Electronic equipment

Abstract

The utility model discloses an electronic device, and belongs to the technical field of electronic devices. The electronic equipment comprises a mainboard; the mainboard support and the mainboard are arranged in a spaced mode, and the mainboard support is a magnetic conduction piece; and the loudspeaker assembly is connected to the main board bracket and is positioned on one side, far away from the main board, of the main board bracket.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and specifically to an electronic device. Background Technology

[0002] With the continuous development of electronic devices, their audio-visual functions are becoming increasingly sophisticated. In related technologies, electronic devices include a motherboard and speakers, which are spaced apart along the thickness of the electronic device. The speakers contain magnets, and components are mounted on the motherboard.

[0003] With the above setup, the distance between the speaker and the motherboard is too small, which causes the magnetic field generated by the magnet during the speaker's operation to interfere with the magnetic field generated by the components during the motherboard's operation, affecting the speaker's sound performance and the performance of the components. Utility Model Content

[0004] This utility model discloses an electronic device to solve, or at least partially solve, the problems of poor sound output of speakers and poor performance of devices in the prior art.

[0005] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0006] This utility model discloses an electronic device, which includes: a motherboard; a motherboard bracket, which is spaced apart from the motherboard and is a magnetic conductor; and a speaker assembly, which is connected to the motherboard bracket and located on the side of the motherboard bracket away from the motherboard.

[0007] The electronic device disclosed in this utility model includes a motherboard, a motherboard bracket, and a speaker assembly. The motherboard and the motherboard bracket are spaced apart. The speaker assembly is connected to the side of the motherboard bracket away from the motherboard. The motherboard bracket is configured as a magnetic conductor. By changing the spatial distribution of the magnetic field lines of the magnets in the speaker assembly through the motherboard bracket, the magnetic field of the speaker assembly is enhanced, the diffusion of the magnetic field of the speaker assembly to the motherboard is reduced, and the mutual influence between the magnetic field of the speaker assembly and the magnetic field of the components on the motherboard is avoided. This improves the magnetic field shielding effect between the speaker assembly and the motherboard, thereby helping to improve the sound effect of the speaker assembly and the performance of the components on the motherboard. Attached Figure Description

[0008] Figure 1 This is a schematic diagram showing the structure of the electronic device described in the embodiments of this utility model;

[0009] Figure 2 This is a cross-sectional view of the electronic device described in an embodiment of the present utility model;

[0010] Figure 3 This is a schematic diagram showing the structure of the speaker assembly described in an embodiment of the present invention.

[0011] Figure label:

[0012] 10: Motherboard;

[0013] 20: Decorative ring components;

[0014] 30: Motherboard bracket;

[0015] 40: Loudspeaker assembly; 41: Diaphragm; 42: Voice coil; 43: Magnet;

[0016] 50: Magnetic shielding component; 51: Magnetic shielding layer; 52: Shielding cover. Detailed Implementation

[0017] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0018] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0019] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] Reference Figure 1 A schematic diagram of the structure of the electronic device described in an embodiment of this utility model is shown; refer to Figure 2 A cross-sectional view of the electronic device described in an embodiment of the present invention is shown; refer to Figure 3 The diagram shows a schematic representation of the speaker assembly described in an embodiment of the present invention.

[0022] like Figures 1 to 3 As shown in the figure, this utility model embodiment discloses an electronic device, which includes a motherboard 10; a motherboard bracket 30, which is spaced apart from the motherboard 10 and is a magnetic conductive component; and a speaker assembly 40, which is connected to the motherboard bracket 30 and located on the side of the motherboard bracket 30 away from the motherboard 10.

[0023] This utility model discloses an electronic device, which can be a mobile phone, a tablet computer, or other electronic devices. In this utility model embodiment, no specific restrictions are placed on the type of electronic device; any electronic device with audio-visual functions is acceptable.

[0024] The following description will use a mobile phone as an example to illustrate this utility model.

[0025] like Figure 1 and Figure 2 As shown, the electronic device disclosed in this embodiment of the present invention includes a motherboard 10. The motherboard 10, as the core component of the electronic device, is the core carrier of all components of the electronic device. The motherboard 10 includes a motherboard body and multiple devices disposed on the motherboard body. The motherboard 10 ensures that the various components of the electronic device can work together to achieve data transmission and sharing. It is understood that there are circuit traces inside the motherboard 10, and a magnetic field is generated around the motherboard 10 during its operation.

[0026] The electronic device disclosed in this embodiment of the utility model also includes a cover, which is understood to be the back cover of the electronic device. A decorative ring assembly 20 is provided on the cover. The decorative ring assembly 20 serves as a decorative ring for the camera of the electronic device, which can protect the camera of the electronic device and improve the appearance of the electronic device.

[0027] like Figure 2 As shown, along the thickness direction of the electronic device, the decorative ring assembly 20, the motherboard bracket 30, and the motherboard 10 are arranged sequentially at intervals. The speaker assembly 40 is connected to the motherboard bracket 30, and the motherboard bracket 30 fixes the speaker assembly 40. The speaker assembly 40 is located on the side of the motherboard bracket 30 away from the motherboard 10, that is, the speaker assembly 40 is located on the side of the motherboard bracket 30 closer to the decorative ring assembly 20.

[0028] like Figure 2 As shown, the speaker assembly 40 is connected to one side of the motherboard bracket 30, and there is a first gap between the speaker assembly 40 and the motherboard bracket 30 along the thickness direction of the electronic device. This first gap serves as the front cavity of the speaker assembly 40.

[0029] like Figure 3 As shown, a magnet 43 is disposed inside the speaker assembly 40. A voice coil 42 is spaced apart from the magnet 43 and located in the magnetic field of the magnet 43. The voice coil 42 is bonded to the diaphragm 41, which is suspended above the magnet 43. When the speaker assembly 40 is working, by applying different currents to the voice coil 42, the voice coil 42 is subjected to the Lorentz force in the magnetic field, which drives the diaphragm 41 to vibrate up and down, thereby compressing and expanding the air and generating sound waves.

[0030] like Figure 2 As shown, along the thickness direction of the electronic device, the speaker assembly 40 and the motherboard 10 are spaced apart. The motherboard 10 contains circuit traces and functions as a large voice coil and diaphragm. When a large current flows through the motherboard 10 near the speaker assembly 40, the motherboard 10 will be subjected to a Lorentz force in the magnetic field of the speaker assembly 40, generating vibration noise. Conversely, when the electronic device is operating, the current in the circuit within the motherboard 10 will also generate a changing magnetic field. This magnetic field superimposes on the fixed magnetic field of the speaker assembly 40, causing the magnetic field of the speaker assembly 40 to strengthen or weaken. This results in unstable vibration of the voice coil 42 of the speaker assembly 40, leading to noise such as current hum in the speaker assembly 40 and affecting its sound production.

[0031] In this embodiment of the invention, the motherboard bracket 30 is configured as a magnetic conductive element, meaning that the motherboard bracket 30 is magnetically conductive. The motherboard bracket 30 can alter the spatial distribution of the magnetic field lines of the magnets within the speaker assembly 40. The motherboard bracket 30 strengthens the magnetic field on the magnet 43 side of the speaker assembly 40 and reduces the diffusion of the magnetic field to the motherboard 10. By shielding the magnetic fields of the speaker assembly 40 and the motherboard 10 devices from each other, the motherboard bracket 30 reduces the diffusion of the magnetic field from the speaker assembly 40 to the motherboard 10 and the diffusion of the magnetic field generated by the motherboard 10 devices to the speaker assembly 40. This helps to improve the shielding effect of the magnetic fields between the speaker assembly 40 and the motherboard 10, thereby improving the sound output of the speaker assembly 40 and the performance of the motherboard 10 devices.

[0032] For example, the motherboard bracket 10 in this embodiment of the present invention can be a silicon steel bracket, a cold-rolled carbon steel bracket, or an iron bracket. Of course, in this embodiment of the present invention, there are no excessive restrictions on the specific material of the motherboard bracket 10; any material with good magnetic conductivity is acceptable. In practical applications, technicians can choose according to their needs.

[0033] In some embodiments, such as Figure 2 As shown, the electronic device in this embodiment of the present invention also includes a magnetic shielding component 50, which is disposed between the motherboard bracket 30 and the motherboard 10.

[0034] like Figure 2 As shown in this embodiment of the invention, a magnetic shielding component 50 is provided between the motherboard bracket 30 and the motherboard 10. The magnetic shielding component 50 further blocks the changing magnetic field generated by the current traces within the motherboard 10, which superimposes with the fixed magnetic field generated by the magnet within the speaker assembly 40. This causes the magnetic field of the speaker assembly 40 to strengthen or weaken, affecting its sound output, and also affects the magnetic field changes of the components on the motherboard 10, thus impacting their performance. In other words, this arrangement helps to further improve the shielding effect of the magnetic field between the speaker assembly 40 and the motherboard 10, thereby contributing to further improvements in the sound output of the speaker assembly 40 and the performance of the components on the motherboard 10.

[0035] For example, the magnetic shielding component 50 in this embodiment of the present invention can be a nickel-iron component, a nanocrystalline layer, or a tin-plated steel component. In this embodiment of the present invention, there are no excessive restrictions on the specific material of the magnetic shielding component 50; any material with good magnetic shielding properties is acceptable. In practical applications, technicians can choose according to their needs.

[0036] In some embodiments, such as Figure 2 As shown, the magnetic shielding component 50 in this embodiment of the present invention includes a magnetic shielding layer 51, which is disposed between the motherboard bracket 30 and the motherboard 10 and connected to the motherboard bracket 30.

[0037] like Figure 2 As shown in this embodiment of the invention, a magnetic shielding layer 51 is provided between the motherboard bracket 30 and the motherboard 10. This magnetic shielding layer 51 is connected to the side of the motherboard bracket 30 closest to the motherboard 10. The magnetic shielding layer 51 further blocks the changing magnetic field generated by the current traces within the motherboard 10, which is superimposed on the fixed magnetic field generated by the magnet inside the speaker assembly 40. This causes the magnetic field of the speaker assembly 40 to strengthen or weaken, affecting its sound output. It also affects the magnetic field changes of the components on the motherboard 10, thus impacting their performance. In other words, this arrangement helps to further improve the shielding effect of the magnetic field between the speaker assembly 40 and the motherboard 10, thereby contributing to further improvements in the sound output of the speaker assembly 40 and the performance of the components on the motherboard 10.

[0038] It should be noted that, in this embodiment of the invention, the magnetic shielding layer 51 can be adhered to the side of the motherboard bracket 30 near the motherboard 10, the magnetic shielding layer 51 can be snapped onto the side of the motherboard bracket 30 near the motherboard 10, or the magnetic shielding layer 51 can be detachably connected to the side of the motherboard bracket 30 near the motherboard 10 by bolts. In this embodiment of the invention, no particular restrictions are placed on the specific method by which the magnetic shielding layer 51 is connected to the motherboard bracket 30. In practical applications, technicians can choose a suitable connection method as needed.

[0039] The magnetic shielding layer 51 in this embodiment can be a nanocrystalline layer, an amorphous alloy layer, a magnetic ceramic, or a ferrite. Of course, the magnetic shielding layer 51 can also be any other material with magnetic shielding properties. In this embodiment, no particular restrictions are placed on the specific material of the magnetic shielding layer 51. In practical applications, those skilled in the art can select the specific material of the magnetic shielding layer 51 as needed.

[0040] In one preferred embodiment, the magnetic shielding layer 51 in this utility model includes a nanocrystalline layer.

[0041] In this embodiment of the present invention, the magnetic shielding layer 51 is set as a nanocrystalline layer. The nanocrystalline layer has high magnetic permeability, can quickly respond to changes in magnetic field, effectively guide the magnetic field, and reduce the mutual interference of magnetic fields between the speaker assembly 40 and the motherboard 10, thereby helping to further improve the sound output effect of the speaker assembly 40 and the performance of the devices on the motherboard 10.

[0042] In some embodiments, such as Figure 2 As shown in the embodiment of this utility model, along the thickness direction of the electronic device, the speaker assembly 40 has a first projection on the plane where the magnetic shielding layer 51 is located, and the first projection falls into the magnetic shielding layer 51.

[0043] like Figure 2As shown in this embodiment of the present invention, along the thickness direction of the electronic device, the speaker assembly 40 has a first projection on the plane where the magnetic shielding layer 51 is located, and this first projection falls within the magnetic shielding layer 51. That is, the magnetic shielding layer 51 and the speaker assembly 40 are arranged at intervals relative to each other along the thickness direction of the electronic device, and along the thickness direction of the electronic device, the area of ​​the magnetic shielding layer 51 is larger than the area of ​​the speaker assembly 40, so that the magnetic shielding layer 51 can block the speaker assembly 40 and the motherboard 10, avoiding mutual interference of magnetic fields between the speaker assembly 40 and the motherboard 10, thereby helping to further improve the sound output effect of the speaker assembly 40 and the performance of the devices on the motherboard 10.

[0044] In other words, on the plane where the magnetic shielding layer 51 is located, the speaker assembly 40 has a first projection, and the area of ​​the magnetic shielding layer 51 is larger than the area of ​​the first projection, so that the magnetic shielding layer 51 can block the speaker assembly 40 and the motherboard 10, avoid mutual interference between the magnetic fields of the speaker assembly 40 and the motherboard 10, so as to further improve the sound effect of the speaker assembly 40 and the performance of the devices on the motherboard 10.

[0045] In some embodiments, such as Figure 2 As shown, the magnetic shielding component 50 in this embodiment of the present invention also includes a shielding cover 52, which is disposed between the magnetic shielding layer 51 and the main board 10.

[0046] like Figure 2 As shown, the motherboard 10 includes a motherboard body and multiple devices disposed on the motherboard body. The multiple devices are disposed on the side of the motherboard body near the motherboard bracket 30, and the devices include, but are not limited to, chips, capacitors, inductors, etc.

[0047] In this embodiment of the invention, the shielding cover 52 is positioned above the device. It can be understood that the shielding cover 52 is positioned between the magnetic shielding layer 51 and the motherboard 10, and there is a gap between the shielding cover 52 and the devices mounted on the motherboard 10. The shielding cover 52 protects the multiple devices mounted on the motherboard 10.

[0048] Furthermore, the shielding cover 52 can also shield the changing magnetic field generated by the current traces within the motherboard 10, preventing the changing magnetic field generated by the motherboard 10 from superimposing with the fixed magnetic field generated by the magnet within the speaker assembly 40. This would prevent the magnetic field of the speaker assembly 40 from being strengthened or weakened, affecting its sound output, as well as the magnetic field changes of the components on the motherboard 10, thus impacting their performance. In other words, the above-mentioned design helps to further improve the shielding effect of the magnetic field between the speaker assembly 40 and the motherboard 10, thereby contributing to further improvements in the sound output of the speaker assembly 40 and the performance of the components on the motherboard 10.

[0049] It should be noted that the shielding cover 52 in this embodiment of the invention can be made of tinplate, also known as tin-plated steel. Of course, the shielding cover 52 can also be nickel-plated steel, zinc-plated steel, or aluminum-plated steel, etc. In this embodiment of the invention, no particular restrictions are placed on the specific material of the shielding cover 52. In practical applications, technicians can choose according to their needs.

[0050] In one preferred embodiment, the shielding cover 52 in this utility model is a tin-plated steel cover.

[0051] The magnetic shielding of tin-plated steel is due to the tin coating on its surface, which forms a magnetic material that isolates it from the environment. Tin itself is a non-magnetic material and does not exhibit significant magnetic absorption or diamagnetic effects on magnetic fields. When tin-plated steel is exposed to an external magnetic field, the field's influence on the tin is relatively small; the tin will not be attracted or magnetized by the magnetic field. Simultaneously, the presence of the tin layer prevents the external magnetic field from penetrating the internal magnetic field of the steel, thus providing a shielding effect and reducing the steel's permeability. Therefore, in this embodiment of the invention, using tin-plated steel as the shielding cover 52 to shield the magnetic field interference between the speaker assembly 40 and the motherboard 10 has significant advantages.

[0052] It should be noted that setting the shielding cover 52 as a tin-plated steel cover is only a specific example of this utility model and is not intended to limit the utility model. In practical applications, technicians can set the shielding cover 52 as a nickel-plated steel cover, a galvanized steel cover, an aluminized steel cover, etc., as needed.

[0053] In some embodiments, such as Figure 2 As shown in the embodiment of this utility model, along the thickness direction of the electronic device, the speaker assembly 40 has a second projection on the plane where the shielding cover 52 is located, and the second projection falls into the shielding cover 52.

[0054] like Figure 2 As shown in this embodiment of the invention, along the thickness direction of the electronic device, the speaker assembly 40 has a second projection on the plane where the shielding cover 52 is located, and this second projection falls within the shielding cover 52. That is, the shielding cover 52 and the speaker assembly 40 are arranged at intervals relative to each other along the thickness direction of the electronic device, and the area of ​​the shielding cover 52 is larger than the area of ​​the speaker assembly 40 along the thickness direction of the electronic device. This allows the shielding cover 52 to block the speaker assembly 40 and the motherboard 10, preventing mutual interference of magnetic fields between the speaker assembly 40 and the motherboard 10, thereby further improving the sound output effect of the speaker assembly 40 and the performance of the devices on the motherboard 10.

[0055] In other words, on the plane where the shielding cover 52 is located, the speaker assembly 40 has a second projection, and the area of ​​the shielding cover 52 is larger than the area of ​​the second projection, so that the shielding cover 52 can block the speaker assembly 40 and the motherboard 10, avoid the magnetic fields between the speaker assembly 40 and the motherboard 10 from interfering with each other, so as to further improve the sound effect of the speaker assembly 40 and the performance of the devices on the motherboard 10.

[0056] In some embodiments of the present invention, the magnetic shielding layer 51 comprises multiple layers, and the multiple magnetic shielding layers 51 are stacked sequentially between the motherboard bracket 30 and the shielding cover 52.

[0057] In this embodiment of the present invention, the magnetic shielding layer 51 can be configured as multiple layers, with the multiple magnetic shielding layers 51 stacked sequentially between the motherboard bracket 30 and the shielding cover 52, and all multiple magnetic shielding layers 51 connected to the side of the motherboard bracket 30 close to the motherboard 10.

[0058] In this embodiment of the present invention, a multi-layer magnetic shielding layer 51 is provided between the motherboard bracket 30 and the shielding cover 52. The multi-layer magnetic shielding layer 51 blocks the speaker assembly 40 and the motherboard 10 to avoid mutual interference of magnetic fields between the speaker assembly 40 and the motherboard 10, thereby helping to further improve the sound output effect of the speaker assembly 40 and the performance of the devices on the motherboard 10.

[0059] In one preferred embodiment, the motherboard bracket 30 in this utility model is a cold-rolled carbon steel bracket.

[0060] In this embodiment of the invention, the motherboard bracket 30 is configured as a cold-rolled carbon steel bracket, which has good magnetic conductivity. The cold-rolled carbon steel bracket can alter the spatial distribution of the magnetic field lines of the magnets within the speaker assembly 40, strengthening the magnetic field on the magnet 43 side of the speaker assembly 40 and reducing the diffusion of the magnetic field to the motherboard 10. By shielding the magnetic field of the speaker assembly 40 and the magnetic fields of the components on the motherboard 10 with the cold-rolled carbon steel bracket, the diffusion of the magnetic field of the magnets within the speaker assembly 40 to the motherboard 10 is reduced, improving the shielding effect of the magnetic field between the speaker assembly 40 and the motherboard 10. This helps to further improve the sound output of the speaker assembly 40 and the performance of the components on the motherboard 10.

[0061] It should be noted that the cold-rolled carbon steel in this embodiment of the present invention has good magnetic properties. As a ferromagnetic material, cold-rolled carbon steel has high magnetic permeability and saturation magnetic induction intensity, which can effectively transmit and concentrate magnetic fields.

[0062] This utility model discloses an electronic device, which includes: a motherboard; a motherboard bracket, which is spaced apart from the motherboard and is a magnetic conductor; and a speaker assembly, which is connected to the motherboard bracket and located on the side of the motherboard bracket away from the motherboard.

[0063] The electronic device disclosed in this embodiment of the utility model includes a motherboard, a motherboard bracket, and a speaker assembly. The motherboard and the motherboard bracket are spaced apart. The speaker assembly is connected to the side of the motherboard bracket away from the motherboard. The motherboard bracket is configured as a magnetic conductor. By changing the spatial distribution of the magnetic field lines of the magnets in the speaker assembly through the motherboard bracket, the magnetic field of the speaker assembly is enhanced, the diffusion of the magnetic field of the speaker assembly to the motherboard is reduced, and the mutual influence between the magnetic field of the speaker assembly and the magnetic field of the components on the motherboard is avoided. This improves the magnetic field shielding effect between the speaker assembly and the motherboard, thereby helping to improve the sound effect of the speaker assembly and the performance of the components on the motherboard.

[0064] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0065] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising: The electronic device comprises: a mainboard (10); a mainboard support (30) spaced apart from the mainboard (10), the mainboard support (30) being a magnetic conductive member; a speaker assembly (40) connected to the mainboard support (30) and located on a side of the mainboard support (30) away from the mainboard (10).

2. The electronic device of claim 1, wherein, The electronic device further comprises a magnetic isolation member (50) arranged between the mainboard support (30) and the mainboard (10).

3. The electronic device of claim 2, wherein, The magnetic isolation member (50) comprises a magnetic isolation layer (51) arranged between the mainboard support (30) and the mainboard (10) and connected to the mainboard support (30).

4. The electronic device of claim 3, wherein, The magnetic isolation layer (51) comprises a nanocrystalline layer.

5. The electronic device of claim 3, wherein, In the thickness direction of the electronic device, the speaker assembly (40) has a first projection in the plane of the magnetic isolation layer (51), and the first projection falls within the magnetic isolation layer (51).

6. The electronic device of claim 3, wherein, The magnetic isolation member (50) further comprises a shielding cover (52) arranged between the magnetic isolation layer (51) and the mainboard (10).

7. The electronic device of claim 6, wherein, The shielding cover (52) is a tinned steel cover.

8. The electronic device of claim 6, wherein, In the thickness direction of the electronic device, the speaker assembly (40) has a second projection in the plane of the shielding cover (52), and the second projection falls within the shielding cover (52).

9. The electronic device of claim 6, wherein, The magnetic isolation layer (51) comprises multiple layers, and the multiple magnetic isolation layers (51) are sequentially stacked between the mainboard support (30) and the shielding cover (52).

10. The electronic device of any of claims 1-9, wherein, The mainboard support (30) is a cold-rolled carbon steel support.

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