Battery equalization system and vehicle
By coating the copper-clad circuitry of the battery management system with a high thermal conductivity material and using thermal conductor pins to transfer heat, combined with a heat sink, the problems of uneven battery distribution and poor heat dissipation in the battery pack are solved, thereby improving the temperature balance and performance of the battery pack.
Patent Information
- Application Number
- CN202520064328.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2035-01-09
AI Technical Summary
In existing technologies, the imbalance of performance parameters of batteries in a battery pack leads to inconsistency issues, and the heat dissipation effect of the balancing resistor is poor, affecting the healthy operation of the power management system.
A high thermal conductivity material is coated on the copper-clad circuitry of the battery management system, and the heat generated by the equalization resistor is transferred to the battery through the thermal conductor pins, combined with a heat sink for efficient heat dissipation.
It effectively improves the heat dissipation of the equalizing resistor, improves the temperature balance of the battery pack, and enhances battery performance and system operational stability.
Smart Images

Figure CN223771145U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of battery technology, and more specifically, to a battery balancing system and a vehicle. Background Technology
[0002] As the number of charge and discharge cycles of the battery pack increases, a consistency problem arises among the batteries in the pack. This consistency problem manifests as an imbalance in the performance parameters (such as output voltage and charge) of different batteries.
[0003] To improve battery consistency, relevant technical solutions include setting a corresponding balancing resistor for each battery. However, the balancing resistor generates heat, and how to efficiently dissipate heat from the balancing resistor is a technical problem that urgently needs to be solved. Utility Model Content
[0004] This application provides a battery balancing system and a vehicle. The various aspects involved in this application embodiment are described below.
[0005] In a first aspect, a battery balancing system is provided, comprising: a battery; a battery management system (BMS) circuit board electrically connected to the battery for managing the battery; the BMS circuit board includes a thermal conductor pin, an balancing resistor, and copper-clad lines connected between the thermal conductor pin and the balancing resistor, wherein a target thermally conductive material is coated on the copper-clad lines, and the balancing resistor is connected in series with the battery through the thermal conductor pin, and the balancing resistor is used to balance the performance parameters of the battery; wherein the heat generated by the balancing resistor is transferred to the battery through the copper-clad lines and the thermal conductor pin, and the thermal conductivity of the target thermally conductive material is greater than the thermal conductivity of the copper-clad lines.
[0006] As one possible implementation, the battery balancing system further includes a heat sink disposed on the surface of the battery for removing heat generated by the battery and heat transferred by the balancing resistor.
[0007] As one possible implementation, the battery balancing system further includes a copper busbar line disposed between the thermal conductor pin and the battery, such that the balancing resistor is connected in series with the battery through the thermal conductor pin and the copper busbar line.
[0008] As one possible implementation, the battery balancing system further includes a controllable switch disposed on the copper-clad circuit for controlling the on / off state of the copper-clad circuit.
[0009] As one possible implementation, the BMS circuit board further includes: an equalization area, in which the equalization resistor is disposed; a sampling area, in which a sampling sensor is disposed, the sampling sensor being used to collect the temperature signal of the equalization area; and a signal area, communicatively connected to the sampling area, in which a communication module is disposed, the communication module being used to transmit the temperature signal to a controller outside the battery equalization system; wherein, the signal area and the equalization area are spaced apart, and the sampling area and the equalization area are spaced apart.
[0010] As one possible implementation, the BMS circuit board further includes an isolation groove disposed between the equalization area and the signal area for isolating heat transfer between the equalization area and the signal area.
[0011] As one possible implementation, the sampling area includes: a heat-sensitive area, in which a heat-sensitive element is disposed; and a non-heat-sensitive area, in which a non-heat-sensitive element is disposed; wherein the non-heat-sensitive area is disposed on the side of the sampling area closer to the equalization area, and the heat-sensitive area is disposed on the side of the sampling area farther from the equalization area.
[0012] As one possible implementation, the equalizing resistor is soldered to the thermal conductor pin.
[0013] As one possible implementation, the target thermally conductive material is solder, graphene coating, or high thermal conductivity ceramic coating.
[0014] In a second aspect, a vehicle is provided, including a battery balancing system as described in the first aspect or any implementation thereof.
[0015] This application provides a battery balancing system, including: a battery; a battery management system (BMS) circuit board electrically connected to the battery for managing the battery; the BMS circuit board includes a thermally conductive pin, an balancing resistor, and copper-clad traces connected between the thermally conductive pin and the balancing resistor, the copper-clad traces being coated with a target thermally conductive material; the balancing resistor is connected in series with the battery through the thermally conductive pin, and the balancing resistor is used to balance the battery's performance parameters; wherein, the heat generated by the balancing resistor is transferred to the battery through the copper-clad traces and the thermally conductive pin, and the thermal conductivity of the target thermally conductive material is greater than the thermal conductivity of the copper-clad traces. This solution, by coating the copper-clad traces on the MS circuit board with a high thermal conductivity material, and then transferring the heat generated by the balancing resistor to the battery through the copper-clad traces and the thermally conductive pin, can effectively improve the heat dissipation effect of the battery balancing resistor. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of a battery balancing system provided in an embodiment of this application.
[0017] Figure 2 This is a schematic diagram of the structure of a battery balancing system provided in another embodiment of this application.
[0018] Figure 3 This is a schematic diagram of the structure of a battery balancing system provided in another embodiment of this application.
[0019] Figure 4 yes Figure 3 The diagram shows a partial structural schematic of the equilibrium region.
[0020] Figure 5 This is a schematic diagram of the structure of a BMS circuit board provided in one embodiment of this application.
[0021] Figure 6 This is a schematic diagram of the structure of a vehicle provided in one embodiment of this application. Detailed Implementation
[0022] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application should fall within the scope of protection of the present application.
[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0024] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application; the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; furthermore, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can refer to fixed connections or detachable connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0025] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.
[0026] As the number of charge and discharge cycles of the battery pack increases, a consistency problem arises among the batteries in the pack. This consistency problem manifests as an imbalance in the performance parameters (such as output voltage and charge) of different batteries.
[0027] To improve battery consistency, relevant technical solutions assign a corresponding balancing resistor to each battery. The balancing resistor is primarily used to discharge higher-capacity batteries, achieving a balanced effect. During discharge, the balancing resistor acts as a heat source, with a single resistor generating anywhere from a few tenths of a watt to several watts of heat. However, to enhance the balancing effect, multiple balancing resistors are typically used to discharge a single battery simultaneously, thus multiplying the heat generation. When multiple batteries discharge concurrently, the temperature in the balancing area rises rapidly, resulting in locally higher temperatures. Therefore, real-time heat dissipation is necessary to ensure the healthy operation of the power management system.
[0028] Currently, natural heat dissipation is mainly used to cool the balancing resistors, but the heat dissipation effect is relatively poor. Therefore, how to efficiently dissipate heat from the balancing resistors is a technical problem that urgently needs to be solved.
[0029] To address the aforementioned problems, this application provides a battery balancing system, comprising: a battery; a battery management system (BMS) circuit board electrically connected to the battery for managing the battery; the BMS circuit board includes a thermal conductor pin, an balancing resistor, and copper-clad traces connecting the thermal conductor pin and the balancing resistor, the copper-clad traces being coated with a target thermally conductive material; the balancing resistor is connected in series with the battery through the thermal conductor pin, and the balancing resistor is used to balance the battery's performance parameters; wherein, the heat generated by the balancing resistor is transferred to the battery through the copper-clad traces and the thermal conductor pin, and the thermal conductivity of the target thermally conductive material is greater than the thermal conductivity of the copper-clad traces. This solution, by coating the copper-clad traces on the MS circuit board with a high thermal conductivity material, and then transferring the heat generated by the balancing resistor to the battery through the copper-clad traces and the thermal conductor pin, can effectively improve the heat dissipation effect of the battery balancing resistor. The battery balancing system in the embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0030] Figure 1 A battery balancing system is provided as an embodiment of this application. See also: Figure 1 The battery balancing system 100 may include a battery 110 and a battery management system (BMS) circuit board 120.
[0031] Battery 110 can be used to store and release electrical energy to drive electric motors and other electronic devices (such as in-vehicle electronics).
[0032] This application does not impose specific restrictions on the type of battery 110. For example, the battery 110 can be a lithium-ion battery (such as a ternary lithium battery, a lithium iron phosphate battery, etc.); or it can be a sodium-ion battery; or it can be a nickel-metal hydride battery or a fuel cell, etc.
[0033] The BMS circuit board 120 includes a thermal conductor pin 121, an equalizing resistor 122, and a copper-clad trace 123 connecting the thermal conductor pin 121 and the equalizing resistor 122. Specifically, the thermal conductor pin 121 is electrically connected to the equalizing resistor 122 via the copper-clad trace 123. The equalizing resistor 122 is connected in series with the battery 110 via the thermal conductor pin 121, and is used to equalize the performance parameters of the battery 110.
[0034] In some implementations, the heat generated by the equalizing resistor 122 is transferred to the battery 110 through the copper-clad circuit 123 and the thermal conductor pin 121 to dissipate the heat generated by the equalizing resistor 122.
[0035] Furthermore, a target thermally conductive material can be coated on the copper-clad circuit 123. The thermal conductivity of the target thermally conductive material is greater than that of the copper-clad circuit 123. In this way, the heat dissipation effect of the equalizing resistor 122 can be effectively increased.
[0036] This application does not impose specific restrictions on the type of target thermally conductive material. For example, the target thermally conductive material may be solder, graphene coating, or high thermal conductivity ceramic coating.
[0037] It should be noted that this application transfers the heat generated by the equalizing resistor 122 to the battery 110 through the copper-clad circuit 123 and the heat conductor pin 121. This not only effectively improves the heat dissipation effect of the equalizing resistor 122, but also effectively increases the temperature of the battery 110 when the ambient temperature is low, thereby increasing the performance of the battery 110.
[0038] In other words, when the ambient temperature is low, the temperature of battery 110 will also be low. The heat released by the balancing resistor 122 can be transferred to battery 110 to heat it up and improve its performance. When the temperature of battery 110 is high, the heat released by the balancing resistor 122 can be transferred to battery 110 to dissipate heat from the balancing resistor 122.
[0039] In some implementations, see Figure 2 The battery balancing system 100 also includes a heat sink 130. The heat sink 130 can be used to remove the heat generated by the battery 110 and the heat transferred by the balancing resistor 122.
[0040] This application does not impose specific restrictions on the location of the heat sink 130. For example, the heat sink 130 can be located on the surface of the battery 110, such as on the bottom or side of the circuit board.
[0041] This application does not impose specific limitations on the type of heat sink 130. For example, the heat sink 130 may be a liquid-cooled heat sink; or it may be an air-cooled heat sink. Furthermore, the heat sink 130 may also be a phase change material heat sink.
[0042] In some implementations, a liquid cooling heat sink with good heat dissipation performance can be selected and placed on the side of the battery 110 to dissipate heat from the battery 110.
[0043] It should be noted that if the heat sink 130 is a liquid-cooled heat sink, it will typically have a coolant inlet 131, see [reference]. Figure 3 .
[0044] It should be noted that the BMS circuit board 120 is provided with a connector 124, which includes a thermal conductor pin 121 and a connector housing 125. See [link to relevant documentation]. Figure 3 .
[0045] In some implementations, the thermal conductor pin 121 can be a high thermal conductivity conductor pin. For example, the thermal conductor pin 121 can be a conductor pin made of a high thermal conductivity metal material, including but not limited to: copper, gold, silver, tungsten, etc.
[0046] It should be understood that the heat conductor pin 121 can be electrically connected to the battery 110 via the wire 140. To improve heat transfer, the wire 140 can be configured as a copper busbar, that is, a copper busbar is provided between the heat conductor pin 121 and the battery 110, so that the balancing resistor 122 is connected in series with the battery 110 through the heat conductor pin 121 and the copper busbar. This improves the heat transfer efficiency from the balancing resistor 122 (the heat generated by the balancing resistor 122) to the battery 110, thereby contributing to improved heat dissipation from the balancing resistor 122.
[0047] To further improve heat dissipation and reduce heat transfer loss, the position of the equalizing resistor 122 can be set as close as possible to the heat conductor pin 121 to shorten the heat conduction path and increase the conduction speed.
[0048] For example, the equalizing resistor 122 is soldered to the heat conductor pin 121, such that the distance between the equalizing resistor 122 and the heat conductor pin 121 is approximately 0.
[0049] To further improve heat dissipation, the wire diameter of copper-clad circuit 123 can be increased, see [reference needed]. Figure 4 The wire diameter of the copper-clad circuit 123 can be set according to requirements, and this application does not impose specific restrictions on it.
[0050] It should be noted that, in order to improve the equalization effect, multiple equalization resistors 122 are usually set in the equalization area 101 of the BMS circuit board 120 to discharge the battery 110 simultaneously. See [link to relevant documentation]. Figure 3 and Figure 4 .
[0051] In some implementations, see again Figure 2 The battery balancing system 100 also includes a controllable switch 150. This controllable switch 150 is disposed on the copper-clad circuit 123 and can be used to control the on / off state of the copper-clad circuit 123. This allows the balancing function to be turned on and off as needed.
[0052] This application does not impose specific restrictions on the type of controllable switch 150. For example, controllable switch 150 can be a MOS switch; or it can be a relay switch or other contact switch.
[0053] In some implementations, see Figure 5The BMS circuit board 120 also includes an equalization area 101, a sampling area, and a signal area 104. An equalization resistor is provided in the equalization area 101; a sampling sensor is provided in the sampling area to collect the temperature signal of the equalization area 101; the signal area 104 is communicatively connected to the sampling area and is provided with a communication module to transmit the temperature signal to a controller (such as a central processing unit or cockpit host) outside the battery equalization system 100.
[0054] In some implementations, to avoid the heat of the equalization zone 101 affecting the signal zone 104 and the sampling zone, the signal zone 104 and the equalization zone 101 can be spaced apart, and the sampling zone and the equalization zone 101 can also be spaced apart.
[0055] It should be noted that the communication module in signal area 104 can refer to a device that has the function of communicating with external devices. The communication module may include transceivers and analog-to-digital converters, etc.
[0056] Considering the high insulation requirements of communication modules, high temperatures should be avoided to prevent accelerated material aging. This application may involve setting an isolation groove 105 on the BMS circuit board 120 and / or increasing the distance between the signal area 104 and the equalization area 101 (i.e., increasing the spacing between the signal area 104 and the equalization area 101) to enhance the heat insulation effect between the signal area 104 and the equalization area 101.
[0057] As an example, the sampling area and signal area 104 should be appropriately separated from the equalization area 101. This distance is positively correlated with the equalization power of the battery 110, that is, the greater the equalization power of the battery 110, the greater the distance should be.
[0058] As an example, the isolation groove 105 can be disposed between the equalization zone 101 and the signal zone 104 to isolate heat transfer between the equalization zone 101 and the signal zone 104, thereby improving the heat insulation effect. See [link to relevant documentation]. Figure 5 .
[0059] This application does not impose specific restrictions on the shape of the isolation groove 105, as long as it can effectively block the heat transfer between the equalization region 101 and the signal region 104.
[0060] In some implementations, one or more isolation slots 105 may be provided between the equalization zone 101 and the signal zone 104.
[0061] Considering the strength of the BMS circuit board 120, the width and proportion of the isolation groove 105 (the ratio between the area of the isolation groove 105 and the area of the BMS circuit board 120) can be set according to requirements. This application does not impose specific restrictions on this.
[0062] In some implementations, the sampling area includes a heat-sensitive area 102 and a non-heat-sensitive area 103. A heat-sensitive element is disposed in the heat-sensitive area 102, and a non-heat-sensitive element is disposed in the non-heat-sensitive area 103. The non-heat-sensitive area 103 is located on the side of the sampling area closer to the equalization area 101, while the heat-sensitive area 102 is located on the side of the sampling area farther from the equalization area 101. That is, the non-heat-sensitive area 103 can be located between the heat-sensitive area 102 and the equalization area 101, thereby effectively protecting the heat-sensitive element and ensuring the accuracy of the data processed by the heat-sensitive element.
[0063] As an example, heat-sensitive elements include, but are not limited to: thermistors, temperature sensors, thermocouples, current sensors, etc.
[0064] As an example, non-heat-sensitive components include, but are not limited to: capacitors, inductors, diodes, transistors, etc.
[0065] In some implementations, copper-clad circuitry 123 may refer to copper-filled circuitry disposed on BMS circuit board 120.
[0066] This application also provides a vehicle, such as... Figure 6 As shown, the vehicle 600 includes any of the battery balancing systems 100 mentioned above.
[0067] In this embodiment, vehicle 600 can be an electric vehicle, a gasoline vehicle, or a hybrid vehicle, etc., and this application does not impose specific restrictions on it.
[0068] It should be noted that the various embodiments in the specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. It should be pointed out that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model.
[0069] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.
Claims
1. A battery equalization system, characterized by, The battery balancing system comprises: a battery; a battery management system (BMS) circuit board electrically connected to the battery for managing the battery; the BMS circuit board comprises a thermal conductor pin, an equalization resistor, and a copper-clad circuit connected between the thermal conductor pin and the equalization resistor, the copper-clad circuit being coated with a target thermal conductive material, the equalization resistor being connected in series with the battery through the thermal conductor pin, and the equalization resistor being used to balance the performance parameters of the battery; wherein the heat generated by the equalization resistor is transferred to the battery through the copper-clad circuit and the thermal conductor pin, and the thermal conductivity of the target thermal conductive material is greater than that of the copper-clad circuit.
2. The battery equalization system of claim 1, wherein, The battery balancing system further comprises: a heat sink arranged on the surface of the battery for carrying away the heat generated by the battery and the heat transferred by the equalization resistor.
3. The battery equalization system of claim 1, wherein, The battery balancing system further comprises: a copper busbar circuit arranged between the thermal conductor pin and the battery, so that the equalization resistor is connected in series with the battery through the thermal conductor pin and the copper busbar circuit.
4. The battery equalization system of claim 1, wherein, The battery balancing system further comprises: a controllable switch arranged on the copper-clad circuit for controlling the on-off of the copper-clad circuit.
5. The battery equalization system of claim 3, wherein, The BMS circuit board further comprises: an equalization area in which the equalization resistor is arranged; a sampling area in which a sampling sensor is arranged, the sampling sensor being used to collect a temperature signal of the equalization area; a signal area in communication connection with the sampling area, the signal area being provided with a communication module for transmitting the temperature signal to a controller outside the battery balancing system; wherein the signal area and the equalization area are arranged in a spaced manner, and the sampling area and the equalization area are arranged in a spaced manner.
6. The battery equalization system of claim 5, wherein, The BMS circuit board further comprises: an isolation groove arranged between the equalization area and the signal area for isolating the heat transfer between the equalization area and the signal area.
7. The battery equalization system of claim 5, wherein, The sampling area comprises: a heat-sensitive area in which a heat-sensitive element is arranged; a non-heat-sensitive area in which a non-heat-sensitive element is arranged; wherein the non-heat-sensitive area is arranged on one side of the sampling area close to the equalization area, and the heat-sensitive area is arranged on the other side of the sampling area away from the equalization area.
8. The battery balancing system according to any one of claims 1 to 7, wherein: the equalization resistor is welded on the thermal conductor pin.
9. The battery equalization system of any one of claims 1 to 7, wherein, The target thermal conductive material is solder, graphene paint, or high-thermal-conductivity ceramic paint.
10. A vehicle characterized by comprising: The battery balancing system comprises: the battery balancing system according to any one of claims 1 to 9.