Sensor chip film-coating packaging equipment

Abstract

The utility model relates to the technical field of chip processing, and specifically relates to a sensor chip film-coating packaging device. Comprising a machine body and a film feeding mechanism, the film feeding mechanism comprises a film storage roller, a film pressing roller, a film guiding roller frame, a positioning base, a support, an electric push rod, a guiding device and a pressing device, during film covering packaging, a chip is placed on the positioning base, the top plane of the chip is flush with the top end face of the positioning base, and then the head of a protective film on the film storage roller penetrates through the position below the film pressing roller; then the protective film sequentially penetrates through the film guide roller frame, finally, the protective film is placed on the upper surface of the chip, the electric push rod is further controlled to act to drive the pressing device to move downwards to conduct hot-pressing film covering and cutting-off, and the protective film can be tensioned in advance through cooperation of the film pressing roller and the film guide roller frame so that the film can be fully flattened and fully stretched; therefore, the problem that the film laminating quality is greatly influenced due to the fact that wrinkles are formed on the film surface in the film laminating process caused by the fact that the film area is too large and the film stress is not uniform when the existing chip film laminating equipment performs film laminating work can be solved.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a sensor chip coating and packaging equipment. Background Technology

[0002] Sensor chip coating encapsulation refers to covering and encapsulating a sensor chip with a layer of transparent polymer material to protect the chip, extend its lifespan and stability, and enable it to operate reliably under various environmental conditions. Generally, the protective film only needs to cover one side of the sensor chip, because the sensor chip's sensitive elements, circuitry, and pins are typically concentrated on one side; only the sensitive areas need protection.

[0003] Existing chip coating equipment often results in wrinkles on the film surface during the coating process due to the excessively large area of ​​the film and uneven stress on the film, which greatly affects the coating quality. Utility Model Content

[0004] The purpose of this invention is to provide a sensor chip coating and packaging device, which aims to solve the problem that existing chip coating equipment often causes wrinkles on the surface of the film during the coating process due to the excessive area of ​​the film and uneven stress on the film, thus greatly affecting the coating quality.

[0005] To achieve the above objectives, this utility model provides a sensor chip coating and packaging device, including a body and a film feeding mechanism;

[0006] The film feeding mechanism includes a film storage roller, a film pressing roller, a film guide roller frame, a positioning seat, a bracket, an electric push rod, a guiding device, and a pressing device. The film storage roller is rotatably mounted on the left side of the machine body and is higher than the film guide roller frame. The film pressing roller is rotatably mounted on the side of the machine body near the film storage roller, and its lowest point is lower than the middle gap of the roller group on the film guide roller frame. Several film guide roller frames are detachably mounted on the top of the machine body and are located on the right side of the film pressing roller. The positioning seat is fixed on the right side of the top of the machine body. The bracket is fixed on the top of the machine body and is located behind the positioning seat. The electric push rod is fixed on the top of the bracket, and its output end is connected to the pressing device. The guiding device is located on the left side of the positioning seat.

[0007] The machine body has a switch door on the front, ventilation panels on the left and right sides, and electrical control equipment inside the cavity.

[0008] The guiding device includes a guide frame and guide rollers. The guide frame is fixed to the top of the machine body and located on the side of the machine body near the positioning seat. The two guide rollers are rotatably mounted on the guide frame.

[0009] The pressing device includes a cutting plate, an electric heating plate, and a guide assembly. The cutting plate is connected to the output end of the electric push rod and is located on the top of the positioning seat. The electric heating plate is fixed to the bottom of the cutting plate and can abut against the top end face of the positioning seat. The guide assembly is disposed on the side of the cutting plate near the bracket.

[0010] The sensor chip coating and packaging equipment also includes a collection mechanism, which includes a hanging ear and a collection box. The two hanging ears are fixed to the left side wall of the machine body. The collection box is detachably connected to the hanging ears and is hung on the hanging ears.

[0011] This invention relates to a sensor chip coating and packaging equipment. During sensor chip coating and packaging, the chip is first placed on a positioning seat, with the top plane of the chip flush with the top end face of the positioning seat. Then, the protective film head on the storage roller passes under the pressure roller, and then sequentially passes through the middle gap of the roller group on the guide roller frame. Finally, the protective film is placed on the upper surface of the chip. Further, the electric push rod is controlled to move the pressing device downwards for hot-press coating and cutting. The pressure roller and guide roller frame work together to pre-tension the protective film, allowing it to be fully flattened and stretched. This solves the problem that existing chip coating equipment often results in wrinkles on the film surface during coating due to excessively large film area and uneven stress, significantly affecting coating quality. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0013] Figure 1 This is a schematic diagram of the overall structure of the sensor chip coating and packaging equipment according to the first embodiment of this utility model.

[0014] Figure 2 This is a cross-sectional view of the positioning seat according to the first embodiment of this utility model.

[0015] Figure 3 This is a schematic diagram of the overall structure of the sensor chip coating and packaging device according to the second embodiment of this utility model.

[0016] In the diagram: 101-body, 102-film storage roller, 103-film pressing roller, 104-film guide roller frame, 105-positioning seat, 106-support, 107-electric push rod, 108-guide frame, 109-guide roller, 110-cutting plate, 111-electric heating plate, 112-guide assembly, 201-hanging ear, 202-collection box. Detailed Implementation

[0017] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0018] Example 1:

[0019] like Figure 1 and Figure 2 As shown, where Figure 1 This is a schematic diagram of the overall structure of a sensor chip coating and packaging equipment. Figure 2 This is a cross-sectional view of the positioning seat 105. This utility model provides a sensor chip coating and packaging device: it includes a body 101 and a film feeding mechanism. The film feeding mechanism includes a film storage roller 102, a pressure roller 103, a guide roller frame 104, a positioning seat 105, a support 106, an electric push rod 107, a guiding device, and a pressing device. The guiding device includes a guide frame 108 and a guide roller 109. The pressing device includes a cutter plate 110, an electric heating plate 111, and a guiding assembly 112. The aforementioned solution solves the problem that existing chip coating equipment often results in wrinkles on the film surface during coating due to excessively large film area and uneven film stress, significantly affecting coating quality. It is understood that the aforementioned solution can reduce surface wrinkles during coating, thereby improving coating quality.

[0020] In this embodiment, the bottom of the body 101 is provided with support feet for working support, the top is an installation platform, and the interior is a rectangular cavity.

[0021] The film storage roller 102 is rotatably mounted on the left side of the machine body 101 and is higher than the film guide roller frame 104. The film pressing roller 103 is rotatably mounted on the side of the machine body 101 near the film storage roller 102, and its lowest point is lower than the middle gap of the roller group on the film guide roller frame 104. Several film guide roller frames 104 are detachably mounted on the top of the machine body 101 and are located on the right side of the film pressing roller 103. The positioning seat 105 is fixed on the top right side of the machine body 101. The bracket 106 is fixed on the top of the machine body 101 and is located behind the positioning seat 105. The electric push rod 107 is fixed on the top of the bracket 106, and its output end is connected to the pressing device. The guide device is located on the left side of the positioning seat 105. The rear end of the film storage roller 102 is mounted on the mounting bracket on the left side of the machine body 101 via a rotating bearing. A limit plate is threaded on the front side. The rear end of the pressure roller 103 is fixed to the mounting bracket on the top of the machine body 101 via a rotating bearing. Several guide roller frames 104 are fixed with bolts, which are arranged from the top inside the machine body 101 outwards. Countersunk holes are provided on the four right-angled sides of the positioning seat 105 to facilitate fixing with bolts. The top of the positioning seat 105 is provided with a placement groove to facilitate chip placement. The bracket 106 is L-shaped and fixed with bolts, which are arranged from the top inside the machine body 101 outwards. The electric push rod 107 is fixed to the bracket 106 with bolts. The pressing device is used for hot pressing and film coating, and the guiding device is used for film feeding.

[0022] Secondly, a switch door is provided on the front side of the machine body 101, and ventilation plates are provided on the left and right sides respectively. Electrical control equipment is installed in the internal cavity. The switch door is used for internal maintenance, and the ventilation plates are used for heat dissipation of the electrical control equipment inside the machine body 101. The electrical control equipment is electrically connected to the electric push rod 107, and a cable hole is provided on the rear side wall of the machine body 101.

[0023] Then, the guide frame 108 is fixed to the top of the machine body 101 and located on the side of the machine body 101 near the positioning seat 105; the two guide rollers 109 are rotatably mounted on the guide frame 108. The guide frame 108 is fixed to the machine body 101 by bolts, which are set from the top inside the machine body 101 outwards, and the shaft ends of the guide rollers 109 on both sides are respectively mounted on the guide frame 108 through rotating bearings.

[0024] Finally, the cutter plate 110 is connected to the output end of the electric push rod 107 and is located on the top of the positioning seat 105; the electric heating plate 111 is fixed to the bottom of the cutter plate 110 and can abut against the top end face of the positioning seat 105; the guide assembly 112 is disposed on the side of the cutter plate 110 near the bracket 106. The positioning seat 105 has a cutting groove on its left side that engages with the cutting blade on the cutting plate 110. The external threaded end of the output end of the electric push rod 107 engages with the connecting threaded hole at the top of the cutting plate 110 for installation. The internal cavity of the electric heating plate 111 is provided with an electric heating wire. After the electric heating wire generates heat, it conducts the heat to the pressure plate at its bottom. The housing of the electric heating plate 111 is connected to the cutting plate 110 by countersunk bolts. The guide assembly 112 includes a guide rod and a T-shaped linear sliding bearing. The T-shaped linear sliding bearing is fixed to the bracket 106 by bolts. The external threaded end at the bottom of the guide rod engages with the connecting threaded hole at the top of the cutting plate 110 and slides with the T-shaped linear sliding bearing.

[0025] To address the problem of wrinkles on the film surface caused by excessively large film area and uneven stress during the coating process in existing chip coating equipment, which significantly affects coating quality, this invention addresses the issue of sensor chip coating and packaging. First, the chip is placed in the placement slot of the positioning seat 105, with the top plane of the chip flush with the top end face of the positioning seat 105. Then, the protective film head on the film storage roller 102 passes under the pressure roller 103, and then sequentially passes through the gaps between the roller groups on multiple guide roller frames 104. The gap between the rollers 109 is filled, and finally the protective film is placed on the upper surface of the chip. Further, the electric push rod 107 is controlled to move the cutter plate 110 and the electric heating plate 111 downward to perform hot pressing, film coating and cutting. The film pressing roller 103 and the film guiding roller frame 104 cooperate to pre-tension the protective film so that the film can be fully flattened and fully stretched. This can solve the problem that existing chip coating equipment often has wrinkles on the surface of the film during the coating process due to the large area of ​​the film and uneven stress on the film, which greatly affects the coating quality.

[0026] Example 2:

[0027] like Figure 3 As shown, where Figure 3 This is a schematic diagram of the overall structure of a sensor chip coating and packaging device. Based on the first embodiment, this utility model provides a sensor chip coating and packaging device, which further includes a collection mechanism, including a hanging ear 201 and a collection box 202.

[0028] Two hanging ears 201 are fixed to the left side wall of the machine body 101; the collection box 202 is detachably connected to the hanging ears 201 and is hung on the hanging ears 201. The hanging ears 201 are fixed to the machine body 101 by bolts, which are set from the inside to the outside of the left side wall of the machine body 101. The hanging ears 201 are provided with through rectangular slots to facilitate the hanging of the rectangular end of the collection box 202.

[0029] In this embodiment, the collection box 202 can be directly hung and installed by setting the hanging ear 201, and the collection box 202 can be used to collect the film waste generated during hot pressing and lamination.

[0030] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A sensor chip film covering and packaging device, comprising a machine body, characterized in that: it further comprises a film feeding mechanism; the film feeding mechanism comprises a film storage roller, a film pressing roller, a film guide roller frame, a positioning seat, a bracket, an electric push rod, a guide device and a pressing device, the film storage roller is rotatably installed on the left side of the machine body and is higher than the film guide roller frame, the film pressing roller is rotatably installed on the side of the machine body close to the film storage roller and the lowest point thereof is lower than the middle gap of the roller group on the film guide roller frame, a plurality of film guide roller frames are detachably installed on the top of the machine body and are arranged on the right side of the film pressing roller, the positioning seat is fixed on the right side of the top of the machine body, the bracket is fixed on the top of the machine body and is located on the rear side of the positioning seat, the electric push rod is fixed on the top of the bracket and the output end thereof is connected with the pressing device, and the guide device is arranged on the left side of the positioning seat.

2. The sensor chip film covering and packaging device according to claim 1, characterized in that: a switch door is arranged on the front side of the machine body, ventilation plates are arranged on the left and right sides thereof respectively, and electrical control equipment is arranged in the internal cavity.

3. The sensor chip film covering and packaging device according to claim 1, characterized in that: the guide device comprises a guide frame and guide rollers, the guide frame is fixed on the top of the machine body and is located on the side of the machine body close to the positioning seat, and two guide rollers are rotatably installed on the guide frame.

4. The sensor chip film covering and packaging device according to claim 1, characterized in that: the pressing device comprises a cutter plate, an electric heating pressing plate and a guide assembly, the cutter plate is connected with the output end of the electric push rod and is located on the top of the positioning seat, the electric heating pressing plate is fixed on the bottom of the cutter plate and can abut on the top end face of the positioning seat, and the guide assembly is arranged on the side of the cutter plate close to the bracket.

5. The sensor chip on film package apparatus of claim 1, wherein : the sensor chip film covering and packaging device further comprises a collecting mechanism, the collecting mechanism comprises ear hangers and a collecting box, two ear hangers are fixed on the left side wall of the machine body, and the collecting box is detachably connected with the ear hangers and is hung on the ear hangers.

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