suction cup, prevents external force from causing the heat-conducting silica gel assembly to slip off, and further improves the stability of the heat-conducting silica gel assembly.
[0014] 2. The heat-conducting silica gel assembly is convenient to provide buffer support for the heat-conducting silica gel body through the buffer air bag, is convenient to buffer and absorb the vibration received by the heat-conducting silica gel body through the damping springs in the damping cavity, can prevent the damping springs from rebounding through the telescopic connecting rods, helps to improve the damping effect, guides heat into the heat-dissipating plate through the heat-conducting plate, discharges heat from the inner heat-dissipating groove through the heat-dissipating holes of the heat-dissipating plate, conducts excess heat through the heat-conducting silica gel body, is convenient to further conduct heat through the heat-conducting metal wires, is convenient to dissipate heat through the outer heat-dissipating grooves, and is convenient and quick to use. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is a three-dimensional structure schematic diagram of the utility model;
[0016] Figure 2 It is a local three-dimensional structure schematic diagram of the utility model;
[0017] Figure 3 It is the cross section structure schematic view of the heat conduction silica gel assembly of the utility model;
[0018] Figure 4 It is the cross section structure schematic view of the heat conassembly of the utility model Figure 3 A enlarged structure schematic view.
[0019] In the drawing: 1, heat conduction silica gel assembly;101, heat conduction silica gel body;102, buffer air bag;103, shock absorbing cavity;104, telescopic connecting rod;105, shock absorbing spring;106, heat dissipation plate;107, heat dissipation hole;108, heat conduction plate;2, connecting round groove;3, connecting pin block;4, disassembly auxiliary groove;5, micro suction cup;6, wear-resistant rubber pad;7, heat conduction metal wire;8, outer heat dissipation groove;9, inner heat dissipation groove. Specific implementation
[0020] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.
[0021] Please refer to Figures 1-4 The utility model provides a kind of technical scheme: a kind of heat conduction silica gel of assembly, including heat conduction silica gel assembly 1, the four around surface of heat conduction silica gel assembly 1 is evenly provided with the connecting round groove 2 of symmetrical distribution, the inner wall of connecting round groove 2 is provided with the connecting pin block 3 compatible with it, two adjacent heat conduction silica gel assembly 1 is connected and fixed by being provided with connecting pin block 3, the four around surface corner of heat conduction silica gel assembly 1 is provided with disassembly auxiliary groove 4, the bottom of heat conduction silica gel assembly 1 is evenly provided with micro suction cup 5, form mortise and tenon structure between connecting pin block 3 and connecting round groove 2, it is convenient to assemble and connect two adjacent heat conduction silica gel assembly 1, the heat conduction silica gel assembly 1 of assembly and connection is relatively close, and heat conduction silica gel assembly 1 can be disassembled by disassembly auxiliary groove 4, it is convenient to be adsorbed with plane by micro suction cup 5, prevent external force from causing heat conduction silica gel assembly 1 to appear slip, further improve the stability of heat conduction silica gel assembly 1 assembly and connection.
[0022] The heat-conducting silica gel assembly 1 comprises a heat-conducting silica gel body 101, the top of the heat-conducting silica gel body 101 is provided with a buffer air bag 102, the inside of the buffer air bag 102 is provided with a damping cavity 103, the inner wall of the damping cavity 103 is provided with a telescopic connecting rod 104, the inner wall of the damping cavity 103 is provided with a damping spring 105, the outside of the telescopic connecting rod 104 is provided with the damping spring 105, the telescopic connecting rod 104 and the damping spring 105 are linearly distributed, the buffer air bag 102 is convenient for providing buffer support for the heat-conducting silica gel body 101, the damping spring 105 in the damping cavity 103 is convenient for buffering and absorbing the vibration received by the heat-conducting silica gel body 101, and the telescopic connecting rod 104 can prevent the damping spring 105 from rebounding, thereby helping to improve the damping effect.
[0023] The bottom of the heat-conducting silica gel body 101 is provided with a heat dissipation plate 106, the heat dissipation plate 106 is uniformly provided with heat dissipation holes 107, the bottom of the heat dissipation plate 106 is provided with a heat-conducting plate 108, the inside of the heat-conducting silica gel assembly 1 is uniformly provided with heat-conducting wires 7, the two side outer walls of the heat-conducting silica gel assembly 1 are provided with outer heat dissipation grooves 8, the bottom of the heat-conducting silica gel assembly 1 is provided with front-rear through inner heat dissipation grooves 9, the inner wall of the inner heat dissipation grooves 9 is provided with the heat dissipation plate 106, the top of the heat-conducting silica gel assembly 1 is provided with a wear-resistant rubber pad 6, heat is introduced into the heat dissipation plate 106 through the heat-conducting plate 108, the heat dissipation plate 106 discharges heat from the inner heat dissipation grooves 9 through the heat dissipation holes 107, and the excess heat is conducted through the heat-conducting silica gel body 101, the heat-conducting wires 7 are convenient for further conducting heat, heat dissipation is facilitated through the outer heat dissipation grooves 8, and the use is convenient and fast.
[0024] Working principle: firstly, a mortise and tenon structure is formed between the connecting pin block 3 and the connecting circular groove 2, so that two adjacent heat-conducting silica gel assemblies 1 can be conveniently assembled and connected, the assembled and connected heat-conducting silica gel assemblies 1 are connected closely, the heat-conducting silica gel assemblies 1 can be disassembled through the disassembly auxiliary grooves 4, the micro suction cup 5 is convenient for adsorbing a plane, external force is prevented from causing the heat-conducting silica gel assembly 1 to slip off, and the stability of the assembled and connected heat-conducting silica gel assemblies 1 is further improved, then the buffer air bag 102 is convenient for providing buffer support for the heat-conducting silica gel body 101, the damping spring 105 in the damping cavity 103 is convenient for buffering and absorbing the vibration received by the heat-conducting silica gel body 101, the telescopic connecting rod 104 can prevent the damping spring 105 from rebounding, thereby helping to improve the damping effect, heat is introduced into the heat dissipation plate 106 through the heat-conducting plate 108, the heat dissipation plate 106 discharges heat from the inner heat dissipation grooves 9 through the heat dissipation holes 107, the excess heat is conducted through the heat-conducting silica gel body 101, the heat-conducting wires 7 are convenient for further conducting heat, heat dissipation is facilitated through the outer heat dissipation grooves 8, and the use is convenient and fast, so that the operation process of the heat-conducting silica gel assembly is completed.
[0025] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An assemblable heat-conducting silica gel, characterized in that, The utility model provides a heat conduction silica gel assembly (1), the four peripheral surfaces of heat conduction silica gel assembly (1) are evenly provided with the connecting circular groove (2) of symmetrical distribution, the inner wall of connecting circular groove (2) is provided with the connecting pin block (3) of adaptation, and two adjacent heat conduction silica gel assemblies (1) are connected and fixed through the connecting pin block (3) setting, the four peripheral surface corners of heat conduction silica gel assembly (1) are provided with the dismounting auxiliary groove (4), and the bottom of heat conduction silica gel assembly (1) is evenly provided with microsuction disc (5).
2. The assemblable heat-conducting silica gel according to claim 1, characterized in that: The heat conduction silica gel assembly (1) comprises a heat conduction silica gel body (101), a buffer air bag (102) is arranged on the top of the heat conduction silica gel body (101), a damping cavity (103) is arranged in the buffer air bag (102), a telescopic connecting rod (104) is arranged on the inner wall of the damping cavity (103), and a damping spring (105) is arranged on the inner wall of the damping cavity (103).
3. The assemblable heat-conducting silica gel according to claim 2, characterized in that: The bottom of the heat conduction silica gel body (101) is provided with a heat dissipation plate (106), the heat dissipation plate (106) is uniformly provided with heat dissipation holes (107), and the bottom of the heat dissipation plate (106) is provided with a heat conduction plate (108).
4. The assemblable heat-conducting silica gel according to claim 1, characterized in that: The inside of the heat conduction silica gel assembly (1) is uniformly provided with heat conduction metal wires (7), the two side outer walls of the heat conduction silica gel assembly (1) are provided with outer heat dissipation grooves (8), and the bottom of the heat conduction silica gel assembly (1) is provided with front and rear through inner heat dissipation grooves (9).
5. The assemblable heat-conducting silica gel according to claim 1, characterized in that: The top of the heat conduction silica gel assembly (1) is provided with a wear-resistant rubber pad (6).
6. The assemblable heat-conducting silica gel according to claim 2, characterized in that: The outside of the telescopic connecting rod (104) is provided with a damping spring (105), and the telescopic connecting rod (104) and the damping spring (105) are linearly distributed.
7. The assemblable heat-conducting silica gel according to claim 4, characterized in that: The inner wall of the inner heat dissipation groove (9) is provided with a heat dissipation plate (106).