System for measuring metal concentration of liquid and ultraviolet light digestion equipment thereof

Abstract

The utility model discloses a system for measuring metal concentration of liquid and ultraviolet light digestion equipment thereof. The system comprises the ultraviolet light digestion equipment and colorimetric test equipment. The ultraviolet light digestion apparatus includes a liquid holder defining a chamber and a light source configured to emit UV light to the chamber. The colorimetric test device is configured to perform a colorimetric test to determine a metal concentration. Therefore, the measurement accuracy and the recovery rate of the metal concentration of the liquid are improved.

Description

Technical Field

[0001] This utility model relates to a system for determining the metal concentration of a liquid and an ultraviolet (UV) digestion device. Background Technology

[0002] Semiconductor devices are formed on, in, and / or from semiconductor wafers and are used in a wide range of electronic devices, such as mobile phones, laptops, desktop computers, tablets, watches, gaming systems, and various other industrial, commercial, and consumer electronic devices. One or more semiconductor manufacturing processes are performed to form semiconductor devices on, in, and / or from a semiconductor wafer. Utility Model Content

[0003] According to some embodiments of this disclosure, a system for determining the metal concentration of a liquid includes: an ultraviolet (UV) digestion apparatus comprising: a liquid holder defining a chamber; a light source configured to emit UV light into the chamber; and a colorimetric testing apparatus configured to perform a colorimetric test to determine the metal concentration.

[0004] According to some embodiments of this disclosure, an ultraviolet (UV) light digestion device includes: a light source; and a liquid holder including: an inner wall surrounding the light source; and an outer wall surrounding the inner wall, wherein: a chamber is defined between the inner wall and the outer wall; a liquid is stored in the chamber; and the light source is configured to emit UV light to the liquid to decompose metal chelates in the liquid into metal ions.

[0005] According to some embodiments of this disclosure, a system for determining the metal concentration of a liquid includes the aforementioned UV digestion device; and a testing device configured to perform a test on a liquid containing the metal ions to determine the metal concentration of the liquid. Attached Figure Description

[0006] The nature of this disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, according to industry standard practice, the various features are not drawn to scale. In fact, for clarity of explanation, the dimensions of the various features may be arbitrarily increased or decreased.

[0007] Figure 1A A perspective view of an ultraviolet (UV) digestion apparatus according to some embodiments is shown.

[0008] Figure 1B A cross-sectional view of a UV digestion apparatus according to some embodiments is shown.

[0009] Figure 2AA cross-sectional view of a UV digestion apparatus according to some embodiments is shown when a first liquid is stored in a chamber of a liquid holder of the UV digestion apparatus.

[0010] Figure 2B A cross-sectional view of a UV digestion apparatus according to some embodiments is shown, which includes a light source that emits UV light to a first liquid.

[0011] Figure 2C An illustration of the structure of a metal chelate in a first liquid according to some embodiments.

[0012] Figure 2D A cross-sectional view of a UV digestion apparatus according to some embodiments is shown when a first liquid leaves a chamber of a liquid holder of the UV digestion apparatus.

[0013] Figure 2E According to some embodiments, a testing device is used to determine the concentration of a metal in a UV-treated liquid.

[0014] Figure 3A An example of a production system according to some embodiments is shown.

[0015] Figure 3B An example of a production system according to some embodiments is shown.

[0016] Figure 3C An example of a production system according to some embodiments is shown.

[0017] Figure 4 An example of a semiconductor processing system according to some embodiments is shown.

[0018] Figure 5 This is a flowchart illustrating a method for measuring the concentration of a metal in a liquid according to some embodiments.

[0019] Figure 6 An example computer-readable medium according to some embodiments is illustrated, which may contain processor-executable instructions configured to implement one or more of the settings set forth herein. Detailed Implementation

[0020] The following disclosure provides several different embodiments or examples for implementing various features of the provided objectives. Specific examples of components and configurations are described below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where an additional feature may be formed between the first and second features so that the first and second features are not in direct contact. Furthermore, references to numbers or letters may be repeated in various examples throughout this disclosure. This repetition is for the purpose of simplicity and clarity and does not in itself specify a relationship between the various embodiments or configurations discussed.

[0021] Additionally, for ease of explanation, this document uses spatial relative terms such as "under," "below," "below," "above," "on top," and similar terms to describe the relationship of one element or feature relative to another element(s) as illustrated in the accompanying drawings. Besides the orientations illustrated in the drawings, these spatial relative terms are intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations) and the spatial relative descriptors used herein may be interpreted accordingly.

[0022] According to some embodiments, a system for determining the metal concentration of a liquid is provided. The system includes an ultraviolet (UV) digestion apparatus configured to treat a liquid with UV light to produce a UV-treated liquid. In some embodiments, the UV digestion apparatus has a liquid holder and a light source, the liquid holder defining a chamber for storing the liquid, and the light source configured to emit UV light onto the liquid. In some embodiments, the liquid contains metal ions, and the UV light causes metal chelates to decompose into metal ions. The system includes a colorimetric testing apparatus for performing a colorimetric test on the UV-treated liquid to determine the metal concentration, such as the concentration of metal ions in the UV-treated liquid. In some embodiments, the metal concentration corresponds to the concentration of cobalt ions in the UV-treated liquid. Compared to some systems that attempt to perform a colorimetric test directly on the liquid without treating the liquid with UV light, the metal concentration is determined more accurately by performing a colorimetric test on the UV-treated liquid, for example, at least in part, because colorimetry is more efficient at measuring pure metal ions than measuring metals in chelated form.

[0023] Figure 1A-1B An ultraviolet (UV) digestion apparatus 100 is illustrated according to some embodiments. Figure 1A A perspective view of a UV digestion apparatus 100 according to some embodiments is shown. Figure 1BA cross-sectional view of a UV digestion apparatus 100 according to some embodiments is shown. In some embodiments, the UV digestion apparatus 100 includes a liquid holder 112 (shown in...). Figure 1A-1B ) and a light source 118 (displayed in Figure 1B ).

[0024] In some embodiments, the liquid retainer 112 defines a chamber 116 in which liquid is stored. In some embodiments, the liquid retainer 112 includes an outer wall 110 (shown in…). Figure 1A-1B ) and an inner wall 108 (shown in Figure 1B In some embodiments, the outer wall 110 surrounds the inner wall 108. In some embodiments, the outer wall 110 is continuous so as to surround, encircle, etc., all of the inner wall 108. In some embodiments, the outer wall 110 is discontinuous or interrupted so as to surround, encircle, etc., some but not all of the inner wall 108. In some embodiments, a chamber 116 is defined between the inner wall 108 and the outer wall 110. In some embodiments, the inner wall 108 surrounds the light source 118. In some embodiments, the inner wall 108 is continuous so as to surround, encircle, etc., all of the light source 118. In some embodiments, the inner wall 108 is discontinuous or interrupted so as to surround, encircle, etc., some but not all of the light source 118. In some embodiments, the liquid holder 112 includes an inlet 106 and an outlet 104 through which liquid enters the chamber 116 of the liquid holder 112 and through which liquid exits the chamber 116 of the liquid holder 112.

[0025] In some embodiments, the UV digestion apparatus 100 includes an apparatus head 120 (displayed in...). Figure 1A-1B ) or a connector 114 (shown in Figure 1A-1B At least one of the following. In some embodiments, the device head 120 contacts the outer wall 110 of the liquid retainer 112. In some embodiments, the device head 120 defines an opening 122 in which a connector 114 is disposed. In some embodiments, the connector 114 is coupled to a power source (not shown). In some embodiments, the power source provides power to the light source 118 (e.g., power to make the light source 118 emit light) through the connector 114. In some embodiments, the device head 120 is located at an interface 115 between the device head 120 and the liquid retainer 112 (shown in...). Figure 1B At least one of the following is used to couple to the liquid holder 112: a groove, a ridge, an adhesive, etc. In some embodiments, when the device head 120 is coupled to the liquid holder 112, the device head 120 supports and / or maintains the position of at least one of the light source 118 or the connector 114 relative to the liquid holder 112.

[0026] In some embodiments, the inner wall 108 of the liquid retainer 112 comprises at least one of glass, one or more polymers, or other suitable materials. In some embodiments, the inner wall 108 comprises a transparent material so that light emitted by the light source 118 passes through the inner wall 108 to reach the liquid in the chamber 116. In some embodiments, the outer wall 110 comprises a reflective material to reflect light incident on the outer wall 110, such as light emitted by the light source 118. In some embodiments, the inner surface 111 of the outer wall 110 (shown on...) Figure 1B The outer wall 110 is coated with a reflective material. In some embodiments, the reflective material comprises at least one of steel, stainless steel, steeluse stainless (SUS), or other suitable materials. In some embodiments, the inner surface 111 of the outer wall 110 is polished, such as by electropolishing (EP) or other suitable techniques.

[0027] Figures 2A-2E Example 200 according to some embodiments, wherein UV digestion device 100 is used to measure the concentration of a metal in a liquid. Figure 2A According to some embodiments, a first liquid 202 is stored in a chamber 116 of a liquid holder 112. In some embodiments, the first liquid 202 is guided into the chamber 116 via the inlet 106 using a conduit 204 (e.g., at least one of a pipe, tube, channel, etc.) coupled to the inlet 106. In some embodiments, the chamber 116 is at least partially filled with the first liquid 202. In some embodiments, a pump (not shown) is used to guide the first liquid 202 into the chamber 116. In some embodiments, the first liquid 202 comprises wastewater. In some embodiments, the first liquid 202 comprises a metal chelate.

[0028] Figure 2B According to some embodiments, a light source 118 emits UV light 206 to a first liquid 202. In some embodiments, the light source 118 is activated to emit UV light 206 in response to a chamber 116 of a liquid holder 112 that is at least partially filled with the first liquid 202. In some embodiments, the UV light 206 comprises short-wavelength UV light. The wavelength of the UV light 206 is between about 100 nanometers and about 280 nanometers. Other values ​​for the wavelength of the UV light 206 are within the scope of this disclosure.

[0029] In some embodiments, UV light 206 emitted by light source 118 passes through inner wall 108 and first liquid 202 towards outer wall 110. In some embodiments, UV light 206 passes through inner wall 108 because inner wall 108 contains a transparent material. In some embodiments, when irradiated on outer wall 110, UV light 206 is reflected back to first liquid 202. In some embodiments, UV light 206 is reflected back to first liquid 202 because outer wall 110 contains a reflective material. In some embodiments, UV light 206 is reflected back to first liquid 202 by inner surface 111 of outer wall 110. Figure 2B Example: UV light 206, and reflection 208 caused by UV light 206 irradiating an outer wall 110 containing a reflective material. In some embodiments, the outer wall 110 containing the reflective material and / or polished provides at least one of the following: (i) increasing the amount of UV reflection path of UV light 206, (ii) increasing the uniformity of the UV reflection path across chamber 116 such that UV light 206 treats a larger proportion of the first liquid 202 and / or decomposes a larger amount of metal chelates and / or other metal compounds in the first liquid 202, (iii) increasing the uniformity of UV light 206 across chamber 116 such that the first liquid 202 is treated with increased uniformity, (iv) enhancing energy superposition effect and / or dynamic superposition, or (v) enhancing bond breaking of metal chelates and / or other metal compounds in the first liquid 202. In some embodiments, the outer wall 110 is opaque to UV light 206, thereby providing a reduced amount of UV light escaping from the UV depletion device 100, which provides safer conditions because the escaping UV light may have harmful health effects on people exposed to it.

[0030] In some embodiments, UV light 206 decomposes metal chelates in the first liquid 202 into metal ions. In some embodiments, the metal chelates are decomposed into metal ions because, at least in part, the energy level of UV light 206 is greater than the bond dissociation energy of the chemical bonds of the metal chelates, causing UV light 206 to break the chemical bonds. In some embodiments, UV light 206 breaks the chemical bonds of the compound, causing the metal ions of the compound to leave the chelated state. In some embodiments, UV light 206 decomposes compounds containing metal ions (e.g., chelated compounds, compressible compounds, surfactants, etc.) to achieve at least one of the following: (i) breaking the chemical bonds of the compound, or (ii) separating the metal ions from other atoms and / or molecules of the compound. In some embodiments, the energy level of UV light 206 depends on the wavelength of UV light 206. In some embodiments, the wavelength of UV light 206 is about 185 nanometers and the energy level of UV light 206 is about 647 kilojoules per mole, such that UV light 206 breaks the chemical bonds with a bond dissociation energy less than about 647 kilojoules per mole. In some embodiments, the wavelength of UV light 206 is about 254 nanometers and the energy level of UV light 206 is about 471 kilojoules per mole, such that UV light 206 breaks chemical bonds with a bond dissociation energy less than about 471 kilojoules per mole.

[0031] Figure 2C A representation 250 illustrates the structure of a metal chelate in a first liquid 202 according to some embodiments. The metal chelate comprises tris(ethylenediamine)cobalt(III) chloride containing cobalt ions. In some embodiments, UV light 206 is used to decompose the metal chelate and / or separate the cobalt ions from other atoms and / or molecules of the metal chelate. Other types of metal chelates in the first liquid 202 are within the scope of this disclosure.

[0032] In some embodiments, emitting UV light 206 to a first liquid 202 produces a UV-treated liquid 203 (shown in...). Figure 2D-2E Compared to the first liquid 202, the UV-treated liquid 203 has a reduced amount of metal compounds (e.g., a reduced amount of chelating compounds, compressible compounds, surfactants, etc.), which is at least partly attributed to the decomposition of compounds (e.g., chelating compounds, compressible compounds, surfactants, etc.) in the first liquid 202 by UV light 206. Compared to the first liquid 202, the UV-treated liquid 203 has an increased amount of metal ions in a non-chelated state, which is at least partly attributed to the decomposition of metal chelates in the first liquid 202 by UV light 206.

[0033] In some embodiments, the light source 118 emits UV light 206 onto a first liquid 202 stored in a chamber 116 of the liquid holder 112 for a predetermined duration to produce a UV-treated liquid 203. The predetermined duration is between about five minutes and about 120 minutes. Other values ​​for the predetermined duration are within the scope of this disclosure. In some embodiments, the predetermined duration is configured such that at least a critical proportion of the metal chelates (and / or other types of metal compounds) in the first liquid 202 is decomposed into metal ions by the UV light 206.

[0034] Figure 2D According to some embodiments, the chamber 116 of the liquid retainer 112 is emptied of the UV-treated liquid 203. In some embodiments, the UV-treated liquid 203 exits the chamber 116 of the liquid retainer 112 via an outlet 104 and enters a conduit 212 coupled to the outlet 104. In some embodiments, the conduit 212 guides the UV-treated liquid 203 from the chamber 116 to a test apparatus 214 (shown in...). Figure 2E In some embodiments, the UV-treated liquid 203 is guided from the chamber 116 of the liquid holder 112 to the test equipment 214 in response to the light source 118 emitting UV light 206 to the first liquid 202 for a predetermined duration to produce the UV-treated liquid 203.

[0035] Figure 2E According to some embodiments, testing equipment 214 is used to determine the metal concentration 215 of UV-treated liquid 203. In some embodiments, testing equipment 214 includes a colorimetric testing device configured to perform a colorimetric test on UV-treated liquid 203 to determine the metal concentration 215. In some embodiments, the colorimetric test uses a colorimetric reagent to determine the metal concentration 215. In some embodiments, the testing device 214 includes one or more components, including at least one of the following: (i) a first detector 216, (ii) a second detector 234, (iii) a reference light tube 218, (iv) a sample light tube 236, (v) a reflector 220, (vi) a half-reflector 238, (vii) an entrance slit assembly 232, (viii) an exit slit assembly 240, (ix) a filter 244, (x) a grating 246, (xi) a collimating lens 248, (xii) a reflector 242, (xiii) a tungsten lamp 230, (xiv) a light switch 228, (xv) a deuterium lamp 224, or (xvi) one or more other components. In some embodiments, the testing device 214 uses one or more components to measure the metal concentration 215 of the UV-treated liquid 203.

[0036] In some embodiments, the test device 214 includes a calibration module for calibrating the test device 214. In some embodiments, the calibration module includes a calibration data structure indicating a measurement calibration curve associated with one or more operating parameters associated with the test device 214. In some embodiments, the measurement calibration curve includes a multi-parameter measurement calibration curve based on the temperature and humidity of the operating environment of the test device 214. In some embodiments, the measurement calibration curve includes at least one of a first moving calibration curve for a first temperature and a first humidity of the operating environment, a second moving calibration curve for a second temperature and a second humidity of the operating environment, etc. In some embodiments, the calibration module is at least one of: (i) using the calibration data structure to determine the measurement calibration curve for a colorimetric test based on the current temperature and current humidity of the operating environment of the test device 214, or (ii) performing calibration according to the measurement calibration curve before measuring the metal concentration 215. In some embodiments, the test device 214 including the calibration module enables the test device 214 to: (i) self-calibrate (e.g., rapid self-calibration), (ii) avoid measurement errors, or (iii) provide a reference measurement result (e.g., rapidly provide a reference measurement result).

[0037] In some embodiments, the metal concentration 215 corresponds to the concentration of metal particles (e.g., metal ions) in the UV-treated liquid 203 (e.g., the amount of metal ions per unit volume). In some embodiments, the metal concentration 215 corresponds to the cobalt concentration in the UV-treated liquid 203, such as the cobalt ion concentration in the UV-treated liquid 203 (e.g., a first liquid 202 contains a cobalt compound, such as a cobalt chelate, which is decomposed into cobalt ions by UV light 206 to produce a UV-treated liquid 203 containing cobalt ions, wherein a testing device 214 analyzes the UV-treated liquid 203 to determine the cobalt ion concentration in the UV-treated liquid 203).

[0038] In some embodiments, the metal concentration 215 corresponds to the aluminum concentration of the UV-treated liquid 203, such as the aluminum ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains an aluminum compound, such as an aluminum chelate, which is decomposed into aluminum ions by UV light 206 to produce a UV-treated liquid 203 containing aluminum ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the aluminum ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the arsenic concentration of the UV-treated liquid 203, such as the arsenic ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains an arsenic compound, such as an arsenic chelate, which is decomposed into arsenic ions by UV light 206 to produce a UV-treated liquid 203 containing arsenic ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the arsenic ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the barium concentration of the UV-treated liquid 203, such as the barium ion concentration in the UV-treated liquid 203 (for example, the first liquid 202 contains a barium compound, such as a barium chelate, which is decomposed into barium ions by UV light 206 to produce a UV-treated liquid 203 containing barium ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the barium ion concentration in the UV-treated liquid 203).

[0039] In some embodiments, the metal concentration 215 corresponds to the cadmium concentration of the UV-treated liquid 203, such as the cadmium ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a cadmium compound, such as a cadmium chelate, which is decomposed into cadmium ions by UV light 206 to produce a UV-treated liquid 203 containing cadmium ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the cadmium ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the chromium concentration of the UV-treated liquid 203, such as the chromium ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a chromium compound, such as a chromium chelate, which is decomposed into chromium ions by UV light 206 to produce a UV-treated liquid 203 containing chromium ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the chromium ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the copper concentration of the UV-treated liquid 203, such as the copper ion concentration in the UV-treated liquid 203 (for example, the first liquid 202 contains a copper compound, such as a copper chelate, which is decomposed into copper ions by UV light 206 to produce a UV-treated liquid 203 containing copper ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the copper ion concentration in the UV-treated liquid 203).

[0040] In some embodiments, the metal concentration 215 corresponds to the iron concentration of the UV-treated liquid 203, such as the iron ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains an iron compound, such as an iron chelate, which is decomposed into iron ions by UV light 206 to produce a UV-treated liquid 203 containing iron ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the iron ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the ferrous concentration of the UV-treated liquid 203, such as the ferrous ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a ferrous compound, such as an iron chelate, which is decomposed into ferrous ions by UV light 206 to produce a UV-treated liquid 203 containing ferrous ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the ferrous ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the lead concentration of the UV-treated liquid 203, such as the lead ion concentration in the UV-treated liquid 203 (for example, the first liquid 202 contains a lead compound, such as a lead chelate, which is decomposed into lead ions by UV light 206 to produce a UV-treated liquid 203 containing lead ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the lead ion concentration in the UV-treated liquid 203).

[0041] In some embodiments, the metal concentration 215 corresponds to the manganese concentration of the UV-treated liquid 203, such as the manganese ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a manganese compound, such as a manganese chelate, which is decomposed into manganese ions by UV light 206 to produce a UV-treated liquid 203 containing manganese ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the manganese ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the mercury concentration of the UV-treated liquid 203, such as the mercury ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a mercury compound, such as a mercury chelate, which is decomposed into mercury ions by UV light 206 to produce a UV-treated liquid 203 containing mercury ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the mercury ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the molybdenum concentration of the UV-treated liquid 203, such as the molybdenum ion concentration in the UV-treated liquid 203 (for example, the first liquid 202 contains a molybdenum compound, such as a molybdenum chelate, which is decomposed into molybdenum ions by UV light 206 to produce a UV-treated liquid 203 containing molybdenum ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the molybdenum ion concentration in the UV-treated liquid 203).

[0042] In some embodiments, the metal concentration 215 corresponds to the molybdate concentration of the UV-treated liquid 203, such as the molybdate ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a molybdate compound, such as a molybdate chelate, which is decomposed into molybdate ions by UV light 206 to produce a UV-treated liquid 203 containing molybdate ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the molybdate ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the nickel concentration of the UV-treated liquid 203, such as the nickel ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a nickel compound, such as a nickel chelate, which is decomposed into nickel ions by UV light 206 to produce a UV-treated liquid 203 containing nickel ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the nickel ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the potassium concentration of the UV-treated liquid 203, such as the potassium ion concentration in the UV-treated liquid 203 (for example, the first liquid 202 contains a potassium compound, such as a potassium chelate, which is decomposed into potassium ions by UV light 206 to produce a UV-treated liquid 203 containing potassium ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the potassium ion concentration in the UV-treated liquid 203).

[0043] In some embodiments, the metal concentration 215 corresponds to the selenium concentration of the UV-treated liquid 203, such as the selenium ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a selenium compound, such as a selenium chelate, which is decomposed into selenium ions by UV light 206 to produce a UV-treated liquid 203 containing selenium ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the selenium ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the silver concentration of the UV-treated liquid 203, such as the silver ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a silver compound, such as a silver chelate, which is decomposed into silver ions by UV light 206 to produce a UV-treated liquid 203 containing silver ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the silver ion concentration in the UV-treated liquid 203). In some embodiments, the metal concentration 215 corresponds to the zinc concentration of the UV-treated liquid 203, such as the zinc ion concentration in the UV-treated liquid 203 (e.g., the first liquid 202 contains a zinc compound, such as a zinc chelate, which is decomposed into zinc ions by UV light 206 to produce a UV-treated liquid 203 containing zinc ions, wherein the testing device 214 analyzes the UV-treated liquid 203 to determine the zinc ion concentration in the UV-treated liquid 203).

[0044] Examples of measuring the concentration of other types of particles besides those explicitly provided herein are envisioned using one or more techniques disclosed herein.

[0045] Compared to some systems that attempt to determine metal concentration 215 by performing a colorimetric test directly on the first liquid 202 (e.g., without treating the first liquid 202 with UV light 206), performing a first colorimetric test on the UV-treated liquid 203 using test device 214 provides improved recovery rate and / or improved accuracy of the first colorimetric test for metal concentration 215. Performing a colorimetric test directly on the first liquid 202 can result in inaccurate metal concentration measurements (e.g., inaccurate cobalt concentration), such as metal ions (e.g., cobalt ions) at least partially attributable to the first liquid 202 being bonded to metal chelates (and / or other metal compounds), which hinder the colorimetric test and cause the colorimetric test to fail to detect and / or measure at least some metal ions. In some embodiments, performing a first colorimetric test on the UV-treated liquid 203 using test device 214 provides a first recovery rate between approximately 83.7% and approximately 108.4%, while systems that directly perform a colorimetric test on the first liquid 202 may provide a recovery rate of approximately 9%.

[0046] Figure 3AAn example of a production system 300 according to some embodiments is illustrated. In some embodiments, the production system 300 includes at least one of a set of analyzers, a processing station 302, a wastewater collection tank 304, a filter system 306, or a filter maintenance controller 324. In some embodiments, the set of analyzers includes at least one of a first analyzer 326, a second analyzer 328, or one or more analyzers 320. In some embodiments, one, some, or all of the individual analyzers in the set include at least one of: (i) a UV digestion device (e.g., UV digestion device 100) for treating a liquid (e.g., a first liquid 202) with UV light to produce a UV-treated liquid (e.g., a UV-treated liquid 203) or (ii) a testing device (e.g., testing device 214) for measuring the metal concentration (e.g., metal concentration 215) of the UV-treated liquid.

[0047] In some embodiments, the first analyzer 326 is configured to receive a second liquid (e.g., wastewater) from the processing station 302. In some embodiments, the production system 300 includes piping (not shown) configured to guide the second liquid from the processing station 302 to the first analyzer 326. In some embodiments, the processing station 302 is configured to perform a first semiconductor manufacturing process on a first semiconductor wafer to produce a processed semiconductor wafer. In some embodiments, the first semiconductor wafer includes at least one of a substrate, a photomask, a semiconductor device, a die, etc. In some embodiments, the processing station 302 performs the first semiconductor manufacturing process on the first semiconductor wafer while the first semiconductor wafer is in a processing chamber 410 (shown in the figure) defined by one or more walls of the processing station 302. Figure 4 In some embodiments, processing station 302 includes at least one of the following: (i) ion implantation equipment; (ii) chemical vapor deposition (CVD) equipment; (iii) physical vapor deposition (PVD) equipment; (iv) etching equipment, such as plasma etching equipment, wet etching equipment, dry etching equipment, reactive ion etching (RIE) equipment, atomic layer etching (ALE) equipment, buffer oxide etching equipment, or ion beam milling equipment; (v) photolithography equipment; (vi) chemical mechanical planarization (CMP) equipment; (vii) plating equipment; (viii) cleaning equipment; (ix) furnace, such as a semiconductor furnace; or (x) other equipment. In some embodiments, the first semiconductor manufacturing process includes at least one of an ion implantation process, a PVD process, a plating process, an etching process, a photolithography process, a CMP process, a CVD process, a thermal process, a cleaning process, or other processes.

[0048] In some embodiments, the second liquid comprises a processing liquid used by processing station 302 to perform a first semiconductor manufacturing process. In some embodiments, the second liquid comprises drainage from processing station 302. In some embodiments, the second liquid is contaminated with one or more contaminants, such as metals (e.g., heavy metals), processing chemicals, and / or materials used by processing station 302 to perform the first semiconductor manufacturing process. In some embodiments, processing station 302 comprises electrodeposition (ELD) equipment, and the first semiconductor manufacturing process comprises an ELD process. In some embodiments, the second liquid comprises a plating solution (e.g., an electroless plating solution) used in the first semiconductor manufacturing process to perform the ELD process. In some embodiments, the second liquid comprises a plating bath liquid stored in a plating bath of the ELD equipment. In some embodiments, the second liquid comprises a chelating agent. In some embodiments, the chelating agent is introduced into the second liquid to extend the lifespan of the second liquid (e.g., the electroless plating solution and / or the plating bath liquid), such as by at least partly attributing to the chelating agent inhibiting the increase of irreversible complexes associated with the second liquid. In some embodiments, the first semiconductor manufacturing process is performed to form a metallic structure on a first semiconductor wafer. In some embodiments, the metal structure comprises one or more metals deposited on a first semiconductor wafer by a first semiconductor manufacturing process. In some embodiments, the metal structure comprises at least one of a connection element, an interconnect structure, a contact, a via, a metal wire, etc. In some embodiments, the metal structure establishes a connection between components (e.g., logic components, memory, transistors, electronic components, etc.) and / or layers (e.g., metal layers) of the first semiconductor wafer. In some embodiments, a chelating agent in a second liquid interacts with one or more metals used in the first semiconductor manufacturing process to form a chelated metal in the second liquid.

[0049] In some embodiments, the first analyzer 326 is at least one of the following: (i) using a second UV digestion device (e.g., UV digestion device 100) for treating the second liquid with second UV light to produce a second UV-treated liquid, or (ii) using a second testing device (e.g., testing device 214) for measuring a second metal concentration (e.g., metal concentration 215) in the second UV-treated liquid. In some embodiments, the second metal concentration is equivalent to the cobalt concentration of the second UV-treated liquid, such as the cobalt ion concentration in the second UV-treated liquid. Other types of metal concentrations of the second metal concentration are within the scope of this disclosure, such as at least one of aluminum concentration, arsenic concentration, etc. In some embodiments, the second liquid is treated using one or more techniques provided herein regarding the treatment of the first liquid 202 using UV digestion device 100. In some embodiments, the second metal concentration is determined using one or more techniques provided herein regarding the determination of metal concentration 215 using testing device 214.

[0050] In some embodiments, a first analyzer 326 provides a second metal concentration to a processing station controller (not shown). In some embodiments, the first analyzer 326 updates the second metal concentration in at least one of (i) a periodic manner, (ii) a non-periodic manner, or (iii) a continuous manner. In some embodiments, the first analyzer 326 updates the second metal concentration by: (i) collecting a (new) sample of liquid from processing station 302, (ii) treating the sample of liquid with UV light using a second UV digestion device to produce a UV-treated liquid sample, or (iii) testing the UV-treated liquid sample using a second testing device to determine an updated value of the second metal concentration. In some embodiments, in response to determining the updated value, the first analyzer 326 provides the updated value of the second metal concentration to the processing station controller. In some embodiments, the processing station controller uses the second metal concentration to perform at least one of controlling one or more parameters of processing station 302 or scheduling the maintenance of processing station 302. In some embodiments, the processing station controller determines the remaining service life of the processing fluid used by the processing station 302 based on a second metal concentration, and schedules maintenance events to replace the processing fluid based on the remaining service life.

[0051] In some embodiments, wastewater collection tank 304 stores liquid (e.g., wastewater) collected from one or more processing stations including at least one of processing station 302, a second processing station (not shown), etc. In some embodiments, the liquid stored in wastewater collection tank 304 includes at least one of effluent from the processing station, processing liquid used by the processing station, etc. In some embodiments, a conduit (not shown) is configured to guide liquid from processing station 302 to wastewater collection tank 304. In some embodiments, production system 300 includes a conduit (not shown) configured to guide liquid from wastewater collection tank 304 to filter system 306. In some embodiments, filter system 306 includes filters F1-F12. Although 12 filters are shown... Figure 3A However, any number of filters in filter system 306 are within the scope of this disclosure. In some embodiments, the filters of filter system 306 are configured in groups, such as at least one of a first group of filters 310 (e.g., filters F1-F3), a second group of filters 312 (e.g., filters F4-F6), a third group of filters 314 (e.g., filters F7-F9), or a fourth group of filters 316 (e.g., filters F10-F12).

[0052] In some embodiments, the individual filters of one, some, or all of the filters in the filter system 306 are configured to filter contaminants, such as metal particles, from liquid from wastewater collection tank 304 to produce filtered liquid. In some embodiments, with respect to the individual filters of one, some, or all of the filters in the filter system 306, one or more analyzers 320 include an analyzer that performs at least one of the following: (i) collecting the filtered liquid from the filter; (ii) treating the filtered liquid with UV light using a UV digestion device (e.g., UV digestion device 100) to produce UV-treated liquid; (iii) determining the metal concentration (e.g., metal concentration 215) of the UV-treated liquid using a testing device (e.g., testing device 214); or (iv) providing the metal concentration to a filter maintenance controller 324. In some embodiments, one or more analyzers 320 provide one or more metal concentrations 322 to the filter maintenance controller 324.

[0053] In some embodiments, one or more analyzers 320 include a third analyzer 330 configured to receive a third liquid (e.g., filtered wastewater) from filter F1. In some embodiments, production system 300 includes a conduit (not shown) configured to direct the third liquid from filter F1 to third analyzer 330. In some embodiments, filter F1 performs a filtration process on liquid (e.g., wastewater) from wastewater collection tank 304 to produce the third liquid. In some embodiments, filter F1 filters contaminants, such as metal particles, from the liquid to produce the third liquid. In some embodiments, filter F1 includes a resin filter containing resin configured to adsorb metal particles, such as through resin adsorption treatment. In some embodiments, as liquid (e.g., wastewater) from wastewater collection tank 304 flows through filter F1, the resin in filter F1 adsorbs metal particles (e.g., metal chelates, metal ions, etc.) from the liquid, separating the metal particles from the liquid to produce a metal-free third liquid. In some embodiments, the metal particles filtered by filter F1 include at least one of the following: cobalt particles, aluminum particles, arsenic particles, barium particles, cadmium particles, chromium particles, copper particles, iron particles, ferrous particles, lead particles, manganese particles, mercury particles, molybdenum particles, molybdate particles, nickel particles, potassium particles, selenium particles, silver particles, zinc particles, or other suitable metal particles.

[0054] In some embodiments, the third analyzer 330 is at least one of the following: (i) using a third UV digestion device (e.g., UV digestion device 100) for treating a third liquid with third UV light to produce a third UV-treated liquid, or (ii) using a third testing device (e.g., testing device 214) for measuring a third metal concentration (e.g., metal concentration 215) in the third UV-treated liquid. In some embodiments, the third metal concentration is equivalent to the cobalt concentration in the third UV-treated liquid, such as the cobalt ion concentration in the third UV-treated liquid. Other types of metal concentrations of the third metal concentration are within the scope of this disclosure, such as at least one of aluminum concentration, arsenic concentration, etc. In some embodiments, the third liquid is treated using one or more techniques provided herein regarding the treatment of the first liquid 202 using UV digestion device 100. In some embodiments, the third metal concentration is determined using one or more techniques provided herein regarding the determination of metal concentration 215 using testing device 214.

[0055] In some embodiments, the third analyzer 330 provides a third metal concentration to the filter maintenance controller 324. In some embodiments, the third analyzer 330 updates the third metal concentration in at least one of (i) a periodic manner, (ii) a non-periodic manner, or (iii) a continuous manner. In some embodiments, the third analyzer 330 updates the third metal concentration by: (i) collecting a (new) sample of filtered liquid from filter F1, (ii) treating the sample of liquid with UV light using a third UV digestion device to produce a UV-treated liquid sample, or (iii) testing the UV-treated liquid sample using a third testing device to determine an updated value of the third metal concentration. In some embodiments, in response to determining the updated value, the third analyzer 330 provides the updated value of the third metal concentration to the filter maintenance controller 324.

[0056] In some embodiments, the filter maintenance controller 324 uses a third metal concentration to perform at least one of the following: (i) determining a first filter state of filter F1, or (ii) controlling the maintenance of filter F1. In some embodiments, the first filter state indicates at least one of the following: (i) a saturation level of filter F1, (ii) whether filter F1 is saturated, or (iii) the remaining service life of filter F1 (e.g., the amount of liquid filter F1 can filter before becoming saturated). In some embodiments, the filter maintenance controller 324 performs one or more operations (e.g., mathematical operations) on the third metal concentration to determine a saturation level. In some embodiments, the saturation level is a function of the third metal concentration, where an increase in the third metal concentration corresponds to an increase in the saturation level. In some embodiments, the filter maintenance controller 324 compares the third metal concentration with a critical metal concentration to determine whether filter F1 is saturated. In some embodiments, the filter maintenance controller 324 determines that filter F1 is saturated based on a determination that the third metal concentration is greater than the critical metal concentration. In some embodiments, the filter maintenance controller 324 determines that filter F1 is saturated based on a determination that the saturation level is greater than the critical saturation level. In some embodiments, the filter maintenance controller 324 performs one or more operations (e.g., mathematical operations) on at least one of a third metal concentration or a saturation level to determine the remaining service life. In some embodiments, the remaining service life is a function of at least one of the third metal concentration or the saturation level, wherein an increase in at least one of the third metal concentration or the saturation level corresponds to a decrease in the remaining service life.

[0057] In some embodiments, the filter maintenance controller 324 schedules maintenance operations for filter F1 based on a first filter status. In some embodiments, the filter maintenance controller 324 schedules future maintenance operations for a scheduled time based on a determination that filter F1 is not yet saturated. In some embodiments, based on the determination that filter F1 is saturated, the filter maintenance controller 324 initiates a maintenance operation such as by: (i) outputting an indication that filter F1 requires filtration maintenance, or (ii) providing instructions to a maintenance operator (e.g., a human, a robot, etc.) to perform the maintenance operation. In some embodiments, the maintenance operation includes at least one of: (i) replacing filter F1 with a replacement filter, (ii) replacing used resin (e.g., saturated resin) in filter F1 with a replacement resin, (iii) flushing filter F1 to reduce the saturation level of filter F1, (iv) servicing filter F1, or (v) one or more other suitable operations. In some embodiments, the filter maintenance controller 324 allocates one or more resources for the maintenance operation.

[0058] In some embodiments, the filter maintenance controller 324 updates the first filter state in at least one of (i) a periodic manner, (ii) an aperiodic manner, or (iii) a continuous manner. In some embodiments, the filter maintenance controller 324 updates the first filter state in response to receiving an updated value of a third metal concentration from the third analyzer 330. In some embodiments, the filter maintenance controller 324 monitors at least one of the first filter state or the third metal concentration (in real time, for example) to check whether the filter F1 is saturated, and at least one of the following: (i) updating the scheduling time of a maintenance operation based on a change in at least one of the first filter state or the third metal concentration, or (ii) initiating a maintenance operation in response to determining that the filter F1 is saturated.

[0059] In some embodiments, the other analyzers of one or more analyzers 320 are used to determine the metal concentration of the filtered liquid from the filter of the filtration system 306 using one or more techniques provided herein regarding the determination of a third metal concentration associated with filter F1 using a third analyzer 330. In some embodiments, the filter maintenance controller 324 uses one or more techniques provided herein regarding scheduling and / or controlling the maintenance of filter F1 to schedule and / or control the maintenance of other filters (e.g., filters F2-F12) of the filter system 306.

[0060] In some embodiments, the inflow distribution of the filters in the filtration system 306 is uneven, such that filter F1 filters a first liquid volume per unit time, and filter F2 filters a second liquid volume per unit time. In some embodiments, the second liquid volume per unit time is greater than the first liquid volume per unit time, such that the time required for filter F1 to become saturated is greater than the time required for filter F2 to become saturated. Filter maintenance controller 324 schedules a first maintenance operation for filter F1 for a first scheduling time based on at least one of a third metal concentration or a first filter state. Filter maintenance controller 324 schedules a second maintenance operation for filter F2 for a second scheduling time based on at least one of the following: (i) the metal concentration associated with filter F2, which is determined using a fourth analyzer 332 using one or more techniques provided herein for determining the third metal concentration using a third analyzer 330; or (ii) the second filter state associated with filter F2, which is determined using a filter maintenance controller 324 using one or more techniques provided herein for determining the first filter state. In some embodiments, the second scheduling time differs from the first scheduling time, for example, at least in part, due to the different amounts of time that filters F1 and F2 take to become saturated.

[0061] Some systems periodically replace all filters in filter system 306 at regular intervals without determining the filter status. In some embodiments, due to uneven inflow distribution among the filters in filter system 306, replacing all filters in filter system 306 at regular intervals results in (i) one or more first filters being replaced before they become saturated, thereby wasting the remaining lifespan of the one or more first filters, or (ii) one or more second filters being replaced only after they have been saturated for some time, wherein the one or more second filters are ineffectively filtering liquid from wastewater collection tank 304, thereby providing discharge contamination. In some embodiments, one or more second filters are overused compared to one or more first filters, such as at least in part due to uneven inflow distribution among the filters in filter system 306. The use of one or more techniques disclosed herein provides improved filter management and / or more accurate maintenance of the filters in filter system 306, such as at least in part attributable to determining the appropriate filter status of the filters in filter system 306 and accurately scheduling maintenance operations for the filters in filter system 306 using said filter status, rather than periodically replacing the filters in filter system 306 without determining the filter status. Therefore, according to some embodiments, the present disclosure provides more efficient use of the filters in filter system 306, such as at least in part attributable to scheduling a first maintenance operation for a period of time when the saturation level is greater than a critical saturation level, which reflects that the service life of filter F1 is nearing its end. In some embodiments, the present disclosure provides reduced emissions and improved environmental impact, such as at least in part attributable to the filter maintenance controller 324 initiating and / or scheduling the first maintenance operation for a period of time before the service life of filter F1 is reached.

[0062] In some embodiments, the filtered liquid output from the filter of the filter system 306 flows to the discharge path 308, which discharges the effluent containing the filtered liquid to an environment such as surface water, a lake, a river, or other suitable environment. In some embodiments, a second analyzer 328 is configured to receive a sample of the fourth liquid containing the effluent. In some embodiments, the second analyzer 328 is at least one of: (i) using a fourth UV digestion device (e.g., UV digestion device 100) for treating the fourth liquid with fourth UV light to produce a fourth UV-treated liquid, or (ii) using a fourth testing device (e.g., testing device 214) for measuring a fourth metal concentration (e.g., metal concentration 215) in the fourth UV-treated liquid. In some embodiments, the fourth metal concentration is equivalent to the cobalt concentration in the fourth UV-treated liquid, such as the cobalt ion concentration in the fourth UV-treated liquid. Other types of metal concentrations of the fourth metal concentration are within the scope of this disclosure, such as at least one of aluminum concentration, arsenic concentration, etc. In some embodiments, the fourth liquid is treated using one or more techniques provided herein regarding the treatment of the first liquid 202 using a UV digestion apparatus 100. In some embodiments, the fourth metal concentration is determined using one or more techniques provided herein regarding the determination of metal concentration 215 using a testing apparatus 214.

[0063] In some embodiments, the second analyzer 328 provides a fourth metal concentration to the filter maintenance controller 324. In some embodiments, the second analyzer 328 updates the fourth metal concentration in at least one of (i) a periodic manner, (ii) a non-periodic manner, or (iii) a continuous manner. In some embodiments, the second analyzer 328 updates the fourth metal concentration by: (i) collecting a (new) sample of the effluent, (ii) treating the liquid sample with UV light using a fourth UV digestion device to produce a UV-treated liquid sample, or (iii) testing the UV-treated liquid sample using a fourth testing device to determine the updated value of the fourth metal concentration.

[0064] In some embodiments, the production system 300 includes a data structure module configured to automatically collect data from one, some, or all of the analyzers in the group and use the data to generate a data structure (e.g., a table, chart, etc.) indicating at least one of: (i) one or more metal concentrations measured using one or more of the analyzers in the group, or (ii) the status of one or more filters in the filter system 306. In some embodiments, the data structure module updates the data structure to provide a real-time representation of metal concentration and / or filter status. In some embodiments, the data structure module displays the data structure via a display screen. In some embodiments, one, some, or all of the individual analyzers in the group include communication means, such as wireless or wired communication devices, for transmitting data to at least one of the data structure module, filter maintenance controller 324, or other components, thereby enabling real-time monitoring of metal concentration and / or filter status.

[0065] In some embodiments, the UV-treated liquid produced by the analyzers in the set of analyzers is directed to the wastewater collection tank 304. Figure 3BAn example of a production system 300 according to some embodiments is shown, in which UV-treated liquid is directed from one, some, or all of a set of analyzers to a wastewater collection tank 304. In some embodiments, UV-treated liquid 342 is directed from a first analyzer 326 to the wastewater collection tank 304 via a conduit (not shown). In some embodiments, the UV-treated liquid 342 includes a second UV-treated liquid, which is measured by a second testing device to determine a second metal concentration. In some embodiments, after the UV-treated liquid 342 is directed to the wastewater collection tank 304, the UV-treated liquid 342 flows from the wastewater collection tank 304 to a filter system 306 for filtration through one or more filters of the filter system 306 (e.g., at least one of filters F1, F2, F3, etc.). In some embodiments, UV-treated liquid 344 is directed from one or more analyzers 320 to the wastewater collection tank 304 via a conduit (not shown). In some embodiments, the UV-treated liquid 344 includes a third UV-treated liquid, which is measured by a third testing device to determine a third metal concentration. In some embodiments, after the UV-treated liquid 344 is directed to a wastewater collection tank 304, the UV-treated liquid 344 flows from the wastewater collection tank 304 to a filter system 306 for filtration through one or more filters of the filter system 306 (e.g., at least one of filter F1, filter F2, filter F3, etc.). In some embodiments, the UV-treated liquid 346 is directed from a second analyzer 328 to the wastewater collection tank 304 using a conduit (not shown). In some embodiments, the UV-treated liquid 346 includes a fourth UV-treated liquid, which is measured by a fourth testing device to determine a fourth metal concentration. In some embodiments, after the UV-treated liquid 346 is directed to the wastewater collection tank 304, the UV-treated liquid 346 flows from the wastewater collection tank 304 to the filter system 306 to be filtered by one or more filters of the filter system 306 (e.g., at least one of filter F1, filter F2, filter F3, etc.).

[0066] In some embodiments, UV-treated liquid produced by the analyzers in the set of analyzers is directed to discharge path 308 for discharge into the environment. Figure 3CAn example of a production system 300 according to some embodiments is shown, in which UV-treated liquid is directed from one, some, or all of a set of analyzers to an exhaust path 308. In some embodiments, UV-treated liquid 342 is directed from a first analyzer 326 to an exhaust path 308 using a conduit (not shown). In some embodiments, UV-treated liquid 344 is directed from one or more analyzers 320 to an exhaust path 308 using a conduit (not shown). In some embodiments, UV-treated liquid 346 is directed from a second analyzer 328 to an exhaust path 308 using a conduit (not shown).

[0067] Figure 4A semiconductor processing system 400 is illustrated according to some embodiments. In some embodiments, the semiconductor processing system 400 includes a processing station 302. In some embodiments, the processing station 302 includes at least one of a track-in component 406, a verification module 408 (e.g., a go / no-go module), a processing chamber 410, or one or more other suitable components. In some embodiments, the track-in component 406 includes one or more tracks of a transport system. In some embodiments, the one or more tracks include at least one of rails, races, sidewalls, etc., and are configured to accommodate a transport vehicle. In some embodiments, in a semiconductor manufacturing environment, the transport vehicle travels along one or more tracks of the track-in component 406 to transport a carrier carrying a first semiconductor wafer to the processing station 302. In some embodiments, the transport vehicle includes at least one of: an overhead transport vehicle, a guided transport vehicle traveling on a predetermined route or track, a forklift, or other suitable vehicle. In some embodiments, the carrier includes a wafer storage device. In some embodiments, the wafer storage device includes at least one of the following: a front-opening unified pod (FOUP), a cassette pod, a reticle pod, or other types of wafer storage device. In some embodiments, the wafer storage device is used to store one or more semiconductor wafers containing a first semiconductor wafer. In some embodiments, the one or more semiconductor wafers comprise a batch of wafers. In some embodiments, the verification module 408 performs a verification procedure to verify that one or more conditions associated with the first semiconductor wafer have been met. In some embodiments, in response to determining that one or more conditions have been met, the verification module 408 allows the first semiconductor wafer to enter the processing chamber 410 of the processing station 302 to undergo a first semiconductor manufacturing process. In some embodiments, in response to determining that one or more conditions have not been met, the verification module 408 does not allow the first semiconductor wafer to enter the processing chamber 410 of the processing station 302 and / or undergo the first semiconductor manufacturing process. In some embodiments, one or more conditions include at least one of the following: (i) the condition that the first semiconductor wafer is in a suitable state, or (ii) the condition that the first semiconductor wafer is free of defects.

[0068] In some embodiments, the semiconductor processing system 400 includes at least one of one or more first components 438, one or more second components 428, a metrology tool 412, an optical profile detection module 414, a wafer acceptance testing module 416, a factory quality assurance module 418, a chip / circuit detection module 420, or one or more other suitable components. In some embodiments, the one or more first components 438 include at least one of a preventive maintenance system 430, a recipe management system 434, an engineering management system 432, an equipment constant system 436, or one or more other suitable components. In some embodiments, the one or more first components 438 are used to determine whether one or more conditions associated with the first semiconductor wafer have been met. In some embodiments, the one or more second components 428 include at least one of a layer-addition manufacturing module 426, a fault detection and classification module 424, a statistical process control module 422, or one or more other suitable components. In some embodiments, one or more second components 428 are used for at least one of the following: (i) controlling one or more parameters of the first semiconductor manufacturing process, (ii) checking whether the processed semiconductor wafer produced by the first semiconductor manufacturing process is in a suitable state, or (iii) checking whether the processed semiconductor wafer has defects.

[0069] In some embodiments, the production system 300 includes a semiconductor processing system 400.

[0070] In some embodiments, one, some, or all of the operations provided herein are performed automatically and / or without human intervention to provide: (i) automatic determination and / or monitoring of the metal concentration of the filtered liquid from the filter of filter system 306; (ii) automatic determination and / or monitoring of the filter status; and (iii) automatic scheduling and / or initiation of filter maintenance operations based on at least one of the metal concentration or filter status.

[0071] Some systems attempt to measure metal concentration 215 using inductively coupled plasma mass spectrometry (ICP-MS). However, ICP-MS tools are too expensive and do not support on-site measurement. Therefore, such systems require transporting liquid samples to remote facilities for measurement, which takes a significant amount of time. In some embodiments, using one or more of the techniques described herein to determine metal concentration 215 using UV digestion equipment 100 and / or testing equipment 214 provides at least one of the following: (i) a significantly reduced cost compared to ICP-MS tools, (ii) on-site measurement of metal concentration in the production environment associated with production system 300, or (iii) real-time measurement of metal concentration without the delays associated with manual sample collection and transport of samples to remote facilities.

[0072] In some embodiments, the metal concentration is determined using one or more techniques provided herein with UV digestion equipment 100 and / or testing equipment 214. 215 provides at least one of the following: automated sampling and / or analysis and / or reduced need for (and / or less need for) specific personnel for sampling and analysis; however, some measurement systems, such as ICP-MS systems, require specific personnel (e.g., trained laboratory specialists).

[0073] It is envisioned that processing station 302 is used to execute programs other than semiconductor manufacturing processes.

[0074] 500 examples of methods for measuring the metal concentration of liquids according to some embodiments are shown below. Figure 5 At 502, UV light is emitted into the liquid containing the metal chelate to decompose the metal chelate into metal ions. In some embodiments, (i) the UV light comprises UV light 206 (shown in...). Figure 2B (ii) the liquid contains the first liquid 202 (shown in) Figure 2A-2B At least one of the following. In 504, a colorimetric test is performed on the liquid containing metal ions to determine the metal concentration of the liquid. In some embodiments, (i) a test device 214 (shown in) is used. Figure 2E (i) The liquid subjected to the colorimetric test (containing metal ions) contains UV-treated liquid 203 (displayed on...). Figure 2D-2E (iii) The metal concentration includes a metal concentration of 215 (shown in Figure 2E At least one of them.

[0075] One or more embodiments relate to a computer-readable medium containing processor-executable instructions configured to implement one or more of the techniques presented herein. An exemplary computer-readable medium is illustrated in... Figure 6 In one embodiment, 600 includes a computer-readable medium 608 (e.g., a CD-R, DVD-R, flash drive, a disk of a hard disk drive, etc.) encoded with computer-readable data 606. This computer-readable data 606 then includes a set of processor-executable computer instructions 604 configured to perform one or more of the principles set forth herein when executed by a processor. In some embodiments of 600, the processor-executable computer instructions 604 are configured to perform a method 602, such as at least some of the foregoing methods, when executed by a processor. In some embodiments, the processor-executable computer instructions 604 are configured to perform a system, such as at least some of the foregoing systems, when executed by a processor. Many such computer-readable media configured to operate according to the techniques presented herein will be conceived by those skilled in the art.

[0076] In some embodiments, a system is provided. The system includes a UV digestion apparatus and a colorimetric testing apparatus. The UV digestion apparatus includes a liquid holder and a light source, the liquid holder defining a chamber, and the light source configured to emit UV light into the chamber. The colorimetric testing apparatus is configured to perform a colorimetric test to determine the metal concentration.

[0077] In some embodiments, a method is provided. The method includes emitting UV light onto a liquid comprising a metal chelate to cause the metal chelate to decompose into metal ions. The method includes performing a colorimetric test on the liquid comprising the metal ions to determine the metal concentration of the liquid.

[0078] In some embodiments, a UV digestion apparatus is provided. The UV digestion apparatus includes a light source and a liquid holder, the liquid holder comprising an inner wall surrounding the light source and an outer wall surrounding the inner wall. A chamber is defined between the inner wall and the outer wall. A liquid comprising a metal chelate is stored in the chamber. The light source is configured to emit UV light onto the liquid to decompose the metal chelate into metal ions.

[0079] The foregoing has outlined features of several embodiments to enable those skilled in the art to better understand the nature of this disclosure. Those skilled in the art will understand that this disclosure can be readily used as the basis for designing or modifying other programs and structures to achieve the same purposes or advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made to this document without departing from the spirit and scope of this disclosure.

[0080] Although the subject matter of this case has been described in language specific to structural features or methodological actions, it should be understood that the subject matter of the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are disclosed as examples of implementing at least some of the claims.

[0081] This document provides various operations according to embodiments. The order of some or all of the operations described should not be construed as implying that these operations must depend on the order. Alternative orders will be understood to have the benefits of this description. Furthermore, it will be understood that not all operations must exist in the various embodiments provided herein. Moreover, it will be understood that not all operations are necessary in some embodiments.

[0082] It will be understood that in some embodiments, the layers, features, elements, etc., illustrated herein are illustrated with respect to specific dimensions relative to each other, such as structural dimensions or orientations, for example for the purpose of simplification and ease of understanding, and the same actual dimensions are substantially different from those illustrated herein. Furthermore, various techniques exist for forming the layers, regions, features, elements, etc., mentioned herein, such as at least one of the following: etching techniques, planarization techniques, implantation techniques, doping techniques, spin coating techniques, sputtering techniques, growth techniques, or deposition techniques such as chemical vapor deposition (CVD).

[0083] Furthermore, "exemplary" and / or similar terms are intended herein to serve as an example, illustration, or illustration, and are not necessarily advantageous. As used herein, "or" is intended to mean inclusive rather than exclusive. Furthermore, "a" and "an" as used in this application and the appended claims are generally interpreted as "one or more," unless otherwise specified or clearly apparent from the context that they refer to the singular form. Moreover, "at least one of A and B" and / or similar terms generally refer to A or B or both A and B. Furthermore, with regard to the use of "includes," "having," "has," "with," or variations thereof, these terms are intended to be inclusive, as in a manner similar to the term "comprising." Furthermore, unless otherwise specified, "first," "second," or similar terms do not imply temporal, spatial, or sequential aspects. Rather, these terms are used only as identifiers, names, etc., of features, elements, items, etc. For example, the first element and the second element usually correspond to element A and element B, or two different or two identical elements, or the same element.

[0084] As will be understood from the foregoing discussion, this disclosure can be implemented in various forms, including but not limited to the following:

[0085] Example 1. A system comprising an ultraviolet (UV) digestion apparatus. The UV digestion apparatus includes a liquid holder defining a chamber; a light source configured to emit UV light into the chamber; and a colorimetric apparatus configured to perform a colorimetric test to determine a metal concentration.

[0086] Example 2. The system of Example 1, wherein the liquid holder comprises: an inner wall surrounding the light source; and an outer wall surrounding the inner wall, wherein the chamber is defined between the inner wall and the outer wall.

[0087] Example 3. The system of Example 2, wherein: the UV light emitted by the light source passes through the inner wall and the chamber toward the outer wall; the outer wall comprises a reflective material; and the UV light is reflected when it irradiates the outer wall.

[0088] Example 4. The system as in Example 2, wherein: the inner wall comprises a transparent material so that the UV light can pass through the inner wall.

[0089] Example 5. The system as in Example 1, wherein the wavelength of the UV light is between about 100 nanometers and about 280 nanometers.

[0090] Example 6. The system of Example 1, wherein: a liquid containing a metal chelate is stored in the chamber of the liquid holder; the UV light emitted by the light source decomposes the metal chelate into metal ions; and the colorimetric testing device is configured to perform the colorimetric test on the liquid containing the metal chelate to determine the metal concentration of the liquid.

[0091] Example 7. The system of Example 6, wherein: the metal chelate comprises a cobalt chelate; and the metal ion comprises a cobalt ion.

[0092] Example 8. A system as described in Example 6, comprising: a filter configured to filter metal particles from a second liquid to produce the liquid.

[0093] Example 9. A system as in Example 8, comprising: a filter maintenance controller configured to schedule a maintenance operation of the filter based on the metal concentration.

[0094] Example 10. The system of Example 8, wherein the filter comprises a resin filter.

[0095] Example 11. A system as described in Example 8, comprising: a liquid collection tank configured to store liquid from one or more semiconductor processing stations; and a conduit configured to guide the second liquid from the liquid collection tank to the filter.

[0096] Example 12. A method comprising: emitting UV light onto a liquid containing a metal chelate to decompose the metal chelate into metal ions; and performing a colorimetric test on the liquid containing the metal ions to determine a metal concentration in the liquid.

[0097] Example 13. The method of Example 12, comprising: transferring a second liquid from a semiconductor processing station to a filter; and filtering metal particles from the second liquid through the filter to produce the liquid.

[0098] Example 14. The method of Example 13, comprising: scheduling a maintenance operation of the filter based on the metal concentration.

[0099] Example 15. The method of Example 12, wherein: emitting the UV light comprises emitting light having a wavelength between about 100 nanometers and about 280 nanometers.

[0100] Example 16. The method of Example 12, comprising: transferring the liquid containing the metal ions to a colorimetric testing device before performing the colorimetric test, wherein performing the colorimetric test on the liquid comprises performing the colorimetric test using the colorimetric testing device.

[0101] Example 17. An ultraviolet (UV) digestion apparatus comprising a light source and a liquid holder. The liquid holder comprises: an inner wall surrounding the light source; and an outer wall surrounding the inner wall. A chamber is defined between the inner wall and the outer wall; a liquid containing a metal chelate is stored in the chamber; and the light source is configured to emit UV light onto the liquid to decompose the metal chelate into metal ions.

[0102] Example 18. A system comprising: a UV digestion apparatus as described in Example 17; and a testing apparatus configured to perform a test on the liquid containing the metal ions to determine the metal concentration of the liquid.

[0103] Example 19. A UV digestion apparatus as in Example 17, wherein: the UV light emitted by the light source passes through the inner wall and the liquid toward the outer wall; the outer wall comprises a reflective material; and when irradiated on the outer wall, the UV light is reflected back into the liquid in the chamber.

[0104] Example 20. A UV digestion apparatus as in Example 17, wherein: the inner wall comprises a transparent material so that the UV light passes through the inner wall to reach the liquid in the chamber.

[0105] Furthermore, although this disclosure has been shown and described with respect to one or more embodiments, equivalent changes and modifications will occur to those skilled in the art upon reading and understanding this specification and drawings. This disclosure encompasses all such modifications and changes and is limited only by the scope of the claims. In particular, with regard to the various functions performed by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, the terminology used to describe such components is intended to correspond to any component performing the specific function of the described component (e.g., a functionally equivalent), even if structurally not equivalent to the disclosed structure. Moreover, although specific features of this disclosure have been disclosed with respect to only one of several embodiments, such features may be combined with one or more other features of other embodiments, as may be desired and advantageous for any given or particular application.

Claims

1. A system for determining the metal concentration of a liquid, characterized in that The system comprises: an ultraviolet light digestion apparatus comprising: a liquid holder defining a chamber; and a light source configured to emit ultraviolet light to the chamber; and a colorimetric test apparatus configured to perform a colorimetric test to determine a metal concentration.

2. The system of claim 1, wherein, The liquid holder comprises: an inner wall surrounding the light source; and an outer wall surrounding the inner wall, wherein the chamber is defined between the inner wall and the outer wall.

3. The system of claim 1, wherein, The ultraviolet light has a wavelength between 100 nanometers and 280 nanometers.

4. The system of claim 1, wherein: a liquid is stored in the chamber of the liquid holder; the ultraviolet light emitted by the light source causes metal chelates in the liquid to decompose into metal ions; and the colorimetric test apparatus is configured to perform the colorimetric test on the liquid to determine a metal concentration of the liquid.

5. The system of claim 4, wherein, The system comprises: a filter configured to filter metal particles from a second liquid to produce the liquid.

6. The system of claim 5, wherein, The system comprises: a liquid collection tank configured to store liquid from one or more semiconductor processing stations; and a conduit configured to direct the second liquid from the liquid collection tank to the filter.

7. An ultraviolet light destruction apparatus, characterized by, The ultraviolet light digestion apparatus comprises: a light source; and a liquid holder comprising: an inner wall surrounding the light source; and an outer wall surrounding the inner wall, wherein: a chamber is defined between the inner wall and the outer wall; a liquid is stored in the chamber; and the light source is configured to emit ultraviolet light to the liquid to cause metal chelates in the liquid to decompose into metal ions.

8. The ultraviolet light digestion apparatus of claim 7, wherein: the ultraviolet light emitted by the light source passes through the inner wall and the liquid toward the outer wall; the outer wall comprises a reflective material; and upon impinging on the outer wall, the ultraviolet light reflects back into the liquid in the chamber.

9. The ultraviolet light digestion apparatus of claim 7, wherein: the inner wall comprises a transparent material so that the ultraviolet light passes through the inner wall to the liquid in the chamber.

10. A system for determining the metal concentration of a liquid, characterized in that The system comprises: the ultraviolet light digestion apparatus of claim 7; and a test apparatus configured to perform a test on a liquid comprising the metal ions to determine a metal concentration of the liquid.

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