SMT carrier with magnetic attraction

Abstract

The utility model discloses a magnetic SMT carrier, which relates to the technical field of SMT carriers, and comprises a carrier plate, a first blind hole is arranged on one side surface of the carrier plate, a magnetic part is arranged in the first blind hole, a separation blade is further arranged in the first blind hole, and the separation blade is fixedly connected with the carrier plate; wherein the magnetic piece is located in a space formed by the blocking piece and the first blind hole, the first blind hole is formed in the bottom face of the carrier plate, the magnetic piece and the blocking piece are sequentially placed into the first blind hole, then the blocking piece is fixedly connected with the carrier plate, and the blocking piece is fixed to an opening of the first blind hole; the magnetic piece can adsorb and fix the PCB placed on the carrier plate in the first blind hole, the magnetic piece is fixed in the first blind hole through the blocking piece, when the carrier plate is used, the situation that the magnetic piece is disengaged from the carrier plate when the magnetic piece faces impact and vibrates violently can be effectively prevented, the blocking piece and the carrier plate are fixedly connected through the spot welding technology, and the service life of the carrier plate is prolonged. And the production efficiency can be improved.

Description

Technical Field

[0001] This utility model relates to the field of SMT carrier technology, and in particular to an SMT carrier with magnetic attraction. Background Technology

[0002] SMT carriers, also known as SMT fixtures, are auxiliary devices specifically designed for the SMT (Surface Mount Technology) production process. One of the main functions of SMT carriers is to support and hold PCB boards, especially during printing and placement machine assembly. They ensure the stability and accuracy of the PCB board during production; and through design, they enable the accurate placement of electronic components on the PCB, ensuring precise component positioning. Therefore, SMT carriers play a crucial role in the electronics manufacturing industry, not only improving production efficiency but also guaranteeing product quality and reliability.

[0003] In some applications, to more accurately position and secure PCBs, SMT carriers use magnetic components embedded in their bottoms. These magnetic components attract the PCBs through the carrier, providing additional fixing force and reducing displacement caused by vibration during transport and handling. However, current methods of connecting magnets to carriers typically use adhesive. While adhesive bonding can achieve a certain level of fixation, it also has some potential drawbacks. For example, adhesive may not provide sufficient bonding strength, especially under impact, vibration, or temperature changes, causing the magnetic components to loosen or detach. Furthermore, the adhesive requires baking and curing after application, which takes a long time and affects efficiency.

[0004] Therefore, it is necessary to propose a new technical solution to address the above problems. Utility Model Content

[0005] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the aforementioned problems.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a magnetic SMT carrier, including a carrier plate, a first blind hole is provided on one side of the carrier plate, a magnetic component is built into the first blind hole, a baffle is also provided in the first blind hole, and the baffle is fixedly connected to the carrier plate.

[0007] The magnetic component is located within the space formed by the baffle and the first blind hole.

[0008] As a further embodiment of this utility model, the baffle plate and the carrier plate are fixedly connected by welding.

[0009] As a further aspect of this utility model: the depth of the space formed by the baffle and the first blind hole is the same as the thickness of the magnetic component.

[0010] As a further embodiment of this utility model: the end face of the baffle away from the first blind hole is flush with the surface of the carrier plate.

[0011] As a further embodiment of this utility model: the area of ​​the carrier plate is larger than that of the second blind hole, the second blind hole covers the first blind hole, and the depth of the second blind hole is less than that of the first blind hole;

[0012] The end face of the baffle away from the first blind hole is flush with the inner side of the second blind hole, and the edge of the baffle and the inner side of the second blind hole are formed with several weld points by spot welding technology.

[0013] As a further embodiment of this utility model, the baffle is made of the same material as the carrier plate.

[0014] Compared with the prior art, the beneficial effects of this technical solution are as follows: by opening a first blind hole on the bottom surface of the carrier plate, and then inserting the magnetic component and the baffle into the first blind hole, and then fixing the baffle to the carrier plate, the baffle is fixed at the opening of the first blind hole. The magnetic component can attract and fix the PCB board placed on the carrier plate inside the first blind hole. By using the baffle to fix the magnetic component in the first blind hole, it can effectively prevent the magnetic component from falling off the carrier plate when facing severe impact and vibration.

[0015] Furthermore, the contact point between the baffle and the carrier plate is fixed by welding. Specifically, a laser spot welding machine can be used to quickly spot weld the welding point. After the baffle is placed into the first blind hole, it is placed on the worktable of the laser spot welding machine. The laser spot welding machine quickly spots welds the baffle and the carrier plate according to the preset, which is not only highly efficient, but also provides a stable connection, thereby preventing the baffle from becoming loose or falling off.

[0016] The depth of the space formed by the baffle and the first blind hole is equal to the thickness of the magnetic component, so that the magnetic component is pressed by the baffle, that is, the magnetic component can always be in close contact with the carrier plate, ensuring that the magnetic attraction of the magnetic component inside the first blind hole can stably attract the PCB board when the carrier plate is in use.

[0017] By creating a second blind hole, the weld point can be placed within the second blind hole, thus ensuring that the surface of the vehicle plate remains flat. This avoids the instability of the vehicle plate caused by the protrusion of the weld point. Furthermore, protruding weld points also pose a risk of being knocked off during a collision, which could lead to loosening of the connection between the baffle and the vehicle plate. This problem is also solved by creating a second blind hole.

[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a partial structural cross-sectional schematic diagram of this utility model;

[0022] The corresponding labels in the attached diagram are explained as follows:

[0023] 1. Carrier plate; 2. First blind hole; 3. Magnetic component; 4. Baffle plate; 5. Second blind hole; 6. Solder joint. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-2 A magnetic SMT carrier includes a carrier plate 1. A first blind hole 2 is provided on one side of the carrier plate 1. A magnetic component 3 is placed inside the first blind hole 2. A baffle 4 is also provided inside the first blind hole 2 and the baffle 4 is fixedly connected to the carrier plate 1.

[0026] The magnetic component 3 is located within the space formed by the baffle 4 and the first blind hole 2;

[0027] In this embodiment of the utility model, a first blind hole 2 is opened on the bottom surface of the carrier plate 1, and a magnetic component 3 and a baffle 4 are placed into the first blind hole 2 in sequence. Then, the baffle 4 is fixedly connected to the carrier plate 1, so that the baffle 4 is fixed at the opening of the first blind hole 2. The magnetic component 3 can attract and fix the PCB board placed on the carrier plate 1 inside the first blind hole 2. By using the baffle 4 to fix the magnetic component 3 inside the first blind hole 2, it can effectively prevent the magnetic component 3 from falling off the carrier plate 1 when facing a relatively strong impact or vibration.

[0028] Furthermore, the baffle 4 can also protect the magnetic component 3, that is, prevent the magnetic component 3 from being impacted from the outside, effectively avoiding the situation where the magnetic component 3 breaks and its magnetism is affected.

[0029] In this embodiment, the first blind hole 2, the magnetic component 3, and the baffle are preferably circular, but not limited to this; their shapes can be changed according to different needs. Figure 1 As shown, in this embodiment, there are multiple first blind holes 2, magnetic components 3 and baffles, which are arranged in sequence at intervals, and the magnetic components 3 are specifically magnets.

[0030] In this embodiment, it is further proposed that the baffle 4 and the carrier plate 1 are fixedly connected by welding process;

[0031] The contact point between the baffle 4 and the carrier plate 1 is fixed by welding. Specifically, a laser spot welding machine can be used to quickly spot weld the welding point. The movement path of the laser spot welding machine can be preset. After the baffle 4 is placed into the first blind hole 2, the side of the carrier plate 1 with the first blind hole 2 facing up is placed on the worktable of the laser spot welding machine. The baffle 4 and the carrier plate 1 are quickly spot welded and fixed by the laser spot welding machine. This method is not only highly efficient, but also provides a stable connection, thereby preventing the baffle 4 from becoming loose or falling off.

[0032] In this embodiment, please refer to Figure 2 Furthermore, it is proposed that the depth of the space formed by the baffle 4 and the first blind hole 2 is the same as the thickness of the magnetic component 3;

[0033] When installing the magnetic component 3 and the baffle 4, preferably after the baffle 4 is fixed to the carrier plate 1, the depth of the space formed by the baffle 4 and the first blind hole 2 is equal to the thickness of the magnetic component 3, so that the magnetic component 3 is pressed by the baffle 4, that is, the magnetic component 3 can always be in close contact with the carrier plate 1, ensuring that when the carrier plate 1 is in use, the magnetic attraction of the magnetic component 3 inside the first blind hole 2 stably acts to attract the PCB board.

[0034] In this embodiment, it is further proposed that the end face of the baffle 4 away from the first blind hole 2 is flush with the surface of the carrier plate 1;

[0035] After the baffle 4 is placed inside the first blind hole 2, its outer side is flush with the surface of the carrier plate 1, making the surface of the carrier plate 1 flat. The baffle 4, which protrudes from the surface of the carrier plate 1, affects the stability of the carrier plate 1 when placed on PCB production, testing and other equipment, reducing shaking or tilting caused by unevenness during transportation. It can also reduce the impact of the baffle 4 during use and prevent the baffle 4 from falling off after being impacted.

[0036] In one embodiment, the area of ​​the carrier plate 1 is larger than that of the second blind hole 5 of the first blind hole 2, the second blind hole 5 covers the first blind hole 2, and the depth of the second blind hole 5 is less than that of the first blind hole 2;

[0037] Among them, the end face of the baffle 4 away from the first blind hole 2 is flush with the inner side of the second blind hole 5, and the edge of the baffle 4 and the inner side of the second blind hole 5 are formed with several weld points 6 by spot welding technology.

[0038] In this embodiment, a second blind hole 5 covering the first blind hole 2 is provided on the carrier plate 1. That is, after the magnetic component 3 and the baffle 4 are sequentially placed into the first blind hole 2, the outer side of the baffle 4 is flush with the inner side of the second blind hole 5. The edge of the baffle 4 and the inner side of the second blind hole 5 are formed by spot welding, and several weld points 6 are protruding. Therefore, by opening the second blind hole 5, the weld points 6 can be placed inside the second blind hole 5, rather than protruding from the surface of the carrier plate 1, so that the surface of the carrier plate 1 always remains flat. This can avoid the carrier plate 1 from being unstable due to the protrusion of the weld points 6. In addition, the protruding weld points 6 also have the risk of being knocked off during collision, which will cause the connection between the baffle 4 and the carrier plate 1 to loosen. This problem is also solved by opening the second blind hole 5.

[0039] Furthermore, the baffle 4 is made of the same material as the vehicle plate 1.

[0040] In this utility model, both the baffle 4 and the carrier plate 1 are preferably made of aluminum. The baffle 4 and the carrier plate 1 are made of the same material, so that when the baffle 4 and the carrier plate 1 are welded, the same material makes the two have similar physical and chemical properties, which makes it easier to form uniform and strong weld points 6 during the welding process, making the welding more stable, reducing the risk of welding defects, ensuring higher welding quality, and improving welding strength.

[0041] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A magnetic SMT carrier, characterized by, The utility model provides a carrier plate (1) is provided with first blind hole (2) on one side, and the first blind hole (2) is provided with magnetic piece (3) and baffle (4) inside, and the baffle (4) is fixedly connected with the carrier plate (1). The magnetic piece (3) is located in the space formed by the baffle (4) and the first blind hole (2).

2. The SMT carrier with magnetic attraction according to claim 1, characterized in that, The baffle (4) and the carrier plate (1) are fixedly connected by welding process.

3. The SMT carrier with magnetic attraction according to claim 1 or 2, characterized in that, The depth of the space formed by the baffle (4) and the first blind hole (2) is the same as the thickness of the magnetic piece (3).

4. The SMT carrier with magnetic attraction according to claim 3, wherein, The end surface of the baffle (4) away from the first blind hole (2) is flush with the surface of the carrier plate (1).

5. The SMT carrier with magnetic attraction according to claim 3, wherein, The area of the carrier plate (1) is larger than the second blind hole (5) of the first blind hole (2), the second blind hole (5) covers the first blind hole (2), and the depth of the second blind hole (5) is smaller than that of the first blind hole (2). The end surface of the baffle (4) away from the first blind hole (2) is flush with the inner side surface of the second blind hole (5), and the edge of the baffle (4) and the inner side surface of the second blind hole (5) are formed with a plurality of welding points (6) by spot welding technology.

6. The SMT carrier with magnetic attraction according to claim 5, wherein, The baffle (4) is made of the same material as the carrier plate (1).

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