Liquid cooling integrated power conversion equipment

Abstract

The utility model provides liquid-cooled integrated power conversion equipment, which relates to the technical field of power electronic heat dissipation, and is characterized in that the interior of the liquid-cooled integrated power conversion equipment comprises a power cavity, a low-temperature closed cavity and a heat dissipation cavity, and a power device and a second heat dissipation device are accommodated in the power cavity. A heat sensitive device and a third heat dissipation device are contained in the low-temperature closed cavity, a first heat dissipation device is contained in the heat dissipation cavity, and the second heat dissipation device and the third heat dissipation device are communicated with the first heat dissipation device through pipelines or extend into the heat dissipation cavity to be matched with the third heat dissipation device. According to the liquid-cooled integrated power conversion equipment, through the technical means of cavity-divided heat dissipation design, heat-sensitive device protection, heat dissipation air channel sharing, efficient heat dissipation structure, modular design and the like, the heat dissipation problem of high-power equipment is effectively solved, the service life of the equipment is prolonged, and the reliability of the equipment is improved.

Description

Technical Field

[0001] This utility model relates to the field of power electronic heat dissipation technology, and more specifically, to a liquid-cooled integrated power conversion device. Background Technology

[0002] As inverter power density and protection requirements increase, the internal ambient temperature of power equipment is becoming a significant factor limiting product design. Even though many power devices currently employ water-cooling solutions to address the heat dissipation issues of power modules and inductors, many components within the inverter remain difficult to cool with water, such as the power cabinet bus capacitors and power transistors on the auxiliary power board. Without proper heat dissipation design, the lifespan of these components will be significantly reduced, affecting the normal operation of the equipment. How to minimize the internal ambient temperature of the inverter, especially the temperature of heat-sensitive components, while ensuring adequate cooling of power modules and inductors is a key concern in the industry. Utility Model Content

[0003] To overcome the aforementioned shortcomings of existing technologies, this invention provides a liquid-cooled integrated power conversion device. This invention employs a compartmentalized design, dividing the power conversion device from bottom to top into a power chamber, a low-temperature sealed chamber, and a heat dissipation chamber. By placing temperature-sensitive components in the low-temperature sealed chamber, and using a separate heat exchange device to dissipate heat from these components, the overheating problem of heat-sensitive components is solved, while significantly improving the lifespan and reliability of the power device.

[0004] A liquid-cooled integrated power conversion device is characterized in that it includes a power cavity, a low-temperature sealed cavity, and a heat dissipation cavity. The power cavity houses a power device and a second heat dissipation device. The low-temperature sealed cavity houses a heat-sensitive device and a third heat dissipation device. The heat dissipation cavity houses a first heat dissipation device. The second and third heat dissipation devices are respectively connected to the first heat dissipation device through pipes or extend into the interior of the heat dissipation cavity and cooperate with the third heat dissipation device.

[0005] In a preferred embodiment, the power cavity, the low-temperature sealed cavity, and the heat dissipation cavity are arranged sequentially from bottom to top.

[0006] In a preferred embodiment, the power device includes a power module and a power inductor. The second heat dissipation device includes a water-air heat exchanger and a second cooling fan. The water-air heat exchanger is positioned above the power inductor, and the second cooling fan is positioned above the water-air heat exchanger. The water-air heat exchanger has a hollow structure. The power inductor is fixedly positioned in the middle of the power cavity. Independent air ducts are formed between the power inductor, the water-air heat exchanger, and the second cooling fan on both sides and the inner wall of the power cavity. The power module and the power inductor are distributed within the independent air ducts. The power module contains an IGBT, a water-cooled plate, a power module inlet, and a power module outlet. The water-air heat exchanger has a water-air heat exchanger inlet and a water-air heat exchanger outlet. The water-air heat exchanger outlet and the power module outlet are connected to the first heat dissipation device via liquid cooling pipes. The water-air heat exchanger outlet and the power module inlet are also connected to the first heat dissipation device via liquid cooling pipes.

[0007] This invention employs a compartmentalized heat dissipation design. The power module dissipates heat through a water-cooled plate installed inside the module. The heat from the power transistors inside the power module is transferred through the water-cooled plate to the cooling medium inside the water-cooled plate, and then transferred to the heat dissipation cavity along the liquid cooling pipeline. The power inductor dissipates heat through a water-air heat exchanger installed above the power inductor. A second cooling fan is installed above the water-air heat exchanger to exhaust air from the heat exchanger. The power inductor, water-air heat exchanger, and cooling fan are arranged from bottom to top. The two sides and the hollow interior of the power inductor form an independent air cavity. Cool air enters the air gap of the power inductor from the bottom, carrying away the heat from the power inductor and transferring the heat to the water-air heat exchanger. Subsequently, the heat is transferred to the heat dissipation cavity by the cooling medium flowing inside the water-air heat exchanger.

[0008] In a preferred embodiment, the power cavity further houses a DC fuse, a DC circuit breaker, an AC circuit breaker, an auxiliary power transformer, a Hall effect sensor, and a busbar that forms a complete power circuit with the aforementioned devices. The DC fuse and the DC circuit breaker are located in an independent duct on one side of the power inductor, while the AC circuit breaker, the auxiliary power transformer, and the Hall effect sensor are located in an independent duct on the other side of the power inductor.

[0009] In a preferred embodiment, the heat-sensitive device includes a DC filter capacitor, a bus electrolytic capacitor, and a power board. The third heat dissipation device includes a thermosiphon heat exchanger and a third cooling fan. The bus electrolytic capacitor is located at the bottom center of the low-temperature sealed cavity, forming a circulating air duct between the bus electrolytic capacitor and the inner wall of the low-temperature sealed cavity. The thermosiphon heat exchanger includes an evaporator and a condenser. The evaporator and the third cooling fan are located on opposite sides of the bus electrolytic capacitor, and the third cooling fan draws air from the bus electrolytic capacitor for heat dissipation. The power board is located on the outlet side of the third cooling fan. The DC filter capacitor is located on the inlet side of the evaporator. The thermosiphon heat exchanger extends through the heat dissipation cavity into the interior of the heat dissipation cavity. The condenser is located inside the heat dissipation cavity and cooperates with the first heat dissipation device.

[0010] In a preferred embodiment, the first heat dissipation device includes a heat exchanger and a first heat dissipation fan. The heat exchanger adopts a V-shaped design, the condenser adopts an inclined design, and the air outlet of the thermosiphon heat exchanger is in close contact with the air inlet of the heat exchanger. The first heat dissipation fan is arranged at the top of the heat dissipation cavity and exhausts air from the bottom to the heat exchanger. The side of the heat dissipation cavity is provided with a heat dissipation cavity air inlet, which corresponds to the positions of the condenser and the heat exchanger. The top of the heat dissipation cavity is provided with a heat dissipation cavity air outlet.

[0011] In a preferred embodiment, the first heat dissipation device further includes a circulating water pump and an expansion tank, with the circulating water pump and the condenser located below the heat exchanger. The expansion tank is located above the heat exchanger. The circulating water pump has a circulating water pump inlet, a circulating water pump outlet, and a circulating water pump makeup inlet. The heat exchanger outlet and the circulating water pump inlet are connected via liquid-cooled piping, and the expansion tank and the circulating water pump makeup inlet are connected via liquid-cooled piping.

[0012] In a preferred embodiment, the outlet of the circulating water pump is connected to the inlet of the water-air heat exchanger and the inlet of the power module via liquid-cooled pipes, and the outlet of the water-air heat exchanger and the outlet of the power module are connected to the inlet of the heat exchanger via liquid-cooled pipes.

[0013] In a preferred embodiment, the bus electrolytic capacitor includes a capacitor cell, the evaporator of the thermosiphon heat exchanger is located at the air inlet of the capacitor cell of the bus electrolytic capacitor, and the third cooling fan is located at the air outlet of the capacitor cell of the bus electrolytic capacitor.

[0014] In a preferred embodiment, the thermosiphon heat exchanger is replaced by a heat pipe heat exchanger or a second water-air heat exchanger. The connection method between the second water-air heat exchanger and the first heat dissipation device is the same as the connection method between the water-air heat exchanger and the first heat dissipation device. The evaporation section of the heat pipe heat exchanger is located inside a low-temperature sealed cavity, and the condensation section is located inside a heat dissipation cavity.

[0015] The technical effects and advantages of this utility model are as follows:

[0016] Split-cavity heat dissipation design: By dividing the power conversion device into a power cavity, a low-temperature sealed cavity, and a heat dissipation cavity, targeted heat dissipation is achieved for devices with different heat generation and temperature sensitivity, thereby improving heat dissipation efficiency.

[0017] Protection of heat-sensitive devices: Heat-sensitive devices such as bus capacitors and filter capacitors are placed in a low-temperature sealed cavity and cooled by an independent heat dissipation system, which effectively reduces the operating temperature of these devices and extends the equipment life.

[0018] Shared heat dissipation duct: The heat dissipation devices of the power cavity and the low-temperature sealed cavity are both connected to the heat dissipation device of the heat dissipation cavity. Through the shared heat dissipation duct, the heat is centrally processed and discharged, which improves the heat dissipation performance and power density of the whole machine.

[0019] High-efficiency heat dissipation structure: The power module dissipates heat through a water-cooled plate, the power inductor dissipates heat through a water-air heat exchanger, and is combined with a cooling fan for exhaust cooling, forming a high-efficiency heat dissipation structure that ensures stable operation of the equipment under high power density.

[0020] Modular design: The entire equipment adopts a modular design, which facilitates maintenance and upgrades, while improving the reliability and maintainability of the equipment.

[0021] In summary, the liquid-cooled integrated power conversion device of this utility model effectively solves the heat dissipation problem of high-power equipment and improves the lifespan and reliability of the equipment through technical means such as cavity heat dissipation design, protection of heat-sensitive devices, shared heat dissipation air duct, high-efficiency heat dissipation structure and modular design. Attached Figure Description

[0022] Figure 1 A schematic diagram of the layout of a liquid-cooled integrated power conversion device provided by this utility model;

[0023] Figure 2 The isometric projection of the liquid-cooled integrated power conversion device provided by this utility model Figure 1 ;

[0024] Figure 3 The isometric projection of the liquid-cooled integrated power conversion device provided by this utility model Figure 2 ;

[0025] Figure 4 A schematic diagram of a partial liquid cooling pipeline connection provided by this utility model;

[0026] Figure 5 A schematic diagram of the power module of the liquid-cooled integrated power conversion device provided by this utility model;

[0027] Figure 6 A schematic diagram of the circulating water pump interface of the liquid-cooled integrated power conversion device provided by this utility model;

[0028] Figure 7 A schematic diagram of the air inlet of the heat dissipation cavity according to another embodiment of the present invention;

[0029] Figure 8 A schematic diagram of the internal layout of the low-temperature sealed cavity in Embodiment 3 of this utility model.

[0030] The attached figures are labeled as follows:

[0031] 1000-Power cavity; 2000-Low-temperature sealed cavity; 3000-Heat dissipation cavity; 1001-Power module; 1002-Power inductor; 1003-DC fuse; 1004-DC circuit breaker; 1005-Water-air heat exchanger; 1006-Second cooling fan; 1007-AC circuit breaker; 1008-Auxiliary power transformer; 1009-Hall effect sensor; 1010-Conducting busbar; 10011-IGBT; 10012-Water-cooled plate; 10013-Power module inlet; 10014-Power module outlet; 10015-Power module conducting busbar; 10016-Heat dissipation hole; 10051-Water-air heat exchanger inlet; 10052-Water-air heat exchanger outlet; 2001-Bus electrolytic capacitor; 2002-DC filter capacitor; 200 3-Third cooling fan; 2300-Thermosiphon heat exchanger; 2301-Evaporator; 2302-Condenser; 2004-Power board; 3001-Heat exchanger; 30011-Heat exchanger inlet; 30012-Heat exchanger outlet; 3004-First cooling fan; 3002-Circulating water pump; 30021-Circulating water pump outlet; 30022-Circulating water pump inlet; 30023-Circulating water pump makeup inlet; 3003-Expansion tank; Expansion tank bottom outlet 30031; 3005-Heat dissipation cavity air inlet; 3006-Heat dissipation cavity air outlet; 3007-Second heat dissipation cavity air inlet; 2500-Heat pipe heat exchanger; 2502-Condensation section; 2503-Evaporation section; 4001-First-stage inlet water pipe; 4002-First-stage return water pipe. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0033] refer to Figures 1-4 A liquid-cooled integrated power conversion device includes a power cavity 1000, a cryogenic sealed cavity 2000, and a heat dissipation cavity 3000. The power cavity houses power devices and a second heat dissipation device. The cryogenic sealed cavity 2000 houses heat-sensitive devices and a third heat dissipation device. The heat dissipation cavity 3000 houses a first heat dissipation device. The second and third heat dissipation devices are connected to the first heat dissipation device via pipes or extend into the heat dissipation cavity 3000 and cooperate with the third heat dissipation device. The power cavity 1000, the cryogenic sealed cavity 2000, and the heat dissipation cavity 3000 are arranged sequentially from bottom to top.

[0034] In high-power electrical equipment, components such as bus capacitors and filter capacitors in heat-sensitive devices are highly sensitive to temperature. Good heat dissipation design is beneficial to improving the long-term reliability of the equipment. Therefore, this utility model adopts a compartmentalized design for the equipment, placing the heat-sensitive devices in an independent low-temperature sealed cavity 2000, and setting up an independent heat dissipation system for this low-temperature sealed cavity 2000. Furthermore, the second heat dissipation device of the low-temperature sealed cavity 2000 is integrated into the third heat dissipation device in the heat dissipation cavity 3000 of the whole machine, thereby improving the power density of the whole machine and the reliability of the equipment.

[0035] The power device includes a power module 1001 and a power inductor 1002. The second heat dissipation device includes a water-air heat exchanger 1005 and a second cooling fan 1006. The water-air heat exchanger 1005 is located above the power inductor 1002, and the second cooling fan 1006 is located above the water-air heat exchanger 1005. The water-air heat exchanger 1005 has a hollow structure. The power inductor 1002 is fixedly located in the middle of the power cavity 1000. Independent air ducts are formed between the power inductor 1002, the water-air heat exchanger 1005, and the second cooling fan 1006 on both sides and the inner wall of the power cavity 1000. The power module 1001 and the power inductor 1002 are distributed... Within an independent air duct, the power module 1001 houses an IGBT 10011, a water-cooled plate 10012, a power module water inlet 10013, a power module water outlet 10014, a power module conductive busbar 10015, and heat dissipation holes 10016. The water-air heat exchanger 1005 has a water-air heat exchanger inlet 10051 and a water-air heat exchanger outlet 10052. The water-air heat exchanger outlet 10052 and the power module water outlet 10014 are connected to the first heat dissipation device via liquid cooling pipes. The water-air heat exchanger outlet 10052 and the power module water inlet 10013 are also connected to the first heat dissipation device via liquid cooling pipes. A second cooling fan 1006 draws air from the water-air heat exchanger 1005 for heat dissipation.

[0036] The power cavity 1000 also houses a DC fuse 1003, a DC circuit breaker 1004, an AC circuit breaker 1007, an auxiliary power transformer 1008, a Hall effect sensor 1009, and a busbar 1010 that forms a complete power circuit with the above devices. The DC fuse 1003 and the DC circuit breaker 1004 are located in an independent duct on one side of the power inductor 1002, while the AC circuit breaker 1007, the auxiliary power transformer 1008, and the Hall effect sensor 1009 are located in an independent duct on the other side of the power inductor 1002. The exhaust air from the second cooling fan 1006 cools the DC switch 1004, DC fuse 1003, AC circuit breaker 1007, auxiliary power transformer 1008, and busbar 1010 downwards along independent air ducts on both sides. Then, the air enters the power inductor 1002 through the air gap to cool it. After passing through the water-air heat exchanger 1005, the heat is transferred to the cooling medium flowing inside the heat exchanger, and then through cooling pipes to the heat dissipation cavity 3000. The power device 1001 and the switching device are connected via the busbar 1010.

[0037] refer to Figure 1 The heat-sensitive components include a DC filter capacitor 2002, a bus electrolytic capacitor 2001, and a power board 2004. The third heat dissipation device includes a thermosiphon heat exchanger 2300 and a third heat dissipation fan 2003. The bus electrolytic capacitor 2001 is located at the bottom center of the inner side of the low-temperature sealed cavity 2000, forming a circulating air duct between the bus electrolytic capacitor 2001 and the inner wall of the low-temperature sealed cavity 2000. The thermosiphon heat exchanger 2300 includes an evaporator 2301 and a condenser 2302. The evaporator 2301 and the third... Cooling fans 2003 are located on both sides of the bus electrolytic capacitor 2001, and the third cooling fan 2003 exhausts air to cool the bus electrolytic capacitor 2001. The power board 2004 is located on the side of the air outlet of the third cooling fan 2003. The DC filter capacitor 2002 is located on the side of the air inlet of the evaporator 2301. The thermosiphon heat exchanger 2300 extends through the heat dissipation cavity 3000 into the interior of the heat dissipation cavity 3000. The condenser 2302 is located inside the heat dissipation cavity 3000 and cooperates with the first heat dissipation device. The third cooling fan 2003 prioritizes cooling the bus electrolytic capacitor 2001. After the air from the third cooling fan 2003 passes the power board 2004, it returns to the air inlet of the evaporator 2301 along the upper part of the inner cavity of the low-temperature sealed cavity 2000 and cools the DC filter capacitor 2002. After the hot air enters the evaporator 2301, it transfers heat to the condenser 2302 of the thermosiphon heat exchanger 2300 along the thermosiphon heat exchanger 2300.

[0038] The first heat dissipation device includes a heat exchanger 3001 and a first heat dissipation fan 3004. The heat exchanger 3001 adopts a V-shaped design. The V-shaped layout can increase the heat exchange area of ​​the heat exchanger 3001 in a limited space. The condenser 2302 adopts an inclined design, and the air outlet surface of the thermosiphon heat exchanger 2300 is close to the air inlet surface of the heat exchanger 3001. The first heat dissipation fan is arranged at the top of the heat dissipation cavity 3000 and exhausts air from the bottom to the heat exchanger 3001. The heat dissipation cavity 3005 is provided on the side of the heat dissipation cavity 3000, and the heat dissipation cavity air inlet 3005 corresponds to the position of the condenser 2302 and the heat exchanger 3001. The heat dissipation cavity 3006 is provided at the top of the heat dissipation cavity 3000. After the external cold air enters the heat dissipation cavity 3000 through the air inlet 3005, it first cools the condenser 2302 of the thermosiphon heat exchanger 2300, then cools the heat exchanger 3001, and then the heat is discharged to the outside environment through the air outlet 3006 of the heat dissipation cavity by the first heat dissipation fan 3004.

[0039] refer to Figure 5 and Figure 6 The first heat dissipation device also includes a circulating water pump 3002 and an expansion tank 3003. The circulating water pump 3002 and the condenser 2302 are located on the lower side of the heat exchanger 3001. The expansion tank 3003 is located above the heat exchanger 3001. The circulating water pump 3002 is provided with a circulating water pump inlet 30022, a circulating water pump outlet 30021, and a circulating water pump makeup inlet 30023. The outlet of the heat exchanger 3001 and the circulating water pump inlet 30022 are connected by liquid cooling pipes. The expansion tank 3003 and the circulating water pump makeup inlet 30023 are connected by liquid cooling pipes. The outlet of the circulating water pump 30021 is connected to the inlet of the water-air heat exchanger 10051 and the inlet of the power module 10013 via liquid cooling pipes. The outlet of the water-air heat exchanger 10052 and the outlet of the power module 10014 are connected to the inlet of the heat exchanger 30011 of the heat exchanger 3001 via liquid cooling pipes.

[0040] The power equipment includes six power modules 1001, two power inductors 1002, and two circulating water pumps 3002. The V-type heat exchanger 3001 can be divided into left and right parts. Therefore, the entire power conversion equipment can provide cooling power for three power modules 1001 and one power inductor 1002 with one circulating water pump 3002. The expansion tank 3003 simultaneously replenishes water for both circulating water pumps 3002. For clarity, the diagram only shows the cooling circuit of one power inductor 1002 and one power module 1001. The circulating water pump outlet 30021 is connected to the primary water inlet pipe 4001. The primary water inlet pipe 4001 enters the power module inlet 10013 and the water-air heat exchanger inlet 10051 through secondary pipes. Cooling water return water enters the primary return water pipeline 4002 from the power module outlet 10014 and the water-air heat exchanger outlet 11052. The coolant first enters heat exchanger 3001 from its inlet 30011, where its heat is carried away by the cold air flowing through the heat exchanger before being discharged into the atmosphere. The coolant then flows out from the heat exchanger outlet 30012 and enters the circulating water pump inlet 30022. After being pressurized in the circulating water pump 3002, it flows back through the primary return water pipeline 4001, thus forming a complete circulating water circuit. The expansion tank bottom outlet 30031 and the circulating water pump replenishment inlet 30023 are connected via liquid cooling pipelines, allowing for liquid addition to the system before operation and ensuring stable water pressure throughout the system.

[0041] The bus electrolytic capacitor 2001 includes a capacitor cell, the evaporator 2301 of the thermosiphon heat exchanger 2300 is located at the air inlet of the capacitor cell of the bus electrolytic capacitor 2001, and the third cooling fan 2003 is located at the air outlet of the capacitor cell of the bus electrolytic capacitor 2001. Example

[0042] refer to Figure 7 This embodiment is based on Embodiment 1. The heat dissipation cavity is provided with air inlets along both the x and z directions. The air inlet 3005 in the x direction is rectangular. The air inlet 3007 in the z direction is triangular and located directly below the heat exchanger 3001. This arrangement can reduce the wind resistance of the entire heat dissipation cavity 3000 and increase the air intake. Example

[0043] like Figure 8 As shown, the thermosiphon heat exchanger 2300 is replaced by a heat pipe heat exchanger 2500. The evaporation section 2503 of the heat pipe heat exchanger is located inside the low-temperature sealed cavity 2000, and the condensation section 2502 is located inside the heat dissipation cavity 3000. The heat pipe of the heat exchanger 3001 can be bent to achieve the same shape as the condensation section 2502, which can effectively increase the heat dissipation area of ​​the condensation section 2502.

[0044] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A liquid-cooled integrated power conversion apparatus, comprising: The internal part comprises a power cavity (1000), a low-temperature sealed cavity (2000) and a heat dissipation cavity (3000), the power cavity internally accommodates a power device and a second heat dissipation device, the low-temperature sealed cavity (2000) internally accommodates a heat-sensitive device and a third heat dissipation device, the heat dissipation cavity (3000) internally accommodates a first heat dissipation device, and the second heat dissipation device and the third heat dissipation device are respectively communicated with the first heat dissipation device through a pipeline or extended into the internal part of the heat dissipation cavity (3000) and cooperated with the third heat dissipation device.

2. The liquid-cooled integrated power conversion device of claim 1, wherein: The power cavity (1000), the low-temperature sealed cavity (2000) and the heat dissipation cavity (3000) are sequentially arranged from bottom to top.

3. The liquid-cooled integrated power conversion device of claim 2, wherein: The power device comprises a power module (1001) and a power inductor (1002), the second heat dissipation device comprises a water-air heat exchanger (1005) and a second heat dissipation fan (1006), the water-air heat exchanger (1005) is arranged on the upper side of the power inductor (1002), the second heat dissipation fan (1006) is arranged on the upper side of the water-air heat exchanger (1005), the water-air heat exchanger (1005) is a hollow structure, the power inductor (1002) is fixedly arranged in the middle part of the power cavity (1000), the power inductor (1002), the water-air heat exchanger (1005) and the second heat dissipation fan (1006) form independent air ducts between the two sides and the inner wall of the power cavity (1000), the power module (1001) and the power inductor (1002) are distributed in the independent air ducts, the power module (1001) internally comprises an IGBT (10011), a water cooling plate (10012), a power module water inlet (10013) and a power module water outlet (10014), the water-air heat exchanger (1005) is provided with a water-air heat exchanger water inlet (10051) and a water-air heat exchanger water outlet (10052), the water-air heat exchanger water outlet (10052) and the power module water outlet (10014) are connected with the first heat dissipation device through a liquid cooling pipeline, and the water-air heat exchanger water outlet (10052) and the power module water inlet (10013) are also connected with the first heat dissipation device through the liquid cooling pipeline.

4. The liquid-cooled integrated power conversion device of claim 3, wherein: The internal part of the power cavity (1000) further accommodates a direct-current fuse (1003), a direct-current circuit breaker (1004), an alternating-current circuit breaker (1007), an auxiliary source transformer (1008), a Hall (1009) and a conductive row (1010) for forming a complete power loop, the direct-current fuse (1003) and the direct-current circuit breaker (1004) are located in the independent air duct on one side of the power inductor (1002), and the alternating-current circuit breaker (1007), the auxiliary source transformer (1008) and the Hall (1009) are located in the independent air duct on the other side of the power inductor (1002).

5. The liquid-cooled integrated power conversion device of claim 3, wherein: The heat-sensitive device includes a direct-current filter capacitor (2002), a bus electrolytic capacitor (2001), and a power board (2004), the third heat dissipation device includes a thermosyphon heat exchanger (2300) and a third heat dissipation fan (2003), the bus electrolytic capacitor (2001) is arranged at the middle position of the bottom of the inside of the low-temperature sealed cavity (2000), a circulating air duct is formed between the bus electrolytic capacitor (2001) and the inner wall of the low-temperature sealed cavity (2000), the thermosyphon heat exchanger (2300) includes an evaporator (2301) and a condenser (2302), the evaporator (2301) and the third heat dissipation fan (2003) are respectively located on the two sides of the bus electrolytic capacitor (2001), and the third heat dissipation fan (2003) performs air extraction and heat dissipation on the bus electrolytic capacitor (2001), the power board (2004) is located on the air outlet side of the third heat dissipation fan (2003), the direct-current filter capacitor (2002) is located on the air inlet side of the evaporator (2301), the thermosyphon heat exchanger (2300) extends to the inside of the heat dissipation cavity (3000) through the heat dissipation cavity (3000), and the condenser (2302) is located in the inside of the heat dissipation cavity (3000) and cooperates with the first heat dissipation device.

6. The liquid-cooled integrated power conversion device of claim 5, wherein: The first heat dissipation device includes a heat exchanger (3001) and a first heat dissipation fan (3004), the heat exchanger (3001) adopts a V-shaped design, the condenser (2302) adopts an inclined design, the air outlet surface of the thermosyphon heat exchanger (2300) is close to the air inlet surface of the heat exchanger (3001), the first heat dissipation fan is arranged at the top of the heat dissipation cavity (3000) and extracts air from the heat exchanger (3001) at the lower part, the heat dissipation cavity (3000) is provided with a heat dissipation cavity air inlet (3005) on the side, the heat dissipation cavity air inlet (3005) corresponds to the positions of the condenser (2302) and the heat exchanger (3001), and the heat dissipation cavity (3000) is provided with a heat dissipation cavity air outlet (3006) on the top.

7. The liquid-cooled integrated power conversion device of claim 6, wherein: The first heat dissipation device further includes a circulating water pump (3002) and an expansion water tank (3003), the circulating water pump (3002) and the condenser (2302) are respectively located below the sides of the heat exchanger (3001), and the expansion water tank (3003) is located above the heat exchanger (3001), the circulating water pump (3002) is provided with a circulating water pump water inlet (30022), a circulating water pump water outlet (30021) and a circulating water pump water supplement opening (30023), the heat exchanger water outlet (30012) of the heat exchanger (3001) and the circulating water pump water inlet (30022) are connected through a liquid cooling pipeline, and the expansion water tank (3003) and the circulating water pump water supplement opening (30023) are connected through a liquid cooling pipeline.

8. The liquid-cooled integrated power conversion device of claim 7, wherein: The water outlet (30021) of the circulating water pump is connected with the water inlet (10051) of the water-air heat exchanger and the water inlet (10013) of the power module through liquid cooling pipelines, and the water outlet (10052) of the water-air heat exchanger and the water outlet (10014) of the power module are connected to the water inlet (30011) of the heat exchanger (3001) through liquid cooling pipelines.

9. The liquid-cooled integrated power conversion device of claim 5, wherein: The bus electrolytic capacitor (2001) comprises a capacitor cell, the evaporator (2301) of the thermosyphon heat exchanger (2300) is located at the air inlet of the capacitor cell of the bus electrolytic capacitor (2001), and the third cooling fan (2003) is located at the air outlet of the capacitor cell of the bus electrolytic capacitor (2001).

10. The liquid-cooled integrated power conversion device of claim 5, wherein: The thermosyphon heat exchanger (2300) is replaced by a heat pipe heat exchanger (2500) or a second water-air heat exchanger, the connection mode of the second water-air heat exchanger and the first heat dissipation device is the same as that of the water-air heat exchanger (1005) and the first heat dissipation device, the evaporation section (2503) of the heat pipe heat exchanger is located inside the low-temperature sealed cavity (2000), and the condensation section (2502) is located inside the heat dissipation cavity (3000).

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