Solder ball grading recovery device for wafer cleaning machine

Abstract

The utility model provides a solder ball grading recovery device for a wafer cleaning machine, and aims to solve the problems that in the conventional wafer cleaning process, the sorting recovery is not carried out in the recovery process, and the secondary sorting is still needed after the liquid is discharged. The tin ball recovery device mainly comprises a recovery cavity, a multi-layer filtering piece, a liquid inlet pipe and a main waste discharge pipe, and is arranged in the gravity direction when put into use, and mixed liquid mixed with tin balls is introduced into the device by means of an upper-stage flushing unit; the tin balls are flushed into the filter boxes with different mesh numbers and specifications by means of impact force and gravity without an additional power source, and the tin balls with different specifications are retained in the corresponding filter boxes through different filter screens, so that graded recovery of the tin balls is realized, and the tin ball recycling device has the advantages of simple structure and high efficiency. Meanwhile, the liquid level detection part and the overflow port are arranged, the internal liquid level state of the tin ball recovery device can be detected in real time, normal work of the tin ball recovery device is ensured, and the problem of backward flowing caused by blockage of the main waste discharge port is solved.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a tin ball grading and recycling device for a wafer cleaning machine. Background Technology

[0002] Wafer cleaning is an important process step in wafer manufacturing, designed to remove contaminants generated during wafer forming and polishing by contact with various organic substances, particles, and metals. The traditional cleaning process involves the wafer entering the cleaning unit of the unloading machine after reflow soldering, where the wafer surface is cleaned. Through processes such as high pressure, two fluids, and nitrogen, the solder balls are washed off and sent to a recycling device. Finally, the waste liquid is discharged through the recycling device, and the solder balls are sorted and retained in the device for recycling.

[0003] The problem with the existing technology is that, in the process from the upper cleaning unit to the graded recycling device to the terminal waste discharge pipeline, the solder balls are not classified and recycled due to their different specifications, such as 1000 mesh and 1800 mesh. After the liquid is discharged, secondary sorting is still required, which increases the workload. Utility Model Content

[0004] This application addresses the shortcomings of the prior art by providing a solder ball grading and recycling device for a wafer cleaning machine. The device uses gravity and waste liquid force as power sources and employs stacked screens to grade and recycle solder balls of different mesh sizes. The grading and recycling device is equipped with a liquid level detection element and an overflow port, enabling continuous operation.

[0005] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows:

[0006] A solder ball grading and recycling device for a wafer cleaning machine includes a recycling chamber and a multi-layer filter element arranged sequentially inside the recycling chamber. The filter element is arranged from top to bottom along the chamber according to the size of the solder balls, from largest to smallest. The upper part of the recycling chamber is provided with multiple liquid inlet pipes for connecting to the upper cleaning unit, and the lower part of the recycling chamber is provided with a main waste discharge pipe for connecting to an external waste discharge pipe.

[0007] Furthermore, a set of flat plates is provided at the same height in the inner cavities on both sides of the recovery chamber, and multiple sets are provided at different heights. Under the action of gravity, each set of flat plates is used to install filter elements.

[0008] Furthermore, each of the filter elements is a filter box, with gravity-loaded folded edges on both sides of the filter box and a filter screen at the bottom of the filter box.

[0009] Furthermore, either the front or rear surface of the recovery chamber is a movable cover plate, which is rotatably connected to the open side of the recovery chamber via a hinge. The connection of the movable cover plate is fixed by a buckle, and sealing strips are provided on all four sides of the movable cover plate.

[0010] Furthermore, a liquid level detection element is also provided on one side of the recovery chamber.

[0011] Furthermore, the other side of the recovery chamber is also provided with an overflow port that connects to the outside.

[0012] The beneficial effects of this utility model are as follows:

[0013] Compared with the prior art, this utility model provides a recycling device for graded recycling of solder balls of different sizes. When the recycling device is put into use, it is set along the direction of gravity. The mixture containing solder balls is introduced into the device through the upper flushing unit. With the help of the flushing force and gravity, the solder balls are flushed into the filter boxes of different mesh sizes without the need for an additional power source. The solder balls of different sizes are retained in the corresponding filter boxes through different filter screens, thereby realizing the graded recycling of solder balls. It has the industrial advantages of simple structure and easy mass production.

[0014] Meanwhile, a liquid level detection device and an overflow port are installed. On the one hand, the internal liquid level of the solder ball recycling device can be detected in real time for easy maintenance. On the other hand, the overflow port can ensure the normal operation of the solder ball recycling device under extreme conditions and prevent backflow caused by blockage of the main waste outlet. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 for Figure 1 An explosion diagram;

[0017] Figure 3 This is a schematic diagram of the internal structure of this utility model.

[0018] The components include: 1. Recovery chamber; 2. Filter element; 21. Filter box; 22. Filter screen; 3. Inlet pipe; 31. Compression fitting; 4. Main waste discharge pipe; 5. Flat plate; 6. Movable cover plate; 7. Hinge; 8. Fastener; 9. Sealing strip; 10. Liquid level detection element; 11. Overflow port. Detailed Implementation

[0019] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0020] This invention provides a solder ball grading and recycling device for a wafer cleaning machine, which aims to solve the problem that in the existing wafer cleaning process, the solder balls are not classified and recycled during the recycling process, and secondary sorting is still required after the liquid is drained, which increases the workload.

[0021] like Figures 1 to 3 As shown, this utility model includes a recovery chamber 1 and a multi-layer filter element 2 arranged sequentially inside the recovery chamber 1. The filter element 2 is arranged in descending order of the size of the solder balls along the chamber from top to bottom. The upper part of the recovery chamber 1 is provided with multiple liquid inlet pipes 3 for connecting to the upper cleaning unit, and the lower part of the recovery chamber 1 is provided with a main waste discharge pipe 4 for connecting to the external waste discharge pipe.

[0022] In one embodiment of this utility model, a set of flat plates 5 are provided at the same height on both sides of the inner cavity of the recovery chamber 1, and multiple sets are provided at different heights. Under the action of gravity, each set of flat plates 5 is used to install the filter element 2.

[0023] In one embodiment of this utility model, each filter element 2 is a filter box 21, and the filter box 21 has folded edges for gravity hanging on both sides, and a filter screen 22 is provided at the bottom of the filter box 21.

[0024] In one embodiment of this utility model, a movable cover plate 6 is provided on either the front or rear surface of the recovery chamber 1. The movable cover plate 6 is rotatably connected to the open side of the recovery chamber 1 via a hinge 7. The connection of the movable cover plate 6 is fixed by a buckle 8. Sealing strips 9 are provided on the four sides of the movable cover plate 6.

[0025] In one embodiment of this utility model, a liquid level detection element 10 is also provided on one side of the recovery chamber 1. The liquid level detection element 10 can be a commonly used model in the field of liquid level detection, and is not specifically limited here.

[0026] In one embodiment of this utility model, the other side of the recovery chamber 1 is also provided with an overflow port 11 that connects to the outside.

[0027] The specific structure and working principle of this utility model are as follows:

[0028] This invention includes a recovery chamber 1 arranged along the direction of gravity. Four clamping connectors 31 are symmetrically arranged above the recovery chamber 1, with two on the same side forming a group to connect to the upper-level cleaning unit. This device can connect two groups of cleaning units simultaneously to meet the requirements of high-volume drainage. Inside the recovery chamber 1, filter boxes 21 are constrained on both sides by flat plates 5. The folded-edge filter boxes 21 naturally hang on the flat plates 5 at a certain height under gravity. This invention includes two filter boxes 21: a 1000-mesh filter box 21 at the top and an 1800-mesh filter box 21 at the bottom. A movable cover 6 is installed on the front surface of the recovery chamber 1, allowing for easy maintenance and replacement of the filter boxes 21. The four joints of the movable cover 6 are sealed with sealing strips 9 to prevent leakage.

[0029] Meanwhile, liquid level detection devices 10 and overflow ports 11 are installed on both sides of the recovery chamber 1. On the one hand, the internal liquid level of the solder ball recovery device can be detected in real time for easy maintenance. On the other hand, the overflow port 11 can ensure the normal operation of the solder ball recovery device under extreme conditions and prevent backflow caused by blockage of the main waste outlet.

[0030] In use, the two sets of inlet pipes 3 are connected to the two sets of cleaning units above to introduce the mixed liquid into the recycling device. Under the action of force and gravity, no additional power source is required. The mixed liquid reaches the uppermost filter box 21. The upper filter box 21 retains larger solder balls, and the mixed liquid enters the lower filter box 21. Smaller solder balls are retained in the lower filter box 21. The remaining waste liquid enters the plant's waste discharge through the main waste discharge pipe 4 at the bottom, thus realizing the non-powered recycling of solder balls.

[0031] The above description is an explanation of the present utility model and not a limitation thereof. The scope of the present utility model is defined by the claims. Within the protection scope of the present utility model, any form of modification may be made.

Claims

1. A solder ball grading and recycling device for a wafer cleaning machine, characterized in that: It includes a recovery chamber (1) and a multi-layer filter element (2) arranged sequentially inside the recovery chamber (1). The filter element (2) is arranged in descending order of the size of the solder balls along the chamber from top to bottom. The upper part of the recovery chamber (1) is provided with multiple liquid inlet pipes (3) for connecting to the upper cleaning unit. The lower part of the recovery chamber (1) is provided with a main waste discharge pipe (4) for connecting to the external waste discharge pipe.

2. The solder ball grading and recycling device for a wafer cleaning machine as described in claim 1, characterized in that: The inner cavities on both sides of the recovery chamber (1) are provided with a set of flat plates (5) at the same height, and multiple sets are provided at different heights. Under the action of gravity, each set of flat plates (5) is used to install filter elements (2).

3. The solder ball grading and recycling device for a wafer cleaning machine as described in claim 1, characterized in that: Each filter element (2) is a filter box (21), and the filter box (21) has folded edges on both sides for gravity hanging, and a filter screen (22) is provided at the bottom of the filter box (21).

4. The solder ball grading and recycling device for a wafer cleaning machine as described in claim 1, characterized in that: The front or rear surface of the recovery chamber (1) is a movable cover plate (6). The movable cover plate (6) is rotatably connected to the open side of the recovery chamber (1) by a hinge (7). The connection of the movable cover plate (6) is fixed by a buckle (8). Sealing strips (9) are provided on the four sides of the movable cover plate (6).

5. A solder ball grading and recycling device for a wafer cleaning machine as described in claim 1, characterized in that: A liquid level detection element (10) is also provided on one side of the recovery chamber (1).

6. The solder ball grading and recycling device for a wafer cleaning machine as described in claim 1, characterized in that: The other side of the recovery chamber (1) is also provided with an overflow port (11) that connects to the outside.

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