Efficient LED module surface mounting equipment

Abstract

The utility model relates to the technical field of LED surface mounting, in particular to efficient LED module surface mounting equipment, which comprises a workbench, a control row key is mounted on the surface of the workbench, a supporting seat is fixed on one side of the workbench, an automatic feeding surface mounting mechanism is arranged on the surface of the workbench, and the automatic feeding surface mounting mechanism is fixed on one side of the workbench. A conveying part, an electric push rod, a linear module and an adsorption chip mounting part are arranged in the automatic feeding chip mounting mechanism, a double-station mechanism is arranged on the surface of the workbench, a rotating assembly and an annular groove are arranged in the double-station mechanism, an adsorption fixing mechanism is arranged above the workbench, and the adsorption fixing mechanism is arranged above the workbench. The adsorption fixing mechanism is composed of a negative pressure cavity, a positioning jig, an adsorption hole and a vacuum pump. According to the utility model, not only is the working efficiency of the chip mounting equipment in use improved, the automation degree is high, the labor intensity of workers in use of the chip mounting equipment reduced, but also the convenience degree of fixing the circuit board by the chip mounting equipment is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED chip mounting technology, specifically to a high-efficiency LED module chip mounting equipment. Background Technology

[0002] An LED module is a product made by arranging a certain number of light-emitting diodes (LEDs) in a regular manner, encapsulating them, and adding some waterproofing treatment. During the production and processing of LED modules, a special surface mount device is needed to attach the LEDs to the outside of the module's circuit board.

[0003] When using a surface mount technology (SMT) device, it is generally necessary to remove one set of LED modules after mounting them before placing the next set of LED modules. This process is relatively slow, which affects the efficiency of the SMT device. Before the SMT device starts working, the LEDs to be mounted usually need to be manually placed on one side of the device, and then the mounting mechanism will pick up the LEDs and attach them to the surface of the circuit board. Manual loading is laborious, has a low degree of automation, and can easily lead to high labor intensity for the workers. When using the SMT device, the circuit board is usually clamped by a clamping component, which is cumbersome and reduces the convenience of fixing the circuit board with the SMT device. Utility Model Content

[0004] The purpose of this utility model is to provide a high-efficiency LED module mounting equipment to solve the problems mentioned in the background art, such as low working efficiency, low degree of automation, high labor intensity of workers, and low convenience when fixing circuit boards.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency LED module placement equipment, including a workbench, a control keypad mounted on the surface of the workbench, a support base fixed on one side of the workbench, an automatic feeding and placement mechanism on the surface of the workbench, the automatic feeding and placement mechanism including a conveying section, an electric push rod, a linear module and an adsorption and placement section, a dual-station mechanism on the surface of the workbench, a rotating component and an annular groove inside the dual-station mechanism, and an adsorption and fixing mechanism above the workbench, the adsorption and fixing mechanism consisting of a negative pressure chamber, a positioning fixture, an adsorption hole and a vacuum pump.

[0006] Preferably, the surface of the workbench is provided with a conveying section, the control key controls the conveying section to convey the light-emitting diodes, and an adsorption and patching section is provided above the conveying section, the control key controls the adsorption and patching section to adsorb, pick up and place the light-emitting diodes and patch them.

[0007] Preferably, a linear module is mounted on the surface of the support base, and an electric push rod is mounted on the surface of the linear module. The control key controls the linear module to drive the electric push rod to move left and right. The input end of the electric push rod is electrically connected to the output end of the control key, and one end of the electric push rod is fixedly connected to the surface of the adsorption patch.

[0008] Preferably, the surface of the worktable is provided with an annular groove, and a rotating component is provided above the worktable.

[0009] Preferably, the rotating assembly includes a rotating column, a drive motor, a rotating plate, a driving gear, and a driven gear. The drive motor is installed at the bottom of the worktable. The input end of the drive motor is electrically connected to the output end of the control key. The output end of the drive motor is fixed to a rotating shaft via a coupling. One end of the rotating shaft is fixed to a driving gear.

[0010] Preferably, a rotating column is rotatably connected at the bottom of the workbench, and a driven gear is fixed on the surface of the rotating column, the driven gear meshing with the driving gear.

[0011] Preferably, a rotating plate is provided above the workbench, the rotating plate and the annular groove rotate in mutual engagement, and the center of the rotating plate is fixedly connected to one end of the rotating column.

[0012] Preferably, the positioning fixture is fixed to both sides of the rotating plate by screws, and the positioning fixture has equally spaced adsorption holes inside, which are opened on the surface of the rotating plate.

[0013] Preferably, the negative pressure cavity is located inside the rotating plate and is connected to the adsorption holes.

[0014] Preferably, the vacuum pumps are respectively installed on the surface of the rotating plate, the input end of the vacuum pump is electrically connected to the output end of the control key, and one end of the vacuum pump is connected to the negative pressure chamber through a pipe.

[0015] Compared with the prior art, the beneficial effects of this utility model are: this high-efficiency LED module placement equipment not only improves the working efficiency of the placement equipment, has a high degree of automation, and reduces the labor intensity of the workers when using the placement equipment, but also improves the convenience of fixing the circuit board.

[0016] 1. By setting up a dual-station mechanism, the drive motor is controlled by a keyway. Under the action of the drive motor, the drive gear rotates. The meshing action of the drive gear and the driven gear drives the driven gear to rotate, which in turn drives the rotating column to rotate, which in turn drives the rotating plate to rotate. This causes the circuit board on the surface of the adsorption and fixing mechanism to rotate to the support base. While the automatic feeding and mounting mechanism is mounting the circuit board, the operator can place the next set of circuit boards to be mounted on the surface of another adsorption and fixing mechanism, saving the time of placing the circuit boards. This realizes the dual-station mounting function of the mounting equipment, thereby improving the working efficiency of the mounting equipment.

[0017] 2. By setting up an automatic feeding and placement mechanism, the LED to be placed is placed on the surface of the conveyor section. The conveyor section is transported to the area below the adsorption and placement section by the control key. Then, the adsorption and placement section picks up the LED. The control key then controls the electric push rod and the linear module to work. Under the action of the linear module, the electric push rod is moved above the circuit board, causing the LED on the surface of the adsorption and placement section to be positioned above the circuit board. Then, the electric push rod drives the adsorption and placement section to move downward, positioning and bonding the LED with the circuit board. This realizes the automatic feeding and placement function of the placement equipment, which has a high degree of automation and reduces the labor intensity of the workers when using the placement equipment.

[0018] 3. By setting up an adsorption and fixing mechanism, a positioning fixture that matches the circuit board is fixed to the surface of the rotating plate with screws. Then, the circuit board is placed inside the positioning fixture, so that the circuit board blocks the adsorption hole. Then, the vacuum pump is controlled by the control key to work, so that the vacuum pump evacuates the negative pressure chamber and adsorbs and fixes the circuit board, thereby realizing the function of easy fixing of circuit boards by the chip mounting equipment, thus improving the convenience of fixing circuit boards by the chip mounting equipment. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a schematic diagram of the front cross-sectional structure of this utility model;

[0021] Figure 3 This is a partially enlarged structural schematic diagram of the present invention;

[0022] Figure 4 This is an enlarged structural schematic diagram of the adsorption and fixation mechanism of this utility model.

[0023] In the diagram: 1. Workbench; 11. Control key; 12. Support base; 2. Automatic feeding and placement mechanism; 21. Conveying section; 22. Electric push rod; 23. Linear module; 24. Adsorption and placement section; 3. Dual-station mechanism; 31. Rotating assembly; 311. Rotating column; 312. Drive motor; 313. Rotating plate; 314. Driving gear; 315. Driven gear; 32. Annular groove; 4. Adsorption and fixing mechanism; 41. Negative pressure chamber; 42. Positioning fixture; 43. Adsorption hole; 44. Vacuum pump. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. In addition, the terms "first", "second", "third", "upper", "lower", "left", "right", etc. are used for descriptive purposes only and should not be construed as indicating or implying relative importance. At the same time, in the description of the present utility model, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0025] The structure of the high-efficiency LED module surface mount equipment provided by this utility model is as follows: Figure 1 and Figure 2 As shown, the device includes a workbench 1, on the surface of which a control keypad 11 is mounted. The control keypad 11 can be of the LA series. A support base 12 is fixed to one side of the workbench 1. An automatic feeding and placement mechanism 2 is installed on the surface of the workbench 1. The automatic feeding and placement mechanism 2 includes a conveying section 21, an electric push rod 22, a linear module 23, and an adsorption and placement section 24. The conveying section 21 is located on the surface of the workbench 1, and the control keypad 11 controls the conveying section 21 to transport the light-emitting diodes. A [missing information - likely a device or structure] is positioned above the conveying section 21. The device includes an adsorption and patching section 24. A control key 11 controls the adsorption and patching section 24 to adsorb, pick up, and place LEDs. A linear module 23 is mounted on the surface of the support base 12. An electric push rod 22 is mounted on the surface of the linear module 23. The electric push rod 22 can be a TA series model. The control key 11 controls the linear module 23 to drive the electric push rod 22 to move left and right. The input end of the electric push rod 22 is electrically connected to the output end of the control key 11. One end of the electric push rod 22 is fixedly connected to the surface of the adsorption and patching section 24.

[0026] In use, the LED to be mounted is placed on the surface of the conveying section 21. The conveying section 21 is then transported to the area below the adsorption mounting section 24 via the control key 11. The adsorption mounting section 24 then picks up the LED. The control key 11 then controls the operation of the electric push rod 22 and the linear module 23. Under the action of the linear module 23, the electric push rod 22 is moved above the circuit board, causing the LED on the surface of the adsorption mounting section 24 to be positioned above the circuit board. The electric push rod 22 then moves the adsorption mounting section 24 downward to position and mount the LED onto the circuit board, thus realizing the automatic feeding and mounting function of the mounting equipment.

[0027] Furthermore, such as Figure 3 As shown, a dual-station mechanism 3 is provided on the surface of the worktable 1. The internal components of the dual-station mechanism 3 include a rotating assembly 31 and an annular groove 32. The annular groove 32 is formed on the surface of the worktable 1. The rotating assembly 31 is located above the worktable 1. The rotating assembly 31 includes a rotating column 311, a drive motor 312, a rotating plate 313, a driving gear 314, and a driven gear 315. The drive motor 312 is mounted at the bottom of the worktable 1. The drive motor 312 can be a JO series model. The input end of the drive motor 312... Electrically connected to the output of the control key 11, the output of the drive motor 312 is fixed to a rotating shaft via a coupling. One end of the rotating shaft is fixed to a drive gear 314. A rotating column 311 is rotatably connected to the bottom of the worktable 1. A driven gear 315 is fixed to the surface of the rotating column 311. The driven gear 315 meshes with the drive gear 314. A rotating plate 313 is provided above the worktable 1. The rotating plate 313 and the annular groove 32 rotate with each other. The center of the rotating plate 313 is fixedly connected to one end of the rotating column 311.

[0028] In use, the drive motor 312 is controlled by the control key 11. Under the action of the drive motor 312, the drive gear 314 is rotated. The meshing action of the drive gear 314 and the driven gear 315 drives the driven gear 315 to rotate, which in turn drives the rotating column 311 to rotate, which in turn drives the rotating plate 313 to rotate. This causes the circuit board on the surface of the adsorption and fixing mechanism 4 to rotate to the bottom of the support base 12. While the automatic feeding and mounting mechanism 2 is mounting the circuit board, the operator can place the next set of circuit boards to be mounted on the surface of another adsorption and fixing mechanism 4, saving the time of placing the circuit board and realizing the dual-station mounting function of the mounting equipment.

[0029] Furthermore, such as Figure 4As shown, an adsorption fixing mechanism 4 is provided above the workbench 1. The adsorption fixing mechanism 4 consists of a negative pressure chamber 41, a positioning fixture 42, adsorption holes 43, and a vacuum pump 44. The positioning fixture 42 is fixed to both sides of the rotating plate 313 by screws. The positioning fixture 42 is provided with equally spaced adsorption holes 43 inside. The adsorption holes 43 are opened on the surface of the rotating plate 313. The negative pressure chamber 41 is opened inside the rotating plate 313 and is connected to the adsorption holes 43. The vacuum pump 44 is installed on the surface of the rotating plate 313. The model of the vacuum pump 44 can be RS series. The input end of the vacuum pump 44 is electrically connected to the output end of the control key 11. One end of the vacuum pump 44 is connected to the negative pressure chamber 41 through a pipe.

[0030] In use, the positioning fixture 42 that matches the circuit board is fixed to the surface of the rotating plate 313 with screws. Then, the circuit board is placed inside the positioning fixture 42 so that the circuit board blocks the adsorption hole 43. Then, the vacuum pump 44 is controlled by the control key 11 to work, so that the vacuum pump 44 evacuates the negative pressure chamber 41 to adsorb and fix the circuit board, so as to realize the function of the chip mounting equipment to easily fix the circuit board.

[0031] Working principle: In use, firstly, the positioning fixture 42 that matches the circuit board is fixed to the surface of the rotating plate 313 with screws. Then, the circuit board is placed inside the positioning fixture 42, so that the circuit board blocks the adsorption hole 43. Then, the vacuum pump 44 is controlled by the control key 11 to work, so that the vacuum pump 44 evacuates the negative pressure chamber 41 to adsorb and fix the circuit board, so as to realize the function of the chip mounting equipment to easily fix the circuit board, thereby improving the convenience of fixing the circuit board in the chip mounting equipment.

[0032] The LED to be mounted is placed on the surface of the conveying section 21. The conveying section 21 is then transported to the area below the adsorption mounting section 24 via the control key 11. The adsorption mounting section 24 then picks up the LED. The control key 11 then controls the operation of the electric push rod 22 and the linear module 23. Under the action of the linear module 23, the electric push rod 22 is moved above the circuit board, causing the LED on the surface of the adsorption mounting section 24 to be positioned above the circuit board. The electric push rod 22 then moves the adsorption mounting section 24 downward to position and mount the LED onto the circuit board, thus realizing the automatic feeding and mounting function of the mounting equipment. This has a high degree of automation and reduces the labor intensity of the operators when using the mounting equipment.

[0033] In use, the drive motor 312 is controlled by the control key 11. Under the action of the drive motor 312, the drive gear 314 is rotated. The meshing action of the drive gear 314 and the driven gear 315 drives the driven gear 315 to rotate, which in turn drives the rotating column 311 to rotate, which in turn drives the rotating plate 313 to rotate. This causes the circuit board on the surface of the adsorption and fixing mechanism 4 to rotate to the bottom of the support base 12. While the automatic feeding and mounting mechanism 2 is mounting the circuit board, the operator can place the next set of circuit boards to be mounted on the surface of another adsorption and fixing mechanism 4, saving the time of placing the circuit board. This realizes the dual-station mounting function of the mounting equipment, thereby improving the working efficiency of the mounting equipment and finally completing the use of the mounting equipment.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high-efficiency LED module patching device, comprising a workbench (1), characterized in that: The surface of the workbench (1) is provided with a control key (11), one side of the workbench (1) is fixedly provided with a support seat (12), and the surface of the workbench (1) is provided with an automatic feeding and patching mechanism (2). The inside of the automatic feeding and patching mechanism (2) comprises a conveying part (21), an electric push rod (22), a linear module (23) and an adsorption patching part (24). The surface of the workbench (1) is provided with a double-station mechanism (3), and the inside of the double-station mechanism (3) is provided with a rotating assembly (31) and an annular groove (32). The upper side of the workbench (1) is provided with an adsorption fixing mechanism (4), and the adsorption fixing mechanism (4) is composed of a negative pressure cavity (41), a positioning jig (42), an adsorption hole (43) and a vacuum pump (44).

2. The efficient LED module patching device of claim 1, wherein: The surface of the workbench (1) is provided with a conveying part (21), and the control key (11) controls the conveying part (21) to convey the light emitting diode. The upper side of the conveying part (21) is provided with an adsorption patching part (24), and the control key (11) controls the adsorption patching part (24) to adsorb, take and place the material and patch the light emitting diode.

3. The efficient LED module patching device of claim 2, wherein: The surface of the support seat (12) is provided with a linear module (23), and the surface of the linear module (23) is provided with an electric push rod (22). The control key (11) controls the linear module (23) to drive the electric push rod (22) to move left and right. The input end of the electric push rod (22) is electrically connected with the output end of the control key (11). One end of the electric push rod (22) is fixedly connected with the surface of the adsorption patching part (24).

4. The efficient LED module patching device of claim 1, wherein: The surface of the workbench (1) is provided with an annular groove (32), and the upper side of the workbench (1) is provided with a rotating assembly (31).

5. The efficient LED module patching device of claim 4, wherein: The inside of the rotating assembly (31) comprises a rotating column (311), a driving motor (312), a rotating plate (313), a driving gear (314) and a driven gear (315). The bottom of the workbench (1) is provided with a driving motor (312). The input end of the driving motor (312) is electrically connected with the output end of the control key (11). The output end of the driving motor (312) is fixedly connected with a rotating shaft through a shaft coupling. One end of the rotating shaft is fixedly connected with the driving gear (314).

6. The efficient LED module patching device of claim 5, wherein: The inside of the workbench (1) is rotatably connected with a rotating column (311) at the bottom position. The surface of the rotating column (311) is fixedly connected with a driven gear (315). The driven gear (315) is meshed with the driving gear (314).

7. The efficient LED module patching device of claim 6, wherein: The upper side of the workbench (1) is provided with a rotating plate (313). The rotating plate (313) is rotatably matched with the annular groove (32). The center position of the rotating plate (313) is fixedly connected with one end of the rotating column (311).

8. The efficient LED module patching device of claim 1, wherein: The positioning jig (42) is fixedly connected with the rotating plate (313) through screws. The inside of the positioning jig (42) is provided with adsorption holes (43) at equal intervals. The adsorption holes (43) are arranged on the surface of the rotating plate (313).

9. The efficient LED module patching device of claim 8, wherein: The negative pressure cavity (41) is arranged in the inside of the rotating plate (313), and is communicated with the adsorption hole (43).

10. The efficient LED module patching device of claim 9, wherein: The vacuum pump (44) is arranged on the surface of the rotating plate (313), and the input end of the vacuum pump (44) is electrically connected with the output end of the control row key (11), and one end of the vacuum pump (44) is communicated with the negative pressure cavity (41) through a pipeline.

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