Full-automatic wafer thinning machine

Abstract

The utility model discloses a full-automatic wafer thinning machine which comprises a box body, a box door is movably installed on the front face of the box body, a telescopic air cylinder is fixedly installed at the top of an inner cavity of the box body, a servo motor is fixedly installed at the output end of the telescopic air cylinder, and the output end of the servo motor is in transmission connection with a grinding sheet. Two electric telescopic rods are fixedly mounted at the top of an inner cavity of the box body; according to the utility model, the plurality of switch-type atomization nozzles are arranged, the heights of the annular pipe and the switch-type atomization nozzles can be adjusted through the electric telescopic rod, and different switch-type atomization nozzles can be opened and closed, so that the water outlet direction can be adjusted, uniform atomization spraying can be conveniently carried out on the periphery of wafer thinning operation, and thinning operation can be assisted; and the water flow is filtered through the filter screen frame and then recycled, the filter screen frame is conveniently taken out by an operator, filtered impurities are taken out, and operation and recycling are facilitated.

Description

Technical Field

[0001] This utility model relates to the field of automatic wafer thinning machine technology, specifically a fully automatic wafer thinning machine. Background Technology

[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. The raw material for wafers is silicon, while silicon dioxide is an inexhaustible resource on the Earth's crust. Wafer thinning is an important process step in integrated circuit fabrication, mainly referring to thinning the wafer substrate through thinning / grinding. Improving chip heat dissipation: With the development of integrated circuit technology, chip integration density is constantly increasing, the number of transistors per unit area is increasing, and the heat generated during operation is correspondingly increasing. Thinner wafers can reduce heat conduction paths, allowing heat to dissipate more quickly, thereby lowering the chip's operating temperature, improving chip reliability and stability, and avoiding performance degradation or damage due to overheating.

[0003] In the wafer thinning process, a wafer thinning machine is required for the thinning operation. Existing wafer thinning machines generally use a traditional fixing structure when installing and fixing the wafer. During the installation and fixing of the wafer, the conventional installation structure may damage the wafer and cannot effectively handle the installation and fixing of wafers of different diameters, thus causing certain inconveniences. Based on this, a fully automatic wafer thinning machine is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a fully automatic wafer thinning machine to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A fully automatic wafer thinning machine, comprising a housing, a door movably installed on the front of the housing, a telescopic cylinder fixedly installed on the top of the inner cavity of the housing, a servo motor fixedly installed on the output end of the telescopic cylinder, a grinding disc drivenly connected to the output end of the servo motor, two electric telescopic rods fixedly installed on the top of the inner cavity of the housing, a ring tube fixedly installed on the output end of the two electric telescopic rods, a plurality of switchable atomizing nozzles connected to the inner side of the ring tube, a permeable plate fixedly installed inside the housing, a circular seat fixedly sleeved on the inner side of the permeable plate, a thin soft pad fixedly installed on the bottom of the circular seat, and the top of the circular seat and the thin soft pad... The interior of the housing has several sealing grooves, and sealing heads are movably fitted inside the sealing grooves. The interior of the circular seat has several annular grooves, and annular sealing pistons are movably fitted inside the annular grooves. Several support rods are fixedly installed at the bottom of the annular sealing pistons, and support plates are fixedly installed at the bottom ends of the support rods. An adjustable stroke cylinder is fixedly installed at the bottom of the support plate, and a short support plate is fixedly installed at the bottom end of the adjustable stroke cylinder. Two sliding plates are fixedly installed inside the housing, and filter frames are slidably installed on the top of the two sliding plates. A water pump is fixedly installed on the outside of the housing. The input end of the water pump is connected to an input pipe, and the output end of the water pump is connected to an output pipe. The other end of the output pipe is connected to a water delivery hose.

[0006] Preferably, the switchable atomizing nozzles are evenly distributed circumferentially on the inner side of the annular tube, the switchable atomizing nozzles are distributed at an angle downwards, and the position of the grinding disc corresponds to the position of the circular seat.

[0007] Preferably, the sealing grooves are evenly distributed circumferentially inside the circular seat and the thin soft pad, the top end of the annular groove is connected to the bottom end of the sealing groove, and the annular grooves have a concentric circle structure layout, in which the larger circles surround the smaller circles in a regular distribution.

[0008] Preferably, the short support plate is fixedly installed on the inner wall of the box, the support rods are evenly distributed in a circle inside the annular groove, and the specifications and dimensions of the support plate are adapted to the specifications and dimensions of the circular seat.

[0009] Preferably, the end of the water supply hose away from the output pipe is connected to the inside of the ring pipe, the end of the input pipe away from the water pump is connected to the bottom of the inner cavity of the box, and the specifications and dimensions of the filter screen frame are adapted to the specifications and dimensions of the slide plate and the short support plate.

[0010] Preferably, a control panel is installed on the front of the cabinet door.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: When using this structure, the operator opens the cabinet door and places the wafer to be thinned at the top center of the thin-layer soft pad. The sealing head then fills the sealing groove (not at the bottom of the wafer) with the sealing plug. Next, the adjustable stroke cylinder retracts, causing the support plate to move downwards, which in turn moves the support rod and the annular sealing piston downwards. This creates a slight negative pressure inside the annular groove and the sealing groove, generating a suction force on the wafer. Under the adsorption of the thin-layer soft pad and the sealing groove, the wafer... This process secures the wafer. Then, a telescopic cylinder extends to move the servo motor and grinding disc downwards. Simultaneously, the servo motor rotates the grinding disc, thinning the wafer. At the same time, an electric telescopic rod extends to adjust the position of the ring pipe. A water pump delivers water through an output pipe to a water delivery hose, which is then sprayed out through the ring pipe and a switchable atomizing nozzle to clean the thinned wafer. The overall operation is convenient, allowing for the fixation of wafers of different sizes, facilitating wafer installation and fixation, reducing wafer damage, and increasing adaptability to different wafers.

[0012] This invention features multiple on / off atomizing nozzles, and the ring tube and on / off atomizing nozzles can be height-adjusted via an electric telescopic rod. Different on / off atomizing nozzles can be opened and closed to adjust the water outlet direction, facilitating uniform atomization spraying around the wafer thinning operation. This helps to assist in the thinning operation. Furthermore, the water is filtered through a filter screen and then recycled. It is also convenient for operators to remove the filter screen and carry away the filtered impurities, making the operation and recycling easier. Attached Figure Description

[0013] Figure 1 This is a front-view stereoscopic structural diagram of the present utility model.

[0014] Figure 2 This is a schematic diagram of the front sectional structure of this utility model.

[0015] Figure 3 This utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0016] Figure 4 This is a three-dimensional view of the sealing head of this utility model from below.

[0017] Figure 5 This is a top view schematic diagram showing the distribution of the sealing groove and sealing head of this utility model.

[0018] In the diagram: 1. Box body; 2. Box door; 3. Control panel; 4. Water pump; 5. Output pipe; 6. Input pipe; 7. Telescopic cylinder; 8. Servo motor; 9. Grinding disc; 10. Water supply hose; 11. Electric telescopic rod; 12. Ring pipe; 13. Switchable atomizing nozzle; 14. Water permeable plate; 15. Short support plate; 16. Adjustable stroke cylinder; 17. Filter screen frame; 18. Slide plate; 19. Support plate; 20. Round seat; 21. Sealing groove; 22. Sealing head; 23. Ring groove; 24. Annular sealing piston; 25. Support rod; 26. Thin layer soft pad. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1-5 This utility model provides a technical solution: a fully automatic wafer thinning machine, including a housing 1, a door 2 movably installed on the front of the housing 1, a telescopic cylinder 7 fixedly installed on the top of the inner cavity of the housing 1, a servo motor 8 fixedly installed on the output end of the telescopic cylinder 7, a grinding disc 9 being drivenly connected to the output end of the servo motor 8, two electric telescopic rods 11 fixedly installed on the top of the inner cavity of the housing 1, a ring pipe 12 fixedly installed on the output end of the two electric telescopic rods 11, a plurality of switchable atomizing nozzles 13 connected to the inner side of the ring pipe 12, a permeable plate 14 fixedly installed inside the housing 1, a round seat 20 fixedly sleeved on the inner side of the permeable plate 14, a thin soft pad 26 fixedly installed on the bottom of the round seat 20, and a plurality of openings in the top of the round seat 20 and the interior of the thin soft pad 26. The sealing groove 21 has a sealing head 22 that is movably fitted inside it. The round seat 20 has several annular grooves 23 inside it. The annular sealing piston 24 is movably fitted inside the annular grooves 23. Several support rods 25 are fixedly installed at the bottom of the annular sealing piston 24. A support plate 19 is fixedly installed at the bottom of the support rods 25. An adjustable stroke cylinder 16 is fixedly installed at the bottom of the support plate 19. A short support plate 15 is fixedly installed at the bottom of the adjustable stroke cylinder 16. Two sliding plates 18 are fixedly installed inside the box body 1. A filter screen frame 17 is slidably installed on the top of the two sliding plates 18. A water pump 4 is fixedly installed on the outside of the box body 1. The input end of the water pump 4 is connected to an input pipe 6. The output end of the water pump 4 is connected to an output pipe 5. The other end of the output pipe 5 is connected to a water delivery hose 10.

[0021] The working principle of the above technical solution is as follows: During use, the operator opens the cabinet door 2 and places the wafer to be thinned at the top center of the thin-layer soft pad 26. The sealing head 22 fills the sealing groove 21 (not at the bottom of the wafer). Then, the adjustable stroke cylinder 16 retracts, causing the support plate 19 to move downwards, which in turn moves the support rod 25 and the annular sealing piston 24 downwards. This creates a slight negative pressure inside the annular groove 23 and the sealing groove 21, generating a suction force on the wafer. Under the adsorption of the thin-layer soft pad 26 and the sealing groove 21, the wafer is thus... The wafer is fixed in place, and then the telescopic cylinder 7 extends to drive the servo motor 8 and the grinding disc 9 to move downwards. At the same time, the servo motor 8 is started to drive the grinding disc 9 to rotate, thereby thinning the wafer. Meanwhile, the electric telescopic rod 11 extends to drive the ring pipe 12 to adjust its position. The water pump 4 inputs water through the output pipe 5 into the water supply hose 10, and finally sprays it out through the ring pipe 12 and the switchable atomizing nozzle 13 to spray and clean the thinned wafer. The overall operation is convenient, and wafers of different sizes can be fixed, which facilitates the installation and fixation of wafers, reduces wafer damage, and increases the functionality to adapt to different wafers.

[0022] In another implementation scheme, such as Figure 1 and Figure 2 As shown, the switchable atomizing nozzles 13 are evenly distributed around the inner side of the ring tube 12, and the switchable atomizing nozzles 13 are distributed at an angle downwards. The position of the grinding disc 9 corresponds to the position of the circular seat 20.

[0023] The grinding disc 9 and the circular base 20 are concentric circles, which facilitates placement and improves the thinning accuracy. This solution sets up multiple switchable atomizing nozzles 13, and the height of the ring pipe 12 and the switchable atomizing nozzles 13 can be adjusted by the electric telescopic rod 11, and different switchable atomizing nozzles 13 can be opened and closed, thereby adjusting the water outlet direction to facilitate uniform atomization spraying around the wafer thinning operation, which helps to assist in the thinning operation. In addition, the water is filtered by the filter screen frame 17 and then recycled. It is also convenient for operators to remove the filter screen frame 17 and take out the filtered impurities, which facilitates operation and recycling.

[0024] In another implementation scheme, such as Figures 1-5 As shown, the sealing groove 21 is evenly distributed in a circle inside the round seat 20 and the thin soft pad 26. The top end of the annular groove 23 is connected to the bottom end of the sealing groove 21. The annular groove 23 presents a concentric circle structure layout, in which the larger circle surrounds the outside of the smaller circle and is regularly distributed.

[0025] The thin, soft pad 26 provides friction to the top of the circular seat 20 and increases airtightness. The circular seat 20 provides the mounting and opening positions for the internal structure. The sealing grooves 21 are circularly distributed, with their bottom ends connected to the top of the annular grooves 23, facilitating air pressure guidance and promoting the uniform application of weak air pressure adsorption. The multiple distributions of the annular grooves 23 correspond to the circumferential distribution of the sealing grooves 21, facilitating distribution and increasing structural convenience. In other designs, the multiple annular grooves 23 located at the center can be interconnected to reduce damage to the wafer center caused by excessive central air pressure, and the arrangement is based on the wafer thickness.

[0026] In another implementation scheme, such as Figures 1-3 As shown, the short support plate 15 is fixedly installed on the inner wall of the box 1, the support rod 25 is evenly distributed in the circumference inside the annular groove 23, and the specifications and dimensions of the support plate 19 are adapted to the specifications and dimensions of the round seat 20.

[0027] The short support plate 15 provides support for the adjustable stroke cylinder 16, and its short plate design does not obstruct the water flow. The support plate 19 provides support for the support rod 25 to facilitate synchronous movement, thereby increasing the relative stability of the structure.

[0028] In another implementation scheme, such as Figure 1 and Figure 2 As shown, the end of the water supply hose 10 away from the output pipe 5 is connected to the inside of the ring pipe 12, and the end of the input pipe 6 away from the water pump 4 is connected to the bottom of the inner cavity of the housing 1. The size of the filter frame 17 is adapted to the size of the slide plate 18 and the short support plate 15.

[0029] The water delivery hose 10 guides the water flow into the ring pipe 12, and its soft, telescopic structure facilitates the adjustment of the height and position of the ring pipe 12, increasing the overall performance. The short support plate 15 provides a certain top limit for the filter screen frame 17, ensuring that the position of the filter screen frame 17 does not shift when pulled out, facilitating the recycling of filtered water and increasing the overall recycling effect.

[0030] In another implementation scheme, such as Figure 1 and Figure 2 As shown, a control panel 3 is installed on the front of the door 2.

[0031] The control output terminal of the control panel 3 is electrically connected to the control input terminals of the output pipe 5, telescopic cylinder 7, servo motor 8, electric telescopic rod 11, switchable atomizing nozzle 13 and adjustable stroke cylinder 16 via wires, so that the control panel 3 can perform automated control operations based on the built-in PCL programmable controller, which facilitates automated operation.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A full-automatic wafer thinning machine comprising a box body (1), characterized in that: The front of the box (1) is movably mounted with a box door (2), the top of the inner cavity of the box (1) is fixedly mounted with a telescopic air cylinder (7), the output end of the telescopic air cylinder (7) is fixedly mounted with a servo motor (8), the output end of the servo motor (8) is drivingly connected with a grinding disc (9), the top of the inner cavity of the box (1) is fixedly mounted with two electric telescopic rods (11), the output ends of the two electric telescopic rods (11) are fixedly mounted with a ring pipe (12), the inner side of the ring pipe (12) is communicated with a plurality of switch type atomizing nozzles (13), the inside of the box (1) is fixedly mounted with a water permeable plate (14), the inner side of the water permeable plate (14) is fixedly sleeved with a circular seat (20), the bottom of the circular seat (20) is fixedly mounted with a thin layer of soft pad (26), a plurality of blocking grooves (21) are formed in the top end of the circular seat (20) and the inside of the thin layer of soft pad (26), the inside of the blocking groove (21) is movably sleeved with a blocking head (22), a plurality of ring grooves (23) are formed in the inside of the circular seat (20), the inside of the ring groove (23) is movably sleeved with a ring-shaped sealing piston (24), a plurality of supporting rods (25) are fixedly mounted on the bottom of the ring-shaped sealing piston (24), the bottom end of the supporting rod (25) is fixedly mounted with a supporting plate (19), the bottom of the supporting plate (19) is fixedly mounted with an adjustable stroke air cylinder (16), the bottom end of the adjustable stroke air cylinder (16) is fixedly mounted with a short supporting plate (15), the inside of the box (1) is fixedly mounted with two sliding plates (18), the top of the two sliding plates (18) is slidingly mounted with a filter screen frame (17), the outside of the box (1) is fixedly mounted with a water pump (4), the input end of the water pump (4) is communicated with an input pipe (6), the output end of the water pump (4) is communicated with an output pipe (5), the other end of the output pipe (5) is communicated with a water conveying hose (10).

2. The fully automatic wafer thinning machine according to claim 1, wherein: The switch type atomizing nozzles (13) are uniformly distributed on the inner side of the ring pipe (12), the switch type atomizing nozzles (13) are inclined downward, the position of the grinding disc (9) corresponds to the position of the circular seat (20).

3. The fully automatic wafer thinning machine according to claim 1, wherein: The blocking grooves (21) are uniformly distributed in the inside of the circular seat (20) and the thin layer of soft pad (26), the top end of the ring groove (23) is communicated with the bottom end of the blocking groove (21), the ring groove (23) presents a concentric circle structure layout, wherein the larger circular ring is arranged outside the smaller circular ring in a regular distribution.

4. The fully automatic wafer thinning machine of claim 1, wherein: The short supporting plate (15) is fixedly mounted on the inner wall of the box (1), the supporting rods (25) are uniformly distributed in the inside of the ring groove (23), the specification size of the supporting plate (19) is matched with the specification size of the circular seat (20).

5. The fully automatic wafer thinning machine according to claim 1, wherein: The water conveying hose (10) is communicated in the inside of the ring pipe (12) away from the output pipe (5), the input pipe (6) is communicated at the bottom of the inner cavity of the box (1) away from the water pump (4), the specification size of the filter screen frame (17) is matched with the specification size of the sliding plate (18) and the short supporting plate (15).

6. The fully automatic wafer thinning machine according to claim 1, wherein: The front of the box door (2) is mounted with a control panel (3).

Images