Heat dissipation system of switch case

Abstract

The utility model provides a heat dissipation system of a switch cabinet, and aims to solve the technical problem that much dust is attached to equipment in the cabinet due to the existing heat dissipation mode of the switch cabinet. The heat dissipation system comprises a box body, the interior of the box body is provided with a plurality of placing areas, each placing area can be used for placing a switch, and the back of the box body is provided with an isolated heat dissipation part; the air pipe is arranged in the heat dissipation part in the vertical direction; the fans are all arranged in the heat dissipation part and correspond to the placement areas, and air inlets of the fans communicate with the air pipe; the plurality of heat conduction pipes are distributed in each placement area, the heat conduction pipes are communicated end to end, and the heat conduction pipes penetrate into the heat dissipation part and pass through an air outlet of the fan; the pump body is arranged on the heat conduction pipe and used for driving a medium in the heat conduction pipe to flow; the heat dissipation plate is arranged on the section, located in the heat dissipation part, of the heat conduction pipe and located at an air outlet of the draught fan. The heat dissipation system has the advantage of preventing dust from being attached to equipment in the case.

Description

Technical Field

[0001] This utility model relates to a switch chassis, and more specifically to a heat dissipation system for the switch chassis. Background Technology

[0002] A switch chassis is a device used to install multiple switches. Inside the chassis, not only is it necessary to set up installation space for the switches and the location for cable bundling, but also to set up a heat dissipation system.

[0003] During operation, switches generate heat. Since multiple switches are installed in the chassis, a large amount of heat is generated during operation. The natural heat dissipation of the chassis is insufficient to meet the operating requirements of the switches, so a separate cooling system is required.

[0004] Traditional cooling systems simply involve installing vents on the side of the chassis and then using a fan to drive the exchange of airflow between the inside and outside of the chassis to dissipate heat. However, this type of cooling method can lead to a lot of dust accumulating on the equipment inside the chassis. Utility Model Content

[0005] To address the technical problem that existing heat dissipation methods for switch chassis lead to excessive dust accumulation on the equipment inside the chassis, this utility model provides a heat dissipation system for switch chassis that has the advantage of preventing dust accumulation on the equipment inside the chassis.

[0006] The technical solution of this utility model is:

[0007] A heat dissipation system for a switch chassis, comprising:

[0008] The enclosure has multiple placement areas inside, each of which can hold one switch, and the back of the enclosure has an isolated heat dissipation section.

[0009] The air duct is installed vertically inside the heat dissipation section;

[0010] Multiple fans are installed inside the heat dissipation section and correspond to each of the placement areas. The air inlet of each fan is connected to the air duct.

[0011] Multiple heat pipes are distributed in each of the placement areas. The heat pipes are connected end to end, penetrate into the heat dissipation part, and pass through the air outlet of the fan.

[0012] A pump body is mounted on the heat pipe and is used to drive the flow of the medium inside the heat pipe;

[0013] A heat sink is disposed on a section of the heat pipe located within the heat dissipation section and at the air outlet of the fan.

[0014] Optionally, a check valve is provided between the air inlet of the fan and the air duct.

[0015] Optionally, the section of the heat pipe located within the placement area has an S-shaped structure, and the cross-section of this section is rectangular.

[0016] Optionally, multiple heat sinks are arranged parallel to each other and at equal intervals on the heat pipe.

[0017] Optionally, all the heat sinks are located inside a rectangular box, the fan is located on the front side of the box, the rear side of the box extends to the heat dissipation section, and the rear side of the box has an open structure.

[0018] Optionally, a section of the heat pipe located within the placement area is provided with multiple heat collection plates.

[0019] Optionally, a section of the heat pipe located within the placement area is provided with multiple heat-conducting plates, the ends of which are in direct contact with the heat dissipation surface of the switch.

[0020] Optionally, the heat-conducting plate is arc-shaped and elastic.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] First, a placement area is set up inside the chassis, and a heat dissipation unit is set up at the back of the chassis. The heat dissipation unit and the placement area are isolated from each other. Then, heat is conducted from the placement area to the heat dissipation unit by heat pipes. Inside the heat dissipation unit, a fan drives the airflow, thereby driving the heat on the heat pipes away from the heat dissipation unit. A pump is installed on the heat pipes, and the pump drives the flow of the medium inside the heat pipes to increase the speed at which heat moves from the placement area to the heat dissipation unit. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the chassis's 3D structure;

[0025] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0026] Figure 3 This is a schematic diagram of the three-dimensional structure of the back of this utility model. Detailed Implementation

[0027] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0028] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0029] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0030] Example:

[0031] See Figure 1 , Figure 2 and Figure 3 This embodiment discloses a heat dissipation system for a switch chassis, including a chassis 10, a duct 20, a fan 30, a heat pipe 40, a pump body 50, and a heat sink 60. Specifically, the interior of the chassis 10 is provided with multiple placement areas, all of which are arranged at equal intervals along the vertical direction. Each placement area can hold one switch 70. The back of the chassis 10 has an isolated heat dissipation section, which is located behind all the placement areas.

[0032] The air duct 20 is installed vertically and is located inside the heat dissipation section. The top of the air duct 20 extends to the top of the chassis and is equipped with a dustproof net.

[0033] Multiple fans 30 are installed in the heat dissipation section, and at least one fan 30 is located behind each placement area. The air inlet of the fan 30 is connected to the air duct 20. A check valve is installed between the fan 30 and the air duct 20. Through the check valve, airflow is only allowed to flow from the air duct 20 into the fan 30.

[0034] A heat pipe 40 is installed in each placement area. The ends of the heat pipe 40 are connected. One end of the heat pipe 40 is located in the heat dissipation part and passes through the air outlet of the fan 30.

[0035] The pump body 50 is mounted on the heat pipe 40 and is used to drive the flow of the medium inside the heat pipe 40. Generally, the heat pipe 40 is filled with coolant. In addition, the pump body 50 is installed downstream of the medium flow, that is, downstream of the fan 30.

[0036] A heat sink 60 is disposed on a section of the heat pipe 40 located within the heat dissipation section. Multiple heat sinks 60 are arranged parallel to and at equal intervals on this section of the heat pipe 40, and all heat sinks 60 are located at the air outlet of the fan 30. By setting up the heat sinks 60, heat from the heat pipe 40 can be conducted to the heat sinks 60, increasing the contact area of ​​the airflow and improving heat dissipation efficiency.

[0037] The working principle of this embodiment is as follows: First, a placement area is set up inside the chassis, and a heat dissipation part is set up on the back of the chassis. The heat dissipation part and the placement area are isolated from each other. Then, the heat in the placement area is conducted to the heat dissipation part by the heat pipe 40. Inside the heat dissipation part, the airflow is driven by the fan 30, thereby driving the heat on the heat pipe 40 away from the heat dissipation part. A pump body 50 is installed on the heat pipe 40. The pump body 50 drives the medium inside the heat pipe 40 to flow, thereby increasing the speed at which the heat in the placement area moves to the heat dissipation part.

[0038] In one specific embodiment:

[0039] The section of the heat pipe 40 located in the placement area has an S-shaped structure and a rectangular cross-section. By designing the heat pipe 40 as an S-shape and its cross-section as a rectangle, the length and area of ​​the heat pipe 40 in the placement area can be effectively increased, thereby improving the heat absorption efficiency of the heat pipe 40.

[0040] In another specific embodiment:

[0041] All heat sinks 60 are located inside a rectangular box 80. A fan 30 is provided on the front side of the box 80, and a heat dissipation part extends out from the rear side of the box 80. The rear side of the box 80 has an open structure and a dustproof net is provided on the rear side of the box 80.

[0042] This design reduces the space for airflow, thereby increasing the airflow speed and thus increasing the heat dissipation rate on the heat sink 60.

[0043] In another specific embodiment:

[0044] Multiple heat collection plates 90 are provided on a section of the heat pipe 40 located in the placement area. By designing the heat collection plates 90, the speed at which heat is transferred from the placement area to the heat pipe 40 can be accelerated.

[0045] In another specific embodiment:

[0046] Multiple heat-conducting plates 100 are installed on a section of the heat pipe 40 located within the placement area. The ends of the heat-conducting plates 100 are in contact with the exchange 70. The heat-conducting plates 100 are arc-shaped and elastic, like metal spring sheets. The purpose of designing the heat-conducting plates 100 is to improve the efficiency of heat transfer from the exchange 70 to the heat pipe 40.

[0047] The embodiments described above merely illustrate specific implementations of this utility model, and while the descriptions are detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A heat dissipation system for a switch chassis, characterized in that, The utility model relates to a heat dissipation device for multiple switches, comprising: a box with multiple placing areas inside, each of which can place one switch, the back of the box having an isolated heat dissipation part; an air duct vertically arranged in the heat dissipation part; multiple fans arranged in the heat dissipation part and corresponding to each placing area, the air inlet of the fan being communicated with the air duct; multiple heat pipes distributed in each placing area, the heat pipes being communicated at the head and tail, the heat pipes penetrating into the heat dissipation part and passing through the air outlet of the fan; a pump body arranged on the heat pipe for driving the flow of medium in the heat pipe; a heat dissipation plate arranged on the section of the heat pipe in the heat dissipation part and at the air outlet of the fan.

2. The heat dissipation system of a switch chassis according to claim 1, wherein, A check valve is arranged between the air inlet of the fan and the air duct.

3. The heat dissipation system of a switch chassis according to claim 2, wherein, The section of the heat pipe in the placing area is in S-shaped structure, and the cross section of this section is rectangular.

4. The heat dissipation system of a switch chassis according to claim 3, wherein, Multiple heat dissipation plates are arranged on the heat pipe in parallel and at equal intervals.

5. The heat dissipation system of a switch chassis according to claim 4, wherein, All the heat dissipation plates are arranged in a rectangular box, the front side of the box being provided with the fan, the back side of the box extending to the heat dissipation part, and the back side of the box being in open structure.

6. The heat dissipation system of a switch chassis according to any one of claims 1-5, wherein, Multiple heat collecting plates are arranged on the section of the heat pipe in the placing area.

7. The heat dissipation system of a switch chassis according to any one of claims 1-5, wherein, Multiple heat conducting plates are arranged on the section of the heat pipe in the placing area, the end of the heat conducting plate being directly contacted with the heat dissipation surface of the switch.

8. The heat dissipation system of a switch chassis according to claim 7, wherein, The heat conducting plate is arc-shaped and has elasticity.

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