LED packaging device

Abstract

The utility model discloses an LED packaging device which comprises a support, a chip, a first packaging adhesive layer, a second packaging adhesive layer and a light blocking layer, the upper end of the support is provided with a groove, the chip is located in the groove, the upper end of the chip protrudes above the groove, the first packaging adhesive layer covers the chip, and the bottom of the first packaging adhesive layer can fill a gap between the chip and the groove. The outer surface of the first packaging adhesive layer is an arc-shaped convex surface, and KSF fluorescent powder is contained in the first packaging adhesive layer; the bottom surface of the second packaging adhesive layer is tightly connected with the outer surface of the first packaging adhesive layer and the upper surface of the bracket, and the top surface of the second packaging adhesive layer is horizontally arranged; the light blocking layer is cylindrical and covers the second packaging adhesive layer. The light emitting angles of the LED device in all directions are consistent, the adhesive layer is not easy to be stripped from the bracket, and the KSF powder is not easy to be in contact with moisture in the air to cause blackening.

Description

Technical Field

[0001] This utility model belongs to the field of LED packaging technology, and specifically relates to an LED packaging device. Background Technology

[0002] Currently, most four-sided LEDs adopt a multi-layer glue encapsulation structure. However, common four-sided LED products with multi-layer glue encapsulation structures usually face the following problems:

[0003] (1) The adhesive layer is easily peeled off from the scaffold;

[0004] (2) KSF powder used in fluorescent powders is prone to blackening when it comes into contact with moisture in the air;

[0005] (3) The light angle is inconsistent.

[0006] Therefore, a new technology is needed to solve the problems of easy peeling of the adhesive layer, easy blackening of KSF powder, and inconsistent light emission angle in existing LED devices. Utility Model Content

[0007] To address the aforementioned problems in the prior art, this utility model provides an LED packaging device with a cylindrical adhesive layer, which enables the LED device to emit light at the same angle on all four sides. The adhesive layer is also less prone to peeling off from the support, and the KSF powder is less likely to come into contact with moisture in the air, thus preventing it from turning black.

[0008] The present invention adopts the following technical solution:

[0009] An LED packaging device includes a bracket, a chip, a first encapsulating adhesive layer, a second encapsulating adhesive layer, and a light blocking layer. The bracket has a groove at its upper end, the chip is located in the groove and its upper end protrudes from the groove, the first encapsulating adhesive layer covers the outside of the chip and can fill the gap between the chip and the groove, the outer surface of the first encapsulating adhesive layer is spherical, and the first encapsulating adhesive layer contains KSF phosphor.

[0010] The second encapsulating adhesive layer has a cylindrical side surface, and its bottom surface is tightly connected to the outer surface of the first encapsulating adhesive layer and the upper surface of the bracket. Its top surface is horizontal.

[0011] The light-blocking layer is cylindrical and covers the second encapsulating adhesive layer.

[0012] As a further improvement to the technical solution of this utility model, the bracket includes an etched sheet and a molding body. The etched sheet includes a base, and a first boss is provided on the center of the base. An insulating groove is provided on the first boss and the groove opening is located on its upper end face.

[0013] The encapsulation body includes a filling portion, wherein the filling portion does not fill the insulating groove and its upper surface is flush with the first boss;

[0014] The encapsulation body also includes a main body portion, which covers the base and surrounds the outside of the first boss, with the upper end face of the main body portion being flush with the upper end face of the first boss.

[0015] The molding compound also includes a positioning protrusion, which is located above the main body and has an annular horizontal cross-section. The inner side of the positioning protrusion forms the inner wall of the groove.

[0016] The upper end face of the first boss is used to form part of the bottom of the groove.

[0017] As a further improvement to the technical solution of this utility model, the main body is provided with an annular groove with the opening facing upward. The annular groove surrounds the outside of the positioning protrusion in the horizontal direction, and the bottom part of the second encapsulating adhesive layer is filled in the annular groove.

[0018] As a further improvement to the technical solution of this utility model, the etching sheet includes a first metal plate and a second metal plate spaced apart, the gap between the first metal plate and the second metal plate forms an insulating groove, and the filling part fills the space between the first metal plate and the second metal plate.

[0019] The first metal plate includes a first plate and a second plate connected to each other in an L-shape. The second metal plate includes a third plate and a fourth plate connected to each other. The first plate and the third plate are both vertically arranged and together form the first boss. The upper surface of each plate forms part of the bottom of the groove. The insulating groove is located between the first plate and the third plate. The second plate and the fourth plate form the base and are both horizontally arranged.

[0020] The main body covers the upper surfaces of the second plate and the fourth plate.

[0021] As a further improvement to the technical solution of this utility model, the connection structure between the positioning protrusion and the main body is stepped on the side near the first protrusion, and the upper end face of the main body forms a stepped surface and is used to form part of the bottom of the groove.

[0022] The vertically arranged outer side of the positioning protrusion is connected to the inner wall of the annular groove.

[0023] As a further improvement to the technical solution of this utility model, the annular groove has a first sidewall and a second sidewall that are opposite to each other. The first sidewall and the second sidewall are both inclined and inclined from bottom to top in a direction away from each other. The first sidewall is connected to the outer sidewall that is vertically arranged on the positioning protrusion.

[0024] As a further improvement of the technical solution of the present utility model, two metal pads are further provided in the groove, which are respectively arranged at intervals with the chip. The two metal pads are respectively located on opposite sides of the chip and are connected to the chip through metal connection lines.

[0025] As a further improvement of the technical solution of the present utility model, the bottom of the annular groove is in a square frame shape.

[0026] As a further improvement of the technical solution of the present utility model, the diameter of the side surface of the light blocking layer is the same as that of the side surface of the second encapsulation glue layer and they are coaxially arranged.

[0027] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0028] For the LED encapsulation device of the present solution, the overall external shape of the glue layer formed by the first encapsulation glue layer and the second encapsulation glue layer is cylindrical, and the light emission angles in all directions of the LED device can be made consistent. At the same time, since the upper end of the chip protrudes from the groove, the overall height of the bracket is lower than the height of the chip, thereby reducing the blockage of the side light of the chip. Moreover, the second encapsulation glue layer covers the outside of the first encapsulation glue layer, and the first encapsulation glue layer is wrapped between the bracket and the second encapsulation glue layer. The KSF powder located in the first encapsulation glue layer is not easily contacted with the moisture in the air and turned black, effectively preventing the KSF powder from turning black. In addition, the inner wall of the groove on the bracket is tightly connected to the first encapsulation glue layer, and the part of the upper surface of the bracket outside the inner wall of the groove, that is, the bottom of the groove, is tightly connected to the second encapsulation glue layer. The setting of the groove can improve the bonding force between the bracket and the first encapsulation glue layer and the second encapsulation glue layer, making the glue layer not easily peeled off from the bracket. Description of the Drawings

[0029] The following further details the technology of the present utility model in conjunction with the drawings and specific embodiments:

[0030] Figure 1 is the overall structural sectional view of the present utility model;

[0031] Figure 2 is the partial sectional view when the present utility model is viewed from above;

[0032] Figure 3 is the overall structural top view of the present utility model.

[0033] Reference Signs:

[0034] 1 - light blocking layer;

[0035] 2 - second encapsulation glue layer;

[0036] 3 - first encapsulation glue layer;

[0037] 4-Chip;

[0038] 5-Support; 51-Etched plate; 511-First metal plate; 5111-First plate; 5112-Second plate; 512-Second metal plate; 5121-Third plate; 5122-Fourth plate; 52-Encapsulation body; 521-Filling portion; 522-Main body; 523-Positioning protrusion; 524-Annular groove; 5241-First sidewall; 5242-Second sidewall; 5243-Annular groove bottom; 53-Insulating groove; 54-Groove;

[0039] 6-Metal pads;

[0040] 7-Metallic connecting wire. Detailed Implementation

[0041] The following will provide a clear and complete description of the concept, specific structure, and technical effects of this utility model in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of this utility model. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The same reference numerals used throughout the drawings indicate the same or similar parts.

[0042] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," and "right" used in this utility model are only relative to the relative positional relationships of the various components of this utility model in the accompanying drawings.

[0043] Reference Figures 1 to 3 An LED packaging device includes a bracket 5, a chip 4, a first encapsulating layer 3, a second encapsulating layer 2, and a light-blocking layer 1. The chip 4 is an LED chip 4, which can be a square-mounted chip 4 or a vertical chip 4. The LED chip 4 is mounted on the top of the bracket 5 and connected to the bonding pads on the bracket 5 via metal wires. The upper end of the bracket 5 has a groove 54, the size of which is smaller than the size of the bottom of the bracket 5. The chip 4 is located within the groove 54 and its upper end protrudes from the groove 54. The overall height of the bracket 5 is lower than that of the chip 4, thereby reducing the obstruction of side light from the chip 4.

[0044] The first encapsulating adhesive layer 3 covers the outside of the chip 4 and can fill the gap between the chip 4 and the groove 54. The outer surface of the first encapsulating adhesive layer 3 is an arc-shaped convex surface. The first encapsulating adhesive layer 3 contains KSF phosphor. Since the first encapsulating adhesive layer 3 is wrapped between the second encapsulating adhesive layer 2 and the support 5, the first encapsulating adhesive layer 3 is not exposed to the air. The KSF powder used in the phosphor is not easy to come into contact with moisture in the air and thus does not turn black. This can effectively prevent the KSF powder from turning black.

[0045] The second encapsulating adhesive layer 2 has a cylindrical side surface, and its bottom surface is tightly connected to the outer surface of the first encapsulating adhesive layer 3 and the upper surface of the bracket 5. Its top surface is horizontal. The light-blocking layer 1 is cylindrical and covers the second encapsulating adhesive layer 2. The overall structure of the adhesive layer formed by the first encapsulating adhesive layer 3 and the second encapsulating adhesive layer 2 has a cylindrical external shape, thus ensuring consistent light emission angles in all directions. The inner wall of the groove 54 on the bracket 5 is tightly connected to the first encapsulating adhesive layer 3, and the portion of the upper surface of the bracket 5 outside the inner wall of the groove 54 (i.e., the bottom of the groove) is tightly connected to the second encapsulating adhesive layer 2. The groove 54 enhances the bonding force between the bracket 5 and the first and second encapsulating adhesive layers 3 and 2, making it less likely for the adhesive layers to peel off from the bracket 5.

[0046] The entire encapsulation layer can be formed into a cylindrical structure through a molding process to ensure consistent light emission angles in all directions for the LED device. Simultaneously, a multi-layer dispensing process is used to cover the outer side of the first encapsulation layer 3 with the second encapsulation layer 2, preventing the KSF powder within the first encapsulation layer 3 from turning black due to moisture.

[0047] Specifically, the support 5 includes an etched plate 51 and a molding compound 52. The etched plate 51 includes a base with a first boss protruding upward from the center of the base. An insulating groove 53 is formed on the first boss, with the groove opening located on its upper surface. The molding compound 52 includes a filler portion 521, which does not fill the insulating groove 53 and has its upper surface flush with the first boss. The molding compound 52 also includes a main body portion 522, which covers the base and surrounds the outside of the first boss. The upper surface of the main body portion 522 is flush with the upper surface of the first boss. The molding compound 52 also includes a positioning protrusion 523, which is located above the main body portion 522 and has a ring-shaped horizontal cross-section. The inner surface of the positioning protrusion 523 forms the inner wall of the groove 54. The upper surface of the first boss is used to form part of the bottom of the groove 54.

[0048] Specifically, the main body 522 is provided with an annular groove 524 with the opening facing upward. The annular groove 524 surrounds the outside of the positioning protrusion 523 in the horizontal direction, and the bottom part of the second encapsulating adhesive layer 2 is filled in the annular groove 524.

[0049] Specifically, the etched plate 51 includes a first metal plate 511 and a second metal plate 512 spaced apart. The first metal plate 511 and the second metal plate 512 are both placed on the same plane, and their upper surfaces are flush. The gap between the first metal plate 511 and the second metal plate 512 forms an insulating groove 53, and the filling portion 521 fills the space between the first metal plate 511 and the second metal plate 512. The first metal plate 511 includes a first plate 5111 and a second plate 5112 connected in an L-shape. The second metal plate 512 includes a third plate 5121 and a fourth plate 5122 connected to each other. The first plate 5111 and the third plate 5121 are both vertically arranged and together form the first boss. Their upper surfaces each form part of the bottom of the groove 54. The insulating groove 53 is located between the first plate 5111 and the third plate 5121. The second plate 5112 and the fourth plate 5122 form the base and are both horizontally arranged. The main body 522 covers the upper surfaces of the second plate 5112 and the fourth plate 5122. The molding compound 52 encapsulates and fills the edges of the two metal plates, the etched areas, and the insulating groove 53 between the two metal plates through injection molding. The die bonding and wire bonding areas are located at the bottom of the groove 54, that is, the metal pads 6 form the wire bonding area, and the place where the chip 4 is placed forms the die bonding area. The positioning protrusions 523 are square and surround the die bonding and wire bonding areas.

[0050] Specifically, the connection structure between the positioning protrusion 523 and the main body 522 is stepped on the side near the first protrusion, and the upper end face of the main body 522 forms a stepped surface and is used to form part of the bottom of the groove 54. The vertically arranged outer side of the positioning protrusion 523 is connected to the inner wall of the annular groove 524.

[0051] In this design, the upper end of the positioning protrusion 523 on the bracket 5 is tightly connected to the second encapsulating adhesive layer 2, and the inner side is tightly connected to the first encapsulating adhesive layer 3. The portion of the upper surface of the main body 522 connected to the inner side of the positioning protrusion 523 is tightly connected to the bottom surface of the first encapsulating adhesive layer 3. Both side walls and the bottom of the annular groove 524 are tightly connected to the second encapsulating adhesive layer 2. The portion of the upper surface of the main body 522 surrounding the opening of the annular groove 524 is also tightly connected to the second encapsulating adhesive layer 2. The arrangement of the positioning protrusion 523 and the annular groove 524 on the bracket 5 increases the bonding force between the bracket 5 and the first and second encapsulating adhesive layers 3 and 2, making it less likely for the adhesive layers to peel off from the bracket 5. Furthermore, the upper surface of the positioning protrusion 523 is lower than the upper surface of the chip 4, meaning the overall height of the injection molded body is lower than that of the chip 4, thereby reducing the obstruction of light from the chip 4. The entire structure of the molding body 52 can be manufactured by injection molding, and both the positioning protrusion 523 and the annular groove 524 can be formed during the injection molding process.

[0052] Specifically, the annular groove 524 has opposing first sidewalls 5241 and second sidewalls 5242. Both the first sidewall 5241 and the second sidewall 5242 are inclined from bottom to top in a direction away from each other. The first sidewall 5241 is connected to the vertically arranged outer surface of the positioning protrusion 523. The bottom 5243 of the annular groove 524 is U-shaped. The first sidewalls 5241 and second sidewalls 5242 within the annular groove 524 have a sloping structure, which further improves the bonding force between the bracket 5 and the second encapsulating adhesive layer 2, making it less likely for the adhesive layer to peel off from the bracket 5.

[0053] Specifically, the groove 54 is further provided with two metal pads 6, which are spaced apart from the chip 4. The two metal pads 6 are located on opposite sides of the chip 4 and are connected to the chip 4 via metal connecting wires 7. In this solution, the fluorescent adhesive 3 containing KSF powder is the first encapsulating adhesive layer 3, which is completely covered by the second encapsulating adhesive layer 2, effectively preventing the KSF powder from coming into contact with moisture in the air and causing it to turn black.

[0054] Specifically, the diameter of the side surface of the light blocking layer 1 is the same as the diameter of the side surface of the second encapsulating adhesive layer 2 and they are coaxially arranged.

[0055] Specifically, the first encapsulating adhesive layer 3 can be obtained by dispensing. The first encapsulating adhesive layer 3 is a light conversion layer containing KSF phosphor, which covers the LED chip 4 and the area surrounded by the positioning protrusion 523 of the molding compound 52. The first encapsulating adhesive layer 3 is in the shape of a circular convex lens. The height of the first encapsulating adhesive layer 3 is greater than the height of the chip 4 and less than the height of the second encapsulating adhesive layer 2.

[0056] Specifically, the second encapsulating layer 2 can be obtained by molding. The second encapsulating layer 2 can be a light conversion layer or a transparent layer. The second encapsulating layer 2 is cylindrical and covers the support 5, with its bottom end filling the annular groove 524 on the support 5 and covering the first encapsulating layer 3. Because the first encapsulating layer 3 contains KSF powder, being covered by the second encapsulating layer 2 prevents the KSF powder from turning black due to contact with moisture in the air. The height of the second encapsulating layer 2 is greater than the height of the first encapsulating layer 3. The diameter of the cylinder of the second encapsulating layer 2 is the same as the width of the support 5, and the projection of the support 5 in the vertical direction can be square.

[0057] Specifically, the light-blocking layer 1 can be obtained by molding. The light-blocking layer 1 is cylindrical and covers the top of the second encapsulating layer 2. The light-blocking layer 1 is filled with a reflective material to block the light emitted directly above the LED chip 4. The outer surface of the second encapsulating layer 2 is cylindrical; that is, the light-emitting surface of the LED package is cylindrical, which allows for consistent light emission angles in all directions. The height of the light-blocking layer 1 is less than the height of the second encapsulating layer 2.

[0058] The LED packaging device using this solution includes the following steps during the packaging process:

[0059] S1. Die Bonding: The die bonding area where the chip is fixed to the support.

[0060] S2. Wire bonding: Connect the chip to the bonding area on the bracket through metal connecting wires to achieve electrical conduction.

[0061] S3. The first encapsulating adhesive layer is formed through a dispensing process.

[0062] S4. A second encapsulating adhesive layer is formed through a molding process.

[0063] S5. A light-blocking layer is formed through a molding process.

[0064] Other aspects of the LED packaging device described in this utility model can be found in the prior art, and will not be repeated here.

[0065] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Therefore, any modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. An LED package device, characterized by: The application relates to a chip package structure, which comprises a support, a chip, a first encapsulating glue layer, a second encapsulating glue layer and a light blocking layer. The upper end of the support is provided with a groove, the chip is located in the groove and protrudes from the upper end of the groove, the first encapsulating glue layer covers the outside of the chip and can fill the gap between the chip and the groove, the outer surface of the first encapsulating glue layer is arc-shaped and convex, and the first encapsulating glue layer contains KSF fluorescent powder. The side surface of the second encapsulating glue layer is cylindrical, the bottom surface is closely connected with the outer surface of the first encapsulating glue layer and the upper surface of the support, and the top surface is horizontally arranged.

2. The LED packaging device according to claim 1, wherein: The light blocking layer is in the shape of a cylinder and covers the upper part of the second encapsulating glue layer. The support comprises an etching sheet and a plastic encapsulating body. The filling part is filled in the insulation groove and the upper surface is flush with the first convex column. The plastic encapsulating body further comprises a main body part which covers the upper part of the base and surrounds the outside of the first convex column, and the upper end surface of the main body part is flush with the upper end surface of the first convex column. The plastic encapsulating body further comprises a positioning convex part which is located above the main body part and has a ring-shaped horizontal cross section, and the inner side surface of the positioning convex part forms the inner wall of the groove.

3. The LED packaging device of claim 2, wherein: The upper end surface of the first convex column is used for forming part of the groove bottom.

4. The LED encapsulating device according to claim 3, characterized in that: The main body part is provided with an annular groove which is open upward and surrounds the outside of the positioning convex part in the horizontal direction, and the bottom part of the second encapsulating glue layer is partially filled in the annular groove. The etching sheet comprises a first metal plate and a second metal plate which are arranged at intervals, the gap between the first metal plate and the second metal plate forms the insulation groove, and the filling part is filled between the first metal plate and the second metal plate. The first metal plate comprises a first plate block and a second plate block which are connected in an L shape, the second metal plate comprises a third plate block and a fourth plate block which are connected with each other, the first plate block and the third plate block are vertically arranged and jointly form the first convex column, the upper end surfaces of the first plate block and the third plate block form part of the groove bottom, the insulation groove is located between the first plate block and the third plate block, and the second plate block and the fourth plate block form the base and are horizontally arranged.

5. The LED encapsulating device according to claim 4, wherein: The main body part covers the upper surfaces of the second plate block and the fourth plate block. The connecting structure of the positioning convex part and the main body part is in the shape of a step on the side close to the first convex column, the upper end surface of the main body part forms a step surface and is used for forming part of the groove bottom.

6. The LED packaging device of claim 5, wherein: The vertically arranged outer side surface of the positioning convex part is connected with the inner wall of the annular groove.

7. The LED packaging device according to claim 6, wherein: The annular groove has opposite first and second side walls which are both inclined and tilt towards each other from bottom to top. The groove is further provided with two metal pads which are arranged at intervals and are respectively located on the opposite sides of the chip and connected with the chip through metal connecting lines.

8. The LED packaging device according to claim 7, wherein: The bottom of the annular groove is in a square-within-a-square shape.

9. The LED encapsulating device according to claim 1, wherein: The diameter of the side surface of the light blocking layer is the same as that of the side surface of the second encapsulation adhesive layer and they are coaxially arranged.

10. The LED encapsulating device according to claim 1, wherein: The height of the light blocking layer is less than the height of the second encapsulation adhesive layer; the height of the first encapsulation adhesive layer is greater than the height of the chip and less than the height of the second encapsulation adhesive layer.

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