Powder filling mold of chip inductor

Abstract

The utility model relates to the technical field of inductor forming, in particular to a chip inductor powder filling die which comprises an upper die module and a lower die module, the upper die module comprises a first material guide plate and a second material guide plate located at the bottom of the first material guide plate, and a plurality of first material guide holes arranged side by side are formed in the first material guide plate; a plurality of second material guide holes which are formed side by side are formed in the second material guide plate, and the second material guide plate can move transversely; the first material guide holes and the second material guide holes are arranged in a row; the lower die module comprises a third material guide plate and a fourth material guide plate, a plurality of third material guide holes which are formed side by side are formed in the third material guide plate, and a plurality of fourth material guide holes which are formed side by side are formed in the fourth material guide plate; the third guide plate can transversely move at the top of the fourth guide plate; a plurality of rows of third material guide holes and a plurality of rows of fourth material guide holes are formed; and it is guaranteed that the powder quantitatively and accurately falls into the powder filling device to achieve powder filling, the situation that the powder is redundant is avoided, and the precision of subsequent inductor powder pressing is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of inductor molding technology, and in particular to a powder filling mold for a chip inductor. Background Technology

[0002] Surface mount inductors are magnetic sensing elements made of insulated wires and are one of the most commonly used components in electronic circuits. In the production of surface mount inductors, powder filling is one of the important processes. Specifically, after the wound coil is soldered onto the lead frame, a powder material mainly composed of iron powder is filled into the mold to enclose the coil in the powder material. Then, the product is pressed together under high temperature and high pressure to give it its inherent characteristics.

[0003] In practice, existing powder filling mechanisms (such as the existing patent with publication number CN219418762U—a multi-stage powder filling mechanism for a surface mount inductor) fill the surface mount inductor with powder of different coarseness by adjusting the horizontal movement of the material box multiple times. However, due to the transportation of the mechanism, Utility Model Content

[0004] The purpose of this invention is to provide a powder filling mold for surface mount inductors, addressing the shortcomings of existing technologies.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] A powder-filling mold for a surface mount inductor includes an upper mold assembly and a lower mold assembly. The upper mold assembly includes a first guide plate and a second guide plate located at the bottom of the first guide plate. The first guide plate has a plurality of first guide holes arranged in parallel, and the second guide plate has a plurality of second guide holes arranged in parallel. The second guide plate is capable of lateral movement. Both the first guide holes and the second guide holes are arranged in a row.

[0007] The lower mold assembly includes a third guide plate and a fourth guide plate. The third guide plate has multiple third guide holes arranged in parallel, and the fourth guide plate has multiple fourth guide holes arranged in parallel. The third guide plate can move laterally on the top of the fourth guide plate. The third guide holes and the fourth guide holes are respectively provided in multiple rows.

[0008] Furthermore: a powder hopper is connected to the top of the first guide plate, and the bottom of the powder hopper is connected to the first guide hole.

[0009] Furthermore: the first guide plate has an upper side plate formed on its side, and the second guide plate moves along the length direction between the two upper side plates.

[0010] Furthermore, the second guide plate is equipped with an adjustment mechanism for adjusting the size of the second guide hole.

[0011] Furthermore: the adjustment mechanism includes an adjustment groove formed in the second guide plate, the adjustment groove having multiple adjustment slots arranged along the length direction, adjustment sliders slidably mounted on the adjustment slots respectively, and adjustment slide plates integrally formed and connected to the adjustment sliders in the adjustment grooves, the adjustment slide plates moving along the length direction of the adjustment slots.

[0012] Furthermore, the adjustment mechanism also includes an adjustment hole formed in the second guide plate, the adjustment hole is equipped with an adjustment rod that can move axially, and the inner end of the adjustment rod is connected to the adjustment slide plate.

[0013] Furthermore, the upper mold module also includes a first telescopic cylinder that drives the second guide plate to move laterally.

[0014] Furthermore: the third guide plate includes an upper guide plate and a lower guide plate, which are fixedly connected; the third guide hole includes an upper guide hole formed on the upper guide plate and a lower guide hole coaxially formed on the lower guide plate.

[0015] Furthermore: the fourth guide plate has upright side guide plates formed on both sides along the length direction, and the third guide plate moves along the length direction between the two side guide plates.

[0016] Furthermore, the upper mold module also includes a second telescopic cylinder that drives the third guide plate to move laterally, and a third telescopic cylinder that drives the fourth guide plate to move laterally.

[0017] The beneficial effects of this utility model are as follows: Initially, the third and fourth guide holes are staggered, and the powder falls into the first guide hole of the first guide plate. Then, the second guide plate moves laterally to align the second guide hole with the first guide hole coaxially, allowing the powder to fall into the second guide hole for the first transfer. Subsequently, the second guide plate continues to move laterally to align the second guide hole with the third guide hole coaxially, allowing the powder in the second guide hole to fall into the third guide hole for the second transfer. After all the third guide holes are filled sequentially, the third guide plate moves laterally on top of the fourth guide plate to align the third and fourth guide holes coaxially, allowing all the powder in the third guide holes to fall into the fourth guide hole simultaneously for filling. This ensures that the powder falls quantitatively and accurately to achieve filling, preventing excess powder and ensuring the accuracy of subsequent inductor powder pressing. Attached Figure Description

[0018] Figure 1 This is a side view of the cross-sectional structure of the powder filling mold.

[0019] Figure 2 This is a frontal cross-sectional view of the powder filling mold, showing the state when the upper and lower mold assemblies are misaligned.

[0020] Figure 3This is a frontal cross-sectional view of the powder filling mold, showing the state when the upper and lower mold assemblies are longitudinally aligned.

[0021] Figure 4 This is a frontal cross-sectional view of the powder filling mold, showing the state of the lower mold assembly when it is pushed out.

[0022] Figure 5 This is a schematic diagram of the second guide plate.

[0023] Figure 6 This is a schematic diagram of the fourth guide plate.

[0024] The reference numerals in the figures include:

[0025] 1-Upper mold module,

[0026] 11-First guide plate, 12-Second guide plate, 13-First guide hole, 14-Second guide hole

[0027] 15-Powder hopper, 16-Upper side plate, 17-First telescopic cylinder

[0028] 2-Adjustment mechanism,

[0029] 21-Adjustment groove, 22-Adjustment slot, 23-Adjustment slider, 24-Adjustment slide plate, 25-Adjustment hole

[0030] 26-Adjusting rod,

[0031] 3-Lower mold module

[0032] 31-Third guide plate, 32-Upper guide plate, 33-Lower guide plate, 34-Upper guide hole

[0033] 35 - Lower guide hole, 36 - Fourth guide plate, 37 - Fourth guide hole, 38 - Side guide plate

[0034] 39 - Second telescopic cylinder, 40 - Third telescopic cylinder. Detailed Implementation

[0035] The present invention will now be described in detail with reference to the accompanying drawings.

[0036] like Figure 1-6As shown, a powder-filling mold for a surface-mount inductor includes an upper mold assembly 1 and a lower mold assembly 3. The upper mold assembly 1 includes a first guide plate 11 and a second guide plate 12 located at the bottom of the first guide plate 11. The first guide plate 11 has a plurality of first guide holes 13 arranged side by side, and the second guide plate 12 has a plurality of second guide holes 14 arranged side by side. The second guide plate 12 is capable of lateral movement. The first guide holes 13 and the second guide holes 14 are both arranged in a row. The lower mold assembly 3 includes a third guide plate 31 and a fourth guide plate 36. The third guide plate 31 has a plurality of third guide holes arranged side by side, and the fourth guide plate 36 has a plurality of fourth guide holes 37 arranged side by side. The third guide plate 31 is capable of lateral movement on the top of the fourth guide plate 36. The third guide holes and the fourth guide holes 37 are arranged in multiple rows.

[0037] Initially, the third and fourth guide holes 37 are staggered, and the powder falls into the first guide hole 13 of the first guide plate 11. Then, the second guide plate 12 moves laterally, making the second guide hole 14 coaxially aligned with the first guide hole 13, allowing the powder to fall into the second guide hole 14 for the first transfer. Subsequently, the second guide plate 12 continues to move laterally, making the second guide hole 14 coaxially aligned with the third guide hole, and the powder in the second guide hole 14 falls into the third guide hole for the second transfer. After all the third guide holes are filled, the third guide plate 31 moves laterally on top of the fourth guide plate 36, making the third guide hole and the fourth guide hole 37 coaxially aligned, and all the powder in the third guide hole falls synchronously into the fourth guide hole 37 for filling. This ensures that the powder falls quantitatively and accurately to achieve filling, without any excess powder, thus ensuring the accuracy of subsequent inductor powder pressing.

[0038] The top of the first guide plate 11 is connected to a powder hopper 15, and the bottom of the powder hopper 15 is connected to the first guide hole 13. When the second guide plate 12 moves laterally to align the first guide hole 13 and the second guide hole 14, the powder in the first guide hole 13 falls into the second guide hole 14, and the powder in the powder hopper 15 enters the first guide hole 13 of the first guide plate 11 through the through hole structure, which can ensure that the first guide hole 13 is always filled with powder.

[0039] Furthermore, the first guide plate 11 has an upper side plate 16 formed on its side, and the second guide plate 12 moves along the length direction between the two upper side plates 16. In this embodiment, under the guidance of the upper side plates 16, the second guide plate 12 can move along the length direction of the first guide plate 11 to ensure the alignment accuracy of the first guide hole 13 and the second guide hole 14, and to ensure the accuracy of powder filling.

[0040] Furthermore, the upper mold module 1 also includes a first telescopic cylinder 17 that drives the second guide plate 12 to move laterally. Under the telescopic drive of the first telescopic cylinder 17, the second guide hole 14 and the first guide hole 13 can be staggered or coaxially aligned. When staggered, the powder in the first guide hole 13 remains stationary. When the second guide hole 14 moves to be coaxially aligned with the first guide hole 13, the first transfer filling can be achieved. Subsequently, the first telescopic cylinder 17 drives the second guide plate 12 to continuously telescopically move laterally, filling the first guide hole 13 into the multiple rows of arranged third guide holes in sequence.

[0041] The second guide plate 12 is provided with an adjustment mechanism 2 for adjusting the size of the second guide hole 14. In this embodiment, when the weight of the powder is different, the size of the second guide hole 14 can be adjusted, thereby adjusting the amount of powder falling from the first guide hole 13 into the second guide hole 14.

[0042] Specifically, the adjustment mechanism 2 includes an adjustment groove 21 formed in the second guide plate 12. The adjustment groove 21 is formed with a plurality of adjustment slots 22 arranged along the length direction. Adjustment sliders 23 are slidably installed on the adjustment slots 22 respectively. An adjustment slide plate 24 integrally formed and connected to the adjustment sliders 23 is installed in the adjustment groove 21. The adjustment slide plate 24 moves along the length direction of the adjustment slots 22. By moving the adjustment slide plate 24, the adjustment sliders 23 formed on the adjustment slide plate 24 will move in the length direction of the adjustment slots 22, thereby changing the size of the second guide hole 14.

[0043] Furthermore, the adjustment mechanism 2 also includes an adjustment hole 25 formed in the second guide plate 12. An adjustment rod 26 capable of axial movement is installed in the adjustment hole 25. The inner end of the adjustment rod 26 is connected to the adjustment slide plate 24. By rotating the adjustment rod 26, the adjustment rod 26 cooperates with the adjustment hole 25 to drive the adjustment slide plate 24 to move along the adjustment groove 21, thereby changing the size of the second guide hole 14.

[0044] The third guide plate 31 includes an upper guide plate 32 and a lower guide plate 33, which are fixedly connected. The third guide hole includes an upper guide hole 34 formed on the upper guide plate 32 and a lower guide hole 35 coaxially formed on the lower guide plate 33. The top of the upper guide hole 34 on the upper guide plate 32 is flared to facilitate the guided entry of powder into the upper guide hole 34 and directly into the lower guide hole 35. The powder in the lower guide hole 35 is stopped by the top surface of the fourth guide plate 36 and will not fall into the fourth guide hole 37. After the lower mold assembly 3 moves to the powder pressing mold, the fourth guide hole 37 is aligned coaxially with the powder pressing mold. The third guide plate 31 is then moved laterally, and all the powder in the third guide hole falls into the fourth guide hole 37 and enters the powder pressing mold, thus achieving precise powder filling.

[0045] Preferably, the fourth guide plate 36 has upright side guide plates 38 formed on both sides along the length direction, and the third guide plate 31 moves in the length direction between the two side guide plates 38; this can ensure that the third guide hole of the third guide plate 31 is coaxially aligned with the fourth guide hole 37 after the lateral movement, thus ensuring accurate powder filling.

[0046] The upper mold module 1 also includes a second telescopic cylinder 39 that drives the third guide plate 31 to move laterally and a third telescopic cylinder 40 that drives the fourth guide plate 36 to move laterally. The second telescopic cylinder 39 can cause the third guide hole of the third guide plate 31 and the fourth guide hole 37 of the fourth guide plate 36 to be misaligned or coaxially aligned. The third telescopic cylinder 40 can drive the fourth guide plate 36 to move closer to or further away from the powder pressing mold to realize the transfer of powder.

[0047] In summary, this utility model possesses the aforementioned excellent characteristics, enabling it to achieve unprecedented efficiency in use and thus become a highly practical product.

[0048] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A powder filling mold for a chip inductor, comprising an upper mold module and a lower mold module, characterized in that: The upper die module comprises a first material guide plate and a second material guide plate located at the bottom of the first material guide plate, the first material guide plate is formed with a plurality of first material guide holes arranged side by side, and the second material guide plate is formed with a plurality of second material guide holes arranged side by side, wherein the second material guide plate can move transversely; the first material guide holes and the second material guide holes are arranged in a row; The lower die module comprises a third material guide plate and a fourth material guide plate, the third material guide plate is formed with a plurality of third material guide holes arranged side by side, and the fourth material guide plate is formed with a plurality of fourth material guide holes arranged side by side; the third material guide plate can move transversely on the top of the fourth material guide plate; the third material guide holes and the fourth material guide holes are respectively arranged in multiple rows.

2. The powder filling mold for a chip inductor according to claim 1, wherein: The top of the first material guide plate is connected with a powder hopper, and the bottom of the powder hopper is communicated with the first material guide holes.

3. The powder filling mold for a chip inductor according to claim 1, wherein: The side edges of the first material guide plate are formed with upper side edge plates, and the second material guide plate moves in the length direction between the two upper side edge plates.

4. The powder filling mold for a chip inductor according to claim 1, wherein: The second material guide plate is provided with an adjusting mechanism for adjusting the size of the second material guide holes.

5. The powder filling mold for a chip inductor according to claim 4, wherein: The adjusting mechanism comprises an adjusting groove formed in the second material guide plate, the adjusting groove is formed with a plurality of adjusting long grooves arranged in the length direction, the adjusting long grooves are respectively slidably installed with adjusting sliding blocks, the adjusting groove is installed with an adjusting sliding plate integrally connected with the adjusting sliding blocks, and the adjusting sliding plate moves along the length direction of the adjusting long grooves.

6. The powder filling mold for a chip inductor according to claim 5, wherein: The adjusting mechanism further comprises an adjusting hole formed in the second material guide plate, the adjusting hole is installed with an adjusting rod which can move axially, and the inner end of the adjusting rod is connected with the adjusting sliding plate.

7. The powder filling mold for a chip inductor according to claim 6, wherein: The upper die module further comprises a first telescopic cylinder for driving the second material guide plate to move transversely.

8. The powder filling mold for a chip inductor according to claim 1, wherein: The third material guide plate comprises an upper guide plate and a lower guide plate, the upper guide plate and the lower guide plate are fixedly connected, and the third material guide holes comprise upper material guide holes formed in the upper guide plate and lower material guide holes coaxially formed in the lower guide plate.

9. The powder filling mold for a chip inductor according to claim 8, wherein: The fourth material guide plate is formed with standing side guide plates in the length direction on both sides, and the third material guide plate moves in the length direction between the two side guide plates.

10. The powder filling mold for a chip inductor according to claim 9, wherein: The upper die module further comprises a second telescopic cylinder for driving the third material guide plate to move transversely and a third telescopic cylinder for driving the fourth material guide plate to move transversely.

Images