Adsorption type material taking mechanism, feeding device for flexible printed circuit board and thermocompression bonding machine

Abstract

The utility model discloses an adsorption type material taking mechanism, a feeding device used for a flexible printed circuit board and a thermocompression bonding machine, the adsorption type material taking mechanism comprises an installation support, and the installation support is provided with a first installation structure and a second installation structure; the main adsorption part is connected with the first mounting structure; the secondary adsorption part is connected with the second mounting structure; the adsorption end of the main adsorption part and the adsorption end of the secondary adsorption part are located at the same horizontal height, and the main adsorption part and the secondary adsorption part can suck the two ends of a to-be-machined workpiece correspondingly. The adsorption type material taking mechanism is applied to a feeding device for a flexible printed circuit board and a thermocompression bonding machine, stable and accurate adsorption grabbing of workpieces to be machined can be achieved, and the adsorption type material taking mechanism is particularly suitable for processing light and thin workpieces such as the flexible printed circuit board.

Description

Technical Field

[0001] This utility model relates to the field of hot pressing machine technology, and in particular to an adsorption-type material handling mechanism. Background Technology

[0002] FPCB—short for Flexible Printed Circuit Board, is a type of printed circuit board with a pattern made using a flexible substrate. It consists of an insulating substrate and a conductive layer. Due to its characteristics such as continuous automated production, high wiring density, light weight, small size, fewer wiring errors, flexibility, and the ability to flexibly change shape, it is widely used in consumer electronics products such as digital cameras, watches, and laptops.

[0003] However, some connector products use relatively long flexible printed circuit boards (PCBs). During production, when the feeding mechanism of the thermoforming machine picks up long PCBs, because the feeding mechanism only has one suction nozzle, the PCBs may deform and bend during the process of being picked up and lifted. This causes the PCBs to interfere with the machine during transport, resulting in them falling off. Furthermore, the appearance of the PCBs is affected by the interference and scratches, leading to product defects.

[0004] Therefore, this application proposes a technical solution that solves the above-mentioned problems. Utility Model Content

[0005] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, this utility model proposes an adsorption-type material handling mechanism, which can prevent flexible printed circuit boards from bending and falling during the loading process, effectively ensuring production efficiency and product quality. Simultaneously, this application also provides a loading device and a hot press machine for flexible printed circuit boards using the aforementioned adsorption-type material handling mechanism.

[0006] In a first aspect, an adsorption-type material handling mechanism according to an embodiment of the present utility model includes:

[0007] The mounting bracket is provided with a first mounting structure and a second mounting structure.

[0008] The main adsorption component is connected to the first mounting structure;

[0009] The secondary adsorption component is connected to the second mounting structure;

[0010] The adsorption ends of the main adsorption element and the adsorption ends of the secondary adsorption element are at the same horizontal height, and the main adsorption element and the secondary adsorption element can respectively pick up both ends of the workpiece to be processed.

[0011] According to an embodiment of this utility model, an adsorption-type material handling mechanism has at least the following beneficial effects: A mounting bracket is added to the main adsorption component, and a secondary adsorption component is mounted on the mounting bracket. The main and secondary adsorption components work together to pick up both ends of a flexible printed circuit board (PCB). This ensures that when a long PCB is picked up and loaded, it provides sufficient adsorption force to the workpiece, preventing bending deformation or the PCB from falling off. Simultaneously, the adsorption ends of the main and secondary adsorption components are at the same horizontal height, ensuring simultaneous contact with the workpiece during operation and achieving synchronous adsorption. This not only improves the stability of adsorption but also helps to evenly distribute the adsorption force, preventing damage to the workpiece due to uneven force. The adsorption-type material handling mechanism provided in this application can achieve stable and precise adsorption and gripping of workpieces to be processed, and is particularly suitable for processing thin and light workpieces such as flexible circuit boards.

[0012] According to an embodiment of the present invention, an adsorption-type material handling mechanism is provided, wherein the mounting bracket is a rectangular bracket, a first mounting structure is disposed at one end of the mounting bracket, and a second mounting structure is disposed at the other end of the mounting bracket.

[0013] According to an embodiment of the present invention, an adsorption-type material handling mechanism includes a second mounting structure comprising a mounting groove disposed on a mounting bracket, a secondary adsorption element passing through the mounting groove, and the secondary adsorption element being fixedly connected to the mounting bracket.

[0014] According to an embodiment of the present invention, an adsorption-type material handling mechanism is provided, wherein the mounting groove is a strip-shaped groove that extends in a direction away from the first mounting structure, and the secondary adsorption component can be adjusted in position within the mounting groove.

[0015] According to an embodiment of the present utility model, the adsorption-type material handling mechanism further includes a second mounting structure, which includes a locking component. The locking component includes a first locking member and a second locking member. The first locking member and the second locking member are threadedly connected to the secondary adsorption member. The first locking member and the second locking member are respectively disposed on both sides of the mounting groove and abut against the mounting bracket.

[0016] According to an embodiment of the present invention, an adsorption-type material handling mechanism includes a first mounting hole, a main adsorption component passing through the first mounting hole, and a main adsorption component being fixedly connected to a mounting bracket.

[0017] According to an embodiment of the present invention, an adsorption-type material handling mechanism includes a first mounting structure that further includes a second mounting hole and a third locking member. The second mounting hole communicates with the first mounting hole, and one end of the third locking member passes through the second mounting hole and abuts against the main adsorption member.

[0018] According to an embodiment of the present invention, an adsorption-type material handling mechanism is provided, in which three second mounting holes are arranged circumferentially around the axis of the first mounting hole, and a third locking member is arranged correspondingly to the second mounting holes.

[0019] Secondly, the feeding device for flexible printed circuit boards according to the embodiments of the present invention utilizes the above-mentioned adsorption-type feeding mechanism.

[0020] The feeding device for flexible printed circuit boards according to embodiments of this utility model has at least the following beneficial effects: A mounting bracket is added to the main adsorption component, and a secondary adsorption component is mounted on the mounting bracket. The main and secondary adsorption components jointly adsorb both ends of the flexible printed circuit board, ensuring sufficient adsorption force for longer flexible printed circuit boards during feeding, preventing bending deformation or the flexible printed circuit board from falling off. Simultaneously, the adsorption ends of the main and secondary adsorption components are at the same horizontal height, ensuring simultaneous contact with the workpiece during operation, achieving synchronous adsorption. This not only improves the stability of adsorption but also helps to evenly distribute the adsorption force, preventing damage to the workpiece due to uneven force. The feeding device of this application, by applying the above-mentioned adsorption-type picking mechanism, can achieve stable and precise adsorption and gripping of the workpiece to be processed, and is particularly suitable for processing thin and light workpieces such as flexible circuit boards.

[0021] Thirdly, the hot press according to the embodiment of the present invention uses the above-mentioned feeding device for flexible printed circuit boards.

[0022] The hot press machine according to this utility model embodiment has at least the following beneficial effects: A mounting bracket is added to the main adsorption component, and a secondary adsorption component is mounted on the mounting bracket. The main and secondary adsorption components jointly adsorb both ends of the flexible printed circuit board, ensuring sufficient adsorption force for longer flexible printed circuit boards during loading, preventing bending deformation or the flexible printed circuit board from falling off. Simultaneously, the adsorption ends of the main and secondary adsorption components are at the same horizontal height, ensuring simultaneous contact with the workpiece during operation, achieving synchronous adsorption. This not only improves adsorption stability but also helps to evenly distribute the adsorption force, preventing damage to the workpiece due to uneven force. The hot press machine of this application, by applying the above-mentioned adsorption-type material handling mechanism, can achieve stable and precise adsorption and gripping of the workpiece to be processed, and is particularly suitable for processing thin and light workpieces such as flexible circuit boards.

[0023] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a structural diagram of an adsorption-type material handling mechanism according to an embodiment of the present invention;

[0026] Figure 2 This is a front view of an adsorption-type material handling mechanism according to an embodiment of the present invention.

[0027] Explanation of reference numerals in the attached figures:

[0028] Mounting bracket 100; mounting slot 110; first locking element 120; second locking element 130; first mounting hole 140; second mounting hole 150;

[0029] Main adsorption component 200;

[0030] 300 secondary adsorption elements. Detailed Implementation

[0031] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0032] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] In the description of a utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If the terms "first" and "second" are used, they are merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or the order of the indicated technical features.

[0034] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0035] This utility model embodiment provides an adsorption-type material handling mechanism.

[0036] Reference Figure 1The adsorption-type material handling mechanism includes a mounting bracket 100 and a main adsorption element 200 and a secondary adsorption element 300 mounted on the mounting bracket 100. As shown in the figure, the main adsorption element 200 and the secondary adsorption element 300 are respectively disposed at both ends of the mounting bracket 100. Correspondingly, the mounting bracket 100 is provided with a first mounting structure and a second mounting structure, which are respectively connected to the main adsorption element 200 and the secondary adsorption element 300.

[0037] Specifically, the mounting bracket 100 is a rectangular bracket. A first mounting structure is located at one end of the mounting bracket 100, and a second mounting structure is located at the other end. The second mounting structure includes a locking assembly and a mounting groove 110 on the mounting bracket 100. The secondary adsorption component 300 passes through the mounting groove 110. The locking assembly includes a first locking member 120 and a second locking member 130. The first locking member 120 and the second locking member 130 are threadedly connected to the secondary adsorption component 300. The first locking member 120 and the second locking member 130 are located on opposite sides of the mounting groove 110 and abut against the mounting bracket 100. The secondary adsorption component 300 is fixed to the mounting bracket 100 through the combined action of the first locking member 120 and the second locking member 130. The structure is simple, practical, and easy to assemble and disassemble.

[0038] Furthermore, the mounting bracket 100 is preferably a rectangular bracket, which is structurally stable and easy to process and install, while the mounting groove 110 is a strip-shaped groove. As shown in the figure, the mounting groove 110 and the mounting bracket 100 extend in the same direction, allowing the user to adjust the distance between the secondary adsorption component 300 and the main adsorption component 200 according to the actual situation, so as to adapt to workpieces of different sizes or shapes, thereby improving the versatility and adaptability of the material handling mechanism.

[0039] Of course, users can also increase the number of adsorption elements 300 according to actual conditions to provide adsorption force on the workpiece and achieve multi-point adsorption of the workpiece, thereby improving the stability of workpiece handling.

[0040] According to some embodiments of this application, as shown in the figure, the first mounting structure includes a first mounting hole 140, a second mounting hole 150, and a third locking member. Specifically, three second mounting holes 150 are circumferentially arranged around the axis of the first mounting hole 140, and the second mounting holes 150 communicate with the first mounting holes 140. One end of the third locking member passes through the second mounting hole 150 and abuts against the main adsorption member 200, forming a omnidirectional fixation. The inner wall of the second mounting hole 150 may be provided with internal threads, and the third locking member is a screw. The main adsorption member 200 is fixed to the mounting bracket 100 by the screw. The structure is simple and practical, and easy for users to assemble and disassemble.

[0041] It should be noted that, for example Figure 2As shown, the adsorption ends of the main adsorption element 200 and the secondary adsorption element 300 need to be at the same horizontal level to ensure that they can contact the workpiece simultaneously during operation and achieve synchronous adsorption. This not only improves the stability of adsorption but also helps to distribute the adsorption force evenly and avoid damage to the workpiece due to uneven force.

[0042] According to some embodiments of this application, this application also provides a feeding device (not shown in the figure) for flexible printed circuit boards that uses the above-mentioned adsorption-type picking mechanism, which can stably and accurately pick up and place flexible printed circuit boards, thereby improving production efficiency and product quality.

[0043] Furthermore, this application also provides a hot press machine (not shown) that uses a feeding device for flexible printed circuit boards. By integrating the feeding mechanism into the hot press machine, automatic feeding and positioning of flexible printed circuit boards can be achieved, further improving the automation level and welding quality of the welding process.

[0044] A mounting bracket 100 is added to the main adsorption component 200, and a secondary adsorption component 300 is mounted on the mounting bracket 100. The main adsorption component 200 and the secondary adsorption component 300 jointly adsorb both ends of the flexible printed circuit board (PCB). This ensures that even long PCBs can be properly adsorbed during loading, preventing bending, deformation, or the PCB from falling off. Simultaneously, the adsorption ends of the main adsorption component 200 and the secondary adsorption component 300 are at the same horizontal level, ensuring simultaneous contact with the workpiece during operation. This synchronous adsorption not only improves the stability of the adsorption but also helps to evenly distribute the adsorption force, preventing damage to the workpiece due to uneven force. The loading device and hot press machine for flexible printed circuit boards of this application, by applying the above-mentioned adsorption-type material handling mechanism, can achieve stable and precise adsorption and gripping of the workpiece to be processed, and is particularly suitable for processing thin and light workpieces such as flexible circuit boards.

[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0046] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A suction pick-up mechanism, characterized in that The application relates to a kind of adsorption type material taking mechanisms, which comprises: a mounting bracket provided with a first mounting structure and a second mounting structure; a main suction accessory connected with the first mounting structure; a secondary suction accessory connected with the second mounting structure; the suction end of the main suction accessory and the suction end of the secondary suction accessory are at the same horizontal height, and the main suction accessory and the secondary suction accessory can respectively suck two ends of a workpiece to be processed.

2. The suction pick-up mechanism according to claim 1, characterized in that The mounting bracket is a rectangular bracket, the first mounting structure is arranged at one end of the mounting bracket, and the second mounting structure is arranged at the other end of the mounting bracket.

3. The suction pick-up mechanism according to claim 2, characterized in that The second mounting structure comprises a mounting slot arranged on the mounting bracket, the secondary suction accessory penetrates through the mounting slot, and the secondary suction accessory is fixedly connected with the mounting bracket.

4. The suction pick-up mechanism according to claim 3, characterized in that The mounting slot is a strip-shaped slot body, the mounting slot extends away from the first mounting structure, and the secondary suction accessory can be adjusted in position in the mounting slot.

5. The suction pick-up mechanism according to claim 4, characterized in that The second mounting structure further comprises a locking assembly, the locking assembly comprises a first locking member and a second locking member, the first locking member and the second locking member are threadedly connected with the secondary suction accessory, and the first locking member and the second locking member are arranged on the two sides of the mounting slot and abut against the mounting bracket.

6. The suction pick-up mechanism according to claim 1, wherein The first mounting structure comprises a first mounting hole, the main suction accessory penetrates through the first mounting hole, and the main suction accessory is fixedly connected with the mounting bracket.

7. The suction pick-up mechanism according to claim 6, characterized in that The first mounting structure further comprises a second mounting hole and a third locking member, the second mounting hole is in communication with the first mounting hole, and one end of the third locking member penetrates through the second mounting hole and abuts against the main suction accessory.

8. The suction pick-up mechanism according to claim 7, characterized in that Three second mounting holes are arranged circumferentially around the axis of the first mounting hole, and the third locking member is correspondingly arranged with the second mounting hole.

9. A feeding device for a flexible printed circuit board, characterized by The application further relates to a kind of feeding devices for soft printed circuit boards, which comprises the adsorption type material taking mechanism.

10. A hot press comprising: The application further relates to a kind of feeding devices for soft printed circuit boards, which comprises the adsorption type material taking mechanism.

Images