Circuit board and electronic equipment with same

Abstract

The utility model discloses a circuit board and an electronic device with the same, the circuit board comprises a glass fiber layer, a first copper layer, a second copper layer, a first bonding layer and a second bonding layer, and at least one through hole is formed on the glass fiber layer; the first copper layer and the second copper layer are arranged on the two sides of the glass fiber layer in the thickness direction respectively. The first bonding layer is arranged between the first copper layer and the glass fiber layer, and the second bonding layer is arranged between the second copper layer and the glass fiber layer. According to the circuit board provided by the utility model, the at least one through hole is arranged on the glass fiber layer, and the first copper layer and the second copper layer are respectively arranged at two sides of the thickness direction of the glass fiber layer, so that the through hole can reduce the structural strength of the glass fiber layer, glass fiber filaments in the glass fiber layer are prevented from being broken in a pressing process, and smooth signal transmission is ensured; and the reliability of the circuit board is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board and an electronic device having the same. Background Technology

[0002] In related technologies, the processing technology of PTFE substrate for PCBs cannot meet the increasingly high-speed signal output requirements and PCB manufacturing process requirements of products. Existing PTFE copper-clad laminates with 1071PP glass fiber are prone to glass fiber breakage after high-temperature pressing, affecting the reliability of PTFE copper-clad laminates and failing to meet the PCB design requirements of being both rigid and flexible. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. Therefore, one objective of this invention is to provide a circuit board in which through-holes can reduce the structural strength of the fiberglass layer, prevent fiberglass filaments from breaking during lamination, ensure smooth signal transmission, and improve the reliability of the circuit board.

[0004] Another objective of this invention is to provide an electronic device that includes the aforementioned circuit board.

[0005] A circuit board according to a first aspect of the present invention includes: a fiberglass layer having at least one through hole formed thereon; a first copper layer and a second copper layer, the first copper layer and the second copper layer being disposed on opposite sides of the fiberglass layer in the thickness direction; a first adhesive layer and a second adhesive layer, the first adhesive layer being disposed between the first copper layer and the fiberglass layer, and the second adhesive layer being disposed between the second copper layer and the fiberglass layer.

[0006] According to the circuit board of this utility model embodiment, by providing at least one through hole on the glass fiber layer, and the first copper layer and the second copper layer are respectively disposed on both sides of the thickness direction of the glass fiber layer, the through hole can reduce the structural strength of the glass fiber layer, prevent the glass fiber filaments in the glass fiber layer from breaking during the pressing process, ensure smooth signal transmission, and improve the reliability of the circuit board.

[0007] According to some embodiments of the present invention, the through hole is filled with a third adhesive layer, and the two side surfaces of the third adhesive layer in the thickness direction are respectively flush with the two side surfaces of the glass fiber layer in the thickness direction.

[0008] According to some embodiments of the present invention, one side surface of the third adhesive layer in the thickness direction is connected to the first adhesive layer; and / or the other side surface of the third adhesive layer in the thickness direction is connected to the second adhesive layer.

[0009] According to some embodiments of the present invention, the first copper layer in the thickness direction of the glass fiber layer blocks the through hole; and / or the second copper layer in the thickness direction of the glass fiber layer blocks the through hole.

[0010] According to some embodiments of the present invention, the thickness of the glass fiber layer in the thickness direction of the glass fiber layer is greater than or equal to the thickness of the first adhesive layer; and / or the thickness of the glass fiber layer in the thickness direction of the glass fiber layer is greater than or equal to the thickness of the second adhesive layer.

[0011] According to some embodiments of the present invention, the thickness of the glass fiber layer in the thickness direction of the glass fiber layer is D, wherein D satisfies: 50μm≤D≤75μm.

[0012] According to some embodiments of the present invention, both the first adhesive layer and the second adhesive layer are soft adhesive layers.

[0013] An electronic device according to a second aspect of the present invention includes a circuit board according to the first aspect of the present invention described above.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0016] Figure 1 This is a schematic diagram of the glass fiber layer of a circuit board according to an embodiment of the present utility model;

[0017] Figure 2 This is a cross-sectional view of a circuit board according to an embodiment of the present utility model, wherein the first copper layer and the second copper layer are not shown;

[0018] Figure 3 This is an exploded view of a circuit board according to an embodiment of the present utility model;

[0019] Figure 4 yes Figure 3 The diagram shows a cross-sectional view of the circuit board.

[0020] Figure label:

[0021] 100: Circuit board:

[0022] 10: Fiberglass layer; 101: Through hole; 20: First copper layer; 30: Second copper layer; 40: First adhesive layer; 50: Second adhesive layer; 60: Third adhesive layer. Detailed Implementation

[0023] The following is for reference. Figures 1-4 A circuit board 100 according to a first aspect embodiment of the present invention is described.

[0024] like Figures 1-4 As shown, the circuit board 100 according to the first aspect embodiment of the present invention includes: a glass fiber layer 10, a first copper layer 20, a second copper layer 30, a first adhesive layer 40, and a second adhesive layer 50.

[0025] Specifically, at least one through-hole 101 is formed on the fiberglass layer 10, and the first copper layer 20 and the second copper layer 30 are respectively disposed in the thickness direction of the fiberglass layer 10 (e.g., Figure 2 On both sides (up and down direction), the first adhesive layer 40 is disposed between the first copper layer 20 and the fiberglass layer 10, and the second adhesive layer 50 is disposed between the second copper layer 30 and the fiberglass layer 10.

[0026] For example, in Figures 1-4 In the example, the two sides of the fiberglass layer 10 in the thickness direction are the first surface and the second surface, respectively. The through-hole 101 extends along the thickness direction of the fiberglass layer 10, that is, the extension direction of the through-hole 101 is the thickness direction of the fiberglass layer 10. The first adhesive layer 40 and the first copper layer 20 are arranged along the direction from the first surface to the second surface, and the second adhesive layer 50 and the second copper layer 30 are arranged along the direction from the second surface to the first surface. The through-hole 101 can be formed at any position in the fiberglass layer 10.

[0027] Specifically, during processing, positioning holes are machined on the fiberglass layer 10 to securely fix the fiberglass layer 10 to the equipment. Then, a milling machine is used to mill the fiberglass layer 10 to create through holes 101. Next, a first adhesive layer 40 and a second adhesive layer 50 are coated on both sides of the fiberglass layer 10 in the thickness direction. Then, a first copper layer 20 and a second copper layer 30 are placed. Finally, the entire assembly is subjected to high-temperature pressing to form a circuit board 100.

[0028] According to the embodiment of the present invention, the circuit board 100 has at least one through hole 101 on the fiberglass layer 10, and the first copper layer 20 and the second copper layer 30 are respectively disposed on both sides of the thickness direction of the fiberglass layer 10. Thus, the through hole 101 can reduce the structural strength of the fiberglass layer 10, prevent the fiberglass filaments in the fiberglass layer 10 from breaking during the pressing process, ensure smooth signal transmission, and improve the reliability of the circuit board 100.

[0029] According to some embodiments of this utility model, refer to Figures 1-4The through-hole 101 is filled with a third adhesive layer 60, and the two side surfaces of the third adhesive layer 60 in the thickness direction are flush with the two side surfaces of the fiberglass layer 10 in the thickness direction. That is to say, the thickness of the third adhesive layer 60 is the same as the thickness of the fiberglass layer 10. The third adhesive layer 60 can effectively support the sidewall of the through-hole 101, prevent the fiberglass layer 10 from deforming during processing, and ensure the yield rate of the circuit board 100.

[0030] Furthermore, one side surface of the third adhesive layer 60 in the thickness direction is connected to the first adhesive layer 40, that is, the first adhesive layer 40 covers the entire fiberglass layer 10 in the thickness direction of the fiberglass layer 10, so as to firmly bond the first copper layer 20 to the fiberglass layer 10.

[0031] And / or, the other side surface of the third adhesive layer 60 in the thickness direction is connected to the second adhesive layer 50, that is, the second adhesive layer 50 covers the entire fiberglass layer 10 in the thickness direction of the fiberglass layer 10, so as to securely bond the second copper layer 30 to the fiberglass layer 10.

[0032] Furthermore, the first copper layer 20 blocks the through hole 101 in the thickness direction of the glass fiber layer 10, that is, the first copper layer 20 is a complete plane. The first copper layer 20 is connected to the third adhesive layer 60 in the through hole 101 through the first adhesive layer 40, so that the thickness of each position on the front of the circuit board 100 is consistent, which is conducive to subsequent lamination operation, making the structure of the circuit board 100 compact and the signal transmission capability strong.

[0033] And / or, the second copper layer 30 blocks the through hole 101 in the thickness direction of the glass fiber layer 10, that is, the second copper layer 30 is a complete plane. The second copper layer 30 is connected to the third adhesive layer 60 in the through hole 101 through the second adhesive layer 50, so that the thickness of each position on the back of the circuit board 100 is consistent, which is conducive to subsequent lamination operation, making the circuit board 100 compact and having strong signal transmission capability.

[0034] According to some embodiments of the present invention, the thickness of the fiberglass layer 10 in the thickness direction is greater than or equal to the thickness of the first adhesive layer 40; and / or the thickness of the fiberglass layer 10 in the thickness direction is greater than or equal to the thickness of the second adhesive layer 50. Alternatively, only the thickness of the fiberglass layer 10 may be greater than or equal to the thickness of the first adhesive layer 40; or only the thickness of the fiberglass layer 10 may be greater than or equal to the thickness of the second adhesive layer 50; or, only the thickness of the fiberglass layer 10 may be greater than or equal to both the thickness of the first adhesive layer 40 and the thickness of the second adhesive layer 50.

[0035] Specifically, such as Figures 1-4As shown, the thickness of the first adhesive layer 40 is the same as the thickness of the second adhesive layer 50, and the thickness of the first adhesive layer 40 is approximately the same as the thickness of the fiberglass layer 10. This arrangement avoids the need to distinguish between the front and back sides of the fiberglass layer 10 during processing, saving processing time, thereby reducing production costs and improving production efficiency.

[0036] According to some embodiments of this utility model, the thickness of the glass fiber layer 10 in the thickness direction is D, where D satisfies: 50μm≤D≤75μm. Since the glass fiber layer 10 is composed of glass fiber filaments, when D < 50μm, the glass fiber filaments are relatively small, resulting in poor structural strength. During high-temperature pressing, the glass fiber filaments are prone to breakage, affecting the reliability of the circuit board 100, and the circuit board 100 cannot meet the design requirements of being both rigid and flexible. When D > 75μm, the glass fiber filaments are relatively thick, which increases the structural strength but also increases the production cost of the circuit board 100. Therefore, by ensuring that the thickness D of the glass fiber layer 10 satisfies: 50μm≤D≤75μm, the structural strength of the glass fiber filaments can be increased, preventing breakage during high-temperature pressing and improving the reliability of the circuit board 100, while also avoiding excessive cost increases.

[0037] Optionally, the fiberglass filaments of the fiberglass layer 10 can be 1078PP or 1080PP. However, it is not limited to this.

[0038] In some alternative embodiments, both the first adhesive layer 40 and the second adhesive layer 50 are soft adhesive layers. For example, the first adhesive layer 40 and the second adhesive layer 50 can be high-temperature resistant soft adhesive layers. The material of the third adhesive layer 60 can be the same as that of the first adhesive layer 40 and the second adhesive layer 50, which facilitates filling the through holes 101 with the third adhesive layer 60 when coating the adhesive layer on the surface of the glass fiber layer 10, saving processing steps and further improving production efficiency.

[0039] An electronic device according to a second aspect of the present invention includes a circuit board 100 according to the first aspect of the present invention described above.

[0040] The electronic device according to the present invention, by adopting the above-described circuit board 100, can improve the reliability of the electronic device, thereby increasing its service life and enhancing its market competitiveness.

[0041] Other configurations and operations of the electronic device according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0042] In the description of this utility model, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0043] In the description of this utility model, "first feature" and "second feature" may include one or more of the features. In the description of this utility model, "above" or "below" the second feature may include direct contact between the first and second features, or contact between the first and second features not in direct contact but through another feature between them.

[0044] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0046] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board, characterized by, The circuit board comprises: a glass fiber layer, at least one through hole being formed on the glass fiber layer; a first copper layer and a second copper layer, the first copper layer and the second copper layer being respectively arranged on two sides in a thickness direction of the glass fiber layer; a first adhesive layer and a second adhesive layer, the first adhesive layer being arranged between the first copper layer and the glass fiber layer, and the second adhesive layer being arranged between the second copper layer and the glass fiber layer.

2. The circuit board of claim 1, wherein The through hole is filled with a third adhesive layer, and two side surfaces in a thickness direction of the third adhesive layer are flush with two side surfaces in the thickness direction of the glass fiber layer respectively.

3. The circuit board of claim 2, wherein, One side surface in the thickness direction of the third adhesive layer is connected with the first adhesive layer; and / or the other side surface in the thickness direction of the third adhesive layer is connected with the second adhesive layer.

4. The circuit board of claim 3, wherein The first copper layer shields the through hole in the thickness direction of the glass fiber layer; and / or The second copper layer shields the through hole in the thickness direction of the glass fiber layer.

5. The circuit board according to any one of claims 1 to 4, characterized in that, The thickness of the glass fiber layer in the thickness direction of the glass fiber layer is greater than or equal to the thickness of the first adhesive layer; and / or The thickness of the glass fiber layer in the thickness direction of the glass fiber layer is greater than or equal to the thickness of the second adhesive layer.

6. The circuit board of claim 5, wherein The thickness of the glass fiber layer in the thickness direction of the glass fiber layer is D, wherein the D satisfies 50 μm≤D≤75 μm.

7. The circuit board of claim 1, wherein The first adhesive layer and the second adhesive layer are both soft adhesive layers.

8. An electronic device, comprising: The circuit board comprises the circuit board according to any one of claims 1-7. The circuit board comprises the circuit board according to any one of claims 1-7.

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