Grinding device and machining equipment

Abstract

The utility model relates to the technical field of electronic device manufacturing, in particular to a grinding device and a chamfering machine, and aims to solve the problem that the machining efficiency is low when existing machining equipment is used for chamfering a wafer. In order to achieve the purpose, the grinding device comprises a first supporting column and a second supporting column which are arranged side by side; the supporting arm is provided with a first end and a second end which are opposite to each other, the first end is connected with the top end of the first supporting column, and the second end is connected with the top end of the second supporting column; the grinding assembly is arranged on the supporting arm, the grinding assembly penetrates through the supporting arm, and the machining end of the grinding assembly is located below the supporting arm and used for grinding a workpiece to be machined. By the adoption of the technical scheme, multiple grinding procedures of the workpiece can be achieved on one device, secondary transferring and secondary positioning of the workpiece are not needed, and therefore the machining procedures of the workpiece can be simplified, and the machining efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of electronic device manufacturing technology, specifically providing a grinding apparatus and processing equipment. Background Technology

[0002] Semiconductor wafers are the foundation for manufacturing integrated circuits and are widely used in advanced electronics, communications, aerospace, and other fields. Ingots are cut into thin slices to obtain wafers. Before grinding the wafer surface, the edges are usually chamfered to remove small cracks and defects from the cutting process and to prevent chipping or other defects during the grinding process.

[0003] In some related technologies, although equipment is involved to chamfer the edges of wafers, the wafers themselves also have V-grooves and other structures on their edges. Due to the size limitations of the V-grooves, after the wafer edges are chamfered, they usually need to be transferred to other V-groove chamfering equipment for secondary chamfering. This will affect the processing efficiency due to secondary transfer and repeated positioning.

[0004] Accordingly, a new technical solution is needed in this field to solve the above problems. Utility Model Content

[0005] This application aims to solve the aforementioned technical problem, namely, to address the low processing efficiency of existing processing equipment when chamfering wafers.

[0006] In a first aspect, this application provides a grinding apparatus comprising:

[0007] The first and second support columns are arranged side by side;

[0008] A support arm having a first end and a second end opposite to each other, the first end being connected to the top end of the first support column and the second end being connected to the top end of the second support column;

[0009] A grinding assembly is disposed on the support arm, the grinding assembly passes through the support arm, and the processing end of the grinding assembly is located below the support arm, for grinding the workpiece to be processed.

[0010] When the above technical solution is adopted, when the workpiece is being ground, the grinding component installed on the support arm can be used to grind the edge groove of the workpiece (for example, when the workpiece is a wafer, the groove is a wafer V-groove), or to grind and polish the edge of the workpiece. Since the processing end of the grinding component on the support arm faces downward and the main body is located above the processing end, the grinding component on the support arm will not affect the layout of the surrounding functional modules. Thus, the grinding component for grinding the edge of the workpiece can be arranged in the surrounding space, thereby realizing multiple grinding processes such as workpiece edge grinding and workpiece edge groove grinding on one machine, without the need for secondary transfer and secondary positioning of the workpiece, thereby simplifying the workpiece processing process and improving processing efficiency.

[0011] In one technical solution of the above-mentioned grinding device, the grinding assembly includes a second grinding assembly, which includes a second spindle passing through the support arm and a second grinding wheel connected to the lower end of the second spindle. The second grinding wheel is used to grind the groove on the edge of the workpiece to be processed.

[0012] When the above technical solution is adopted, the grinding component on the support arm can realize the grinding of the groove on the edge of the workpiece.

[0013] In one technical solution of the above-mentioned grinding device, a first through hole is provided on the support arm, the second spindle passes through the first through hole, and the second spindle is fixed to the first through hole by an expansion sleeve.

[0014] With the above technical solution adopted, a specific installation method for the second grinding assembly and the support arm is provided, in which the second spindle and the support arm are fixed by a tightening sleeve, making the disassembly and installation of the second spindle more convenient.

[0015] In one technical solution of the above-mentioned grinding device, the grinding assembly further includes a third grinding assembly, which includes a third spindle passing through the support arm and a third grinding wheel connected to the lower end of the third spindle. The third grinding wheel is used to polish the edge of the workpiece to be processed.

[0016] When the above technical solution is adopted, the grinding component on the support arm can realize the edge groove grinding and edge polishing of the workpiece.

[0017] In one technical solution of the above-mentioned grinding device, a second through hole is provided on the support arm, and the third spindle passes through the second through hole;

[0018] The support arm has a slit connected to the second through hole, the slit extends to the outer surface of the support arm, and a fastener is provided on the support arm, the fastener passing through the slit to fix the third spindle in the second through hole.

[0019] In adopting the above technical solution, a specific installation method between the third grinding component and the support arm is provided.

[0020] In one technical solution of the above-mentioned grinding device, the first end is rotatably connected to the first support column;

[0021] The second support column is provided with a support surface and a locking assembly. The support arm has a first state and a second state during its rotation. When the support arm rotates from the first state to the second state, the processing end of the grinding assembly is located below the support arm. The support surface supports the second end, and the locking assembly fixes the second end.

[0022] With the above technical solution adopted, this application rotatably connects the support arm to the first support column. When the second and third grinding components are required to grind the wafer, the support arm is rotated to the second state, and the second end of the support arm is locked by the locking component. In this way, both the first and second ends of the support arm are fixed, which can reduce the axial runout of the second and third spindles during grinding, thereby improving the grinding quality. When it is necessary to replace or repair the second / third grinding wheel, the support arm is rotated upward to the first state. At this time, the support arm is raised, and a space area for replacement or repair is opened under the support arm. At this time, the grinding wheel can be replaced or repaired using relevant tools.

[0023] In one technical solution of the above-mentioned grinding device, a positioning pin is slidably provided on the first support column, and a positioning part that cooperates with the positioning pin is provided at the first end. When the support arm is in the first state, the positioning pin extends into the positioning part to fix the support arm.

[0024] When the above technical solution is adopted, when the support arm rotates to the first state, the support arm is fixed by moving the positioning pin to prevent the support arm from rotating during maintenance.

[0025] In one technical solution of the above-mentioned grinding device, the locking assembly includes:

[0026] A locking bolt, which is threadedly connected to the second support column;

[0027] A rotating arm, which is rotatably connected to the locking bolt;

[0028] A clamping part is provided at the end of the rotating arm away from the locking bolt. When the support arm is in the second state, rotating the locking bolt can cause the clamping part to press against the second end.

[0029] With the above technical solution, not only can the support arm be fixed, but also the rotational cooperation between the rotating arm and the locking bolt can make room for the support arm to switch between different states, without having to remove the locking component from the second support column during the state switching process, so that the locking component and the second support column are integrated into a single structure.

[0030] In one technical solution of the above-mentioned grinding device, a protrusion is provided on the support surface, and a positioning post corresponding to the protrusion is provided at the second end. When the support arm is in the second state, the positioning post abuts against the protrusion.

[0031] When the above technical solution is adopted, the relative position of the positioning post and the protrusion when the support arm is in the second state can be observed to determine whether the shape of the support arm meets the processing requirements, thereby reducing the impact of support arm deformation and other reasons on the grinding operation.

[0032] In one technical solution of the above-mentioned grinding device, the grinding device includes two first support columns, which are symmetrically arranged with respect to the second support column. Each first support column is provided with a support arm, and each support arm is provided with the grinding component. The second support column is provided with two locking components corresponding to the support arms on both sides.

[0033] By adopting the above technical solution, on the one hand, two grinding stations can be formed side by side, allowing grinding operations to be performed simultaneously at both stations, thereby improving wafer processing efficiency. On the other hand, the two support arms share a second support column, so that both support arms exert downward forces on the second support column simultaneously. For the second support column, it is subjected to symmetrical pressure from both sides, which can prevent deformation caused by long-term unilateral pressure on the second support column, thereby affecting the grinding quality of the wafer and improving the overall stability of the grinding device.

[0034] In one technical solution of the above-mentioned grinding device, the second grinding wheel includes a first part and a second part arranged along its axial direction, wherein the grinding accuracy of the first part is greater than that of the second part.

[0035] By adopting the above technical solution, rough grinding and fine grinding of the workpiece edge groove can be achieved on the same grinding station, thereby improving grinding quality and processing efficiency.

[0036] In one technical solution of the above-mentioned grinding device, the grinding device further includes a fourth grinding component, which is inserted through the support arm. A fourth grinding wheel is provided at the lower end of the fourth grinding component, and the fourth grinding wheel is used to grind the groove on the edge of the workpiece to be processed.

[0037] The second grinding wheel and the fourth grinding wheel have the same grinding accuracy at all positions along their axial direction, and the grinding accuracy of the fourth grinding wheel is greater than that of the second grinding wheel.

[0038] With the above technical solution, rough grinding and fine grinding of the workpiece edge groove can be achieved in the same grinding station, without the need for special customization of the second grinding wheel.

[0039] In one technical solution of the above-mentioned grinding device, the grinding device further includes:

[0040] A support platform assembly, used to support and hold the workpiece to be processed;

[0041] The first grinding assembly is located on one side of the support table assembly. The first grinding assembly includes a first spindle and a first grinding wheel connected to the upper end of the first spindle. The first grinding wheel is used to grind the edge of the workpiece to be processed.

[0042] The second grinding assembly and the third grinding assembly are both located above the first grinding wheel, the first grinding wheel is located at the lower end of the first grinding assembly, the second grinding wheel is located at the lower end of the second grinding assembly, and the third grinding wheel is located at the lower end of the third grinding assembly, so that the first grinding wheel is respectively positioned opposite to the second grinding wheel and the third grinding wheel.

[0043] With the above technical solution, the second grinding wheel, the first grinding wheel, and the support table assembly are not at the same height, which can avoid mutual interference between the three. Under the premise of meeting the spatial layout requirements, multiple grinding processes of the workpiece can be realized on one machine.

[0044] In one technical solution of the above-mentioned grinding device, the axes of the first grinding wheel, the second grinding wheel and the third grinding wheel are parallel to each other, and the distances from the side surfaces of the first grinding wheel, the second grinding wheel and the third grinding wheel to the support table assembly are equal.

[0045] When the above technical solution is adopted, the bearing table assembly will not interfere with the first grinding assembly, the second grinding assembly, and the third grinding assembly during the edge grinding, edge groove grinding, and edge polishing of the workpiece. Moreover, during the process of grinding the edge of the workpiece by the first grinding assembly and then performing edge groove grinding and edge polishing, the displacement adjustment of the bearing table assembly in the horizontal plane can be minimized, thereby improving processing efficiency.

[0046] In one technical solution of the above-mentioned grinding device, the distance from the lower end of the second grinding wheel to the first grinding wheel is equal to the distance from the lower end of the third grinding wheel to the first grinding wheel.

[0047] When the above technical solution is adopted, during the workpiece processing, when switching between the two processes of groove grinding and edge polishing, the vertical displacement adjustment of the support platform assembly can be minimized, thereby improving processing efficiency.

[0048] In one technical solution of the above-mentioned grinding apparatus, a position adjustment device is provided below the support table assembly, and the position adjustment device includes:

[0049] First base;

[0050] The second base is slidably disposed on the first base, and the first base is provided with a first driving component for driving the second base to reciprocate along a first direction.

[0051] The third base is slidably disposed on the second base, and the second base is provided with a second driving component for driving the third base to reciprocate along the second direction;

[0052] The fourth base is slidably disposed on the third base, and the third base is provided with a third drive component for driving the fourth base to reciprocate along a third direction;

[0053] The support platform assembly is disposed on the fourth base, and the first direction, the second direction, and the third direction are perpendicular to each other.

[0054] When the above technical solution is adopted, the coordinate position of the bearing table assembly in three-dimensional space can be adjusted by the pose adjustment device, so that the relative position between the workpiece on the bearing table assembly and each grinding assembly can be adjusted according to the operation requirements.

[0055] In a second aspect, this application provides a processing apparatus that includes the grinding apparatus described in any one of the first aspects.

[0056] In one technical solution of the above-mentioned processing equipment, the processing equipment is a chamfering machine. Attached Figure Description

[0057] The preferred embodiments of this application are described below with reference to the accompanying drawings, in which:

[0058] Figure 1 This is a schematic diagram of the overall structure of a processing device according to an embodiment of this application;

[0059] Figure 2 yes Figure 1 A diagram from another perspective;

[0060] Figure 3 yes Figure 1The front view;

[0061] Figure 4 yes Figure 1 Side view;

[0062] Figure 5 yes Figure 4 A magnified view of part A in the middle;

[0063] Figure 6 This is a schematic diagram of a grinding apparatus according to an embodiment of this application;

[0064] Figure 7 This is a schematic diagram of the mounting method of the second grinding assembly and the third grinding assembly according to an embodiment of this application;

[0065] Figure 8 yes Figure 7 A partial cross-sectional view of the middle support arm in its second state;

[0066] Figure 9 yes Figure 7 A partial structural diagram;

[0067] Figure 10 This is a schematic diagram of a second grinding wheel according to one embodiment of this application;

[0068] Figure 11 This is a schematic diagram of a grinding apparatus according to another embodiment of this application.

[0069] In the figure, the reference numerals refer to the following:

[0070] 1. Machine base; 2. Feeding device; 3. Receiving device; 4. Detection device; 5. Grinding device; 51. Support platform assembly; 511. Rotary shaft; 512. Vacuum chuck; 513. First base; 5131. First drive assembly; 514. Second base; 5141. Second drive assembly; 515. Third base; 5151. Third drive assembly; 516. Fourth base; 52. First grinding assembly; 521. First spindle; 522. First grinding wheel; 53. Second grinding assembly; 531. Second spindle; 532. Second grinding wheel; 5321. First part; 5322. Second part; 54. Third grinding assembly; 541. Third spindle; 542. Third grinding wheel; 55. Fourth grinding assembly; 551. Fourth spindle; 552. Fourth grinding wheel; 56. First support column; 561. Positioning pin; 57. Second support column; 571. Support surface; 572. Locking assembly; 5721. Locking bolt; 5722. Rotating arm; 5723. Pressing part; 573. Protrusion; 58. Support arm; 581. First end; 582. Second end; 583. First through hole; 584. Expansion sleeve; 585. Second through hole; 586. Slit; 587. Fastener; 588. Positioning column. Detailed Implementation

[0071] Preferred embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0072] It should be noted that in the description of this application, terms such as "upper," "lower," "left," "right," "inner," and "outer," which indicate direction or positional relationship, are based on the direction or positional relationship shown in the accompanying drawings. These terms are used merely for ease of description and do not indicate or imply that the relevant device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, ordinal numbers such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0073] Furthermore, it should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0074] In wafer fabrication, the edges need to be chamfered and ground first to remove small cracks and defects that may have occurred during the cutting process. Depending on the processing requirements, the wafer edges may also need to be polished after chamfering to further improve the flatness of the wafer edges. The wafer itself usually has a "V-groove" on its edge. The V-groove is a notch cut into the edge of the wafer, resembling the letter "V". The V-groove has a significant impact on subsequent processes, such as chip manufacturing and packaging, and is an important structural feature in wafer manufacturing. After the wafer edges are chamfered and ground, the V-groove also needs to be chamfered. However, the V-groove is small enough that it cannot be ground using the same equipment used for wafer edge chamfering. Therefore, the wafer needs to be transferred to other V-groove chamfering equipment for secondary processing. This process requires not only secondary transfer but also repositioning of the wafer, increasing the complexity of the process and reducing processing efficiency.

[0075] Reference Figure 1 and Figure 2 This is a processing apparatus according to one embodiment of the present application, which includes a base 1, a feeding device 2, a receiving device 3, a detection device 4, and a grinding device 5.

[0076] The machine base 1 serves as the carrier for the aforementioned functional modules of the processing equipment. The feeding device 2, receiving device 3, detection device 4, and grinding device 5 are all mounted on the machine base 1. A control system electrically connected to the corresponding functional modules is installed within the machine base 1. The feeding device 2 and receiving device 3 are located at opposite ends of the machine base 1. The feeding device 2 includes a feeding bin for accommodating the workpiece to be processed. The detection device 4 is located near the feeding device 2. The picking arm picks up the workpiece from the feeding bin of the feeding device 2 and places it in the detection device 4. The detection device 4 then detects the type, thickness, and offset of the workpiece. The grinding device 5 is located between the detection device 4 and the receiving device 3. The picking arm transfers the workpiece, which has been detected by the detection device 4, to the grinding device 5, where it performs grinding. Finally, the picking arm transfers the ground workpiece to the receiving device 3 for cleaning, drying, and collection into the unloading bin of the receiving device 3.

[0077] In one embodiment of this application, the processing equipment is a chamfering machine used to chamfer and grind the wafer. Accordingly, the wafer is described as the workpiece to be processed in the following description of this application.

[0078] Reference Figure 2 , Figure 3 and Figure 4 The grinding apparatus 5 includes a support platform assembly 51 for supporting and fixing the wafer, and a grinding assembly disposed on one side of the support platform assembly 51. The grinding assembly includes a first grinding assembly 52, a second grinding assembly 53, and a third grinding assembly 54. A support column and a support arm 58 disposed at the top of the support column are fixedly disposed on the base 1. Specifically, the support column includes a first support column 56 and a second support column 57 arranged side-by-side. The two ends of the support arm 58 are respectively connected to the top ends of the first support column 56 and the second support column 57. The second grinding assembly 53 and the third grinding assembly 54 are fixedly disposed on the support arm 58, and the first grinding assembly 52 is fixedly disposed on the base 1. Specifically, the processing end of the first grinding assembly 52 is arranged facing upwards, and the processing ends of the second grinding assembly 53 and the third grinding assembly 54 are arranged facing downwards. The processing ends of the second grinding assembly 53 and the third grinding assembly 54 are located below the support arm 58. In this application, the "processing end" of the first grinding assembly 52, the second grinding assembly 53 and the third grinding assembly 54 refers to the rotatable grinding wheel.

[0079] The first grinding assembly 52 is used to grind the edges of the wafer to achieve chamfering. The first grinding assembly 52 includes a first spindle 521 and a first grinding wheel 522 connected to the end of the first spindle 521. The first spindle 521 is arranged vertically, and the first grinding wheel 522 is connected to the upper end of the first spindle 521. The first grinding assembly 52 also includes a driver for driving the first grinding wheel 522 to rotate. When the wafer is fixed on the support stage assembly 51, the axis of the wafer is parallel to the axis of the first grinding wheel 522, thereby chamfering the edges of the wafer through the rotation of the first grinding wheel 522.

[0080] The second grinding assembly 53 is used to grind the grooves on the edge of the workpiece to be processed. When the workpiece is a wafer, the groove is a V-groove of the wafer. The second grinding assembly 53 chamfers the V-groove of the wafer. The second grinding assembly 53 includes a second spindle 531 and a second grinding wheel 532 connected to the end of the second spindle 531. The second spindle 531 is arranged vertically, with its lower end passing downwards through a support arm 58. The second grinding wheel 532 is connected to the lower end of the second spindle 531. The second grinding assembly 53 also includes a driver for rotating the second grinding wheel 532. When the wafer is fixed on the support stage assembly 51, the axis of the wafer is parallel to the axis of the second grinding wheel 532, thereby chamfering the V-groove through the rotation of the second grinding wheel 532.

[0081] The third grinding assembly 54 is used to grind the edges of the wafer to achieve polishing. The third grinding assembly 54 includes a third spindle 541 and a third grinding wheel 542 connected to the end of the third spindle 541. The third spindle 541 is arranged vertically, and its lower end also passes downward through the support arm 58. The third grinding wheel 542 is connected to the lower end of the third spindle 541. The third grinding assembly 54 also includes a driver for rotating the third grinding wheel 542. When the wafer is fixed on the support stage assembly 51, the axis of the wafer is parallel to the axis of the third grinding wheel 542, thereby polishing the edge of the wafer through the rotation of the third grinding wheel 542.

[0082] It should be noted that in this application, the drivers connected to the first grinding wheel 522, the second grinding wheel 532 and the third grinding wheel 542 are not shown in the figures. They are well-known technologies in the field. The drivers include, but are not limited to, servo motors and other drive forms, as long as they can drive the first grinding wheel 522, the second grinding wheel 532 and the third grinding wheel 542 to rotate and meet the precision requirements of the machining.

[0083] Furthermore, both the second grinding wheel 532 and the third grinding wheel 542 are located above the first grinding wheel 522. Since the second grinding wheel 532 and the third grinding wheel 542 are not on the same horizontal plane as the first grinding wheel 522, interference between the second grinding wheel 532 and the third grinding wheel 542 and the support table assembly 51 and the first grinding wheel 522 can be avoided, thus satisfying the spatial layout requirements between the various grinding components and the support table assembly 51. The support table assembly 51 can move horizontally and vertically, meaning its coordinate position can be arbitrarily adjusted in three-dimensional space, thereby adjusting its relative positional relationship with the corresponding grinding components in each grinding process.

[0084] It should be understood that, due to the structural dimensions of both the first grinding assembly 52 and the support table assembly 51, they often occupy a large space. If grinding assemblies with the same layout direction as the first grinding assembly 52 are arranged side by side on one side of the first grinding assembly 52, the space constraints will make it difficult for other grinding assemblies to cooperate with the support table assembly 51 for grinding. Otherwise, they will interfere with each other, making it impossible to perform multiple grinding processes on the same machine at the same time.

[0085] This application, by setting a second grinding component 53 above the first grinding component 52, allows the first grinding wheel 522 and the second grinding wheel 532 to be arranged opposite each other in the vertical direction, with the first spindle 521 and the second spindle 531 located at different heights. This arrangement of the first grinding component 52 and the second grinding component 53 at different heights effectively avoids interference between them. After the first grinding component 52 has completed the chamfering of the wafer edge, the coordinate position of the support stage component 51 is adjusted to allow the wafer to cooperate with the second grinding component 53 to achieve the chamfering of the wafer V-groove. Thus, edge chamfering and V-groove chamfering of the wafer can be achieved on the same equipment without the need for secondary transfer and secondary positioning of the wafer, thereby simplifying the wafer processing steps and improving processing efficiency.

[0086] Similarly, the third grinding assembly 54 is also positioned above the first grinding assembly 52, thereby enabling the three processes of wafer edge chamfering grinding, V-groove chamfering grinding, and wafer edge polishing to be performed on the same machine, improving the functionality and applicability of the chamfering machine and further increasing wafer processing efficiency.

[0087] Reference Figure 5The axes of the first grinding wheel 522, the second grinding wheel 532, and the third grinding wheel 542 are parallel to each other. In one embodiment of this application, the distances from the side surfaces of the first grinding wheel 522, the second grinding wheel 532, and the third grinding wheel 532 to the support stage assembly 51 (specifically, the central axis of the support stage assembly 51) are equal. Thus, during the edge chamfering, V-groove chamfering, and edge polishing processes of the wafer, the support stage assembly 51 will not interfere with the first grinding assembly 52, the second grinding assembly 53, and the third grinding assembly 54. Furthermore, during the process of chamfering the wafer edge using the first grinding assembly 52 and then proceeding to the next grinding process, the displacement adjustment of the support stage assembly 51 in the horizontal plane can be minimized, thereby improving processing efficiency.

[0088] Furthermore, the distance from the lower end of the second grinding wheel 532 to the first grinding wheel 522 is equal to the distance from the lower end of the third grinding wheel 542 to the first grinding wheel 522. Thus, during wafer fabrication, when switching between the V-groove chamfering and edge polishing processes, the vertical displacement adjustment of the support platform assembly 51 can be minimized, thereby improving processing efficiency.

[0089] Reference Figure 6 In one embodiment of this application, the carrier stage assembly 51 includes a rotating shaft 511 and a vacuum chuck 512 disposed on the upper end of the rotating shaft 511. The carrier stage assembly 51 also includes a driver (not shown in the figure) for driving the rotating shaft 511 to rotate, which can be in the form of a servo motor or the like. After the pick-up arm places the wafer on the vacuum chuck 512, the negative pressure system is activated, thereby adsorbing and fixing the wafer on the vacuum chuck 512. During the grinding process, the rotating shaft 511 drives the wafer to rotate, so as to achieve chamfering, polishing and V-groove chamfering of the wafer edge.

[0090] A posture adjustment device is provided below the support platform assembly 51. The posture adjustment device includes a first base 513, a second base 514 slidably disposed on the first base 513, a third base 515 slidably disposed on the second base 514, and a fourth base 516 slidably disposed on the third base 515. The support platform assembly 51 is disposed on the fourth base 516. A first drive assembly 5131 is provided on the first base 513 to drive the second base 514 to reciprocate along a first direction. A second drive assembly 5141 is provided on the second base 514 to drive the third base 515 to reciprocate along a second direction. A third drive assembly 5151 is provided on the third base 515 to drive the fourth base 516 to reciprocate along a third direction.

[0091] Among them, the first direction, the second direction, and the third direction are perpendicular to each other, for example, in Figure 6In the exemplary embodiment, the first direction is the X direction, the second direction is the Y direction, and the third direction is the Z direction. Thus, the coordinate position of the stage assembly 51 in three-dimensional space can be adjusted by the pose adjustment device, thereby enabling the relative position between the wafer on the stage assembly 51 and each grinding assembly to be adjusted as needed.

[0092] It should be noted that in some implementations of this application, the first drive component 5131, the second drive component 5141 and the third drive component 5151 mentioned above can be a structure such as a ball screw to achieve linear reciprocating adjustment. This is a well-known technology in the field and will not be described in detail here.

[0093] Reference Figure 7 , Figure 8 and Figure 9 The support arm 58 has a first end 581 and a second end 582. The first end 581 is rotatably connected to the top of the first support column 56. The top of the second support column 57 has a support surface 571, and the second end 582 of the support arm 58 can overlap the support surface 571. For ease of description, based on different positions of the support arm 58 during rotation, the state when the support arm 58 is rotated upward to separate from the second support column 57 is called the first state, and the state when the support arm 58 is rotated downward to contact the support surface 571 of the second support column 57 is called the second state. When the support arm 58 is in the second state, the second end 582 is in contact with the support surface 571, and the support arm 58 is in a horizontal state. The second support column 57 is also provided with a locking assembly 572 for fixing the second end 582. When the support arm 58 is in the second state, the locking assembly 572 can lock and fix the support arm 58.

[0094] In one embodiment of this application, both the first support column 56 and the second support column 57 are in a vertical state. When the support arm 58 rotates to the second state, the support arm 58 is in a horizontal state. When the support arm 58 rotates to the first state, the support arm 58 is in an inclined state.

[0095] It should be noted that, although the above embodiments of this application use the example of simultaneously providing a second grinding component 53 and a third grinding component 54 on the support arm 58, this does not constitute a limitation on this application. In practical applications, only the second grinding component 53 or the third grinding component 54 may be provided on the support arm 58 as needed, or other grinding components may be added. This application does not impose any restrictions on this.

[0096] As described above, this application rotatably connects the support arm 58 to the first support column 56. When the second grinding assembly 53 and the third grinding assembly 54 are required to grind the wafer, the support arm 58 is rotated to the second state, and the second end 582 of the support arm 58 is locked by the locking assembly 572. In this way, both the first end 581 and the second end 582 of the support arm 58 are fixed, which can reduce the axial runout of the second spindle 531 and the third spindle 541 during the grinding process, thereby improving the grinding quality. When it is necessary to replace or repair the second grinding wheel 532 / third grinding wheel 542, the support arm 58 is rotated upward to the first state. At this time, the support arm 58 is raised, and a space area for replacement or repair is opened under the support arm 58. At this time, the grinding wheel can be replaced or repaired by relevant tools.

[0097] As can be seen, by adopting the above solution, the rotation of the support arm 58 to create operating space can reduce the interference of functional modules such as the bearing table assembly 51 and the first grinding assembly 52 on the maintenance operations of the second grinding assembly 53 and the third grinding assembly 54, thus making the maintenance operations more convenient. At the same time, fixing the support arm 58 with the locking assembly 572 to reduce spindle runout can also improve the wafer grinding quality.

[0098] In one embodiment of this application, a first through hole 583 is provided on the support arm 58, through which a second main shaft 531 passes. A shrink sleeve 584 is provided between the second main shaft 531 and the first through hole 583. The shrink sleeve 584 generates relative pressure and friction between the side surface of the second main shaft 531 and the first through hole 583. Under the action of the aforementioned pressure and friction, the second main shaft 531 is fixed relative to the first through hole 583. The shrink sleeve 584 is a keyless connection device in the mechanical field for realizing wheel-axle connection or hole-shaft connection, which will not be described in detail here.

[0099] This application uses a tightening sleeve 584 to fix the second spindle 531 to the support arm 58, making the disassembly and installation of the second spindle 531 more convenient.

[0100] In one embodiment of this application, the support arm 58 is further provided with a second through hole 585, through which the third main shaft 541 passes. Simultaneously, the support arm 58 is also provided with a slit 586 communicating with the second through hole 585. The slit 586 extends to the outer surface of the support arm 58, thereby forming two parts on both sides of the slit 586. When pressure is applied to one side of the slit 586, the slit 586 can be controlled to open or retract. The support arm 58 is also provided with a fastener 587, which passes through the slit 586. By adjusting the width of the slit 586 using the fastener 587, the third main shaft 541 can be fixed within the second through hole 585.

[0101] For example, in one implementation, the fastener 587 is a bolt that passes laterally through the slit 586 and is threaded to the support arm 58. The width of the slit 586 can be adjusted by rotating the bolt, thereby changing the cross-sectional size of the second through hole 585, so that the inner wall of the second through hole 585 holds the third spindle 541 tightly.

[0102] Reference Figure 7 , Figure 8 and Figure 9 A positioning pin 561 is slidably disposed at the top of the first support column 56 along a direction parallel to the rotation axis of the support arm 58. A positioning part (not shown in the figure, but can be a groove or through hole on the support arm 58, the cross-section of which is adapted to the cross-section of the positioning pin 561) is provided on the first end 581 of the support arm 58. When the support arm 58 is in the aforementioned first state, the positioning pin 561 extends into the positioning part, thereby fixing the support arm 58 in the position of the first state. Thus, when the support arm 58 rotates to the first state, the positioning pin 561 is moved to fix the support arm 58, preventing rotation of the support arm 58 during maintenance.

[0103] In one embodiment of this application, the locking assembly 572 includes a locking bolt 5721, a rotating arm 5722, and a clamping part 5723. The locking bolt 5721 is threadedly connected to the second support column 57, the rotating arm 5722 is rotatably connected to the locking bolt 5721, and the clamping part 5723 may be a columnar component, fixed to the end of the rotating arm 5722 away from the locking bolt 5721. Optionally, the extending direction of the rotating arm 5722 is perpendicular to the extending direction of the locking bolt 5721, and the extending direction of the clamping part 5723 is the same as the extending direction of the locking bolt 5721.

[0104] When the support arm 58 is in the first state, rotate the rotating arm 5722 away from the support surface 571, so that the rotating arm 5722 and the clamping part 5723 are away from the space above the support surface 571. At this time, the support arm 58 can be rotated to the second state. Then, rotate the rotating arm 5722 above the second end 582. Finally, move the clamping part 5723 downward by rotating the locking bolt 5721 to fix the second end 582. Similarly, when it is necessary to rotate the support arm 58 from the second state to the first state, the above steps are reversed.

[0105] As can be seen, by adopting the above method, not only can the support arm 58 be fixed, but also by rotating the arm 5722 and locking bolt 5721, space can be made for the support arm 58 to switch between different states, without having to remove the locking component 572 from the second support column 57 during the state switching process, so that the locking component 572 and the second support column 57 are integrated into a single structure.

[0106] In one embodiment, a protrusion 573 is fixedly provided on the support surface 571, and a positioning post 588 corresponding to the protrusion 573 is fixedly provided on the second end 582. When the support arm 58 is in the second state, the lower end of the positioning post 588 just abuts against the protrusion 573.

[0107] When the above technical solution is adopted, on the one hand, when the support arm 58 is in the second state, the relative position of the positioning post 588 and the protrusion 573 can be observed to determine whether the support arm 58 is in the preset position. For example, if the contact point between the positioning post 588 and the protrusion 573 does not coincide, it indicates that the support arm 58 may have shifted in the horizontal direction. The reason for this phenomenon may be that there is a defect in the structure of the support arm 58 itself, or that the connection between the support arm 58 and the first support post 56 is loose, etc. At this time, the support arm 58 and its surrounding components should be inspected to prevent the grinding quality of the wafer from being affected. It can be seen that the setting of the positioning post 588 and the protrusion 573 is conducive to detecting the working status of the support arm 58, thereby reducing the impact on the grinding operation.

[0108] On the other hand, when the locking component 572 applies force to the positioning post 588, the force is transmitted vertically downward along the positioning post 588 and the protrusion 573 in sequence. In practical applications, the positioning post 588 and the protrusion 573 can be made of materials with high structural strength, thereby reducing damage to the second end 582 of the support arm 58.

[0109] Reference Figure 2 and Figure 7 In one embodiment of this application, each second support post 57 is provided with a first support post 56 and a support arm 58 on both sides, and the first support post 56 and support arm 58 on both sides of the second support post 57 are symmetrically arranged relative to the second support post 57. Accordingly, each support arm 58 is provided with a second grinding assembly 53 and a third grinding assembly 54, and the second support post 57 is provided with two locking assemblies 572 corresponding to the support arms 58 on both sides respectively.

[0110] In this way, two grinding stations can be formed side by side, allowing grinding operations to be performed simultaneously at both stations, thereby improving wafer processing efficiency. On the other hand, the two support arms 58 share a second support column 57, so that the two support arms 58 exert downward forces on the second support column 57 simultaneously. The second support column 57 is subjected to symmetrical pressure from both sides, which can prevent deformation caused by long-term unilateral pressure on the second support column 57, thereby affecting the grinding quality of the wafer and improving the overall stability of the grinding device.

[0111] Reference Figure 10 In one embodiment of this application, the second grinding wheel 532 includes a first portion 5321 and a second portion 5322 arranged along its axial direction, wherein the grinding precision of the first portion 5321 is greater than that of the second portion 5322. Thus, rough grinding and fine grinding of the wafer V-groove chamfer can be achieved at the same grinding station, thereby improving the wafer processing quality.

[0112] Of course, in some other implementations, the first grinding wheel 522 and the third grinding wheel 542 can also be divided into a fine grinding part and a rough grinding part based on the above principle.

[0113] Reference Figure 11 In one embodiment of this application, the grinding apparatus further includes a fourth grinding assembly 55 disposed on the support arm 58. Similar to the aforementioned second grinding assembly 53 and third grinding assembly 54, the fourth grinding assembly 55 also includes a fourth spindle 551 and a fourth grinding wheel 552. The fourth spindle 551 passes downward through the support arm 58, and the fourth grinding wheel 552 is mounted on the lower end of the fourth spindle 551. The fourth grinding wheel 552 is also used for grinding the grooves on the edge of the workpiece to be processed. When the workpiece to be processed is a wafer, the grooves are V-grooves of the wafer.

[0114] When the above method is used, both the second grinding wheel 532 and the fourth grinding wheel 552 chamfer the V-groove. At this time, the grinding accuracy of the second grinding wheel 532 and the fourth grinding wheel 552 is the same at all positions along their axial direction, and the grinding accuracy of the fourth grinding wheel 552 is greater than that of the second grinding wheel 532. That is, the fourth grinding wheel 552 is the V-groove fine grinding wheel, and the second grinding wheel 532 is the V-groove rough grinding wheel. In this way, both rough and fine grinding of the wafer V-groove can be achieved at the same grinding station. This method, compared to the aforementioned... Figure 9 In terms of the method, there is no need to customize dual grinding wheels (that is, to specially customize the grinding wheel and divide its different positions in the axial direction into fine grinding part and rough grinding part).

[0115] It should be noted that although the above embodiments provide two different methods for chamfering the V-groove of a wafer, these embodiments do not constitute a limitation of this application. For example, in some other implementations, the two parallel grinding stations can be divided into a rough grinding station and a fine grinding station. That is, all grinding wheels on one station are rough grinding wheels, and all grinding wheels on the other station are fine grinding wheels. After the rough grinding is completed, the grinding is transferred to the fine grinding station for further grinding. As mentioned above, those skilled in the art can adjust the type of grinding wheels on each grinding station according to actual needs to meet processing requirements. Any corresponding adjustments made to the type of grinding wheels and the arrangement of the grinding wheels should be within the scope of protection of this application.

[0116] It should also be noted that in some implementations, two or more grinding devices can be arranged side by side on the machine base 1 to form more grinding stations to meet processing needs. This application does not limit the specific number of grinding stations.

[0117] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of this application.

Claims

1. A grinding apparatus, characterized in that, include: The first support column (56) and the second support column (57) are arranged side by side; The support arm (58) has a first end (581) and a second end (582) opposite to each other, the first end (581) being connected to the top end of the first support column (56) and the second end (582) being connected to the top end of the second support column (57). A grinding assembly is disposed on the support arm (58), the grinding assembly passes through the support arm (58), and the processing end of the grinding assembly is located below the support arm (58) for grinding the workpiece to be processed.

2. The grinding apparatus according to claim 1, characterized in that, The grinding assembly includes a second grinding assembly (53), which includes a second spindle (531) passing through the support arm (58) and a second grinding wheel (532) connected to the lower end of the second spindle (531). The second grinding wheel (532) is used to grind the groove on the edge of the workpiece to be processed.

3. The grinding apparatus according to claim 2, characterized in that, The support arm (58) has a first through hole (583), the second main shaft (531) passes through the first through hole (583), and the second main shaft (531) is fixed to the first through hole (583) by an expansion sleeve (584).

4. The grinding apparatus according to claim 2, characterized in that, The grinding assembly further includes a third grinding assembly (54), which includes a third spindle (541) passing through the support arm (58) and a third grinding wheel (542) connected to the lower end of the third spindle (541). The third grinding wheel (542) is used to polish the edge of the workpiece to be processed.

5. The grinding apparatus according to claim 4, characterized in that, The support arm (58) has a second through hole (585), and the third main shaft (541) passes through the second through hole (585); The support arm (58) has a slit (586) that communicates with the second through hole (585). The slit (586) extends to the outer surface of the support arm (58). A fastener (587) is provided on the support arm (58). The fastener (587) passes through the slit (586) to fix the third spindle (541) in the second through hole (585).

6. The grinding apparatus according to claim 1, characterized in that, The first end (581) is rotatably connected to the first support column (56); The second support column (57) is provided with a support surface (571) and a locking assembly (572). The support arm (58) has a first state and a second state during its rotation. When the support arm (58) rotates from the first state to the second state, the processing end of the grinding assembly is located below the support arm (58). The support surface (571) supports the second end (582), and the locking assembly (572) fixes the second end (582).

7. The grinding apparatus according to claim 6, characterized in that, A positioning pin (561) is slidably provided on the first support column (56), and a positioning part that cooperates with the positioning pin (561) is provided on the first end (581). When the support arm (58) is in the first state, the positioning pin (561) extends into the positioning part to fix the support arm (58).

8. The grinding apparatus according to claim 6, characterized in that, The locking assembly (572) includes: Locking bolt (5721), which is threadedly connected to the second support column (57); Rotating arm (5722), which is rotatably connected to the locking bolt (5721); A clamping part (5723) is provided at the end of the rotating arm (5722) away from the locking bolt (5721). When the support arm (58) is in the second state, rotating the locking bolt (5721) can cause the clamping part (5723) to press against the second end (582).

9. The grinding apparatus according to claim 8, characterized in that, The support surface (571) is provided with a protrusion (573), and the second end (582) is provided with a positioning post (588) corresponding to the protrusion (573). When the support arm (58) is in the second state, the positioning post (588) abuts against the protrusion (573).

10. The grinding apparatus according to claim 6, characterized in that, The grinding device includes two first support columns (56), which are symmetrically arranged with respect to the second support column (57). Each first support column (56) is provided with a support arm (58), and each support arm (58) is provided with a grinding component. The second support column (57) is provided with two locking components (572) corresponding to the support arms (58) on both sides.

11. The grinding apparatus according to claim 2, characterized in that, The second grinding wheel (532) includes a first portion (5321) and a second portion (5322) arranged along its axial direction, wherein the grinding accuracy of the first portion (5321) is greater than that of the second portion (5322).

12. The grinding apparatus according to claim 2, characterized in that, The grinding device further includes a fourth grinding assembly (55), which is inserted through the support arm (58). A fourth grinding wheel (552) is provided at the lower end of the fourth grinding assembly (55), which is used to grind the groove on the edge of the workpiece to be processed. The second grinding wheel (532) and the fourth grinding wheel (552) have the same grinding accuracy at each position in their axial direction, and the grinding accuracy of the fourth grinding wheel (552) is greater than that of the second grinding wheel (532).

13. The grinding apparatus according to claim 4, characterized in that, The grinding apparatus also includes: A support platform assembly (51) is used to support and fix the workpiece to be processed; A first grinding assembly (52) is located on one side of the support table assembly (51). The first grinding assembly (52) includes a first spindle (521) and a first grinding wheel (522) connected to the upper end of the first spindle (521). The first grinding wheel (522) is used to grind the edge of the workpiece to be processed. The second grinding assembly (53) and the third grinding assembly (54) are both located above the first grinding wheel (522). The first grinding wheel (522) is located at the lower end of the first grinding assembly (52), the second grinding wheel (532) is located at the lower end of the second grinding assembly (53), and the third grinding wheel (542) is located at the lower end of the third grinding assembly (54), so that the first grinding wheel (522) is respectively arranged opposite to the second grinding wheel (532) and the third grinding wheel (542).

14. The grinding apparatus according to claim 13, characterized in that, The axes of the first grinding wheel (522), the second grinding wheel (532), and the third grinding wheel (542) are parallel to each other, and the side surfaces of the first grinding wheel (522), the second grinding wheel (532), and the third grinding wheel (542) are equidistant from the support platform assembly (51).

15. The grinding apparatus according to claim 14, characterized in that, The distance from the lower end of the second grinding wheel (532) to the first grinding wheel (522) is equal to the distance from the lower end of the third grinding wheel (542) to the first grinding wheel (522).

16. The grinding apparatus according to claim 13, characterized in that, A pose adjustment device is provided below the support platform assembly (51), the pose adjustment device comprising: First base (513); The second base (514) is slidably disposed on the first base (513), and the first base (513) is provided with a first driving component (5131) for driving the second base (514) to reciprocate along a first direction. The third base (515) is slidably disposed on the second base (514), and the second base (514) is provided with a second driving component (5141) for driving the third base (515) to reciprocate along the second direction; A fourth base (516) is slidably disposed on the third base (515), and the third base (515) is provided with a third drive assembly (5151) for driving the fourth base (516) to reciprocate along a third direction. The support platform assembly (51) is disposed on the fourth base (516), and the first direction, the second direction and the third direction are perpendicular to each other.

17. A processing equipment, characterized in that, The grinding apparatus includes any one of claims 1 to 16.

18. The processing equipment according to claim 17, characterized in that, The processing equipment is a chamfering machine.

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