Thermal insulation sandwich panel

Abstract

The utility model belongs to the technical field of thermal insulation materials, and discloses a thermal insulation sandwich board which comprises an upper layer board, a nanometer silicon composite thermal insulation board and a lower layer board body. The nanometer silicon composite heat insulation plate is located between the upper-layer plate body and the lower-layer plate body, and further comprises a splicing mechanism and a sealing assembly. The splicing mechanism comprises a T-shaped protrusion arranged on the first side edge of the heat preservation sandwich panel and a dovetail groove arranged on the second side edge of the heat preservation sandwich panel, a magnetic metal strip is embedded in the T-shaped protrusion, and a magnetic attraction piece is arranged in the dovetail groove. According to the heat preservation sandwich plate, the nanometer silicon composite heat insulation plate is adopted as a heat preservation core material, the heat resistance and the mechanical strength are optimized, the heat conductivity coefficient of the sandwich plate is obviously reduced, the heat insulation performance is improved, the compression resistance and the bending resistance are improved, the service life is prolonged, and the thickness of the plate is reduced. And self-locking splicing is adopted, gelling-free rapid installation is achieved, the installation process is simplified, the sealing performance of joints is improved, and the construction cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of thermal insulation materials technology, specifically to a thermal insulation sandwich panel with high thermal insulation performance. Background Technology

[0002] During the construction process, insulation boards are needed to waterproof and insulate the building. The strength and performance of the insulation boards directly affect the strength and waterproofing and insulation effect of the building's interior walls.

[0003] Existing insulation boards mostly use polyurethane, rock wool, or EPS to fill the space between two layers of panels, which has the following problems:

[0004] 1) The thermal conductivity of the insulation layer is high, resulting in insufficient heat insulation effect;

[0005] 2) Sandwich panels have low overall strength and are prone to deformation.

[0006] In addition, existing insulation boards are mostly installed using adhesive or bolts, which has the following problems:

[0007] 1) Thermal bridging is easily generated at the joints, reducing the thermal insulation performance;

[0008] 2) The joint treatment is complex, and the sealing performance depends on auxiliary materials;

[0009] 3) Difficult to disassemble and assemble, which is not conducive to repair and replacement.

[0010] Therefore, in order to solve the above-mentioned technical defects, there is a need for an insulation board that has excellent thermal insulation performance, improves the overall strength of the sandwich panel, and is easy to install. Utility Model Content

[0011] The technical problem to be solved by this utility model is to provide an insulated sandwich panel with excellent thermal insulation performance, stable structure and convenient installation.

[0012] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a thermal insulation sandwich panel, comprising an upper panel, a nano-silicon composite insulation board, and a lower panel; the nano-silicon composite insulation board is located between the upper panel and the lower panel.

[0013] Nano-silicon composite insulation panels utilize nano-silicon, light-blocking agents, and high-strength fibers to provide excellent thermal insulation to the filling core. The high-strength fiber mesh formed by the high-strength fibers gives the filling core good strength. The insulation layer and the high-strength fiber mesh of the nano-silicon composite insulation panel are bonded together with an inorganic adhesive, which preserves the natural pores of nano-silicon and effectively exerts its thermal insulation effect, giving the nano-silicon composite insulation panel the advantages of high thermal insulation and high strength.

[0014] This invention uses a nano-silicon composite insulation board as the filling core of the insulation board, which allows the overall thickness of the insulation board to be reduced as much as possible while optimizing thermal resistance and mechanical strength.

[0015] Preferably, the upper plate and the lower plate of this utility model are metal plates or rock plates.

[0016] Preferably, the thickness of the nano-silicon composite heat insulation board of this utility model is 1.8-3cm.

[0017] Preferably, the thickness of the upper plate and the lower plate of this utility model is 0.05-0.5cm.

[0018] Preferably, the present invention further includes a splicing mechanism and a sealing component; the splicing mechanism includes a T-shaped protrusion on the first side of the heat-insulating sandwich panel and a dovetail groove on the second side, a magnetic metal strip is pre-embedded in the T-shaped protrusion, and a magnetic suction piece is provided in the dovetail groove.

[0019] By adopting a structure with a splicing mechanism and sealing components, splicing installation can be achieved through the T-shaped protrusion on the first side and the dovetail groove on the second side, which can achieve glue-free rapid installation, improve splicing accuracy by more than 50%, increase construction efficiency by 30%, support non-destructive disassembly and assembly, and achieve a reuse rate of 80%.

[0020] Preferably, the sealing component is an elastic sealing strip disposed at the root of the T-shaped protrusion, and the compression rebound rate of the elastic sealing strip is ≥80%.

[0021] Preferably, the inner wall of the dovetail groove of this invention is provided with a waterproof adhesive strip.

[0022] The use of a sealed structure reduces heat loss by 15-20%.

[0023] The beneficial effects of this utility model are as follows:

[0024] 1) The thermal insulation sandwich panel of this utility model uses nano-silicon composite insulation board as the insulation core material, which optimizes the thermal resistance, significantly reduces the thermal conductivity of the sandwich panel, improves the thermal insulation performance, and has excellent cold and heat preservation effects.

[0025] 2) The thermal insulation sandwich panel of this utility model uses nano-silicon composite insulation board as the thermal insulation core material, which optimizes mechanical strength, improves compressive and bending strength, and extends service life.

[0026] 3) This utility model optimizes the thermal resistance and mechanical strength of the insulated sandwich panel while reducing the thickness of the panel.

[0027] 4) This utility model adopts self-locking splicing, realizes glue-free and rapid installation, simplifies the installation process, improves the sealing of joints, and reduces construction costs. Attached Figure Description

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this utility model.

[0030] Figure 2 This is a structural schematic diagram of Embodiment 2 of the present invention.

[0031] Figure 3 This is a schematic diagram of the splicing component in Embodiment 3 of this utility model.

[0032] Figure 4 This is a schematic diagram of the splicing component in Embodiment 5 of this utility model. Detailed Implementation

[0033] The technical solution of this utility model will be clearly and completely described below through specific embodiments.

[0034] The thermal insulation sandwich panel of this utility model includes an upper panel, a nano-silicon composite insulation board, and a lower panel; the nano-silicon composite insulation board is located between the upper panel and the lower panel.

[0035] The applicant has been granted a patent for a nano-silicon composite heat insulation board. The nano-silicon composite heat insulation board consists of a reinforcing mesh and heat insulation layers disposed on both sides of the reinforcing mesh. The reinforcing mesh and the heat insulation layers are bonded together by an inorganic adhesive.

[0036] The insulation layer comprises 60-90 parts by weight of nano-silicon, 15-35 parts by weight of light-blocking agent, and 1-10 parts by weight of fiber;

[0037] The light-blocking agent is silicon carbide;

[0038] The fiber is selected from one or more of glass fiber, high silica fiber, and carbon fiber.

[0039] Example 1

[0040] like Figure 1 As shown, this embodiment illustrates a thermal insulation sandwich panel for walls, comprising an upper rock slab 11, a nano-silicon composite insulation board 2, and a lower rock slab 13; the nano-silicon composite insulation board 2 is located between the upper rock slab 11 and the lower rock slab 13. The thickness of the nano-silicon composite insulation board 2 is 1.8 cm. The thicknesses of the upper rock slab 11 and the lower board 13 are 0.5 cm.

[0041] In this embodiment, the upper rock slab 11 and the lower slab 13 can be granite slabs, marble slabs, quartzite slabs, or limestone slabs, etc.

[0042] In this embodiment, a nano-silicon composite insulation board 2 is used as the filling core, which gives the insulation board excellent thermal insulation properties. The high-strength fiber mesh composed of the high-strength fibers of the nano-silicon composite insulation board 2 gives the filling core good strength, thus giving the insulation sandwich panel the advantages of high thermal insulation and high strength.

[0043] Existing insulation boards are generally 6cm thick and still achieve good insulation effects. The wall insulation sandwich panel in this embodiment is about 2cm thick, which can meet the insulation requirements, has a low thermal conductivity, and has good heat and cold insulation effects.

[0044] The insulation wall panel of this embodiment achieves the effect of not being cold in cold weather and not being hot in summer. In the cold winter, when the outdoor environment reaches below zero, the indoor temperature can still be maintained at more than ten degrees Celsius after using the insulation wall panel of this embodiment.

[0045] Example 2

[0046] like Figure 2 As shown, this embodiment illustrates a thermal insulation sandwich panel for roofing, comprising an upper metal plate 21, a nano-silicon composite insulation board 2, and a lower metal plate 23; the nano-silicon composite insulation board 23 is located between the upper metal plate 21 and the lower metal plate 23, and the thickness of the nano-silicon composite insulation board 2 is 2.8 cm. The thicknesses of the upper metal plate 21 and the lower metal plate 23 are both 0.05 cm.

[0047] In this embodiment, the upper metal plate 21 and the lower metal plate 23 can be stainless steel plates, aluminum alloy plates, etc.

[0048] The difference between this embodiment and Embodiment 1 is that the material of the upper plate is different, and the thickness of the nano-silicon composite heat insulation board 2 is different.

[0049] Similar to the previous embodiment, the insulation board in this embodiment can achieve the effect of heat preservation and moisture retention.

[0050] Example 3

[0051] This embodiment of a thermal insulation sandwich panel for roofing includes an insulation panel body composed of an upper metal plate 21, a nano-silicon composite insulation board 2, and a lower metal plate 23. The insulation panel body has a T-shaped protrusion 4 on the first side and a dovetail groove 5 on the second side. A magnetic metal strip 6 is pre-embedded in the T-shaped protrusion 4, and a magnetic absorbing sheet 7 is provided in the dovetail groove 5.

[0052] The T-shaped protrusion 4 and the dovetail groove 5 can be set on the side of the nano-silicon composite heat insulation board.

[0053] Specifically, a groove is provided in the middle of the T-shaped protrusion 4, and a magnetic metal strip 6 is embedded in the groove. The embedded magnetic metal strip 6 includes a top conical metal strip and a serpentine metal sheet fixedly connected to the conical metal strip. The serpentine metal sheet is fixed in the groove.

[0054] The dovetail groove 5 has a second groove on one side, and a magnetic piece 7 is installed in the second groove.

[0055] In this embodiment, the nano-silicon composite heat insulation board 3 is located between the upper metal plate 21 and the lower metal plate 23, and the thickness of the nano-silicon composite heat insulation board 2 is 2.6 cm. The thickness of the upper metal plate 21 and the lower metal plate 23 is 0.1 cm.

[0056] The main difference between this embodiment and embodiment 2 is that it includes splicing and sealing components, which enables glue-free and rapid installation.

[0057] In this embodiment, when assembling the thermal insulation sandwich panel, the T-shaped protrusion is first aligned with the dovetail groove of the adjacent panel, and then horizontally pushed to the magnetic attraction mechanism to generate a positioning sense and achieve self-locking. The splicing accuracy is improved by more than 50%, the construction efficiency is improved by 30%, it supports non-destructive assembly and disassembly, and the reuse rate reaches 80%.

[0058] Example 4

[0059] To improve sealing performance, based on Example 3, this example also provides an elastic sealing strip 8 at the root of the T-shaped protrusion 4, with the compression rebound rate of the elastic sealing strip 8 being ≥80%.

[0060] In this embodiment, the joint is sealed by the elastic sealing strip 8 set at the base of the T-shaped protrusion 4, thereby improving the sealing performance of the joint.

[0061] Example 5

[0062] The main difference between this embodiment of the thermal insulation sandwich panel for roofing and embodiment 4 is that the inner wall of the dovetail groove 5 is provided with a waterproof adhesive strip 9, which further improves the sealing effect of the splice seam and reduces the thermal bridging effect.

[0063] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Those skilled in the art can make various modifications or equivalent substitutions to the present utility model within its substance and protection scope, and such modifications or equivalent substitutions should also be considered to fall within the protection scope of the present utility model's technical solution.

Claims

1. An insulated sandwich panel, characterised in that: The application relates to a thermal insulation sandwich panel, which comprises an upper plate body, a nano-silicon composite thermal insulation plate and a lower plate body; the nano-silicon composite thermal insulation plate is located between the upper plate body and the lower plate body; the thermal insulation sandwich panel further comprises a splicing mechanism and a sealing assembly; the splicing mechanism comprises a T-shaped protrusion arranged at a first side edge of the thermal insulation sandwich panel and a dovetail groove arranged at a second side edge of the thermal insulation sandwich panel, a magnetic metal strip is embedded in the T-shaped protrusion, and a magnetic absorbing piece is arranged in the dovetail groove.

2. A thermally insulated sandwich panel according to claim 1, characterised in that: The upper plate body and the lower plate body are metal plates or rock plates.

3. A thermally insulated sandwich panel according to claim 1, characterized in that: The thickness of the nano-silicon composite thermal insulation plate is 1.8-3 cm.

4. A thermally insulated sandwich panel according to claim 1, characterized in that: The thickness of the upper plate body and the lower plate body is 0.05-0.5 cm.

5. A thermally insulated sandwich panel according to claim 1, characterized in that: The sealing assembly is an elastic sealing strip arranged at the root of the T-shaped protrusion.

6. A thermally insulated sandwich panel according to claim 5, characterised in that: The compression resilience rate of the elastic sealing strip is greater than or equal to 80%.

7. A thermally insulated sandwich panel according to claim 1, characterized in that: A waterproof adhesive tape is arranged on the inner wall of the dovetail groove.

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