Waterproof insulating temperature sensor

Abstract

The utility model discloses a waterproof insulating temperature sensor, which relates to the technical field of temperature sensors and comprises a flexible substrate and an epoxy resin packaging film, the epoxy resin packaging film is arranged on the outer wall of the flexible substrate, and the flexible substrate is connected with the epoxy resin packaging film in a packaging manner. A thermistor is arranged between the flexible substrate and the epoxy resin packaging film, two metal interdigital electrodes are arranged at the lower end of the thermistor, a high-thermal-conductivity patch is arranged on the outer wall of the thermistor, a hard PCB waterproof shell is arranged outside the high-thermal-conductivity patch, and a waterproof layer is arranged on the outer wall of the hard PCB waterproof shell. The rear end face of the hard PCB waterproof shell is provided with a PCB rear cover. According to the scheme, the problems that an existing sensor is single in packaging mode and poor in waterproof effect are solved.

Description

Technical Field

[0001] This utility model relates to the field of temperature sensor technology, specifically a waterproof and insulated temperature sensor. Background Technology

[0002] With the rapid development of new energy and industrial control in recent years, the requirements for various sensors are getting higher and higher. Conventional temperature sensors generally adopt epoxy resin thin film encapsulation production process.

[0003] As stated in announcement number CN208721276U, a flexible temperature sensor based on a carbon nanotube epoxy resin composite film is described. This flexible temperature sensor includes a flexible substrate, a pair of interdigital metal electrodes deposited on the flexible substrate, and a layer of carbon nanotube epoxy resin composite temperature-sensing film coated on the upper surface of the interdigital metal electrodes.

[0004] In new energy and industrial control applications, temperature sensors are often exposed to outdoor environments or operate in humid conditions for extended periods. However, the aforementioned sensor packaging methods are limited and lack waterproofing. Therefore, we propose a waterproof and insulated temperature sensor to address these issues. Utility Model Content

[0005] The purpose of this invention is to provide a waterproof and insulated temperature sensor to solve the problems mentioned in the background art, such as the single packaging method and poor waterproof effect of existing sensors.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a waterproof and insulating temperature sensor, comprising a flexible substrate and an epoxy resin encapsulation film, wherein the epoxy resin encapsulation film is disposed on the outer wall of the flexible substrate, and the flexible substrate and the epoxy resin encapsulation film are encapsulated and connected, a thermistor is disposed between the flexible substrate and the epoxy resin encapsulation film, two metal interdigitated electrodes are disposed at the lower end of the thermistor, a high thermal conductivity patch is disposed on the outer wall of the thermistor, a rigid PCB waterproof shell is disposed outside the high thermal conductivity patch, and a PCB back cover is disposed on the rear end face of the rigid PCB waterproof shell.

[0007] Preferably, the front end of the rigid PCB waterproof shell is provided with a patch slot, and the high thermal conductivity patch is nested and connected with the patch slot.

[0008] Preferably, the rear end of the rigid PCB waterproof shell is provided with a back cover slot, and the inner wall of the PCB back cover is provided with a locking protrusion, and the PCB back cover is engaged with the back cover slot on the rigid PCB waterproof shell through the locking protrusion.

[0009] Preferably, rubber strips are provided on the inner walls of both the patch slot and the back cover slot.

[0010] Preferably, the outer wall of the PCB back cover is provided with a disassembly groove.

[0011] Preferably, one end of the metal interdigitated electrode is provided with a copper foil flexible connector.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. The sensor of this utility model, while using traditional epoxy resin encapsulation film, additionally assembles a rigid PCB waterproof shell on the high thermal conductivity patch portion, thereby significantly improving the waterproof performance of the sensor. The rigid PCB waterproof shell is assembled using a separate PCB back cover snap-fit ​​method, which is convenient. At the same time, rubber strips are provided on the inner walls of both the patch slot and the back cover slot, which improves the sealing of the connection between the high thermal conductivity patch and the PCB back cover and the rigid PCB waterproof shell after assembly, further improving the waterproof performance and solving the problem of the single packaging method and poor waterproof effect of existing sensors.

[0014] 2. By setting a copper foil flexible connector at one end of the metal interdigitated electrode, the connection has a lower resistance, which effectively reduces the heat generated by the wire during operation. In addition, the copper foil has good flexibility, which improves the bending resistance of the wire connection and ensures the service life. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the rear structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the sensor separation state structure of this utility model;

[0018] Figure 4 This is a partial structural diagram of the rigid PCB waterproof shell of this utility model;

[0019] In the diagram: 1. Flexible substrate; 2. Epoxy resin encapsulation film; 3. High thermal conductivity patch; 4. Rigid PCB waterproof shell; 5. PCB back cover; 6. Removal slot; 7. Thermistor; 8. Metal interdigitated electrode; 9. Copper foil flexible connector; 10. Patch slot; 11. Positioning bump; 12. Back cover slot; 13. Rubber strip. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Please see Figure 1-4 This utility model provides an embodiment of a waterproof and insulating temperature sensor, comprising a flexible substrate 1 and an epoxy resin encapsulation film 2. The epoxy resin encapsulation film 2 is disposed on the outer wall of the flexible substrate 1, and the flexible substrate 1 and the epoxy resin encapsulation film 2 are encapsulated and connected. A thermistor 7 is disposed between the flexible substrate 1 and the epoxy resin encapsulation film 2. Two metal interdigitated electrodes 8 are disposed at the lower end of the thermistor 7. A high thermal conductivity patch 3 is disposed on the outer wall of the thermistor 7. A rigid PCB waterproof shell 4 is disposed outside the high thermal conductivity patch 3. A PCB back cover 5 is disposed on the rear end face of the rigid PCB waterproof shell 4.

[0022] Please see Figure 1 and Figure 3 The front end of the rigid PCB waterproof shell 4 is provided with a patch slot 10, and the high thermal conductivity patch 3 is nested and connected with the patch slot 10. The patch slot 10 allows the high thermal conductivity patch 3 to be exposed after the rigid PCB waterproof shell 4 and the high thermal conductivity patch 3 are partially nested and engaged, so as to ensure the testing effect.

[0023] Please see Figure 2 , Figure 3 and Figure 4 The rigid PCB waterproof shell 4 has a rear cover slot 12 at its rear end. The inner wall of the PCB rear cover 5 has a locking protrusion 11, and the PCB rear cover 5 is engaged with the rear cover slot 12 on the rigid PCB waterproof shell 4 through the locking protrusion 11. The outer wall of the PCB rear cover 5 has a disassembly groove 6. The PCB rear cover 5 and the rigid PCB waterproof shell 4 are connected by a plastic snap-fit, which is convenient for assembly. When disassembling, you only need to use a tool to apply force to the disassembly groove 6 to pry up the PCB rear cover 5 and separate it from the rigid PCB waterproof shell 4.

[0024] Please see Figure 4 Rubber strips 13 are provided on the inner walls of the patch slot 10 and the back cover slot 12. The rubber strips 13 improve the sealing of the patch slot 10 and the back cover slot 12 with the high thermal conductivity patch 3 and the PCB back cover 5, and further improve the waterproof performance.

[0025] Please see Figure 3One end of the metal interdigital electrode 8 is provided with a copper foil flexible connector 9. The copper foil flexible connector 9 is used to connect the metal interdigital electrode 8 to the wire, so that the connection has a low resistance, effectively reducing the heat generated by the wire during operation. In addition, the copper foil has good flexibility, which improves the bending resistance of the wire connection and ensures the service life.

[0026] Working principle: In use, while using the traditional epoxy resin encapsulation film 2, the sensor is additionally equipped with a rigid PCB waterproof shell 4 on the high thermal conductivity patch 3, which significantly improves the waterproof performance of the sensor. The rigid PCB waterproof shell 4 is assembled by a separate PCB back cover 5, which is convenient. At the same time, rubber strips 13 are provided on the inner walls of the patch slot 10 and the back cover slot 12, which improves the sealing of the connection between the high thermal conductivity patch 3 and the PCB back cover 5 and the rigid PCB waterproof shell 4 after assembly, further improving the waterproof performance.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A waterproof insulated temperature sensor comprising a flexible substrate (1) and an epoxy encapsulation film (2) arranged on the outer wall of the flexible substrate (1) and encapsulatedly connected with the epoxy encapsulation film (2), characterized in that: The flexible substrate (1) and epoxy resin packaging film (2) are provided with thermistors (7), the lower end of the thermistors (7) is provided with metal interdigital electrodes (8), the metal interdigital electrodes (8) are two, the outer wall of the thermistors (7) is provided with high-thermal-conductivity patches (3), the outside of the high-thermal-conductivity patches (3) is provided with hard PCB waterproof shells (4), the rear end surface of the hard PCB waterproof shells (4) is provided with PCB rear covers (5).

2. A waterproof insulated temperature sensor according to claim 1, characterized in that: The front end of the hard PCB waterproof shell (4) is provided with a patch clamping groove (10), and the high-thermal-conductivity patch (3) is nested and connected with the patch clamping groove (10).

3. A waterproof insulated temperature sensor according to claim 2, wherein: The rear end of the hard PCB waterproof shell (4) is provided with a rear cover clamping groove (12), the inner wall of the PCB rear cover (5) is provided with a clamping block (11), and the PCB rear cover (5) is clamped and connected with the rear cover clamping groove (12) on the hard PCB waterproof shell (4) through the clamping block (11).

4. A waterproof insulated temperature sensor according to claim 3, wherein: The inner walls of the patch clamping groove (10) and the rear cover clamping groove (12) are both provided with rubber strips (13).

5. A waterproof insulated temperature sensor according to claim 1, wherein: The outer wall of the PCB rear cover (5) is provided with a dismounting groove (6).

6. A waterproof insulated temperature sensor according to claim 1, wherein: One end of the metal interdigital electrode (8) is provided with a copper foil flexible joint (9).

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