Heat dissipation structure
By using a non-metallic casing, a water-blocking film, and a capillary structure for heat dissipation, the problems of uneven heat dissipation and moisture penetration are solved, achieving stable temperature regulation and efficient heat dissipation, thereby improving the performance and lifespan of electronic products.
Patent Information
- Application Number
- CN202422779005.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-10-23
- Filing Date
- 2024-11-14
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2034-11-14
AI Technical Summary
Existing heat dissipation structures are difficult to effectively regulate the operating temperature of electronic products, and the vacuum environment is easily affected by moisture or water vapor penetration, resulting in uneven heat dissipation and low efficiency.
The heat dissipation structure includes a shell structure, a water-blocking film, and a capillary structure. The shell structure uses non-metallic materials such as plastic substrates, the water-blocking film prevents moisture penetration, the capillary structure promotes the circulation of cooling fluid, and the guide structure ensures a stable vacuum environment.
It achieves uniform two-phase flow, maintains stable temperature of electronic products, improves heat dissipation efficiency and equipment reliability, reduces electromagnetic interference, enhances insulation performance, and improves user comfort and product lifespan.
Smart Images
Figure CN223772342U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation structure, specifically to two-phase flow heat dissipation structure. BACKGROUND
[0002] With the progress of science and technology, the application of electronic products is widely used in human life, in order to meet the needs of convenient use, the electronic product gradually towards the design with multi -functional, but the electronic product in operation, often because of energy consumption and lead to temperature rise, in the prior art, through a heat dissipation structure or component help the electronic product cooling, but in the traditional heat dissipation technology often difficult to effectively regulate the operating temperature of electronic products, lead to in high temperature environment temperature is too high or in low temperature environment temperature is too low, thereby affecting the performance and life of electronic products.
[0003] In the traditional technology, the heat dissipation structure uses a metal shell structure with good high thermal conductivity and thermal diffusion, but the metal shell structure has the problems of high cost and complex processing, if other non-metallic materials are used, the vacuum environment in the heat dissipation structure will be affected by the penetration of moisture or water vapor, thereby reducing the heat dissipation efficiency, affecting the vacuum effect in the heat dissipation mechanism, so that the heat dissipation structure has the problem of uneven two-phase flow, which further leads to uneven or low efficiency of heat dissipation.
[0004] Therefore, it is urgent to develop a heat dissipation structure that can prevent moisture or water vapor from penetrating and increase the uniformity of two-phase flow in the related field. CONTENT OF THE UTILITY MODEL
[0005] In order to develop a heat dissipation structure that can prevent moisture or water vapor from penetrating and increase the uniformity of two-phase flow, the utility model provides a heat dissipation structure, which comprises:
[0006] One or more shell structures, comprising an inner surface, the inner surface defining a cavity, the cavity comprising a two-phase heat dissipation material and at least a part of a vacuum environment; and
[0007] A water blocking film is formed on at least part or all of the inner surface.
[0008] Wherein, the shell structure comprises any plastic substrate, composite material or part of the plastic substrate. The material of the plastic substrate comprises polycarbonate (PC), polyethylene terephthalate (PET), polyimide (PI), acrylic, polypropylene (PP), polyethylene (PE) or a combination of one or more thereof.
[0009] Further, the cavity is formed between the water blocking film, and a flow channel can be formed in the cavity.
[0010] The water-blocking membrane is a thin film, and its combination with the outer shell structure includes coating, electroplating, chemical vapor deposition, physical vapor deposition, molten lamination, or bonding.
[0011] Furthermore, the water-blocking membrane can be co-extruded, blow-molded, or high-pressure molded together with the outer shell structure in the same process as the outer shell structure.
[0012] The water vapor transmission rate (WVTR) of this shell structure is less than 0.1 g / m. 2 *day. The water vapor transmission rate (WVTR) of this water-blocking membrane is less than 0.1 g / m³. 2 *day.
[0013] Furthermore, the outer shell structure is formed by sandwiching two corresponding plates, and the outer shell structure forms an outer surface of the heat dissipation structure.
[0014] Furthermore, the outer casing is formed by folding a sheet metal in half, and the outer casing forms an outer surface of the heat dissipation structure. Furthermore, the outer casing includes a guide structure, which is a gel-like substance, located at at least one portion of the water-blocking membrane relative to at least one of the outer casing components. The guide structure protrudes from one surface of the water-blocking membrane according to a design and a pattern, such that the guide structure creates a height on one of the surfaces of the water-blocking membrane.
[0015] The water vapor transmission rate (WVTR) of this guiding structure is less than 0.1 g / m. 2 *day.
[0016] Furthermore, the cavity is provided with a capillary structure, which is formed into a sheet by weaving or sintering. The capillary structure includes two opposing sides with different densities.
[0017] The capillary structure has a low-density region on one side and a high-density region on the other side.
[0018] The density from one side to the other of the two opposing sides is a gradient from the high-density region to the low-density region.
[0019] The volatile condensable materials (CVCM) of the capillary structure are less than or equal to 0.1%, and the total mass loss (TML) of the capillary structure is less than 1%.
[0020] Furthermore, the outer shell structure and the water-blocking membrane are bonded together by a joint, which is an adhesive colloid, wherein the joint is coated on at least a portion of the surface of the outer shell structure or on at least a portion of the surface of the water-blocking membrane.
[0021] Based on the above, the present invention provides the following advantages:
[0022] 1. This heat dissipation structure can effectively regulate the operating temperature of the electronic product. When the ambient temperature rises, the liquid cooling fluid in the heat dissipation structure absorbs heat energy and transforms into gaseous cooling fluid, thereby preventing the ambient temperature from rising excessively. Conversely, when the ambient temperature drops, the gaseous cooling fluid releases heat energy and transforms back into liquid cooling fluid. This heat dissipation structure helps maintain a stable ambient temperature, thereby protecting the electronic product from component damage or circuit malfunctions caused by temperature fluctuations.
[0023] 2. This housing structure possesses superior signal transmission performance, interference suppression, and excellent insulation properties. Because the housing is made of a non-conductive material with a low dielectric constant, it almost completely reduces resistance to changes in the electric field and effectively isolates current, avoiding current loss and electromagnetic interference, thereby improving the stability and reliability of signal transmission. Furthermore, the low electromagnetic interference characteristics of this housing structure further enhance its signal protection capabilities, ensuring that the impact of external electromagnetic interference on internal signals is effectively reduced in various environments, guaranteeing the normal operation of the equipment.
[0024] 3. This casing design not only achieves lightweight and visual appeal but also ensures excellent heat dissipation, preventing the casing temperature from exceeding 45°C, thus improving user comfort and preventing future customer returns due to overheating. Furthermore, the casing's thermal melting point is lower than that of metals, making its construction more malleable and allowing for more complex solid-state drive designs to enhance heat dissipation, thereby improving overall performance and the user experience.
[0025] 4. The water-blocking membrane and the guiding structure have excellent waterproof performance, effectively blocking the penetration of moisture or water vapor, improving the stability of the vacuum environment in the cavity, and enhancing the overall performance of the heat dissipation structure. The water-blocking membrane ensures that the heat dissipation structure can maintain a low boiling point in the vacuum environment, thereby ensuring the stability of the heat dissipation performance.
[0026] 5. The low-density and high-density regions of the capillary structure enhance the distribution and circulation of the cooling fluid more efficiently. The capillary structure allows the liquid and gaseous cooling fluids to flow in a balanced manner. Through capillary action, the liquid cooling fluid is encouraged to flow back to the heat source area, effectively maintaining the overall heat dissipation efficiency of the heat dissipation structure, improving its stability and long-term reliability, and further ensuring that the heat dissipation structure does not reduce its efficiency due to the release of volatile condensable substances under high-temperature conditions.
[0027] 6. This utility model specifically overcomes the problems in the prior art, such as the difficulty in effectively regulating the operating temperature of the electronic product, the influence of the cavity on the permeation of moisture or water vapor in the vacuum environment, and the circulation of the liquid cooling fluid and the gaseous cooling fluid. It provides an efficient, stable and reliable heat dissipation structure, further improving the performance and lifespan of the electronic product. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of an exploded view of the preferred first embodiment of the present invention;
[0029] Figure 2 This is a schematic diagram of a cross-sectional view of the preferred first embodiment of the present invention;
[0030] Figure 3 This is a schematic diagram of a cross-sectional view of a preferred second embodiment of the present invention;
[0031] Figure 4 This is a schematic diagram of a cross-sectional view of a preferred third embodiment of the present invention;
[0032] Figure 5 This is a schematic cross-sectional view of the preferred fourth embodiment of the present invention; and
[0033] Figure 6 This is a schematic diagram illustrating the application of the preferred first embodiment of the present invention.
[0034] Symbol explanation:
[0035] 10 Heat dissipation structure
[0036] 11. Shell Structure
[0037] 111 inner surface
[0038] 112 cavity
[0039] 12 Water-resistant membrane
[0040] 13 Guiding Structure
[0041] 14 Joints
[0042] 15 Capillary Structure Detailed Implementation
[0043] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0044] The present invention will now be described in further detail with reference to the accompanying drawings:
[0045] This utility model provides a heat dissipation structure 10, which includes a shell structure 11, a water-blocking film 12, a guiding structure 13, a connecting part 14, and a capillary structure 15.
[0046] Please refer to Figures 1 to 6 The heat dissipation structure 10 can cause a phase change fluid to absorb the heat energy provided by the ambient temperature and convert it into a gaseous state when the ambient temperature rises. The phase change achieves the effect of reducing the temperature. Preferably, when the heat dissipation structure 10 is applied to electronic products such as mobile phones, computers, home appliances or even precision instruments, it can help maintain the ambient temperature of the electronic product in a stable range, avoid damage to the internal components of the electronic product or the occurrence of circuit abnormalities due to excessively low or high temperatures, and maintain the operating quality of the electronic product.
[0047] Please refer to Figures 1 to 6 The preferred embodiment of the present invention includes a shell structure 11 comprising one or more plates and an inner surface 111. The shape of the shell structure 11 is not limited. For example, the shell structure 11 may be formed by sandwiching two plates with corresponding shapes, or by folding a plate in half. The shell structure 11 forms an outer surface of the heat dissipation structure 10.
[0048] In this preferred embodiment, the material of the outer shell structure 11 is not limited. The outer shell structure 11 can be any plastic substrate, composite material, or partially include the plastic substrate. The material of the plastic substrate is not limited, such as polycarbonate (PC), polyethylene terephthalate (PET), polyimide (PI), acrylic, polypropylene (PP), polyethylene (PE), or a combination of one or more. The outer shell structure 11 can be translucent, colored, or include a printed coating. In another embodiment, the outer shell structure 11 is supplemented with other materials of different materials, such as ceramic powder or carbon fiber laminates, and then formed into a composite plastic substrate through co-extrusion blow molding, injection molding, or high-pressure molding.
[0049] At least a portion of the inner surface 111 defines a cavity 112. Preferably, a flow channel can be formed within the cavity 112, wherein the cavity 112 contains a cooling fluid. Further, before or after the cooling fluid is filled into the cavity 112, a vacuum is evacuated to create a vacuum environment or a negative pressure environment, and as the ambient temperature increases, the proportion of the cooling fluid in a gaseous state increases.
[0050] like Figure 1 As shown, the outer shell structure 11 of this embodiment includes two plastic substrates with corresponding shapes. After the outer shell structure 11 is clamped together, the inner surface 111 is formed between the outer shell structure 11, and the cavity 112 is formed on at least a portion of the inner surface 111.
[0051] like Figures 2 to 6 As shown, the water-blocking membrane 12 is located between the outer shell structure 11. The water-blocking membrane 12 is a thin film. The water-blocking membrane 12 abuts against at least a portion of the inner surface 111. The cavity 112 is formed between the water-blocking membranes 12.
[0052] The water-blocking film 12 can be a thin film, and its bonding with the outer shell structure 11 can be achieved through coating, electroplating, chemical vapor deposition, physical vapor deposition, melt deposition, or adhesive bonding. Furthermore, the water-blocking film 12 can also be formed by coating the outer shell structure 11 with a liquid water-blocking film and then drying it. Additionally, the water-blocking film 12 can be co-extruded, blow-molded, or press-molded together with the outer shell structure 11 in a single process.
[0053] The water-blocking membrane 12 has excellent waterproof performance and can effectively prevent moisture or water vapor from penetrating into the cavity 112, further improving the vacuum level of the heat dissipation structure 10 in the vacuum environment. Preferably, the water-blocking membrane 12 can be made of a highly hydrophobic polymer or composite material and is specially treated to enhance its waterproof function, while also giving the water-blocking membrane 12 low outgassing and low permeability.
[0054] The material of the water-blocking membrane 12 is not limited, and it may include a coating or film made of materials such as silicon oxide, silicon nitride, or aluminum oxide. Furthermore, the material of the water-blocking membrane 12 may include any metal coating or film made of metal.
[0055] The water vapor transmission rate (WVTR) of the water-blocking membrane 12 is less than 0.1 g / m³. 2 *day, the water vapor transmission rate refers to the amount of water vapor that passes through the water-blocking membrane 12 per unit area per day. In a preferred embodiment of the present invention, the water-blocking membrane 12 has extremely high water-blocking strength.
[0056] Please refer to Figure 3 and Figure 5 Optionally, the guide structure 13 may be formed by solidifying an adhesive colloid. The guide structure 13 is used to bond the outer casing 11 or the water-blocking membrane 12. Preferably, the guide structure 13 is located at at least one portion of the water-blocking membrane 12 relative to one of the outer casing 11. More preferably, the guide structure 13 protrudes from one surface of the water-blocking membrane 12 according to a design and a pattern, such that the guide structure 13 creates a height difference on one surface of the water-blocking membrane 12.
[0057] In this embodiment, the outer shell structure 11 and the guide structure 13 are respectively coupled to the other side of one of the water-blocking membranes 12, further enabling the cavity 112 to be defined between the outer shell structure 11, the water-blocking membrane 12, and the guide structure 13 in accordance with the designed texture. The guide structure 13 can extend to the edge of one of the surfaces of the water-blocking membrane 12, and the guide structure 13 can also serve as an edge sealant, achieving a sealing effect after solidification.
[0058] Please refer to Figure 6 The outer shell structure 11 can be a single-piece shell or assembled from two or more corresponding components. In one embodiment, it includes two outer shell structures 11 and two water-blocking membranes 12. The two water-blocking membranes 12 are respectively disposed on the inner surfaces 111 of the two outer shell structures 11. The guide structure 13 is located between the two water-blocking membranes 12, and the cavity 112 is also distributed between the two water-blocking membranes 12. Due to the characteristic of the guide structure 13 being solidified from a rubber material, the cavity 112 can be formed along a complex, curved path according to the designed texture.
[0059] The water vapor transmission rate (WVTR) of the guiding structure 13 is less than 0.1 g / m. 2 *day, the guiding structure 13 can also effectively prevent moisture or water vapor from penetrating into the interior of the heat dissipation structure 10, further improving the vacuum level of the vacuum environment in the heat dissipation structure 10, while making the guiding structure 13 have the effects of low outgassing and low permeability.
[0060] Preferably, the cavity 112 is protected by the water-blocking membrane 12 and the guiding structure 13, so that the cavity 112 maintains a low boiling point in the vacuum environment and generates a two-phase flow operation.
[0061] Please refer to Figure 4 and Figure 5Optionally, the capillary structure 15 is disposed in the cavity 112, wherein the capillary structure 15 can be formed into a single piece by weaving or sintering. Further, the capillary structure 15 includes two opposing sides with different densities. One side can be a low-density region and the other side can be a high-density region. Preferably, the density from one side to the other can be a gradient from the high-density region to the low-density region.
[0062] Furthermore, the capillary structure 15 uniformly distributes the cooling fluid through a capillary phenomenon. At least a portion of the capillary structure 15 is in contact with the liquid cooling fluid, and / or another portion of the capillary structure 15 is in contact with the gaseous cooling fluid.
[0063] The capillary structure 15 is distributed within the cavity 112, or the capillary structure 15 is set only in the area where the electronic product provides a heat source, which helps to guide and distribute the gaseous cooling fluid. Furthermore, after the liquid cooling fluid is heated and evaporated, it smoothly returns to the area of the heat source through the capillary phenomenon of the capillary structure 15, maintaining the circulation of the liquid and gaseous cooling fluids.
[0064] Preferably, the capillary structure 15 allows the liquid cooling fluid to remain in the high-density region, and the capillary structure 15 allows the gaseous cooling fluid to flow in the low-density region.
[0065] Preferably, the capillary structure 15 is made of, but is not limited to, polyamide (Nylon), liquid crystal polymer (LCP), polyethylene terephthalate (PET), polyester fiber, any metal, or a combination of one or more of these materials.
[0066] Preferably, in a preferred embodiment of the present invention, the volatile condensable materials (CVCM) of the capillary structure 15 is less than or equal to 0.1%. The volatile condensable materials refer to the amount of condensable substances volatilized by the capillary structure 15 under vacuum conditions. In a preferred embodiment of the present invention, the volatile condensable materials of the capillary structure 15 being less than or equal to 0.1% means that the components volatilized by the capillary structure 15 under vacuum conditions are very small. Therefore, the capillary structure 15 has good stability and applicability.
[0067] Preferably, in a preferred embodiment of the present invention, the total mass loss (TML) of the capillary structure 15 is less than 1%. The total mass loss refers to the fact that the total mass loss of the capillary structure 15 is very small under high temperature conditions. It can be seen that the capillary structure 15 has good thermal stability and will not have significant volatilization or decomposition during heating or heat treatment.
[0068] Based on the above, the present invention provides the following advantages:
[0069] 1. The heat dissipation structure 10 can effectively regulate the operating temperature of the electronic product. When the ambient temperature rises, the liquid cooling fluid in the heat dissipation structure 10 absorbs heat energy and is converted into gaseous cooling fluid, thereby preventing the ambient temperature from rising excessively. Conversely, when the ambient temperature drops, the gaseous cooling fluid releases heat energy and is converted back into liquid cooling fluid. The heat dissipation structure 10 helps to maintain a stable ambient temperature, thereby protecting the electronic product from component damage or circuit abnormalities caused by temperature fluctuations.
[0070] 2. The housing structure 11 possesses superior signal transmission performance, interference suppression capability, and excellent insulation performance. Because the housing structure 11 is made of a non-conductive material with a low dielectric constant, it almost completely reduces the obstruction to changes in the electric field and effectively isolates current, avoiding current loss and electromagnetic interference, thereby improving the stability and reliability of signal transmission. Furthermore, the low electromagnetic interference characteristics of the housing structure 11 further enhance its signal protection capabilities, ensuring that the impact of external electromagnetic interference on internal signals is effectively reduced in various environments, guaranteeing the normal operation of the equipment.
[0071] 3. This casing structure 11 not only achieves lightweight and visual appeal but also ensures excellent heat dissipation, preventing it from exceeding 45°C, thus improving user comfort and preventing future customer return rates due to overheating. Furthermore, the casing structure 11 has a lower melting point than metals, making it more malleable and allowing for more complex solid-state drive designs to enhance heat dissipation, thereby improving overall performance and user experience.
[0072] 4. The water-blocking membrane 12 and the guiding structure 13 have excellent waterproof performance, effectively blocking the penetration of moisture or water vapor, improving the stability of the vacuum environment in the cavity 112, and enhancing the overall performance of the heat dissipation structure 10. The water-blocking membrane 12 ensures that the heat dissipation structure 10 can maintain a low boiling point in the vacuum environment, thereby ensuring the stability of the heat dissipation performance.
[0073] 5. The low-density and high-density regions of the capillary structure 15 enhance the more efficient distribution and circulation of the cooling fluid. The capillary structure 15 allows the liquid and gaseous cooling fluids to flow in a balanced manner. Through capillary action, the liquid cooling fluid is encouraged to flow back to the heat source region, effectively maintaining the overall heat dissipation efficiency of the heat dissipation structure 10, improving the stability and long-term reliability of the heat dissipation structure 10, and further ensuring that the heat dissipation structure 10 will not reduce its efficiency due to the release of volatile condensable substances under high-temperature conditions.
[0074] 6. This utility model specifically overcomes the problems in the prior art, such as the difficulty in effectively regulating the operating temperature of the electronic product, the influence of the cavity 112 on the permeation of moisture or water vapor in the vacuum environment, and the circulation of the liquid cooling fluid and the gaseous cooling fluid. It provides a highly efficient, stable and reliable heat dissipation structure 10, further improving the performance and lifespan of the electronic product.
[0075] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A heat dissipating structure, characterized by comprising: It comprises: one or more housing structures, the housing structure is a plastic substrate, which comprises an inner surface, the inner surface defines a cavity, the cavity comprises a two-phase heat dissipation material and at least a part of a vacuum environment; and one water blocking film is formed on at least part or all of the inner surface.
2. The heat dissipating structure according to claim 1, wherein The cavity is formed between the water blocking film, and a flow channel can be formed in the cavity.
3. The heat dissipating structure according to any one of claims 1 to 2, wherein The housing structure is formed by clamping two corresponding plates, and the housing structure forms an outer surface of the heat dissipation structure.
4. The heat dissipating structure according to any one of claims 1 to 2, wherein The housing structure is formed by folding a plate, and the housing structure forms an outer surface of the heat dissipation structure.
5. The heat dissipating structure according to claim 2, wherein The housing structure comprises a guide structure, which is a gel located at least one part of the housing structure relative to the water blocking film, and the guide structure protrudes from one surface of the water blocking film according to a design pattern, so that the guide structure has a height on one surface of the water blocking film.
6. The heat dissipating structure according to claim 5, wherein The cavity is provided with a capillary structure, which is formed by weaving or sintering into a sheet, and the capillary structure comprises two opposite sides with different densities.
7. The heat dissipating structure according to claim 6, wherein One side of the capillary structure is a low-density area, and the other side is a high-density area.
8. The heat dissipating structure according to claim 7, wherein The density of one side to the other side of the two opposite sides is gradually changed from the high-density area to the low-density area.
9. The heat dissipating structure according to claim 8, wherein The housing structure and the water blocking film are bonded to each other through a bonding part, which is a viscous gel, wherein the bonding part is coated on at least a part of the surface of the housing structure or at least a part of the surface of the water blocking film.