Liquid-cooled heat dissipation device and water cooling plate thereof

Abstract

The utility model relates to a liquid-cooled heat dissipation device and a water cooling plate thereof, the water cooling plate comprises a heat conduction seat and a cover body, the heat conduction seat comprises a bottom plate and fins extending from the bottom plate, one end, far away from the bottom plate, of each fin is provided with a lower transverse flow channel and a lower inclined flow channel, and a part of the lower inclined flow channel is communicated with the two lower transverse flow channels; the cover body corresponds to the heat conducting seat and covers the heat conducting seat, a fluid cavity is formed between the heat conducting seat and the cover body, the cover body comprises an upper plate and an opening penetrating through the upper plate, the opening is formed between the two lower transverse flow channels, the surface, facing the fins, of the upper plate is provided with upper inclined flow channels, and part of the upper inclined flow channels are communicated with the opening; wherein the lower inclined flow channel and the upper inclined flow channel are arranged in a crossed manner and are communicated with each other. Therefore, the time that the working fluid stays in the fluid cavity can be prolonged, and the heat exchange efficiency of the working fluid is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of liquid cooling heat dissipation devices, in particular to a liquid cooling heat dissipation device and a water cooling plate thereof. BACKGROUND

[0002] With the progress and development of science and technology, the pictures of various computer games are more and more delicate, and the functions of computer-aided drawing software are becoming more and more powerful. When such software is operated, the central processor and the drawing chip processor are often in a high load state, which also causes a large amount of heat to be generated. If the heat cannot be effectively dissipated, the performance of the central processor or the drawing chip processor will be reduced, and in severe cases, the central processor or the drawing chip processor will be damaged or the service life will be greatly reduced.

[0003] In order to effectively reduce the working temperature of the heat-generating electronic components, it is quite common to apply a liquid cooling heat dissipation device to the heat-generating electronic components. The liquid cooling heat dissipation device mainly includes a water cooling row, two water conduits, a water pump and a water cooling plate. The water cooling row connects the water pump and the water cooling plate through the water conduits, and the water cooling plate is attached to a heat-generating electronic component. The working liquid is driven by the water pump to flow onto the water cooling row for heat dissipation, and continuously circulates to quickly dissipate heat.

[0004] In the actual use process of the existing water cooling plate, the following problems exist. Since the working liquid passes through the internal flow channel in a fast manner, the heat energy that can be transferred to each fin is quite limited, which results in that the heat dissipation efficiency cannot be effectively improved.

[0005] Therefore, the present inventors have made great efforts to solve the above problems by means of deep research and application of theories, which is the improvement goal of the present inventors. CONTENT OF THE UTILITY MODEL

[0006] The present application relates to the technical field of liquid cooling heat dissipation devices, in particular to a liquid cooling heat dissipation device and a water cooling plate thereof.

[0007] To achieve the above object, the present application provides a liquid cooling device, comprising a base, a water cooling plate and a liquid driving mechanism, the base has a containing space and a heat exchange chamber, a water pipe is arranged between the containing space and the heat exchange chamber and is communicated with each other; the water cooling plate is connected with the base and is located in the heat exchange chamber, and comprises a heat conduction seat and a cover, the heat conduction seat comprises a bottom plate and a plurality of fins extending upward from the bottom plate, two lower transverse flow channels and a plurality of lower inclined flow channels are arranged at one end of each fin away from the bottom plate, and part of each lower inclined flow channel is communicated with the two lower transverse flow channels; the cover corresponds to the heat conduction seat and covers the heat conduction seat, and a fluid chamber is formed between the heat conduction seat and the cover, the cover comprises an upper plate and an opening penetrating through the upper plate, the opening is arranged between the two lower transverse flow channels, and a plurality of upper inclined flow channels are arranged on the surface of each fin facing the upper plate, and part of each upper inclined flow channel is communicated with the opening; each lower inclined flow channel and each upper inclined flow channel are arranged in a cross manner and communicated with each other; the liquid driving mechanism is connected with the base and is located in the containing space, the liquid driving mechanism comprises a shell and a rotor structure, the shell comprises a containing cavity and a water outlet pipe communicated with the containing cavity, and the rotor structure is arranged in the containing cavity, and the water outlet pipe is communicated with the water pipe.

[0008] To achieve the above object, the present application provides a liquid cooling device, comprising a base, a water cooling plate and a liquid driving mechanism, the base has a containing space and a heat exchange chamber, a water pipe is arranged between the containing space and the heat exchange chamber and is communicated with each other; the water cooling plate is connected with the base and is located in the heat exchange chamber, and comprises a heat conduction seat and a cover, the heat conduction seat comprises a bottom plate and a plurality of fins extending upward from the bottom plate, two lower transverse flow channels and a plurality of lower inclined flow channels are arranged at one end of each fin away from the bottom plate, and part of each lower inclined flow channel is communicated with the two lower transverse flow channels; the cover corresponds to the heat conduction seat and covers the heat conduction seat, and a fluid chamber is formed between the heat conduction seat and the cover, the cover comprises an upper plate and an opening penetrating through the upper plate, the opening is arranged between the two lower transverse flow channels, and a plurality of upper inclined flow channels are arranged on the surface of each fin facing the upper plate, and part of each upper inclined flow channel is communicated with the opening; each lower inclined flow channel and each upper inclined flow channel are arranged in a cross manner and communicated with each other.

[0009] The present application also has the following effects: by arranging each lower inclined flow channel and each upper inclined flow channel in a cross manner and communicated with each other, the thermal boundary layer of the working fluid is destroyed to generate turbulence and disturbance, so that the time of the working fluid staying in the fluid chamber is prolonged, and sufficient heat exchange is performed with each fin, thereby improving the overall heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a perspective view of the heat conduction seat of the present application.

[0011] Figure 2 is a top view of the heat conduction seat of the present application.

[0012] Figure 3 is an exploded view of the water cooling plate of the present application.

[0013] Figure 4 is a combined perspective view of the water-cooled plate of the present application.

[0014] Figure 5 is a combined sectional view of the liquid-cooled heat sink of the present application.

[0015] Figure 6 is another combined sectional view of the liquid-cooled heat sink of the present application.

[0016] In the drawings:

[0017] 10: base

[0018] 11: accommodation space

[0019] 12: heat exchange chamber

[0020] 13: water delivery pipe

[0021] 14: annular groove

[0022] 20: water-cooled plate

[0023] 21: heat-conductive seat

[0024] 211: bottom plate

[0025] 212: fin

[0026] 213: lower horizontal flow channel

[0027] 214: lower oblique flow channel

[0028] 215: longitudinal passage

[0029] 22: cover

[0030] 221: upper plate

[0031] 222: opening

[0032] 223: upper oblique flow channel

[0033] A: fluid chamber

[0034] 30: liquid driving mechanism

[0035] 31: housing

[0036] 311: accommodating cavity

[0037] 312: water outlet pipe

[0038] 32: rotor structure

[0039] 33: sealing assembly DETAILED DESCRIPTION

[0040] Detailed description and technical content of the present application are described below in conjunction with the accompanying drawings, however the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present application.

[0041] Referring to Figures 1 to 6 As shown in the drawings, the present application provides a liquid cooling heat dissipation device and a water cooling plate thereof, wherein the liquid cooling heat dissipation device mainly comprises a base 10, a water cooling plate 20, a liquid driving mechanism 30 and other necessary devices and components.

[0042] Referring to Figure 5 and Figure 6 As shown in the drawings, the base 10 is generally a rectangular body, which has a receiving space 11 and a heat exchange chamber 12, wherein the receiving space 11 is formed at the upper portion of the base 10, the heat exchange chamber 12 is formed at the lower portion of the base 10, the heat exchange chamber 12 is communicated with a drain pipe (not shown in the drawings), and a water supply pipe 13 is arranged between the receiving space 11 and the heat exchange chamber 12 and communicated with each other, and an annular groove 14 is arranged at the periphery of the water supply pipe 13.

[0043] Referring to Figures 1 to 4 As shown in the drawings, the water cooling plate 20 is connected to the base 10 and located in the heat exchange chamber 12, and the water cooling plate 20 of the present embodiment mainly comprises a heat conduction seat 21 and a cover 22.

[0044] The heat conduction seat 21 can be made of copper, aluminum, magnesium or their alloys, etc. which have good heat conductivity, and mainly comprises a bottom plate 211 and a plurality of fins 212 extending upward from the bottom plate 211, two lower transverse flow channels 213 and a plurality of lower inclined flow channels 214 are arranged at the end of each fin 212 away from the bottom plate 211, and part of the lower inclined flow channels 214 are communicated with the two lower transverse flow channels 213. A longitudinal channel 215 is arranged at one side of the fin 212 of the bottom plate 211.

[0045] The cover 22 covers the heat conduction seat 21, and a fluid chamber A is formed between the heat conduction seat 21 and the cover 22, and the cover 22 mainly comprises an upper plate 221 and an opening 222 penetrating through the upper plate 221, the opening 222 is between the two lower transverse flow channels 213, and the surface of the upper plate 221 facing the surface of each fin 212 is provided with a plurality of upper inclined flow channels 223, and part of the upper inclined flow channels 223 are communicated with the opening 222.

[0046] Each lower inclined flow channel 214 and each upper inclined flow channel 223 are cross-arranged and communicated with each other.

[0047] In an embodiment, part of the lower inclined flow channels 214 which are not communicated with the two lower transverse flow channels 213 are cross-arranged and communicated with each other with the upper inclined flow channels 223 communicated with the opening 222.

[0048] In an embodiment, the upper inclined flow channels 223 not in communication with the openings 222 are cross-arranged and in communication with each other with the lower inclined flow channels 214 communicating two lower horizontal flow channels 213.

[0049] In an embodiment, any two adjacent lower inclined flow channels 214 are arranged to form a V-shape.

[0050] In an embodiment, any two adjacent upper inclined flow channels 223 are arranged to form a V-shape.

[0051] The liquid driving mechanism 30 is connected to the base 10 and located in the accommodating space 11. The liquid driving mechanism 30 mainly comprises a housing 31 and a rotor structure 32. The housing 31 comprises a cavity 311, a water outlet pipe 312 in communication with the cavity 311, and a water inlet pipe (not shown in the figure) in communication with the cavity 311. The water outlet pipe 312 is arranged in the annular groove 14 and in communication with the water delivery pipe 13, and the water outlet pipe 312 and the water delivery pipe 13 are sealingly connected by a sealing assembly 33. The rotor structure 32 is arranged in the cavity 311 and mainly comprises an impeller, a rotor, and a stator. The cavity has an upper chamber and a lower chamber formed below the upper chamber. The stator is arranged in the upper chamber, and the rotor and the impeller are arranged in the lower chamber.

[0052] In use, the working fluid is driven by the liquid driving mechanism 30 and is forcedly filled into the fluid chamber A of the water-cooled plate 20 from the water outlet pipe 312 of the liquid driving mechanism 30 through the water delivery pipe 13 and the openings 222 of the cover 22, and then flows through the lower horizontal flow channels 213 and the lower inclined flow channels 214. Since the lower inclined flow channels 214 and the upper inclined flow channels 223 are cross-arranged and in communication with each other, the thermal boundary layer of the working fluid is destroyed to generate turbulence and disturbance, so as to prolong the time of the working fluid staying in the fluid chamber A and to perform sufficient heat exchange with the fins 212, thereby improving the overall heat dissipation efficiency.

[0053] The above description is only the preferred embodiments of the present application, and is not intended to limit the patent scope of the present application. Other equivalent changes made by using the patent spirit of the present application shall also belong to the patent scope of the present application.

Claims

1. A water-cooling plate characterized by, A heat-conducting seat comprising a bottom plate and a plurality of fins extending upwardly from the bottom plate, each of the fins being provided with two lower transverse flow channels and a plurality of lower inclined flow channels at an end thereof away from the bottom plate, wherein some of the lower inclined flow channels are in communication with the two lower transverse flow channels; and a cover corresponding to the heat-conducting seat and covering the heat-conducting seat to form a fluid chamber therebetween, the cover comprising an upper plate and an opening penetrating the upper plate, the opening being between the two lower transverse flow channels, the upper plate being provided with a plurality of upper inclined flow channels facing the surfaces of the fins, wherein some of the upper inclined flow channels are in communication with the opening; wherein the lower inclined flow channels and the upper inclined flow channels are cross-arranged and in communication with each other. Some of the lower inclined flow channels not in communication with the two lower transverse flow channels are cross-arranged and in communication with the upper inclined flow channels in communication with the opening. Some of the upper inclined flow channels not in communication with the opening are cross-arranged and in communication with the lower inclined flow channels in communication with the two lower transverse flow channels. Any two adjacent lower inclined flow channels form a V-shape. Any two adjacent upper inclined flow channels form a V-shape.

2. The water cold plate of claim 1, wherein, A longitudinal channel is provided at one side of each of the fins of the bottom plate.

3. The water cold plate of claim 1, wherein, A base body having a receiving space and a heat exchange chamber, a water delivery pipe being provided between the receiving space and the heat exchange chamber and in communication therebetween; 4. The water cold plate of claim 1, wherein, A water cooling plate as claimed in any one of claims 1 to 6 connected to the base body and located in the heat exchange chamber; 5. The water cold plate of claim 1, wherein, A liquid driving mechanism connected to the base body and located in the receiving space, the liquid driving mechanism comprising a housing and a rotor structure, the housing comprising a cavity and a water outlet pipe in communication with the cavity, the rotor structure being arranged in the cavity, and the water outlet pipe being in communication with the water delivery pipe.

6. The water cold plate of claim 1, wherein, An annular groove is provided at the periphery of the water delivery pipe, and the water outlet pipe is tightly fitted in the annular groove through a sealing assembly.

7. A liquid-cooled heat dissipation device, characterized in that, ​ ​ ​ ​ 8. The liquid-cooled heat sink of claim 7, wherein, ​

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