Plating line processing device

Abstract

The utility model relates to the technical field of plating line processing devices, and discloses a plating line processing device. Comprising a device base frame, a grinding structure set and a take-up structure set, the take-up structure set is arranged above the device base frame, the take-up structure set comprises a second motor, the output end of the second motor is fixedly connected with a first belt wheel, a take-up wheel is rotationally installed above the device base frame, and a second belt wheel is fixedly arranged on one side of the take-up wheel; a grinding box shell is arranged above the device base frame, the grinding structure set comprises a first motor arranged on the outer wall of one side of the grinding box shell, the output end of the first motor is fixedly connected with a third shaft, and the third shaft is fixedly connected with a driving wheel in a penetrating mode. According to the electroplating line polishing device, the electroplating line is fully polished by arranging the polishing structure group.

Description

Technical Field

[0001] This utility model relates to the technical field of electroplating line processing equipment, specifically an electroplating line processing equipment. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. Electroplating is divided into rack plating, barrel plating, continuous plating, and brush plating, mainly depending on the size and batch size of the parts to be plated. Continuous plating is suitable for mass production of wires and strips. However, during the electroplating process, the continuous plating process leads to the rapid consumption of metal ions near the cathode, resulting in uneven electroplating on the wire surface and affecting the electroplating processing effect.

[0003] A search revealed existing technology (application number: CN202221452711.9), which describes "a high-precision grinding device for the parting line of electroplated parts." This utility model includes a grinding frame, with a rotating drive roller at the lower end of the grinding frame. A drive wheel is fixedly sleeved on the roller wall of the drive roller. Multiple driven rollers are rotating on the side wall of the grinding frame, with driven wheels fixedly sleeved on the outer sides of the driven rollers. A sanding belt drives between the multiple driven wheels and the drive wheel. A dual-axis motor is fixedly mounted on the lower back side of the grinding frame. One output end of the dual-axis motor passes through the grinding frame and is fixedly connected to the drive roller. A support plate is fixedly mounted on the back side of the grinding frame, with a robotic arm fixedly mounted on the top of the support plate. A vertical plate is fixedly mounted on the side of the grinding frame, with a negative ion generator fixedly mounted on the upper end of the vertical plate.

[0004] However, while existing technologies can improve polishing precision and efficiency and achieve dust-free polishing, they still have some shortcomings: insufficient polishing in electroplating lines. Utility Model Content

[0005] The purpose of this utility model is to address the shortcomings of existing technologies by proposing an electroplating line processing device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an electroplating line processing device, comprising a device base frame, a grinding structure assembly, and a take-up structure assembly. The take-up structure assembly is disposed above the device base frame. The take-up structure assembly includes a second motor, the output end of which is fixedly connected to a pulley. A take-up wheel is rotatably mounted above the device base frame, and a pulley is fixedly disposed on one side of the take-up wheel. A grinding box housing is disposed above the device base frame. The grinding structure assembly includes a first motor disposed on one outer wall of the grinding box housing. The output end of the first motor is fixedly connected to a third shaft. The third shaft is fixedly connected to a driving wheel. A second shaft is rotatably connected to the grinding box housing. A driven gear is fixedly connected to the second shaft, and the driven gear meshes with the driving wheel. A first shaft is disposed above the third shaft, and a pressure pulley is rotatably connected to the first shaft. The first shaft is fixedly connected to the grinding box housing and is located above the third shaft. The driven gears are symmetrically disposed on both sides of the driving wheel.

[0007] As a further description of the above technical solution:

[0008] The grinding structure group is arranged symmetrically in two sets, and the two sets of driven gears are meshed with each other.

[0009] As a further description of the above technical solution:

[0010] The outer rings of pulley one and pulley two are provided with transmission belts. When pulley one rotates, it drives the transmission belt to rotate simultaneously. The transmission belt causes pulley two to rotate simultaneously, which in turn drives the take-up reel to rotate.

[0011] As a further description of the above technical solution:

[0012] The second shaft is located on both sides of the third shaft. The second shaft and the outer ring of the pressure roller are equipped with a polishing belt. When the third shaft rotates, the driving wheel drives the driven gears on both sides to rotate. The driven gears drive the two sets of second shafts arranged vertically to rotate, which in turn drives the two sets of polishing belts arranged vertically to rotate, polishing the electroplating line.

[0013] As a further description of the above technical solution:

[0014] A chip suction fan is installed at the lower end of the inner wall of the grinding box housing. The chip suction fan passes through the base frame of the fixed connection device. When the chip suction fan is started, it absorbs the chips that fall off the grinding structure assembly.

[0015] As a further description of the above technical solution:

[0016] The bottom of the chip suction fan is equipped with a chip collection box, which passes through the base frame of the sliding connection device. The chip collection box is used to collect the chips that fall down through the chip suction fan.

[0017] As a further description of the above technical solution:

[0018] A wire feeding reel is installed at the end of the device base away from the second motor. The wire feeding reel is equipped with an electroplated wire. The electroplated wire is wound around the middle outer ring of the wire feeding reel and the wire take-up structure assembly. The electroplated wire passes through the middle of two sets of polishing belts, and the polishing belts polish the electroplated wire.

[0019] This utility model has the following beneficial effects:

[0020] 1. The grinding belt installed on the outer ring of the shaft and the pressure roller enables continuous grinding of the electroplating line, improving processing efficiency and surface treatment quality. The grinding structure of the equipment is symmetrically arranged to ensure that the electroplating line can be evenly stressed when passing through, so that the electroplating line can be fully ground.

[0021] 2. The equipment's built-in chip suction fan and chip collection box effectively collect and clean the chips generated during the grinding process, maintaining a clean working environment and reducing environmental pollution. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of an electroplating line processing device proposed in this utility model;

[0023] Figure 2 This is a partial schematic diagram of the take-up structure assembly of an electroplating line processing device proposed in this utility model;

[0024] Figure 3 This is a partial schematic diagram of the grinding structure assembly of an electroplating line processing device proposed in this utility model.

[0025] Legend:

[0026] 1. Device base frame; 2. Feeding reel; 303. Grinding box housing; 312. Chip suction fan; 3. Grinding structure assembly; 302. Motor 1; 304. Shaft 1; 305. Pressure roller; 306. Grinding belt; 307. Driven gear 1; 308. Shaft 2; 309. Shaft 3; 310. Drive wheel; 4. Take-up structure assembly; 41. Motor 2; 42. Pulley 1; 43. Transmission belt; 44. Pulley 2; 45. Take-up reel; 5. Chip collection box; 6. Electroplating line. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figures 1-3 This utility model provides an electroplating line processing device, including: a device base frame 1, a grinding structure assembly 3, and a take-up structure assembly 4. The take-up structure assembly 4 is arranged above the device base frame 1. The take-up structure assembly 4 includes a second motor 41, the output end of which is fixedly connected to a first pulley 42. A take-up wheel 45 is rotatably mounted above the device base frame 1, and a second pulley 44 is fixedly arranged on one side of the take-up wheel 45. A grinding box housing 303 is arranged above the device base frame 1. The grinding structure assembly 3 includes a first motor 302 disposed on the outer wall of one side of the grinding box housing 303. The output end of shaft 302 is fixedly connected to shaft 309. Shaft 309 passes through and is fixedly connected to drive wheel 310. Shaft 2 308 is rotatably connected to the grinding box housing 303. Shaft 2 308 passes through and is fixedly connected to driven gear 307. Driven gear 307 meshes with drive wheel 310. Shaft 1 304 is provided above shaft 309. Shaft 1 304 passes through and is rotatably connected to pressure pulley 305. Shaft 1 304 passes through and is fixedly connected to grinding box housing 303 and is located above shaft 309. Driven gear 307 is symmetrically arranged on both sides of drive wheel 310.

[0029] In this embodiment, the device base frame, the grinding structure group, and the wire take-up structure group constitute the electroplating line processing device involved in this application, realizing an electroplating line processing device. The electroplating line in this application refers to the electroplating line in the electroplating line processing. This device can be used for any electroplating line that needs to be processed. This application does not limit the specific type of electroplating line.

[0030] In this embodiment, shaft 304 is located above shaft 309 and is rotatably connected to pressure roller 305. A polishing belt is installed on the outer ring of pressure roller 305. When shaft 304 rotates, it drives pressure roller 305 to rotate, causing the polishing belt to rotate. Shaft 2 308 is fixedly connected to driven gear 307. The rotation of driven gear 307 drives pressure roller 305 to rotate through shaft 2 308, thus polishing the electroplating line.

[0031] In this embodiment, pulley 42 is connected to pulley 44 via a transmission belt. The rotation of pulley 42 drives the transmission belt, which in turn drives pulley 44 and take-up pulley 45 to rotate, thereby winding up the electroplating wire.

[0032] It should be noted that the electroplating wire to be processed is wound around the middle outer ring of the wire feeding wheel and the wire take-up structure assembly, passing through the middle of the two sets of polishing belts. The electroplating wire is polished as it passes through the polishing belts.

[0033] Specifically, the grinding structure group 3 has two sets arranged symmetrically at the top and bottom, and the two sets of driven gears 307 arranged at the top and bottom mesh with each other.

[0034] In this embodiment, the grinding structure group 3 is set as two symmetrical groups, and the two driven gears 307 mesh with each other to ensure that the upper and lower grinding belts grind the electroplating line at the same speed.

[0035] Specifically, a drive belt 43 is provided on the outer ring of pulley 42 and pulley 44. When pulley 42 rotates, it drives the drive belt 43 to rotate at the same time. The drive belt 43 causes pulley 44 to rotate at the same time, which in turn drives the take-up reel 45 to rotate.

[0036] In a preferred embodiment, the drive belt 43 ensures that pulley 42 and pulley 44 rotate simultaneously. When pulley 44 rotates, it drives the take-up pulley 45, causing the take-up pulley 45 to wind up the electroplating wire.

[0037] Specifically, shaft 2 308 is set on both sides of shaft 309. Shaft 2 308 and the outer ring of pressure roller 305 are equipped with polishing belt 306. When shaft 309 rotates, drive wheel 310 drives driven gear 1 307 on both sides to rotate. Driven gear 1 307 drives the two sets of shaft 2 308 arranged vertically to rotate, which in turn drives the two sets of polishing belt 306 arranged vertically to rotate, polishing the electroplating line.

[0038] It should be noted that the rotation of shaft 309 is driven by the drive wheel 310 to rotate the driven gears 307 on both sides. The two sets of shafts 308 and the grinding belt 306 can simultaneously grind the upper and lower surfaces of the electroplating line.

[0039] Specifically, a chip suction fan 312 is provided at the lower end of the inner wall of the grinding box housing 303. The chip suction fan 312 passes through the base frame 1 of the fixed connection device. When the chip suction fan 312 is started, it absorbs the chips that fall off the grinding structure assembly 3.

[0040] As a preferred implementation, the chip suction fan 312 absorbs the debris generated during the grinding process, reducing the pollution of the working environment by dust and debris.

[0041] Specifically, a chip collection box 5 is provided at the bottom of the chip suction fan 312. The chip collection box 5 passes through the sliding connection device base frame 1 and is used to collect the chips that fall down through the chip suction fan 312.

[0042] It should be noted that the grinding debris collection box 5 passes through the sliding connection device base frame 1 to clean up the accumulated debris.

[0043] Specifically, a wire feeding wheel 2 is installed at the end of the device base frame 1 away from the motor 41. The wire feeding wheel 2 is equipped with an electroplating wire 6. The electroplating wire 6 is wound around the middle outer ring of the wire feeding wheel 2 and the wire take-up structure group 4. The electroplating wire 6 passes through the middle of the two sets of polishing belts 306, and the polishing belts 306 polish the electroplating wire 6.

[0044] In this embodiment, the electroplating line 6 is ensured to be evenly spread out before entering the grinding area by the middle outer ring of the wire feeding wheel 2 and the wire take-up structure group 4, which improves the uniformity of grinding. The wire feeding wheel 2 enables the electroplating line 6 to continuously enter the processing area, so that the electroplating line can be continuously ground, thereby improving the efficiency of the production line.

[0045] In use, start motor 2 41, pulley 1 42 drives transmission belt 43 to rotate, causing pulley 2 44 to rotate, which in turn causes take-up pulley 45 to rotate, pulling the electroplating wire 6 from unwind pulley 2 to wind it up. Start motor 1 302 to drive pulley 310 to rotate, and two sets of driven gears 1 307 mesh with drive pulley 310 to rotate, thereby causing two sets of shafts 2 308 to rotate. Pressure pulley 305 rotates on shaft 1 304, causing grinding belt 306 to rotate and grind the electroplating wire 6. At the same time, drive pulley 310 drives four sets of driven gears 1 307 to rotate, and two sets of grinding belts 306 installed on the four sets of driven gears 1 307 rub the electroplating wire 6. Start chip suction fan 312, and the grinding chips will enter the chip collection box 5.

[0046] This utility model discloses an electroplating line processing device. By starting motor 2 and motor 1, the device realizes automatic winding and automatic polishing of the electroplating line. Two sets of polishing belts polish the electroplating line simultaneously, ensuring the uniformity and consistency of the surface treatment of the electroplating line. The use of a dust suction fan reduces the spread of dust during the polishing process and improves the working environment.

[0047] Finally, it should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0048] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An electroplating line processing apparatus, characterized by: Including device base (1), polishing structure group (3) and take-up structure group (4), the device base (1) is provided with take-up structure group (4) on the top, the take-up structure group (4) includes motor two (41), the output end of motor two (41) is fixedly connected with pulley one (42), the device base (1) is rotatably installed with take-up wheel (45) on the top, pulley two (44) is fixedly arranged on the one side of take-up wheel (45).

2. A plating line processing apparatus according to claim 1, characterized by: The device base (1) is provided with polishing box shell (303) on the top, the polishing structure group (3) includes motor one (302) arranged on the outer wall of one side of polishing box shell (303), the output end of motor one (302) is fixedly connected with shaft three (309), shaft three (309) is fixedly connected with driving wheel (310) through penetration.

3. A plating line processing apparatus according to claim 2, characterized in that: The polishing box shell (303) is rotatably connected with shaft two (308), shaft two (308) is fixedly connected with driven gear one (307) through penetration, driven gear one (307) is engaged with driving wheel (310), shaft three (309) is provided with shaft one (304) on the top, shaft one (304) is rotatably connected with pressure belt wheel (305), shaft one (304) penetrates polishing box shell (303) and is located above shaft three (309), driven gear one (307) is symmetrically arranged on both sides of driving wheel (310), the polishing structure group (3) is symmetrically arranged with two groups in up and down, and the two groups of driven gear one (307) are engaged with each other.

4. A plating line processing apparatus according to claim 3, characterized by: The outer circle of pulley one (42) and pulley two (44) is provided with transmission belt (43), pulley one (42) drives transmission belt (43) to rotate at the same time, transmission belt (43) drives pulley two (44) to rotate at the same time, and drives take-up wheel (45) to rotate.

5. A plating line processing apparatus according to claim 4, characterized in that: Shaft two (308) is arranged on both sides of shaft three (309), polishing belt (306) is installed on the outer circle of shaft two (308) and pressure belt wheel (305), driving wheel (310) drives both sides driven gear one (307) to rotate when shaft three (309) rotates, driven gear one (307) drives the rotation of the two groups of shaft two (308) arranged in up and down, and further drives the rotation of the two groups of polishing belt (306) arranged in up and down, and polishes the electroplating line.

6. A plating line processing apparatus according to claim 5, wherein: The lower end of the inner wall of the polishing box shell (303) is provided with a dust extraction fan (312), the dust extraction fan (312) is fixedly connected with the device base (1) through penetration, and the dust extraction fan (312) is started. The bottom end of the dust extraction fan (312) is provided with a grinding dust collecting box (5), the grinding dust collecting box (5) is slidably connected with the device base (1) through penetration, and the grinding dust collecting box (5) is used for loading the debris falling through the dust extraction fan (312).

7. A plating line processing apparatus according to claim 6, characterized in that: The device base frame (1) is provided with a pay-off wheel (2) at one end away from the motor (41), the pay-off wheel (2) is provided with an electroplated wire (6), the electroplated wire (6) is wound around the middle outer ring of the pay-off wheel (2) and the take-up structure group (4), the electroplated wire (6) penetrates the middle part of the two groups of polishing belts (306), and the polishing belts (306) polish the electroplated wire (6).

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