Light bar

Abstract

The utility model provides a light bar, and belongs to the technical field of illumination. The light bar comprises a substrate, a light-emitting chip and fluorescent glue; the light-emitting chip is connected with one surface of the substrate; the fluorescent glue covers the light-emitting chip, after the fluorescent glue is cured, the face, back to the substrate, of the fluorescent glue is an outwards-protruding arc face, and the face, facing the substrate, of the fluorescent glue is connected with the substrate. The manufacturing cost of the light bar can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure belongs to the technical field of lighting, and particularly relates to a light bar. BACKGROUND

[0002] The light bar is a common lighting electronic device, which mainly plays a lighting function.

[0003] In the related art, the light bar mainly comprises a substrate, light beads and a lens, each light bead is arranged on one side of the substrate along the length direction of the substrate in sequence and at intervals, the lens and the light bead are one-to-one corresponding, the lens is arranged outside the light bead, and the lens is fixed on the substrate through epoxy thermosetting glue. Under the action of the lens, the light emitted by the light bead can be diffused, thereby increasing the lighting range of the light bar.

[0004] However, the material cost of the light bead and the lens is high, and the mounting process of the two is relatively complex, so as to cause the manufacturing cost of the light bar to be high. CONTENT OF THE INVENTION

[0005] The embodiment of the present disclosure provides a light bar, which can effectively reduce the manufacturing cost of the light bar. The technical scheme is as follows:

[0006] The embodiment of the present disclosure provides a light bar, which comprises a substrate, a light emitting chip and fluorescent glue.

[0007] The light emitting chip is connected with one side of the substrate.

[0008] The fluorescent glue is covered outside the light emitting chip, when the fluorescent glue is solidified, one side of the fluorescent glue away from the substrate is an outward convex arc surface, and one side of the fluorescent glue towards the substrate is connected with the substrate.

[0009] In one implementation manner of the present disclosure, when the fluorescent glue is solidified, the fluorescent glue is a spherical segment structure.

[0010] In another implementation manner of the present disclosure, the bottom surface diameter of the fluorescent glue is 3.8-4.2 mm, and the height of the fluorescent glue is 2.3-2.7 mm.

[0011] In still another implementation manner of the present disclosure, the coaxiality between the central axis of the fluorescent glue and the central axis of the light emitting chip is 0.1-0.2 mm.

[0012] In still another implementation manner of the present disclosure, the light bar comprises a plurality of light emitting chips, each light emitting chip is arranged along the length direction of the substrate in sequence and at intervals.

[0013] The fluorescent glue corresponds to the light emitting chip one-to-one.

[0014] In a further implementation form of the present disclosure, the fluorescent glue is in a semi-cylindrical structure after being solidified.

[0015] In a further implementation form of the present disclosure, the side of the fluorescent glue extending along the length direction is flush with the side of the substrate extending along the length direction.

[0016] In a further implementation form of the present disclosure, the bottom width of the fluorescent glue is 3.8-4.2 mm, and the height of the fluorescent glue is 3.8-4.2 mm.

[0017] In a further implementation form of the present disclosure, the light bar comprises a plurality of light emitting chips, and each of the light emitting chips is arranged in sequence along the length direction of the substrate.

[0018] The fluorescent glue extends along the length direction of the substrate to cover each of the light emitting chips.

[0019] In a further implementation form of the present disclosure, the fluorescent glue comprises a glue body and fluorescent powder.

[0020] The fluorescent powder is doped in the glue body, and the ratio between the fluorescent powder and the glue body is 2%-20%.

[0021] The technical scheme provided by the embodiments of the present disclosure has the following beneficial effects:

[0022] The light bar provided by the embodiments of the present disclosure comprises a substrate, a light emitting chip and a fluorescent glue. The substrate is used to provide a mounting basis for the light emitting chip and the fluorescent glue, and to supply power for the light emitting chip. After the fluorescent glue is coated outside the light emitting chip, the fluorescent glue can cover the light emitting chip. Moreover, after the fluorescent glue is solidified, one side of the fluorescent glue facing the substrate is connected with the substrate, and the other side of the fluorescent glue facing away from the substrate forms an outward convex arc surface, thereby playing a role of diffusing the light emitted by the light emitting chip.

[0023] That is, the light bar provided by the embodiments of the present disclosure does not have the lens in the related art, so the material cost is effectively reduced, and the lens mounting process is omitted, thereby reducing the overall manufacturing cost of the light bar. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme in the embodiments of the present disclosure, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without any creative effort.

[0025] Figure 1 is a top view of a light bar provided by the embodiments of the present disclosure;

[0026] Figure 2 is a top view of another light bar provided by an embodiment of the present disclosure; Figure 1 is an A-A direction sectional view of the light bar of

[0027] Figure 3 is a top view of another light bar provided by an embodiment of the present disclosure;

[0028] Figure 4 is an A-A direction sectional view of the light bar of Figure 3 is a B-B direction sectional view of the light bar of

[0029] The meanings of the symbols in the drawings are as follows:

[0030] 10, substrate;

[0031] 110, printed circuit board; 120, connector;

[0032] 20, light emitting chip;

[0033] 30, fluorescent glue.

[0034] The specific embodiments of the present disclosure have been shown in the above drawings, and will be described in more detail hereinafter. The drawings and the written description are not intended to restrict the scope of the present disclosure in any way, but to explain the concept of the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0035] In order to make the purposes, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below with reference to the drawings.

[0036] Figure 1 is a top view of another light bar provided by an embodiment of the present disclosure; Figure 1 In the embodiment, the light bar comprises a substrate 10, a light emitting chip 20 and a fluorescent glue 30.

[0037] Figure 2 is an A-A direction sectional view of the light bar of Figure 1 is an A-A direction sectional view of the light bar of Figure 2 In the embodiment, the light emitting chip 20 is connected to one side of the substrate 10, and the fluorescent glue 30 covers the light emitting chip 20. After the fluorescent glue 30 is solidified, the side of the fluorescent glue 30 away from the substrate 10 is an outward convex arc surface, and the side of the fluorescent glue 30 toward the substrate 10 is connected to the substrate 10.

[0038] The lamp strip provided by the embodiment of the present disclosure comprises a substrate 10, a light emitting chip 20 and a fluorescent glue 30. The substrate 10 is used to provide a mounting basis for the light emitting chip 20 and the fluorescent glue 30 and to supply power for the light emitting chip 20. After the fluorescent glue 30 is coated outside the light emitting chip 20, the fluorescent glue 30 can cover the light emitting chip 20. After the fluorescent glue 30 is cured, one side of the fluorescent glue 30 facing the substrate 10 is connected with the substrate 10, and the other side of the fluorescent glue 30 facing away from the substrate 10 forms a convex arc surface, thereby playing a role of diffusing the light emitted by the light emitting chip 20.

[0039] That is, the lamp strip provided by the embodiment of the present disclosure does not have a lens in the related art, so the material cost is effectively reduced, and the lens mounting process is omitted, thereby reducing the overall manufacturing cost of the lamp strip.

[0040] In the embodiment, the substrate 10 comprises a printed circuit board 110 and a connector 120. The printed circuit board 110 is a long strip-shaped structure. One side of the printed circuit board 110 has a connection pad and a plurality of chip pads. The connection pad is located at one end of the printed circuit board 110 in the length direction. The plurality of chip pads are arranged in sequence and at intervals along the length direction of the printed circuit board 110. The connector 120 is located at one end of the printed circuit board 110 in the length direction and is connected with the connection pad. The light emitting chip 20 is connected with the chip pad.

[0041] For example, the printed circuit board 110 is an aluminum substrate 10. The connection pad and the chip pad both have tin paste. The connector 120 and the connection pad are welded together by a reflow soldering furnace, and the light emitting chip 20 and the chip pad are welded together.

[0042] It is worth noting that, in order to ensure that the connector 120 and the light emitting chip 20 do not have abnormal phenomena such as virtual welding and missing welding, the soldering cavity rate needs to be less than 25%.

[0043] For example, the tin paste is lead-free tin paste, thereby meeting the environmental protection requirements. The tin paste powder particle is No. 5 powder.

[0044] For example, the light emitting chip 20 is a light emitting diode chip, which has the advantages of high brightness and energy saving.

[0045] In the embodiment, the fluorescent glue 30 comprises a colloid and fluorescent powder. The fluorescent powder is doped in the colloid. The proportion between the fluorescent powder and the colloid is 2% to 20%.

[0046] The corresponding fluorescent glue 30 can be configured according to the required color temperature. The fluorescent powder added in the fluorescent glue 30 with different color temperatures has different proportions to meet different color temperature requirements. It is worth noting that the proportion between the fluorescent powder and the colloid can be a mass ratio. Of course, in other embodiments, other ratios can also be used.

[0047] It is worth mentioning that the colloidal cannot have convex, concave, bubbles, etc. to ensure that the light will not appear uneven phenomenon when passing through the fluorescence glue 30 refraction.

[0048] In this embodiment, after the fluorescence glue 30 is arranged, it is placed into the oven. First, pre-bake for 1 hour, set the temperature to 85℃. Then, cure baking for 2.5 hours, set the temperature to 150℃. After baking, naturally cool down, so that the fluorescence glue 30 is cured and shaped.

[0049] As can be seen from the foregoing, the shape of the fluorescence glue 30 is the key to its light diffusion, which will be introduced below.

[0050] Continuing to refer to Figure 2 In this embodiment, after the fluorescence glue 30 is cured, the fluorescence glue 30 is a spherical segment structure.

[0051] In the above implementation, the fluorescence glue 30 is dropped on the light emitting chip 20 by dispensing, and the fluorescence glue 30 forms a spherical segment structure under the action of its own tension and gravity, and the shape is fixed after curing. In this way, the fluorescence glue 30 can play the role of a convex lens, so as to diffuse the light emitted by the light emitting chip 20, thereby improving the illumination range of the light bar.

[0052] In this embodiment, the light bar includes a plurality of light emitting chips 20, and each light emitting chip 20 is arranged in sequence along the length direction of the substrate 10. The fluorescence glue 30 corresponds to the light emitting chip 20 one by one.

[0053] If the light bar includes a plurality of light emitting chips 20, then the light bar also includes a plurality of fluorescence glues 30, which are dropped on the light emitting chips 20 one by one by dispensing, so that the fluorescence glue 30 corresponds to the light emitting chip 20 one by one, thereby ensuring that the light emitted by each light emitting chip 20 can be effectively diffused.

[0054] Moreover, since the fluorescence glue 30 is dropped on the light emitting chip 20 one by one by dispensing, the material cost of the fluorescence glue 30 can be effectively saved, thereby being conducive to the cost control of the light bar.

[0055] Exemplarily, the diameter of the bottom surface of the fluorescence glue 30 is 3.8-4.2mm, and the height of the fluorescence glue 30 is 2.3-2.7mm.

[0056] It is worth mentioning that the spherical segment refers to a part of a sphere cut by a plane, and the cross section is called the bottom surface of the spherical segment. After the diameter perpendicular to the cross section is cut, the remaining line segment is called the height of the spherical segment.

[0057] In the embodiment, the diameter of the bottom surface of the fluorescent glue 30 is 4 mm, the height of the fluorescent glue 30 is 2.5 mm, and the tolerance of the size of the bottom surface and the height of the fluorescent glue 30 is ±0.2 mm.

[0058] For example, the coaxiality between the central axis of the fluorescent glue 30 and the central axis of the light emitting chip 20 is 0.1-0.2 mm.

[0059] It is worth mentioning that the central axis of the fluorescent glue 30 refers to the height made by the central point of the orthographic projection of the fluorescent glue 30 on the plane where the substrate 10 is located, and the central axis of the light emitting chip 20 refers to the height made by the central point of the orthographic projection of the light emitting chip 20 on the plane where the substrate 10 is located.

[0060] In the embodiment, the coaxiality between the central axis of the fluorescent glue 30 and the central axis of the light emitting chip 20 is 0.15 mm.

[0061] Figure 3 Another plan view of the lamp strip provided by the embodiment of the present disclosure, Figure 3 and Figure 1 have the same view angle, and the difference mainly lies in the different arrangement modes of the fluorescent glue 30, Figure 4 is Figure 3 the B-B direction sectional view, in combination with Figure 3 and Figure 4 In the embodiment, when the fluorescent glue 30 is solidified, the fluorescent glue 30 is a semi-cylindrical structural member.

[0062] In the above implementation mode, the fluorescent glue 30 is coated on the light emitting chip 20 by coating, and the fluorescent glue 30 forms a semi-cylindrical structural member under the action of its own tension and gravity, and the shape is fixed after solidification. In this way, the fluorescent glue 30 can play the role of a convex lens, so as to diffuse the light emitted by the light emitting chip 20, thereby improving the illumination range of the lamp strip.

[0063] In the embodiment, the lamp strip includes a plurality of light emitting chips 20, the lamp strip includes a plurality of light emitting chips 20, and each light emitting chip 20 is arranged in sequence along the length direction of the substrate 10, and the fluorescent glue 30 extends along the length direction of the substrate 10 to cover each light emitting chip 20.

[0064] If the lamp strip includes a plurality of light emitting chips 20, then the fluorescent glue 30 is coated on each light emitting chip 20 by coating along the arrangement direction of the light emitting chip 20, so as to ensure that the light emitted by each light emitting chip 20 can be effectively diffused.

[0065] Moreover, compared with the mode of dropping the fluorescent glue one by one, directly arranging the fluorescent glue 30 by coating can reduce the process difficulty and improve the manufacturing efficiency.

[0066] Exemplarily, the side edge of the fluorescent glue 30 extending along the length direction is flush with the side edge of the substrate 10 extending along the length direction.

[0067] In the above implementation, the fluorescent glue 30 completely covers one side of the substrate 10, that is, the orthogonal projection of the fluorescent glue 30 on the plane where the substrate 10 is located coincides with the substrate 10. In this way, it can be effectively ensured that the light emitted by each light emitting chip 20 can be effectively diffused.

[0068] Exemplarily, the bottom width of the fluorescent glue 30 is 3.8-4.2 mm, and the height of the fluorescent glue 30 is 3.8-4.2 mm.

[0069] It is worth noting that the bottom width of the fluorescent glue 30 refers to the dimension perpendicular to the length direction of the fluorescent glue 30.

[0070] In the embodiment, the bottom width of the fluorescent glue 30 is 4 mm, and the height of the fluorescent glue 30 is 4 mm.

[0071] When the lamp strip disclosed in the embodiment of the present disclosure works, the external power supply transmits current through the connector 120, and the current passes through the circuit on the PCB to light up the light emitting chip 20. The light emitting chip 20 emits blue light with a wave band of 450 nm±5 nm. After the blue light emitted by the light emitting chip 20 reacts with the fluorescent powder in the fluorescent glue 30, the light refracted by the fluorescent glue 30 is white light. The light refracts through the fluorescent glue 30, so that the light can reach 180° scattering. According to the distribution of the light emitting chip 20 of the lamp strip, the light refracted by each chip is scattered through the scattering of the fluorescent glue 30, forming the phenomenon that each region mutually complements light, thereby forming a whole light emitting area.

[0072] Unless otherwise defined, technical terms or scientific terms used herein shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first", "second", "third" and similar terms used herein do not denote any order, quantity, or importance, but are used to distinguish one element from another, and the terms "one", "another", "an" and "a" are defined as including one or more of the referenced elements. The terms "including" and "comprising" and similar terms are used herein to mean that the referenced elements are included or comprised, but not to the exclusion of other elements. The term "connected" or "coupled" and similar terms are used herein to mean either a direct connection or coupling between the connected or coupled elements, or an indirect connection or coupling between the connected or coupled elements through one or more additional elements. The terms "upper", "lower", "left", "right", and similar terms are used herein only to denote relative positions for ease of description, and can change accordingly when the absolute positions of the described objects are changed.

[0073] The above description is merely illustrative of the exemplary embodiments of this disclosure, and does not limit the scope of the disclosure. Any modification, equivalent replacement, improvement, and the like made within the spirit and principle of this disclosure shall be included in the scope of the disclosure.

Claims

1. A light bar, characterized in that, The application relates to a light-emitting device, which comprises a substrate (10), a plurality of light-emitting chips (20) and a plurality of fluorescent glue (30). The light-emitting chips (20) are arranged in sequence along the length direction of the substrate (10) and are connected to one side of the substrate (10). The fluorescent glue (30) corresponds to the light-emitting chips (20) one by one, the fluorescent glue (30) covers the corresponding light-emitting chips (20), and the fluorescent glue (30) is a spherical segment structure after solidification, the side of the fluorescent glue (30) away from the substrate (10) is an outward convex arc surface, the side of the fluorescent glue (30) towards the substrate (10) is connected to the substrate (10), the diameter of the bottom surface of the fluorescent glue (30) is 3.8-4.2 mm, the height of the fluorescent glue (30) is 2.3-2.7 mm, and the tolerance of the size of the bottom surface and the height of the fluorescent glue (30) is 0.2 mm.

2. The lightbar of claim 1, wherein, The coaxiality between the central axis of the fluorescent glue (30) and the central axis of the light-emitting chip (20) is 0.1-0.2 mm.

3. The light bar of claim 1 or 2, wherein, The fluorescent glue (30) comprises glue and fluorescent powder. The fluorescent powder is doped in the glue.

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