Wafer ultrasonic continuous cleaning device

Abstract

The wafer ultrasonic continuous cleaning device comprises a continuous cleaning pool and a placing basket mechanism, a linear guide rail is fixedly installed at the top of the continuous cleaning pool, an installation frame is installed at the top of the linear guide rail in a sliding mode, a telescopic assembly is fixedly installed on one side of the installation frame, and the telescopic assembly is fixedly installed on the other side of the installation frame. A clamping assembly is fixedly installed at the bottom of the telescopic assembly, and a rolling mechanism is fixedly installed in the placing basket mechanism. According to the wafer ultrasonic continuous cleaning device, the linear guide rail, the mounting frame and the telescopic assembly are matched to drive the containing basket mechanism and wafers in the containing basket mechanism, continuous multi-stage cleaning is carried out in the continuous cleaning pool, and in the cleaning process, an output gear is driven by a motor to rotate; and through cooperation of an output gear, a synchronous belt and a driven gear, the four sets of clamping rollers rotate synchronously, then the wafer rotates, the cleaning liquid can cover the surface of the wafer more evenly, and cleaning dead corners are reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer cleaning devices, specifically a wafer ultrasonic continuous cleaning device. Background Technology

[0002] A wafer is a fundamental material in semiconductor manufacturing, typically a thin, circular sheet made of high-purity single-crystal silicon or other semiconductor materials (such as gallium arsenide and gallium nitride). Wafers are the basis for manufacturing integrated circuits (ICs), sensors, solar cells, and other electronic devices. As a core material in semiconductor manufacturing, the quality and performance of wafers directly affect the performance and reliability of the final product. With technological advancements, the size and purity of wafers have continuously improved, providing a solid foundation for the development of the semiconductor industry.

[0003] A continuous ultrasonic wafer cleaning system is a specialized device for the efficient cleaning of wafers during semiconductor manufacturing. This system utilizes ultrasonic technology to remove various contaminants from the wafer surface, such as particles, organic matter, and metal ions. The design aims to meet the high cleanliness requirements of the semiconductor manufacturing industry while improving cleaning efficiency and consistency and minimizing the impact of human factors. Such devices are widely used in wafer cleaning processes in integrated circuits, sensors, and solar cells.

[0004] In existing technologies, continuous ultrasonic cleaning devices for wafers typically use a wafer rack to hold a large number of wafers before placing the rack into a cleaning tank for cleaning. While this meets the requirements to some extent, it has been found in actual use that the wafers are in contact with the rack, and the cleaning fluid cannot fully reach all surfaces during the cleaning process, resulting in cleaning dead zones. Utility Model Content

[0005] The purpose of this invention is to provide a wafer ultrasonic continuous cleaning device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer ultrasonic continuous cleaning device, comprising a continuous cleaning tank and a basket placement mechanism. A linear guide rail is fixedly installed on the top of the continuous cleaning tank, and a mounting frame is slidably installed on the top of the linear guide rail. A telescopic component is fixedly installed on one side of the mounting frame, and a clamping component is fixedly installed on the bottom of the telescopic component. A rolling mechanism is fixedly installed inside the basket placement mechanism. The rolling mechanism includes a mounting plate and a synchronous belt. The mounting plate is fixedly installed on one side of the basket placement mechanism. Two sets of mounting blocks are slidably installed on one side of the mounting plate. Two sets of clamping rollers are rotatably installed on one side of the mounting blocks. An output gear is rotatably installed on one side of the mounting blocks. A driven gear is fixedly connected to one side of the clamping rollers. The synchronous belt is sleeved on the outer wall of the two sets of driven gears and the output gear. A motor is fixedly installed on one side of the mounting block, and the output shaft of the motor is fixedly connected to one side of the output gear via a coupling.

[0007] Preferably, the basket placement mechanism includes a mounting frame, a plurality of partitions are fixedly installed inside the mounting frame, a plurality of sliding grooves are formed inside the partitions, and the clamping rollers are slidably installed inside the sliding grooves.

[0008] Preferably, two sets of lifting lugs are fixedly installed on the top of the mounting frame, and several legs are fixedly installed on the bottom of the mounting frame.

[0009] Preferably, a rubber sleeve is fixedly installed on the outer wall of the clamping roller.

[0010] Preferably, two sets of second guide rails are fixedly installed on one side of the mounting plate, and two sets of mounting blocks are slidably installed on one side of the second guide rails. A first slide rail is fixedly installed on one side of the mounting plate, and the mounting blocks are symmetrically arranged on the left and right sides of the first slide rail. A slider is slidably installed on one side of the first slide rail, and two sets of connecting rods are symmetrically installed on the left and right sides of the slider. A connecting block is rotatably installed on one side of the connecting rod, and the connecting block is fixedly connected to one side of the mounting block. The two sets of mounting blocks are slidably installed on one side of the second guide rails.

[0011] Preferably, a cylinder is fixedly mounted on one side of the mounting plate, and the telescopic shaft of the cylinder is fixedly connected to one side of the slider.

[0012] Preferably, placement areas are provided on both the left and right sides of the continuous cleaning pool.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the wafer ultrasonic continuous cleaning device;

[0014] 1. Several wafers are placed in the mounting frame and separated by several partitions. Then, the wafers are continuously cleaned in multiple stages inside the continuous cleaning tank through the cooperation of linear guide rails, mounting brackets, and telescopic components. During the cleaning process, the output gear is driven by a motor to rotate. The four sets of clamping rollers rotate synchronously through the cooperation of the output gear, synchronous belt, and driven gear. The four sets of clamping rollers drive the wafers to rotate inside the placement basket mechanism. By rotating the wafers, the cleaning fluid can be more evenly covered on the wafer surface, including edges and corners, reducing cleaning dead spots.

[0015] Rubber sleeves prevent the clamping rollers from directly contacting the wafers and prevent the clamping rollers from crushing the wafers. Lifting lugs facilitate the clamping of the basket mechanism. Support legs prevent the basket mechanism from touching the bottom inside the continuous cleaning tank, ensuring that there are no dead angles in the contact between the wafers and the cleaning solution.

[0016] 2. By cooperating with the first slide rail, slider, connecting rod and connecting block, the distance between the two sets of mounting blocks can be changed when the slider is moved. During the placement and removal of the wafer, the distance between the mounting blocks is adjusted to the maximum, which facilitates the entry and exit of the wafer into and out of the placement basket mechanism. At the same time, several clamping rollers can clamp wafers of different diameters through the edge distance.

[0017] The displacement of the slider is powered by a cylinder, and the wafers to be cleaned and those that have been cleaned are placed in the placement area to ensure the continuity of the cleaning process. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a partial structural schematic diagram of the present invention;

[0020] Figure 3 This is a schematic diagram of the rolling mechanism of this utility model;

[0021] Figure 4 This is a partial structural schematic diagram of the rolling mechanism of this utility model;

[0022] Figure 5 This is a schematic diagram of the basket placement mechanism of this utility model.

[0023] In the diagram: 1. Continuous cleaning tank; 2. Linear guide rail; 3. Mounting frame; 4. Telescopic assembly; 5. Clamping assembly; 6. Basket placement mechanism; 601. Mounting frame; 602. Partition plate; 603. Lifting lug; 604. Support leg; 605. Slide groove; 7. Rolling mechanism; 701. Mounting plate; 702. Mounting block; 703. Clamping roller; 704. Output gear; 705. Synchronous belt; 706. Driven gear; 707. Motor; 708. Rubber sleeve; 709. First slide rail; 710. Slider; 711. Connecting rod; 712. Connecting block; 713. Second guide rail; 714. Cylinder; 8. Placement area. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-4This utility model provides a technical solution: a continuous ultrasonic cleaning device for wafers, comprising a continuous cleaning tank 1 and a basket placement mechanism 6. A linear guide rail 2 is fixedly installed on the top of the continuous cleaning tank 1, and a mounting frame 3 is slidably installed on the top of the linear guide rail 2. A telescopic component 4 is fixedly installed on one side of the mounting frame 3, and a clamping component 5 is fixedly installed on the bottom of the telescopic component 4. A rolling mechanism 7 is fixedly installed inside the basket placement mechanism 6. The rolling mechanism 7 includes a mounting plate 701 and a synchronous belt 705. The mounting plate 701 is fixedly installed on one side of the basket placement mechanism 6. Two sets of mounting blocks 702 are slidably installed on one side of the mounting plate 701. Two sets of clamping rollers 703 are rotatably installed on one side of the mounting blocks 702. An output gear 704 is rotatably installed on one side of the mounting blocks 702. A driven gear 706 is fixedly connected to one side of the clamping rollers 703. The synchronous belt 705 is sleeved on the two sets of driven gears 706 and the output gear 705. On the outer wall of 04, a motor 707 is fixedly installed on one side of the mounting block 702. The output shaft of the motor 707 is fixedly connected to one side of the output gear 704 via a coupling. The basket placement mechanism 6 includes a mounting frame 601. Several partitions 602 are fixedly installed inside the mounting frame 601. Several sliding grooves 605 are opened inside the partitions 602. The clamping roller 703 is slidably installed inside the sliding grooves 605. Two sets of lifting lugs 603 are fixedly installed on the top of the mounting frame 601. Several support feet 604 are fixedly installed on the bottom of the mounting frame 601. The rubber sleeve 708 prevents the clamping roller 703 from directly contacting the wafer and prevents the clamping roller 703 from crushing the wafer. The outer wall of the clamping roller 703 is fixedly installed with a rubber sleeve 708. The lifting lugs 603 facilitate the clamping assembly 5 to clamp the basket placement mechanism 6. The support feet 604 prevent the basket placement mechanism 6 from touching the bottom inside the continuous cleaning tank 1, ensuring that there are no dead angles in contact between the wafer and the cleaning fluid.

[0026] The specific implementation method is as follows: Several wafers are placed in the mounting frame 601 and separated by several partitions 602. Then, the cooperation between the linear guide rail 2, the mounting frame 3, and the telescopic component 4 drives the placement basket mechanism 6 and the wafers inside it to perform continuous multi-stage cleaning inside the continuous cleaning tank 1. During the cleaning process, the motor 707 drives the output gear 704 to rotate. Then, through the cooperation between the output gear 704, the synchronous belt 705, and the driven gear 706, the four sets of clamping rollers 703 rotate synchronously. In turn, the four sets of clamping rollers 703 drive the wafers to rotate inside the placement basket mechanism 6. By rotating the wafers, the cleaning fluid can be more evenly covered on the wafer surface, including the edges and corners, reducing cleaning dead corners.

[0027] Please see Figure 1-5This utility model provides a technical solution: a wafer ultrasonic continuous cleaning device, wherein two sets of second guide rails 713 are fixedly installed on one side of a mounting plate 701, two sets of mounting blocks 702 are slidably installed on one side of the second guide rails 713, a first slide rail 709 is fixedly installed on one side of the mounting plate 701, the mounting blocks 702 are symmetrically arranged on the left and right sides of the first slide rail 709, a slider 710 is slidably installed on one side of the first slide rail 709, and two sets of connecting rods 711 are symmetrically installed on the left and right sides of the slider 710. A connecting block 712 is rotatably mounted on one side, and the connecting block 712 is fixedly connected to one side of the mounting block 702. Two sets of mounting blocks 702 are slidably mounted on one side of the second guide rail 713. A cylinder 714 is fixedly mounted on one side of the mounting plate 701. The telescopic shaft of the cylinder 714 is fixedly connected to one side of the slider 710. The cylinder 714 provides power for the displacement of the slider 710. Placement areas 8 are provided on both the left and right sides of the continuous cleaning pool 1. Wafers to be cleaned and cleaned wafers are placed in the placement areas 8 to ensure the continuity of the cleaning process.

[0028] The specific implementation method is as follows: through the cooperation between the first slide rail 709, the slider 710, the connecting rod 711, and the connecting block 712, the distance between the two sets of mounting blocks 702 can be changed when the slider 710 is displaced. During the placement and removal of the wafer, the distance between the mounting blocks 702 is adjusted to the maximum, which facilitates the entry and exit of the wafer into and out of the placement basket mechanism 6. At the same time, several clamping rollers 703 can clamp wafers of different diameters through the edge distance.

[0029] Working principle: When using this wafer ultrasonic continuous cleaning device, several wafers are placed in the mounting frame 601 and separated by several partitions 602. Then, the cooperation between the linear guide rail 2, the mounting frame 3, and the telescopic component 4 drives the placement basket mechanism 6 and the wafers inside it to perform continuous multi-stage cleaning inside the continuous cleaning tank 1. During the cleaning process, the motor 707 drives the output gear 704 to rotate. Then, through the cooperation between the output gear 704, the synchronous belt 705, and the driven gear 706, the four sets of clamping rollers 703 rotate synchronously. In turn, the four sets of clamping rollers 703 drive the wafers to rotate inside the placement basket mechanism 6. By rotating the wafers, the cleaning fluid can be more evenly covered on the wafer surface, including the edges and corners, reducing cleaning dead corners.

[0030] The rubber sleeve 708 prevents the clamping roller 703 from directly contacting the wafer and prevents the clamping roller 703 from damaging the wafer. The lifting lug 603 facilitates the clamping assembly 5 to clamp the placement basket mechanism 6. The support leg 604 prevents the placement basket mechanism 6 from touching the bottom inside the continuous cleaning tank 1, ensuring that there are no dead angles in the contact between the wafer and the cleaning fluid.

[0031] Through the cooperation between the first slide rail 709, the slider 710, the connecting rod 711, and the connecting block 712, the distance between the two sets of mounting blocks 702 can be changed when the slider 710 is displaced. During the placement and removal of the wafer, the distance between the mounting blocks 702 is adjusted to the maximum, which facilitates the entry and exit of the wafer into and out of the placement basket mechanism 6. At the same time, several clamping rollers 703 can clamp wafers of different diameters through the edge distance.

[0032] The cylinder 714 provides power for the displacement of the slider 710, and the wafers to be cleaned and those that have been cleaned are placed in the placement area 8, ensuring the continuity of the cleaning process.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer ultrasonic continuous cleaning device, comprising a continuous cleaning tank (1) and a basket placement mechanism (6), wherein a linear guide rail (2) is fixedly installed on the top of the continuous cleaning tank (1), a mounting frame (3) is slidably installed on the top of the linear guide rail (2), a telescopic component (4) is fixedly installed on one side of the mounting frame (3), a clamping component (5) is fixedly installed on the bottom of the telescopic component (4), and a rolling mechanism (7) is fixedly installed inside the basket placement mechanism (6), characterized in that: The rolling mechanism (7) includes a mounting plate (701) and a timing belt (705). The mounting plate (701) is fixedly mounted on one side of the basket placement mechanism (6). Two sets of mounting blocks (702) are slidably mounted on one side of the mounting plate (701). Two sets of clamping rollers (703) are rotatably mounted on one side of the mounting block (702). An output gear (704) is rotatably mounted on one side of the mounting block (702). A driven gear (706) is fixedly connected to one side of the clamping rollers (703). The timing belt (705) is sleeved on the outer wall of the two sets of driven gears (706) and the output gear (704). A motor (707) is fixedly mounted on one side of the mounting block (702). The output shaft of the motor (707) is fixedly connected to one side of the output gear (704) through a coupling.

2. The wafer ultrasonic continuous cleaning apparatus according to claim 1, characterized in that, The basket placement mechanism (6) includes a mounting frame (601), and a plurality of partitions (602) are fixedly installed inside the mounting frame (601). A plurality of sliding grooves (605) are opened inside the partitions (602), and the clamping roller (703) is slidably installed inside the sliding grooves (605).

3. The wafer ultrasonic continuous cleaning apparatus according to claim 2, characterized in that, Two sets of lifting lugs (603) are fixedly installed on the top of the mounting frame (601), and several legs (604) are fixedly installed on the bottom of the mounting frame (601).

4. The wafer ultrasonic continuous cleaning apparatus according to claim 1, characterized in that, A rubber sleeve (708) is fixedly installed on the outer wall of the clamping roller (703).

5. The wafer ultrasonic continuous cleaning apparatus according to claim 1, characterized in that, Two sets of second guide rails (713) are fixedly installed on one side of the mounting plate (701). Two sets of mounting blocks (702) are slidably installed on one side of the second guide rails (713). A first slide rail (709) is fixedly installed on one side of the mounting plate (701). The mounting blocks (702) are symmetrically arranged on the left and right sides of the first slide rail (709). A slider (710) is slidably installed on one side of the first slide rail (709). Two sets of connecting rods (711) are symmetrically installed on the left and right sides of the slider (710). A connecting block (712) is rotatably installed on one side of the connecting rod (711). The connecting block (712) is fixedly connected to one side of the mounting block (702). Two sets of mounting blocks (702) are slidably installed on one side of the second guide rail (713).

6. The wafer ultrasonic continuous cleaning apparatus according to claim 1, characterized in that, A cylinder (714) is fixedly installed on one side of the mounting plate (701), and the telescopic shaft of the cylinder (714) is fixedly connected to one side of the slider (710).

7. The wafer ultrasonic continuous cleaning apparatus according to claim 1, characterized in that, Placement areas (8) are provided on both the left and right sides of the continuous cleaning pool (1).

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