Frequency converter and IGBT pin sealing structure

Abstract

The utility model discloses an IGBT pin sealing structure and a frequency converter, an IGBT module is fixed on a die-casting radiator, a sealing member layer is arranged on the IGBT module to seal a cavity space formed between the IGBT module and a PCBA assembly, the sealing member layer is arranged on the surface of the IGBT module, and the PCBA assembly is connected with the die-casting radiator after pressing the sealing member layer. According to the utility model, effective protection can be effectively carried out by sealing the area between the IGBT pins and the PCBA, the internal of the UGBT pin cavity is isolated from the external environment, acid and alkali corrosion is effectively isolated, short circuit between the IGBT pins caused by condensation is avoided, the effective operation time of a machine is prolonged, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to frequency converter technical field especially is related to a frequency converter and IGBT pin sealing structure. BACKGROUND

[0002] Frequency converter (Variable-frequency Drive, VFD) is application frequency conversion technology and microelectronic technology, through the way of changing motor working power frequency to control AC motor's electric power control equipment.

[0003] Frequency converter mainly is rectified (AC changes DC), filtering, inversion (DC changes AC), brake unit, drive unit, detection unit microprocessing unit etc. Frequency converter adjusts the voltage and frequency of output power supply by the opening and closing of internal IGBT, provides the power supply voltage that motor needs according to the actual need of motor, and then achieves the purpose of energy saving and speed regulation, in addition, frequency converter has many protection functions, such as overcurrent, overvoltage, overload protection etc. With the continuous improvement of industrial automation, frequency converter has been very widely used.

[0004] The existing frequency converter cannot be sealed in the area between the IGBT pin and the pcba due to the arrangement of electronic components during the packaging process of the IGBT module, the internal and external environment of the IGBT pin cavity is not isolated, acid and alkali corrosion is easy to occur, external moisture is easy to cause short circuit of the pin, and the operation risk is increased. UTILITY MODEL CONTENT

[0005] The utility model discloses a kind of frequency converter and IGBT pin sealing structure, effectively protect IGBT pin, avoid being corroded by acid and alkali, avoid condensation between IGBT pin short circuit, increase the effective operation time of machine, prolong life.

[0006] To solve the above technical problems, the utility model embodiment provides an IGBT pin sealing structure, including IGBT module, die-casting radiator, PCBA component and sealing element, the IGBT module is arranged in the frequency converter main body, is used to rectify and invert the frequency converter main body, the die-casting radiator is arranged in the frequency converter main body, is used to fix the IGBT module and the PCBA component, and the frequency converter main body, the IGBT module and the PCBA component are radiated, the sealing element layer is arranged in the IGBT module, is used to seal the cavity space formed between the IGBT module and the PCBA component, the PCBA component is connected with the die-casting radiator after pressing the sealing element.

[0007] Among them, including the adhesive layer of the connecting face of the sealing element layer, the sealing element layer is bonded with the IGBT module through the adhesive layer.

[0008] The sealing layer is an insulating rubber sealing layer or a silica gel sealing layer.

[0009] The sealing layer and the bonding layer are in an integrated structure.

[0010] The PCBA assembly is connected with the die-casting heat sink through bolts or screws passing through the mounting hole.

[0011] The bolts or the screws are connected with the mounting hole in interference fit or clearance fit, and the bolts or the screws are sealed with a sealing glue layer at the connection.

[0012] The PCBA assembly and the die-casting heat sink form a complete cavity, and an outer wall of the complete cavity is sleeved with a shell for protecting the complete cavity.

[0013] In addition, the application also provides a frequency converter comprising the IGBT pin sealing structure.

[0014] Compared with the prior art, the electric heating comb provided by the application has the following advantages.

[0015] The IGBT pin sealing structure and the frequency converter provided by the application can effectively protect the area between the IGBT pins and the PCBA by sealing the cavity space formed between the IGBT module and the PCBA assembly, isolate the inside of the IGBT pin cavity from the external environment, effectively isolate acid and alkali corrosion, avoid short circuit between the IGBT pins caused by condensation, increase the effective operation time of the machine, and prolong the service life. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0017] Fig. 1 A structure diagram of an IGBT pin sealing structure in the prior art;

[0018] Fig. 2 A structure diagram of an embodiment of the IGBT pin sealing structure provided by the utility model;

[0019] Among them, IGBT module-1, die-casting radiator-2, sealing layer-3, PCBA assembly-4, shell-5. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0021] Please refer to Figs. 1-2 , Fig. 1 A structure diagram of an IGBT pin sealing structure in the prior art; Fig. 2 A structure diagram of an embodiment of the IGBT pin sealing structure provided by the utility model.

[0022] In a specific embodiment, the IGBT pin sealing structure comprises an IGBT module 1, a die-casting radiator 2, a PCBA assembly 4 and a sealing piece. The IGBT module 1 is arranged in a frequency converter main body and is used for rectifying and inverting the frequency converter main body. The die-casting radiator 2 is arranged in the frequency converter main body and is used for fixing the IGBT module 1 and the PCBA assembly 4 and radiating the frequency converter main body, the IGBT module 1 and the PCBA assembly 4. The sealing layer 3 is arranged on the IGBT module 1 and is used for sealing a cavity space formed between the IGBT module 1 and the PCBA assembly 4. The PCBA assembly 4 is connected with the die-casting radiator 2 after pressing the sealing piece.

[0023] By fixing the IGBT module 1 on the die-casting radiator 2, the sealing layer 3 is arranged on the IGBT module 1 to seal the cavity space formed between the IGBT module 1 and the PCBA assembly 4. The sealing layer 3 is arranged on the surface of the IGBT module 1. The PCBA assembly 4 is connected with the die-casting radiator 2 after pressing the sealing layer 3. The area between the IGBT pin and the PCBA can be effectively protected by sealing the area, the inside of the IGBT pin cavity is isolated from the external environment, acid and alkali corrosion is effectively isolated, short circuit between the IGBT pins caused by condensation is avoided, the effective operation time of the machine is increased, and the service life is prolonged.

[0024] The seal layer 3 is used to effectively protect the area between the IGBT pin and the PCBA in the present application, and the thickness, material, size and mounting method of the seal layer 3 are not limited.

[0025] In order to improve the sealing effect as much as possible and reduce the moisture, dust and other pollutants from the outside to the IGBT pin, in an embodiment, the IGBT pin sealing structure further comprises an adhesive layer arranged on the connecting surface of the seal layer 3, and the seal layer 3 is bonded to the IGBT module 1 through the adhesive layer.

[0026] By arranging the adhesive layer on the connecting surface of the seal layer 3 and bonding the seal layer 3 to the IGBT module 1, the gap between the two can be eliminated as much as possible, so that even if aging and other phenomena occur over time, the gap between the two will not increase, the sealing effect will not decrease, and the reliability of the seal is improved.

[0027] The type, material, thickness and distribution of the adhesive layer are not limited in the present application. The adhesive layer can be arranged only in the bonding area, or the connecting surface can be completely covered with the adhesive layer.

[0028] The seal layer 3 is used to seal and connect the corresponding parts in the present application, and the material and thickness of the seal layer 3 are not limited. The seal layer 3 is an insulating rubber seal layer 3 or a silicone seal layer 3, or other types of seal layer 3. Generally, a flexible seal layer 3 is preferred, which can improve the sealing degree of the connecting parts as much as possible.

[0029] Preferably, the seal layer 3 and the adhesive layer are of an integrated structure.

[0030] By designing the seal layer 3 and the adhesive layer as an integrated structure, the installation of the seal layer 3 can be completed in one step during the connection process, improving the assembly efficiency and assembly quality.

[0031] The integrated structure of the seal layer 3 and the adhesive layer is not limited in the present application.

[0032] In order to further improve the efficiency and reliability of the installation, in an embodiment, the IGBT pin sealing structure further comprises a mounting hole arranged in the seal layer 3, and the PCBA assembly 4 is connected to the die-cast heat sink 2 by passing through the mounting hole with a bolt or a screw.

[0033] Through the installation hole arranged in the sealing layer 3, after the bolt or screw is fixed to the corresponding installation hole, the sealing layer 3 can be quickly positioned, and the installation efficiency is improved. Meanwhile, the fixing of the sealing layer 3 by the bolt or screw also makes the connection of the sealing layer 3 with the IGBT module 1 more reliable after the bonding is completed.

[0034] The type of the installation hole is not limited in the application. The bolt connection described above is included but not limited in the application. The connection mode such as clamping can also be adopted.

[0035] In order to further improve the sealing reliability of the bonding and avoid the water vapor and dust from entering the cavity through the installation hole, in an embodiment, the bolt or the screw is connected in interference fit with the installation hole, or the bolt or the screw is connected in clearance fit with the installation hole, and the bolt or the screw is sealed with the installation hole at the connection position by a sealing glue layer.

[0036] Through the interference fit connection, the gap can be reduced or even avoided, and the sealing reliability is improved. If the clearance fit is adopted, although the gap exists, the sealing effect is further ensured by arranging the sealing glue layer.

[0037] The specific connection fit mode and the further sealing mode are not limited in the application.

[0038] In order to further improve the use reliability of the device, in an embodiment, the PCBA assembly 4 is connected with the die-casting heat sink 2 to form a complete cavity, an outer wall of the complete cavity is sleeved with a housing 5 for protecting the complete cavity, the housing 5 is connected with the complete cavity in clamping or bolt connection, the housing 5 is a plastic housing or an aluminum alloy housing, and the protection level of the housing 5 for the complete cavity is greater than or equal to ip20.

[0039] Through the housing 5 arranged outside the complete cavity for protection, the whole device can withstand greater external force impact, the damage rate during transportation and use is further reduced, and the service life is further improved.

[0040] The material, thickness and installation mode of the housing 5 are not limited in the application.

[0041] In addition, the application embodiment further provides a frequency converter including the IGBT pin sealing structure as described above.

[0042] Since the frequency converter includes the IGBT pin sealing structure as described above, the same beneficial effects are achieved, and the application will not be described here.

[0043] In one embodiment, the IGBT pin sealing structure comprises: an IGBT module 1, an insulating rubber piece with back adhesive, a PCBA assembly 4, a die-casting heat sink 2, and a plastic shell, wherein the IGBT module 1 is fastened on the die-casting heat sink 2 by two screws, the insulating rubber piece with back adhesive is attached to the surface of the IGBT shell 5, the PCBA assembly 4 is fixed on the die-casting heat sink 2, and then the plastic shell is sleeved on the assembled PCBA to complete the whole machine.

[0044] The IGBT is in the rectification and inversion function in the whole machine function; the die-casting heat sink 2 is used for fixing the IGBT module 1 and the PCBA assembly 4, plays a conductive heat dissipation function, the insulating rubber piece with back adhesive is attached to the IGBT, and is used for sealing the cavity space between the IGBT and the PCBA assembly 4; the PCBA assembly 4 is attached to the insulating rubber assembly, and then the PCBA assembly 4 is fastened on the die-casting heat sink 2 by screws; after the PCBA assembly 4 is fixed on the die-casting heat sink 2, the plastic shell body 5 is sleeved, a complete cavity is formed, and ip20 protection is played.

[0045] The IGBT module 1 is fixed on the die-casting heat sink 2 first, then the insulating rubber piece with back adhesive is attached to the IGBT module 1, the PCBA assembly 4 is fixed on the heat sink by screws, and the rubber piece is pressed, so that a closed cavity is formed between the IGBT pin and the PCBA assembly 4, a dustproof, waterproof and condensation-proof state is played, and the situation that the IGBT pin is not coated in place is solved.

[0046] The distance between the IGBT pin and the PCBA can be effectively protected, a complete sealed space is formed therebetween, the IGBT pin cavity inside and the external environment can be isolated, acid and alkali corrosion can be effectively isolated, short circuit between the IGBT pins caused by condensation is avoided, the effective operation time of the machine is increased, and the service life is prolonged.

[0047] In summary, the IGBT pin sealing structure and the frequency converter provided by the embodiment of the utility model can fix the IGBT module on the die-casting heat sink, seal the cavity space formed between the IGBT module and the PCBA assembly by the sealing piece layer arranged on the surface of the IGBT module, connect the die-casting heat sink after the PCBA assembly is pressed against the sealing piece layer, effectively protect the area between the IGBT pin and the PCBA, isolate the IGBT pin cavity inside and the external environment, effectively isolate acid and alkali corrosion, avoid short circuit between the IGBT pins caused by condensation, increase the effective operation time of the machine, and prolong the service life.

[0048] The IGBT pin sealing structure and the frequency converter are described in detail. The principle and implementation of the present application are described by using specific examples. The above description of the embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that for ordinary skilled persons in the art, without departing from the principle of the present application, the present application can be improved and modified in several ways, and these improvements and modifications also fall within the protection scope of the present application.

Claims

1. An IGBT pin sealing structure, characterized by, The IGBT module is arranged in a frequency converter body for rectifying and inverting the frequency converter body, the die-casting radiator is arranged in the frequency converter body for fixing the IGBT module and the PCBA assembly and radiating the frequency converter body, the IGBT module and the PCBA assembly, the sealing layer is arranged on the IGBT module for sealing the cavity space formed between the IGBT module and the PCBA assembly, and the PCBA assembly is connected with the die-casting radiator after being pressed with the sealing layer.

2. The IGBT pin sealing structure of claim 1, wherein, The sealing layer is bonded with the IGBT module through the bonding layer arranged on the connecting surface of the sealing layer.

3. The IGBT pin sealing structure of claim 2, wherein the sealing material is a glass frit. The sealing layer is an insulating rubber sealing layer or a silica gel sealing layer.

4. The IGBT pin sealing structure of claim 3, wherein the sealing material is a glass frit. The sealing layer and the bonding layer are in an integrated structure.

5. The IGBT pin sealing structure according to any one of claims 1 to 4, wherein The mounting hole is arranged on the sealing layer, and the PCBA assembly is connected with the die-casting radiator through the mounting hole by means of a bolt or a screw.

6. The IGBT pin sealing structure according to claim 5, wherein The bolt or the screw is connected with the mounting hole in an interference fit or a clearance fit, and the bolt or the screw is sealed with the mounting hole at the connection by means of a sealing glue layer.

7. The IGBT pin sealing structure according to claim 6, wherein The PCBA assembly and the die-casting radiator are connected to form a complete cavity, an outer wall of the complete cavity is sleeved with a shell for protecting the complete cavity, the shell is connected with the complete cavity by means of clamping or a bolt, the shell is a plastic shell or an aluminum alloy shell, and a protection level of the shell for the complete cavity is greater than or equal to ip20.

8. A frequency converter, characterized in that The IGBT pin sealing structure comprises the IGBT pin sealing structure according to any one of claims 1-7. The IGBT pin sealing structure comprises the IGBT pin sealing structure according to any one of claims 1-7.

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